ES8700500A1 - Perfeccionamientos en dispositivos de circuitos integrados - Google Patents
Perfeccionamientos en dispositivos de circuitos integradosInfo
- Publication number
- ES8700500A1 ES8700500A1 ES540478A ES540478A ES8700500A1 ES 8700500 A1 ES8700500 A1 ES 8700500A1 ES 540478 A ES540478 A ES 540478A ES 540478 A ES540478 A ES 540478A ES 8700500 A1 ES8700500 A1 ES 8700500A1
- Authority
- ES
- Spain
- Prior art keywords
- substrate
- integrated circuit
- circuit chip
- wells
- chips
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 abstract 5
- 239000013078 crystal Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 230000002093 peripheral effect Effects 0.000 abstract 1
Classifications
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5222—Capacitive arrangements or effects of, or between wiring layers
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- H01L23/147—Semiconductor insulating substrates
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- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
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- H01L23/5384—Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors
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Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
DISPOSITIVOS DE CIRCUITOS INTEGRADOS. SE TRATA DE UN DISPOSITIVO DE AL MENOS UN CIRCUITO INTEGRADO CONECTADO A UNA CIRCUITERIA LITOGRAFICAMENTE DEFINIDA EN UN SUSTRATO MONOCRISTALINO. AL MENOS UNA PARTE DEL CHIP Y DEL SUSTRATO TIENEN LA MISMA ESTRUCTURA CRISTALOGRAFICA, O BIEN SON MATERIALES ESENCIALMENTE IDENTICOS, SEMICONDUCTORES; EN PARTICULAR, SILICIO. LA CIRCUITERIA ELECTRICA COMPRENDE UN CONDUCTOR DE CORRIENTE Y OTRO A TIERRA, DISPONIENDOSE DE UN CAPACITOR DE DESACOPLAMIENTO METAL-OXIDO-SEMICONDUCTOR ENTRE AMBOS. EL SUSTRATO TIENE, AL MENOS, UNA DEPRESION SUPERFICIAL CON UNA PARED INCLINADA CONSECUENCIA DEL MORDENTADO CRISTALOGRAFICAMENTE ANISOTROPICO. EL CHIP PRESENTA UN LADO PORTADOR DE CIRCUITOS ENCARADO CON LA DEPRESION. PUEDEN UTILIZARSE VARIOS CHIPS INTERCONECTADOS POR CONDUCTORES SEPARADOS POR UN MATERIAL POLIMERO FOTODEFINIBLE. PUEDE DISPONERSE DE FIBRAS OPTICAS SOBRE LOS CHIPS.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US58126084A | 1984-02-17 | 1984-02-17 | |
US06/581,259 US4613891A (en) | 1984-02-17 | 1984-02-17 | Packaging microminiature devices |
US06/581,336 USH208H (en) | 1984-02-17 | 1984-02-17 | Packaging microminiature devices |
US06/582,079 US4670770A (en) | 1984-02-21 | 1984-02-21 | Integrated circuit chip-and-substrate assembly |
Publications (2)
Publication Number | Publication Date |
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ES540478A0 ES540478A0 (es) | 1986-11-16 |
ES8700500A1 true ES8700500A1 (es) | 1986-11-16 |
Family
ID=27504949
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES540478A Expired ES8700500A1 (es) | 1984-02-17 | 1985-02-15 | Perfeccionamientos en dispositivos de circuitos integrados |
Country Status (4)
Country | Link |
---|---|
EP (2) | EP0154431B1 (es) |
DE (1) | DE3572421D1 (es) |
ES (1) | ES8700500A1 (es) |
WO (1) | WO1985003806A1 (es) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6281745A (ja) * | 1985-10-05 | 1987-04-15 | Fujitsu Ltd | ウエハ−規模のlsi半導体装置とその製造方法 |
DE3718684A1 (de) * | 1987-06-04 | 1988-12-22 | Licentia Gmbh | Halbleiterkoerper |
FR2618255A1 (fr) * | 1987-07-14 | 1989-01-20 | Gen Electric | Bloc de conditionnement pour le montage et l'interconnexion de puces semiconductrices. |
FR2634322A1 (fr) * | 1988-07-13 | 1990-01-19 | Thomson Csf | Module semi-conducteur actif hybride obtenu par reconfiguration physique de pastilles, interconnectees par films minces, et procede de fabrication correspondant |
WO1990001215A1 (en) * | 1988-07-22 | 1990-02-08 | Nippondenso Co., Ltd. | Semiconductor device |
US5008213A (en) * | 1988-12-09 | 1991-04-16 | The United States Of America As Represented By The Secretary Of The Air Force | Hybrid wafer scale microcircuit integration |
US4989063A (en) * | 1988-12-09 | 1991-01-29 | The United States Of America As Represented By The Secretary Of The Air Force | Hybrid wafer scale microcircuit integration |
DE68916784T2 (de) * | 1989-04-20 | 1995-01-05 | Ibm | Integrierte Schaltungspackung. |
US5032896A (en) * | 1989-08-31 | 1991-07-16 | Hughes Aircraft Company | 3-D integrated circuit assembly employing discrete chips |
EP0419767B1 (de) * | 1989-09-29 | 1993-11-24 | Siemens Aktiengesellschaft | Verfahren zur Herstellung eines Körpers aus Silizium |
US6864570B2 (en) | 1993-12-17 | 2005-03-08 | The Regents Of The University Of California | Method and apparatus for fabricating self-assembling microstructures |
JP3701542B2 (ja) * | 2000-05-10 | 2005-09-28 | シャープ株式会社 | 半導体装置およびその製造方法 |
FR2917234B1 (fr) * | 2007-06-07 | 2009-11-06 | Commissariat Energie Atomique | Dispositif multi composants integres dans une matrice semi-conductrice. |
FR2934082B1 (fr) | 2008-07-21 | 2011-05-27 | Commissariat Energie Atomique | Dispositif multi composants integres dans une matrice |
FR2947948B1 (fr) | 2009-07-09 | 2012-03-09 | Commissariat Energie Atomique | Plaquette poignee presentant des fenetres de visualisation |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3918148A (en) * | 1974-04-15 | 1975-11-11 | Ibm | Integrated circuit chip carrier and method for forming the same |
GB2047466B (en) * | 1979-02-24 | 1983-03-30 | Int Computers Ltd | Multi-level connection networks |
-
1985
- 1985-02-15 EP EP85301014A patent/EP0154431B1/en not_active Expired
- 1985-02-15 WO PCT/US1985/000263 patent/WO1985003806A1/en not_active Application Discontinuation
- 1985-02-15 EP EP85901243A patent/EP0172889A1/en active Pending
- 1985-02-15 ES ES540478A patent/ES8700500A1/es not_active Expired
- 1985-02-15 DE DE8585301014T patent/DE3572421D1/de not_active Expired
Also Published As
Publication number | Publication date |
---|---|
EP0154431B1 (en) | 1989-08-16 |
DE3572421D1 (en) | 1989-09-21 |
EP0154431A1 (en) | 1985-09-11 |
WO1985003806A1 (en) | 1985-08-29 |
ES540478A0 (es) | 1986-11-16 |
EP0172889A1 (en) | 1986-03-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FD1A | Patent lapsed |
Effective date: 19970612 |