AT310843B - Process for manufacturing a printed circuit board - Google Patents

Process for manufacturing a printed circuit board

Info

Publication number
AT310843B
AT310843B AT629371A AT629371A AT310843B AT 310843 B AT310843 B AT 310843B AT 629371 A AT629371 A AT 629371A AT 629371 A AT629371 A AT 629371A AT 310843 B AT310843 B AT 310843B
Authority
AT
Austria
Prior art keywords
manufacturing
circuit board
printed circuit
printed
board
Prior art date
Application number
AT629371A
Other languages
German (de)
Original Assignee
Photocircuits Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Photocircuits Corp filed Critical Photocircuits Corp
Application granted granted Critical
Publication of AT310843B publication Critical patent/AT310843B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1605—Process or apparatus coating on selected surface areas by masking
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0236—Plating catalyst as filler in insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
AT629371A 1966-06-28 1967-06-27 Process for manufacturing a printed circuit board AT310843B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US56112366A 1966-06-28 1966-06-28

Publications (1)

Publication Number Publication Date
AT310843B true AT310843B (en) 1973-10-25

Family

ID=24240722

Family Applications (2)

Application Number Title Priority Date Filing Date
AT598867A AT314010B (en) 1966-06-28 1967-06-27 Starting material for metallizing by means of electroless metal-plating baths, preferably for the production of printed circuit boards, and a method for its production
AT629371A AT310843B (en) 1966-06-28 1967-06-27 Process for manufacturing a printed circuit board

Family Applications Before (1)

Application Number Title Priority Date Filing Date
AT598867A AT314010B (en) 1966-06-28 1967-06-27 Starting material for metallizing by means of electroless metal-plating baths, preferably for the production of printed circuit boards, and a method for its production

Country Status (8)

Country Link
JP (3) JPS5031940B1 (en)
AT (2) AT314010B (en)
CH (1) CH504830A (en)
DE (1) DE1665374B1 (en)
ES (1) ES342451A1 (en)
FR (1) FR1605382A (en)
GB (1) GB1186558A (en)
NL (1) NL162816C (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1906267A1 (en) * 1968-02-07 1969-11-13 Poclain Sa Hydraulic control device, especially for controlling hydraulic winches
JPS5026022B1 (en) * 1970-11-16 1975-08-28
JPS5914882U (en) * 1982-07-19 1984-01-28 川上　規久雄 drainage device
JPS60190403U (en) * 1984-05-30 1985-12-17 川崎製鉄株式会社 Roll cooling device
US4767665A (en) * 1985-09-16 1988-08-30 Seeger Richard E Article formed by electroless plating
GB2188194A (en) * 1986-03-21 1987-09-23 Plessey Co Plc Carrier for high frequency integrated circuits
CA1318416C (en) * 1987-01-14 1993-05-25 Kollmorgen Corporation Bonding compositions for the manufacture of additive printed wiring boards and articles made with the bonding composition
JPH0748583B2 (en) * 1989-04-03 1995-05-24 喜平 大津 Method for manufacturing electrical inspection jig board for high-density printed wiring board
EP1843649A3 (en) 1998-09-03 2007-10-31 Ibiden Co., Ltd. Multilayered printed circuit board and manufacturing method therefor
US10765012B2 (en) * 2017-07-10 2020-09-01 Catlam, Llc Process for printed circuit boards using backing foil

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB938365A (en) * 1959-01-08 1963-10-02 Photocircuits Corp Method of making printed circuits
US3143484A (en) * 1959-12-29 1964-08-04 Gen Electric Method of making plated circuit boards
US3171756A (en) * 1961-05-04 1965-03-02 Ibm Method of making a printed circuit and base therefor

Also Published As

Publication number Publication date
NL162816B (en) 1980-01-15
CH504830A (en) 1971-03-15
FR1605382A (en) 1975-02-28
NL6709035A (en) 1967-12-29
NL162816C (en) 1980-06-16
JPS5031940B1 (en) 1975-10-16
GB1186558A (en) 1970-04-02
JPS5110329B1 (en) 1976-04-03
ES342451A1 (en) 1968-07-16
AT314010B (en) 1974-03-11
DE1665374B1 (en) 1971-09-09
JPS5746679B1 (en) 1982-10-05

Similar Documents

Publication Publication Date Title
AT330878B (en) METHOD OF MANUFACTURING A CONTACT-THROUGH CIRCUIT BOARD
CH504148A (en) Process for manufacturing a printed circuit board
CH523000A (en) Device for connecting at least one printed circuit board
AT297758B (en) Method of making a lithographic printing plate
AT312731B (en) Process for manufacturing electrical circuit boards
CH449777A (en) Method of manufacturing a solid-state circuit
CH364822A (en) Process for the production of an insulating board with a printed circuit
AT256217B (en) Process for manufacturing a printed circuit
AT310843B (en) Process for manufacturing a printed circuit board
CH425924A (en) Process for the production of circuit boards with thin layers
CH492381A (en) Process for the production of printed circuits
CH479229A (en) Method of manufacturing a thin film integrated circuit
CH488289A (en) Method of manufacturing a multilayer microelectronic circuit
CH541424A (en) Process for the production of a copper-clad plastic plate
CH471524A (en) Process for the production of printed circuit boards with metallized holes
CH500845A (en) Process for making prints
AT262383B (en) Process for manufacturing an integrated circuit
AT294955B (en) Process for the production of printed circuit boards
AT281957B (en) Process for the production of a board with extensive wiring
CH515993A (en) Process for making a dextrin solution
CH465026A (en) Method for establishing a connection to extensive wiring
CH502748A (en) Process for making a printed circuit board
CH512869A (en) Process for the manufacture of a printed circuit type electrical circuit board
CH494984A (en) Process for producing an etch reserve
AT260329B (en) Process for manufacturing a printed circuit

Legal Events

Date Code Title Description
ELJ Ceased due to non-payment of the annual fee