ES2135073T3 - Procedimiento para la obtencion de biscianoacrilatos. - Google Patents

Procedimiento para la obtencion de biscianoacrilatos.

Info

Publication number
ES2135073T3
ES2135073T3 ES95923211T ES95923211T ES2135073T3 ES 2135073 T3 ES2135073 T3 ES 2135073T3 ES 95923211 T ES95923211 T ES 95923211T ES 95923211 T ES95923211 T ES 95923211T ES 2135073 T3 ES2135073 T3 ES 2135073T3
Authority
ES
Spain
Prior art keywords
pct
sec
date
adhesives
biscianoacrylates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES95923211T
Other languages
English (en)
Inventor
Yuri Gololobov
Werner Gruber
Christian Nicolaisen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Henkel AG and Co KGaA
Original Assignee
Henkel AG and Co KGaA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel AG and Co KGaA filed Critical Henkel AG and Co KGaA
Application granted granted Critical
Publication of ES2135073T3 publication Critical patent/ES2135073T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C255/00—Carboxylic acid nitriles
    • C07C255/01—Carboxylic acid nitriles having cyano groups bound to acyclic carbon atoms
    • C07C255/23—Carboxylic acid nitriles having cyano groups bound to acyclic carbon atoms containing cyano groups and carboxyl groups, other than cyano groups, bound to the same unsaturated acyclic carbon skeleton
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01012—Magnesium [Mg]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01016—Sulfur [S]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01032—Germanium [Ge]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01067—Holmium [Ho]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)

Abstract

LOS BISCIANOACRILATOS SE OBTIENEN EN SOLUCION POR REACCION DE ACIDOS 2-CIANO-ACRILICOS O DE SUS ESTERES ALQUILICOS CON DIOLES EN PRESENCIA DE ACIDOS SULFONICOS COMO CATALIZADOR. LA MEZCLA REACTIVA SE TRATA SUSTITUYENDO EL DISOLVENTE AROMATICO CON UN DISOLVENTE ALIFATICO Y SE SOMETE DESPUES DOS VECES A UNA CRISTALIZACION FRACCIONADA. LOS BISCIANOACRILATOS OBTENIDOS SE CARACTERIZAN POR UNA ELEVADA PUREZA. POR TANTO SE PUEDEN UTILIZAR PARA LA FABRICACION DE PEGAMENTOS ESTABLES DE CIANOACRILATO. SU ADICION ELEVA LA RESISTENCIA TERMICA, LO QUE ES ESPECIALMENTE IMPORTANTE EN ELEMENTOS ELECTRICOS Y ELECTRONICOS.
ES95923211T 1994-06-06 1995-05-30 Procedimiento para la obtencion de biscianoacrilatos. Expired - Lifetime ES2135073T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4419740 1994-06-06

Publications (1)

Publication Number Publication Date
ES2135073T3 true ES2135073T3 (es) 1999-10-16

Family

ID=6519909

Family Applications (1)

Application Number Title Priority Date Filing Date
ES95923211T Expired - Lifetime ES2135073T3 (es) 1994-06-06 1995-05-30 Procedimiento para la obtencion de biscianoacrilatos.

Country Status (10)

