ES2135073T3 - PROCEDURE FOR THE OBTAINING OF BISCIANOACRYLATES. - Google Patents

PROCEDURE FOR THE OBTAINING OF BISCIANOACRYLATES.

Info

Publication number
ES2135073T3
ES2135073T3 ES95923211T ES95923211T ES2135073T3 ES 2135073 T3 ES2135073 T3 ES 2135073T3 ES 95923211 T ES95923211 T ES 95923211T ES 95923211 T ES95923211 T ES 95923211T ES 2135073 T3 ES2135073 T3 ES 2135073T3
Authority
ES
Spain
Prior art keywords
pct
sec
date
adhesives
biscianoacrylates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES95923211T
Other languages
Spanish (es)
Inventor
Yuri Gololobov
Werner Gruber
Christian Nicolaisen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Henkel AG and Co KGaA
Original Assignee
Henkel AG and Co KGaA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel AG and Co KGaA filed Critical Henkel AG and Co KGaA
Application granted granted Critical
Publication of ES2135073T3 publication Critical patent/ES2135073T3/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C255/00—Carboxylic acid nitriles
    • C07C255/01—Carboxylic acid nitriles having cyano groups bound to acyclic carbon atoms
    • C07C255/23—Carboxylic acid nitriles having cyano groups bound to acyclic carbon atoms containing cyano groups and carboxyl groups, other than cyano groups, bound to the same unsaturated acyclic carbon skeleton
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01012—Magnesium [Mg]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01016—Sulfur [S]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01032—Germanium [Ge]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01067—Holmium [Ho]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Abstract

PCT No. PCT/EP95/02049 Sec. 371 Date Mar. 5, 1997 Sec. 102(e) Date Mar. 5, 1997 PCT Filed May 30, 1995 PCT Pub. No. WO95/33708 PCT Pub. Date Dec. 14, 1995Biscyanoacrylates in solution are prepared by reacting 2-cyanoacrylic acids or their alkyl esters with diols in the presence of sulfonic acids as catalysts. The reaction mixture is processed by substituting an aliphatic solvent for the aromatic solvent and is then subjected twice to fractional crystallization. The thus obtained biscyanoacrylates are very pure. They are therefore useful for producing storage stable cyanoacrylate adhesives. Their admixture increases the thermal resistance of the adhesives, which is particularly important in the case of electric and electronic components.
ES95923211T 1994-06-06 1995-05-30 PROCEDURE FOR THE OBTAINING OF BISCIANOACRYLATES. Expired - Lifetime ES2135073T3 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4419740 1994-06-06

Publications (1)

Publication Number Publication Date
ES2135073T3 true ES2135073T3 (en) 1999-10-16

Family

ID=6519909

Family Applications (1)

Application Number Title Priority Date Filing Date
ES95923211T Expired - Lifetime ES2135073T3 (en) 1994-06-06 1995-05-30 PROCEDURE FOR THE OBTAINING OF BISCIANOACRYLATES.

Country Status (10)

