ES2128302T3 - Placa de transferencia termica y pastilla de circuito integrado u otros montajes de componentes electricos que incluyen dicha placa. - Google Patents

Placa de transferencia termica y pastilla de circuito integrado u otros montajes de componentes electricos que incluyen dicha placa.

Info

Publication number
ES2128302T3
ES2128302T3 ES91104591T ES91104591T ES2128302T3 ES 2128302 T3 ES2128302 T3 ES 2128302T3 ES 91104591 T ES91104591 T ES 91104591T ES 91104591 T ES91104591 T ES 91104591T ES 2128302 T3 ES2128302 T3 ES 2128302T3
Authority
ES
Spain
Prior art keywords
heat
cooling fins
transfer plate
plate
electrical component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES91104591T
Other languages
English (en)
Inventor
Albert Nicholas Hopfer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Globe Motors Inc
Original Assignee
Labinal Components and Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Labinal Components and Systems Inc filed Critical Labinal Components and Systems Inc
Application granted granted Critical
Publication of ES2128302T3 publication Critical patent/ES2128302T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1076—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by sliding
    • H05K7/1084—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by sliding pin grid array package carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

UNA PLACA DE TRANSFERENCIA TERMAL PARA ELIMINAR EL CALOR DE UN DEPOSITO DE CALOR O ALETAS DE ENFRIAMIENTO, ESTA SITUADA ENTRE UN COMPONENTE ELECTRICO Y UNA SUPERFICIE DE SOPORTE. LA PLACA COMPRENDE UN MATERIAL CONDUCTOR DE CALOR QUE ESTA EN COMUNICACION TERMICA CON EL COMPONENTE ELECTRICO Y SE EXTIENDE MAS ALLA DEL COMPONENTE ELECTRICO PARA ESTABLECER UNA COMUNICACION TERMICA CON UN DEPOSITO DE CALOR O ALETAS ENFRIADORAS. EN UNA EXPRESION ESPECIFICA, LA PLACA DE TRANSFERENCIA TERMAL TIENE UNA PARTE DE BASE CON PAREDES LATERALES VERTICALES, QUE FORMAN UNA CUENCA PARA RECIBIR AL COMPONENTE ELECTRICO. LAS ALETAS DE ENFRIAMIENTO HORIZONTALES ESTAN SITUADAS EN LA PARTE SUPERIOR DE LAS PAREDES LATERALES. LAS ALETAS ENFRIADORAS PUEDEN SER DE CUALQUIER FORMA QUE PUEDA LLEVAR A CABO EL ENFRIAMIENTO O FUNCION DE DEPOSITO DE CALOR, Y PUEDEN ESTAR HECHAS CON ABERTURAS QUE PERMITAN AL AIRE CIRCULAR A TRAVES DE LAS ALETAS ENFRIADORAS. SIN EMBARGO, DADO SUS EFICACES CAPACIDADES DE TRANSFERENCIA DEL CALOR,LA PLACA DE TRANSFERENCIA DE CALOR PUEDE ESTAR CONECTADA TERMALMENTE A UN DISPOSITIVO SEPARADO DE DEPOSITO DE CALOR.
ES91104591T 1990-03-26 1991-03-23 Placa de transferencia termica y pastilla de circuito integrado u otros montajes de componentes electricos que incluyen dicha placa. Expired - Lifetime ES2128302T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US49902590A 1990-03-26 1990-03-26

Publications (1)

Publication Number Publication Date
ES2128302T3 true ES2128302T3 (es) 1999-05-16

Family

ID=23983499

Family Applications (1)

Application Number Title Priority Date Filing Date
ES91104591T Expired - Lifetime ES2128302T3 (es) 1990-03-26 1991-03-23 Placa de transferencia termica y pastilla de circuito integrado u otros montajes de componentes electricos que incluyen dicha placa.

Country Status (5)

Country Link
EP (1) EP0449150B1 (es)
JP (1) JP2554409B2 (es)
CA (1) CA2038998A1 (es)
DE (1) DE69130928T2 (es)
ES (1) ES2128302T3 (es)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5201866A (en) * 1992-02-03 1993-04-13 International Business Machines Corporation Structure for dissipation of heat having slidably engaged fins for conformal disposition against a heat generating surface
JP2901867B2 (ja) * 1993-03-19 1999-06-07 富士通株式会社 ヒートシンク及びヒートシンクの取付構造
SE9501455L (sv) 1995-04-20 1996-10-21 Ericsson Telefon Ab L M Telefonväxeltillhörigt korskopplingsarrangemang
SE504430C2 (sv) 1995-06-20 1997-02-10 Ericsson Telefon Ab L M Magasin
US6537082B2 (en) * 1997-10-23 2003-03-25 Cinch Connectors, Inc. Electrical connector
US5930114A (en) * 1997-10-23 1999-07-27 Thermalloy Incorporated Heat sink mounting assembly for surface mount electronic device packages
US5917703A (en) * 1998-04-17 1999-06-29 Advanced Interconnections Corporation Integrated circuit intercoupling component with heat sink
CN113835488B (zh) * 2021-09-24 2024-03-26 北京百度网讯科技有限公司 处理器模组及服务器

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL124607C (es) * 1961-11-21
US3917375A (en) * 1974-06-17 1975-11-04 Teradyne Inc Electrical connection apparatus
JPS533010U (es) * 1976-06-25 1978-01-12
US4190098A (en) * 1978-02-16 1980-02-26 Ncr Corporation Multiple component circuit board cooling device
US4373778A (en) * 1980-12-30 1983-02-15 International Business Machines Corporation Connector implemented with fiber optic means and site therein for integrated circuit chips
US4508405A (en) * 1982-04-29 1985-04-02 Augat Inc. Electronic socket having spring probe contacts
JPS5972739U (ja) * 1982-11-04 1984-05-17 富士通株式会社 放熱フイン
DE3335377A1 (de) * 1983-09-29 1985-04-11 Siemens AG, 1000 Berlin und 8000 München Einrichtung zum festhalten eines kuehlkoerpers auf einem integrierten baustein
GB2163287B (en) * 1984-08-07 1988-06-08 Aavid Eng Inc Electronic chip-carrier heat sinks

Also Published As

Publication number Publication date
JP2554409B2 (ja) 1996-11-13
EP0449150A3 (en) 1991-11-13
DE69130928T2 (de) 1999-07-29
CA2038998A1 (en) 1991-09-27
EP0449150A2 (en) 1991-10-02
JPH0595195A (ja) 1993-04-16
DE69130928D1 (de) 1999-04-08
EP0449150B1 (en) 1999-03-03

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