ES342451A1 - Improvements in Metallization of Insulating Subtrates - Google Patents

Improvements in Metallization of Insulating Subtrates

Info

Publication number
ES342451A1
ES342451A1 ES342451A ES342451A ES342451A1 ES 342451 A1 ES342451 A1 ES 342451A1 ES 342451 A ES342451 A ES 342451A ES 342451 A ES342451 A ES 342451A ES 342451 A1 ES342451 A1 ES 342451A1
Authority
ES
Spain
Prior art keywords
subtrates
metallization
insulating
cupric
pyrrolidone
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES342451A
Other languages
Spanish (es)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Corp
Original Assignee
Photocircuits Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Photocircuits Corp filed Critical Photocircuits Corp
Publication of ES342451A1 publication Critical patent/ES342451A1/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1605—Process or apparatus coating on selected surface areas by masking
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0236—Plating catalyst as filler in insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

A catalytic adhesive for use in forming a printed circuit by electroless deposition comprises (g./1.) ethylene glycol monoethyl ether acetate 600, epoxy resin 109, acrylonitrile butadiene copolymer rubber 204, phenolic resin 60, silicon dioxide 50, wetting agent 17À5 mixed with an equal part by weight of a solution of any one of palladium, cupric or auric chloride or silver nitrate in N-methyl-2-pyrrolidone.
ES342451A 1966-06-28 1967-06-28 Improvements in Metallization of Insulating Subtrates Expired ES342451A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US56112366A 1966-06-28 1966-06-28

Publications (1)

Publication Number Publication Date
ES342451A1 true ES342451A1 (en) 1968-07-16

Family

ID=24240722

Family Applications (1)

Application Number Title Priority Date Filing Date
ES342451A Expired ES342451A1 (en) 1966-06-28 1967-06-28 Improvements in Metallization of Insulating Subtrates

Country Status (8)

Country Link
JP (3) JPS5031940B1 (en)
AT (2) AT314010B (en)
CH (1) CH504830A (en)
DE (1) DE1665374B1 (en)
ES (1) ES342451A1 (en)
FR (1) FR1605382A (en)
GB (1) GB1186558A (en)
NL (1) NL162816C (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1906267A1 (en) * 1968-02-07 1969-11-13 Poclain Sa Hydraulic control device, especially for controlling hydraulic winches
JPS5026022B1 (en) * 1970-11-16 1975-08-28
JPS5914882U (en) * 1982-07-19 1984-01-28 川上　規久雄 drainage device
JPS60190403U (en) * 1984-05-30 1985-12-17 川崎製鉄株式会社 Roll cooling device
US4767665A (en) * 1985-09-16 1988-08-30 Seeger Richard E Article formed by electroless plating
GB2188194A (en) * 1986-03-21 1987-09-23 Plessey Co Plc Carrier for high frequency integrated circuits
CA1318416C (en) * 1987-01-14 1993-05-25 Kollmorgen Corporation Bonding compositions for the manufacture of additive printed wiring boards and articles made with the bonding composition
JPH0748583B2 (en) * 1989-04-03 1995-05-24 喜平 大津 Method for manufacturing electrical inspection jig board for high-density printed wiring board
EP1843649A3 (en) 1998-09-03 2007-10-31 Ibiden Co., Ltd. Multilayered printed circuit board and manufacturing method therefor
US10765012B2 (en) * 2017-07-10 2020-09-01 Catlam, Llc Process for printed circuit boards using backing foil

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB938365A (en) * 1959-01-08 1963-10-02 Photocircuits Corp Method of making printed circuits
US3143484A (en) * 1959-12-29 1964-08-04 Gen Electric Method of making plated circuit boards
US3171756A (en) * 1961-05-04 1965-03-02 Ibm Method of making a printed circuit and base therefor

Also Published As

Publication number Publication date
AT310843B (en) 1973-10-25
NL162816B (en) 1980-01-15
CH504830A (en) 1971-03-15
FR1605382A (en) 1975-02-28
NL6709035A (en) 1967-12-29
NL162816C (en) 1980-06-16
JPS5031940B1 (en) 1975-10-16
GB1186558A (en) 1970-04-02
JPS5110329B1 (en) 1976-04-03
AT314010B (en) 1974-03-11
DE1665374B1 (en) 1971-09-09
JPS5746679B1 (en) 1982-10-05

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