ES540478A0 - Perfeccionamientos en dispositivos de circuitos integrados - Google Patents

Perfeccionamientos en dispositivos de circuitos integrados

Info

Publication number
ES540478A0
ES540478A0 ES540478A ES540478A ES540478A0 ES 540478 A0 ES540478 A0 ES 540478A0 ES 540478 A ES540478 A ES 540478A ES 540478 A ES540478 A ES 540478A ES 540478 A0 ES540478 A0 ES 540478A0
Authority
ES
Spain
Prior art keywords
integrated circuit
circuit devices
devices
integrated
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
ES540478A
Other languages
English (en)
Other versions
ES8700500A1 (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
American Telephone and Telegraph Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US06/581,259 external-priority patent/US4613891A/en
Priority claimed from US06/581,336 external-priority patent/USH208H/en
Priority claimed from US06/582,079 external-priority patent/US4670770A/en
Application filed by American Telephone and Telegraph Co Inc filed Critical American Telephone and Telegraph Co Inc
Publication of ES540478A0 publication Critical patent/ES540478A0/es
Publication of ES8700500A1 publication Critical patent/ES8700500A1/es
Expired legal-status Critical Current

Links

Classifications

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    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5222—Capacitive arrangements or effects of, or between wiring layers
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    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
ES540478A 1984-02-17 1985-02-15 Perfeccionamientos en dispositivos de circuitos integrados Expired ES8700500A1 (es)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US58126084A 1984-02-17 1984-02-17
US06/581,259 US4613891A (en) 1984-02-17 1984-02-17 Packaging microminiature devices
US06/581,336 USH208H (en) 1984-02-17 1984-02-17 Packaging microminiature devices
US06/582,079 US4670770A (en) 1984-02-21 1984-02-21 Integrated circuit chip-and-substrate assembly

Publications (2)

Publication Number Publication Date
ES540478A0 true ES540478A0 (es) 1986-11-16
ES8700500A1 ES8700500A1 (es) 1986-11-16

Family

ID=27504949

Family Applications (1)

Application Number Title Priority Date Filing Date
ES540478A Expired ES8700500A1 (es) 1984-02-17 1985-02-15 Perfeccionamientos en dispositivos de circuitos integrados

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EP (2) EP0172889A1 (es)
DE (1) DE3572421D1 (es)
ES (1) ES8700500A1 (es)
WO (1) WO1985003806A1 (es)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6281745A (ja) * 1985-10-05 1987-04-15 Fujitsu Ltd ウエハ−規模のｌｓｉ半導体装置とその製造方法
DE3718684A1 (de) * 1987-06-04 1988-12-22 Licentia Gmbh Halbleiterkoerper
FR2618255A1 (fr) * 1987-07-14 1989-01-20 Gen Electric Bloc de conditionnement pour le montage et l'interconnexion de puces semiconductrices.
FR2634322A1 (fr) * 1988-07-13 1990-01-19 Thomson Csf Module semi-conducteur actif hybride obtenu par reconfiguration physique de pastilles, interconnectees par films minces, et procede de fabrication correspondant
EP0448713B1 (en) * 1988-07-22 1993-10-27 Nippondenso Co., Ltd. Semiconductor device
US4989063A (en) * 1988-12-09 1991-01-29 The United States Of America As Represented By The Secretary Of The Air Force Hybrid wafer scale microcircuit integration
US5008213A (en) * 1988-12-09 1991-04-16 The United States Of America As Represented By The Secretary Of The Air Force Hybrid wafer scale microcircuit integration
EP0393220B1 (en) * 1989-04-20 1994-07-13 International Business Machines Corporation Integrated circuit package
US5032896A (en) * 1989-08-31 1991-07-16 Hughes Aircraft Company 3-D integrated circuit assembly employing discrete chips
DE59003592D1 (de) * 1989-09-29 1994-01-05 Siemens Ag Verfahren zur Herstellung eines Körpers aus Silizium.
US6864570B2 (en) 1993-12-17 2005-03-08 The Regents Of The University Of California Method and apparatus for fabricating self-assembling microstructures
JP3701542B2 (ja) * 2000-05-10 2005-09-28 シャープ株式会社 半導体装置およびその製造方法
FR2917234B1 (fr) 2007-06-07 2009-11-06 Commissariat Energie Atomique Dispositif multi composants integres dans une matrice semi-conductrice.
FR2934082B1 (fr) 2008-07-21 2011-05-27 Commissariat Energie Atomique Dispositif multi composants integres dans une matrice
FR2947948B1 (fr) 2009-07-09 2012-03-09 Commissariat Energie Atomique Plaquette poignee presentant des fenetres de visualisation

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US3918148A (en) * 1974-04-15 1975-11-11 Ibm Integrated circuit chip carrier and method for forming the same
GB2047466B (en) * 1979-02-24 1983-03-30 Int Computers Ltd Multi-level connection networks

Also Published As

Publication number Publication date
DE3572421D1 (en) 1989-09-21
EP0154431B1 (en) 1989-08-16
EP0154431A1 (en) 1985-09-11
EP0172889A1 (en) 1986-03-05
ES8700500A1 (es) 1986-11-16
WO1985003806A1 (en) 1985-08-29

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