Country Link
US (1) US6096848A (en)
EP (1) EP0764148B1 (en)
AT (1) ATE182328T1 (en)
BR (1) BR9507927A (en)
CA (1) CA2192383A1 (en)
DE (2) DE59506424D1 (en)
DK (1) DK0764148T3 (en)
ES (1) ES2135073T3 (en)
GR (1) GR3030843T3 (en)
WO (1) WO1995033708A1 (en)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19640202A1 (en) * 1996-09-30 1998-04-09 Henkel Kgaa Cyanoacrylate adhesive
DE19644332A1 (en) 1996-10-25 1998-04-30 Henkel Kgaa Fluorescent cyanoacrylate adhesive
US6562181B2 (en) * 1999-06-11 2003-05-13 Lord Corporation Reactive adhesives and coatings with trifunctional olefinic monomers
US6245933B1 (en) 1999-11-19 2001-06-12 Closure Medical Corporation Transesterification method for making cyanoacrylates
US7341716B2 (en) * 2002-04-12 2008-03-11 Boston Scientific Scimed, Inc. Occlusive composition
US7659423B1 (en) * 2006-04-18 2010-02-09 Loctite (R&D) Limited Method of preparing electron deficient olefins in polar solvents
JP5382801B2 (en) * 2006-10-25 2014-01-08 ヘンケル アイルランド リミテッド Novel iminium salt and method for producing electron-deficient olefin using the same
US7569719B1 (en) 2006-10-25 2009-08-04 Loctite (R&D) Limited Method of preparing electron deficient olefins
US7718821B1 (en) 2006-12-19 2010-05-18 Loctite (R&D) Limited Method of preparing electron deficient olefins
CA2703603A1 (en) * 2007-10-24 2009-04-30 Loctite (R&D) Limited Electron deficient olefins
US7973119B1 (en) 2007-10-24 2011-07-05 Loctite (R&D) Limited Adhesive systems using imines and salts thereof and precursurs to electron deficient olefins
US8686105B2 (en) 2007-10-24 2014-04-01 Henkel IP & Holding GmbH Adhesive systems using imines and salts thereof, precursors to electron deficient olefins and coreactants therefor
US8053589B1 (en) 2007-10-24 2011-11-08 Henkel Ireland Limited Imines and methods of preparing electron deficient olefins using such novel imines
WO2009053482A2 (en) * 2007-10-24 2009-04-30 Loctite (R & D) Limited Activated methylene reagents and curable compositions prepared therefrom
US8399698B1 (en) 2008-10-24 2013-03-19 Henkel Ireland Limited Substituted activated methylene reagents and methods of using such reagents to form electron deficient olefins
US10196471B1 (en) 2008-10-24 2019-02-05 Henkel IP & Holding GmbH Curable composition having an electron deficient olefin
KR101517087B1 (en) 2008-11-21 2015-05-04 헨켈 아이피 앤드 홀딩 게엠베하 Thermally decomposable polymer coated metal powders
JP5267571B2 (en) 2008-12-25 2013-08-21 東亞合成株式会社 Adhesive composition
DE102009000861A1 (en) 2009-02-13 2010-08-19 Henkel Ag & Co. Kgaa Process for the preparation of cyanoacrylates
DE102009027545A1 (en) 2009-07-08 2011-02-03 Henkel Ag & Co. Kgaa Process for the preparation of cyanoacrylates in the presence of transition metal catalysts
US9249265B1 (en) 2014-09-08 2016-02-02 Sirrus, Inc. Emulsion polymers including one or more 1,1-disubstituted alkene compounds, emulsion methods, and polymer compositions
US9828324B2 (en) 2010-10-20 2017-11-28 Sirrus, Inc. Methylene beta-diketone monomers, methods for making methylene beta-diketone monomers, polymerizable compositions and products formed therefrom
US10414839B2 (en) 2010-10-20 2019-09-17 Sirrus, Inc. Polymers including a methylene beta-ketoester and products formed therefrom
US9657120B1 (en) 2011-09-06 2017-05-23 Henkel IP & Holding GmbH Cyanoacrylate compositions
WO2013036347A1 (en) 2011-09-06 2013-03-14 Henkel Corporation Di-or poly-functional electron deficient olefins coated metal powders for solder pastes
CN103083718B (en) * 2011-11-02 2015-06-10 中国人民解放军军事医学科学院毒物药物研究所 Biodegradable medical adhesive, and preparation method and purpose thereof
US10607910B2 (en) 2012-11-30 2020-03-31 Sirrus, Inc. Composite compositions for electronics applications
US9315597B2 (en) 2014-09-08 2016-04-19 Sirrus, Inc. Compositions containing 1,1-disubstituted alkene compounds for preparing polymers having enhanced glass transition temperatures
US10196481B2 (en) 2016-06-03 2019-02-05 Sirrus, Inc. Polymer and other compounds functionalized with terminal 1,1-disubstituted alkene monomer(s) and methods thereof
US9567475B1 (en) 2016-06-03 2017-02-14 Sirrus, Inc. Coatings containing polyester macromers containing 1,1-dicarbonyl-substituted 1 alkenes
US9617377B1 (en) 2016-06-03 2017-04-11 Sirrus, Inc. Polyester macromers containing 1,1-dicarbonyl-substituted 1 alkenes
GB2558262B (en) 2016-12-23 2019-05-15 Henkel IP & Holding GmbH Process for preparing electron deficient olefins
GB2558253B (en) 2016-12-23 2019-12-11 Henkel IP & Holding GmbH Process for preparing electron deficient olefins
GB2558256B (en) 2016-12-23 2019-12-18 Henkel IP & Holding GmbH Process for preparing electron deficient olefin precursors
GB2558264B (en) 2016-12-23 2019-11-20 Henkel IP & Holding GmbH Process for preparing electron deficient olefins
GB2558260B (en) 2016-12-23 2019-11-20 Henkel IP & Holding GmbH Process for preparing electron deficient olefin precursors
GB2562107B (en) 2017-05-05 2021-08-11 Henkel IP & Holding GmbH Cyanoacrylate compositions
EP4086294A1 (en) 2021-05-07 2022-11-09 Bostik SA Two-part curable composition
EP4194523A1 (en) 2021-12-07 2023-06-14 Cuantum Medical Cosmetics, S.L. Cyanoacrylate adhesive composition
EP4209484B1 (en) 2022-07-11 2024-05-15 Aeardis Ltd. Process for preparing electron-deficient olefin monomers

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US3254111A (en) * 1960-12-09 1966-05-31 Eastman Kodak Co Esters of alpha-cyanoacrylic acid and process for the manufacture thereof
GB1206759A (en) * 1967-07-20 1970-09-30 Standard Telephones Cables Ltd Semiconductor devices
US3654340A (en) * 1970-08-27 1972-04-04 Minnesota Mining & Mfg Cyanoacrylate monomer process
DE2231561A1 (en) * 1972-06-28 1974-01-17 Kores Holding Zug Ag Purification of methyl cyanacrylates - by crystallization to give better adhesive
US3975422A (en) * 1972-11-21 1976-08-17 Johnson & Johnson Preparation of bis (2-cyanoacrylate)monomers
SU726086A1 (en) * 1977-07-25 1980-04-05 Ордена Ленина Институт Элементоорганических Соединений Ан Ссср Method of preparing cyanacrylic acid esters
AU5714294A (en) * 1993-01-11 1994-08-15 Eurotax Limited Process for the preparation of esters of 2-cyanoacrylic acid and use of the esters so prepared as adhesives

Also Published As

Publication number Publication date
EP0764148B1 (en) 1999-07-21
EP0764148A1 (en) 1997-03-26
US6096848A (en) 2000-08-01
DE19519958A1 (en) 1995-12-07
BR9507927A (en) 1997-11-11
CA2192383A1 (en) 1995-12-14
DK0764148T3 (en) 1999-12-27
WO1995033708A1 (en) 1995-12-14
ATE182328T1 (en) 1999-08-15
GR3030843T3 (en) 1999-11-30
DE59506424D1 (en) 1999-08-26

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