Country Link
US (1) US6096848A (es)
EP (1) EP0764148B1 (es)
AT (1) ATE182328T1 (es)
BR (1) BR9507927A (es)
CA (1) CA2192383A1 (es)
DE (2) DE59506424D1 (es)
DK (1) DK0764148T3 (es)
ES (1) ES2135073T3 (es)
GR (1) GR3030843T3 (es)
WO (1) WO1995033708A1 (es)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19640202A1 (de) * 1996-09-30 1998-04-09 Henkel Kgaa Cyanacrylat-Klebstoff
DE19644332A1 (de) 1996-10-25 1998-04-30 Henkel Kgaa Fluoreszierender Cyanacrylatklebstoff
US6562181B2 (en) * 1999-06-11 2003-05-13 Lord Corporation Reactive adhesives and coatings with trifunctional olefinic monomers
US6245933B1 (en) 1999-11-19 2001-06-12 Closure Medical Corporation Transesterification method for making cyanoacrylates
US7341716B2 (en) * 2002-04-12 2008-03-11 Boston Scientific Scimed, Inc. Occlusive composition
US7659423B1 (en) * 2006-04-18 2010-02-09 Loctite (R&D) Limited Method of preparing electron deficient olefins in polar solvents
US7569719B1 (en) 2006-10-25 2009-08-04 Loctite (R&D) Limited Method of preparing electron deficient olefins
CN101528674B (zh) * 2006-10-25 2015-04-29 汉高知识产权及控股有限公司 亚胺*盐和使用该新的亚胺*盐制备缺电子烯烃的方法
US7718821B1 (en) 2006-12-19 2010-05-18 Loctite (R&D) Limited Method of preparing electron deficient olefins
KR101561712B1 (ko) * 2007-10-24 2015-10-19 헨켈 아이피 앤드 홀딩 게엠베하 활성화된 메틸렌 시약 및 그로부터 제조되는 경화가능한 조성물
US7973119B1 (en) 2007-10-24 2011-07-05 Loctite (R&D) Limited Adhesive systems using imines and salts thereof and precursurs to electron deficient olefins
US8686105B2 (en) 2007-10-24 2014-04-01 Henkel IP & Holding GmbH Adhesive systems using imines and salts thereof, precursors to electron deficient olefins and coreactants therefor
JP5639892B2 (ja) * 2007-10-24 2014-12-10 ヘンケル アイルランド リミテッド 電子欠損オレフィン
US8053589B1 (en) 2007-10-24 2011-11-08 Henkel Ireland Limited Imines and methods of preparing electron deficient olefins using such novel imines
US10196471B1 (en) 2008-10-24 2019-02-05 Henkel IP & Holding GmbH Curable composition having an electron deficient olefin
US8399698B1 (en) 2008-10-24 2013-03-19 Henkel Ireland Limited Substituted activated methylene reagents and methods of using such reagents to form electron deficient olefins
KR101517087B1 (ko) 2008-11-21 2015-05-04 헨켈 아이피 앤드 홀딩 게엠베하 열 분해성 중합체 코팅된 금속 분말
WO2010074095A1 (ja) 2008-12-25 2010-07-01 東亞合成株式会社 接着剤組成物
DE102009000861A1 (de) 2009-02-13 2010-08-19 Henkel Ag & Co. Kgaa Verfahren zur Herstellung von Cyanacrylsäureestern
DE102009027545A1 (de) 2009-07-08 2011-02-03 Henkel Ag & Co. Kgaa Verfahren zur Herstellung von Cyanacrylsäureestern in Gegenwart von Übergangsmetall-Katalysatoren
US10414839B2 (en) 2010-10-20 2019-09-17 Sirrus, Inc. Polymers including a methylene beta-ketoester and products formed therefrom
US9249265B1 (en) 2014-09-08 2016-02-02 Sirrus, Inc. Emulsion polymers including one or more 1,1-disubstituted alkene compounds, emulsion methods, and polymer compositions
US9828324B2 (en) 2010-10-20 2017-11-28 Sirrus, Inc. Methylene beta-diketone monomers, methods for making methylene beta-diketone monomers, polymerizable compositions and products formed therefrom
EP2753442B1 (en) 2011-09-06 2019-10-30 Henkel IP & Holding GmbH Di-or poly-functional electron deficient olefins coated metal powders for solder pastes
US9657120B1 (en) * 2011-09-06 2017-05-23 Henkel IP & Holding GmbH Cyanoacrylate compositions
CN103083718B (zh) * 2011-11-02 2015-06-10 中国人民解放军军事医学科学院毒物药物研究所 一种可生物降解的医用粘合剂及其制备方法和用途
JP6549038B2 (ja) 2012-11-30 2019-07-24 シラス・インコーポレイテッド エレクトロニクス適用のための複合組成物
US9315597B2 (en) 2014-09-08 2016-04-19 Sirrus, Inc. Compositions containing 1,1-disubstituted alkene compounds for preparing polymers having enhanced glass transition temperatures
US9567475B1 (en) 2016-06-03 2017-02-14 Sirrus, Inc. Coatings containing polyester macromers containing 1,1-dicarbonyl-substituted 1 alkenes
US10196481B2 (en) 2016-06-03 2019-02-05 Sirrus, Inc. Polymer and other compounds functionalized with terminal 1,1-disubstituted alkene monomer(s) and methods thereof
US9617377B1 (en) 2016-06-03 2017-04-11 Sirrus, Inc. Polyester macromers containing 1,1-dicarbonyl-substituted 1 alkenes
GB2558253B (en) 2016-12-23 2019-12-11 Henkel IP & Holding GmbH Process for preparing electron deficient olefins
GB2558256B (en) 2016-12-23 2019-12-18 Henkel IP & Holding GmbH Process for preparing electron deficient olefin precursors
GB2558262B (en) 2016-12-23 2019-05-15 Henkel IP & Holding GmbH Process for preparing electron deficient olefins
GB2558264B (en) 2016-12-23 2019-11-20 Henkel IP & Holding GmbH Process for preparing electron deficient olefins
GB2558260B (en) 2016-12-23 2019-11-20 Henkel IP & Holding GmbH Process for preparing electron deficient olefin precursors
GB2562107B (en) 2017-05-05 2021-08-11 Henkel IP & Holding GmbH Cyanoacrylate compositions
EP4086294A1 (en) 2021-05-07 2022-11-09 Bostik SA Two-part curable composition
EP4194523A1 (en) 2021-12-07 2023-06-14 Cuantum Medical Cosmetics, S.L. Cyanoacrylate adhesive composition
EP4209484B1 (en) 2022-07-11 2024-05-15 Aeardis Ltd. Process for preparing electron-deficient olefin monomers

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US3254111A (en) * 1960-12-09 1966-05-31 Eastman Kodak Co Esters of alpha-cyanoacrylic acid and process for the manufacture thereof
GB1206759A (en) * 1967-07-20 1970-09-30 Standard Telephones Cables Ltd Semiconductor devices
US3654340A (en) * 1970-08-27 1972-04-04 Minnesota Mining & Mfg Cyanoacrylate monomer process
DE2231561A1 (de) * 1972-06-28 1974-01-17 Kores Holding Zug Ag Reinigungsverfahren
US3975422A (en) * 1972-11-21 1976-08-17 Johnson & Johnson Preparation of bis (2-cyanoacrylate)monomers
SU726086A1 (ru) * 1977-07-25 1980-04-05 Ордена Ленина Институт Элементоорганических Соединений Ан Ссср Способ получени эфиров -цианакриловой кислоты
WO1994015907A1 (en) * 1993-01-11 1994-07-21 Eurotax Limited Process for the preparation of esters of 2-cyanoacrylic acid and use of the esters so prepared as adhesives

Also Published As

Publication number Publication date
CA2192383A1 (en) 1995-12-14
BR9507927A (pt) 1997-11-11
GR3030843T3 (en) 1999-11-30
EP0764148A1 (de) 1997-03-26
WO1995033708A1 (de) 1995-12-14
ATE182328T1 (de) 1999-08-15
DE59506424D1 (de) 1999-08-26
US6096848A (en) 2000-08-01
EP0764148B1 (de) 1999-07-21
DE19519958A1 (de) 1995-12-07
DK0764148T3 (da) 1999-12-27

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