IT1162748B - Struttura di raffreddamento di dispositivi semiconduttori - Google Patents
Struttura di raffreddamento di dispositivi semiconduttoriInfo
- Publication number
- IT1162748B IT1162748B IT23939/79A IT2393979A IT1162748B IT 1162748 B IT1162748 B IT 1162748B IT 23939/79 A IT23939/79 A IT 23939/79A IT 2393979 A IT2393979 A IT 2393979A IT 1162748 B IT1162748 B IT 1162748B
- Authority
- IT
- Italy
- Prior art keywords
- tunnels
- integrated circuit
- circuit devices
- cooling structure
- semiconductive devices
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0102—Calcium [Ca]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S165/00—Heat exchange
- Y10S165/908—Fluid jets
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US05/923,592 US4203129A (en) | 1978-07-11 | 1978-07-11 | Bubble generating tunnels for cooling semiconductor devices |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| IT7923939A0 IT7923939A0 (it) | 1979-06-28 |
| IT1162748B true IT1162748B (it) | 1987-04-01 |
Family
ID=25448933
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IT23939/79A IT1162748B (it) | 1978-07-11 | 1979-06-28 | Struttura di raffreddamento di dispositivi semiconduttori |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US4203129A (it) |
| EP (1) | EP0007015B1 (it) |
| JP (1) | JPS5512798A (it) |
| CA (1) | CA1115822A (it) |
| DE (1) | DE2966253D1 (it) |
| IT (1) | IT1162748B (it) |
Families Citing this family (63)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4246597A (en) * | 1979-06-29 | 1981-01-20 | International Business Machines Corporation | Air cooled multi-chip module having a heat conductive piston spring loaded against the chips |
| US4449580A (en) * | 1981-06-30 | 1984-05-22 | International Business Machines Corporation | Vertical wall elevated pressure heat dissipation system |
| JPS58501648A (ja) * | 1981-12-29 | 1983-09-29 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | 冷却手段を備えた半導体組立体 |
| US4468717A (en) * | 1982-06-09 | 1984-08-28 | Sperry Corporation | Apparatus for cooling integrated circuit chips |
| US4450505A (en) * | 1982-06-09 | 1984-05-22 | Sperry Corporation | Apparatus for cooling integrated circuit chips |
| US4485429A (en) * | 1982-06-09 | 1984-11-27 | Sperry Corporation | Apparatus for cooling integrated circuit chips |
| US4514746A (en) * | 1983-12-01 | 1985-04-30 | Flakt Aktiebolag | Apparatus for cooling telecommunications equipment in a rack |
| JPS60136352A (ja) * | 1983-12-26 | 1985-07-19 | Hitachi Ltd | 集積回路チップの冷却装置 |
| JPS60229353A (ja) * | 1984-04-27 | 1985-11-14 | Hitachi Ltd | 熱伝達装置 |
| US4688150A (en) * | 1984-06-15 | 1987-08-18 | Texas Instruments Incorporated | High pin count chip carrier package |
| US4694378A (en) * | 1984-12-21 | 1987-09-15 | Hitachi, Ltd. | Apparatus for cooling integrated circuit chips |
| KR900001393B1 (en) * | 1985-04-30 | 1990-03-09 | Fujitsu Ltd | Evaporation cooling module for semiconductor device |
| US4748495A (en) * | 1985-08-08 | 1988-05-31 | Dypax Systems Corporation | High density multi-chip interconnection and cooling package |
| US4741385A (en) * | 1986-02-18 | 1988-05-03 | Iowa State University Research Foundation, Inc. | Gas jet impingement means and method |
| US4833567A (en) * | 1986-05-30 | 1989-05-23 | Digital Equipment Corporation | Integral heat pipe module |
| US4757370A (en) * | 1987-01-12 | 1988-07-12 | International Business Machines Corp. | Circuit package cooling technique with liquid film spreading downward across package surface without separation |
| EP0298372B1 (en) * | 1987-07-10 | 1993-01-13 | Hitachi, Ltd. | Semiconductor cooling apparatus |
| US4884169A (en) * | 1989-01-23 | 1989-11-28 | Technology Enterprises Company | Bubble generation in condensation wells for cooling high density integrated circuit chips |
| US5004973A (en) * | 1989-07-13 | 1991-04-02 | Thermal Management, Inc. | Method and apparatus for maintaining electrically operating device temperatures |
| JP2741255B2 (ja) * | 1989-08-18 | 1998-04-15 | 株式会社日立製作所 | 沸騰冷却用伝熱体 |
| NO894328L (no) * | 1989-10-30 | 1991-05-02 | Dolphin Server Technology As | Fremgangsmaate og anordning for kjoeling av elektroniske komponenter. |
| US5097385A (en) * | 1990-04-18 | 1992-03-17 | International Business Machines Corporation | Super-position cooling |
| US5198889A (en) * | 1990-06-30 | 1993-03-30 | Kabushiki Kaisha Toshiba | Cooling apparatus |
| US5106451A (en) * | 1990-11-15 | 1992-04-21 | International Business Machines Corporation | Heat sink and method of attachment |
| US5168348A (en) * | 1991-07-15 | 1992-12-01 | International Business Machines Corporation | Impingment cooled compliant heat sink |
| JPH05136305A (ja) * | 1991-11-08 | 1993-06-01 | Hitachi Ltd | 発熱体の冷却装置 |
| WO1993024983A1 (de) * | 1992-05-25 | 1993-12-09 | Mannesmann Ag | Elektrische maschine mit halbleiterventilen |
| US5339214A (en) * | 1993-02-12 | 1994-08-16 | Intel Corporation | Multiple-fan microprocessor cooling through a finned heat pipe |
| US5323818A (en) * | 1993-04-28 | 1994-06-28 | International Business Machines Corporation | Apparatus and process for dispensing thermal paste into a thermal conduction module cold plate |
| US5513070A (en) * | 1994-12-16 | 1996-04-30 | Intel Corporation | Dissipation of heat through keyboard using a heat pipe |
| FR2738446B1 (fr) * | 1995-08-30 | 1997-09-26 | Gec Alsthom Transport Sa | Procede et dispositif de filtrage d'un milieu liquide isolant electrique et caloriporteur et groupe d'electronique de puissance comportant un tel dispositif |
| US5665648A (en) * | 1995-12-21 | 1997-09-09 | Hughes Electronics | Integrated circuit spring contact fabrication methods |
| US6167948B1 (en) | 1996-11-18 | 2001-01-02 | Novel Concepts, Inc. | Thin, planar heat spreader |
| US5895972A (en) | 1996-12-31 | 1999-04-20 | Intel Corporation | Method and apparatus for cooling the backside of a semiconductor device using an infrared transparent heat slug |
| US6570247B1 (en) | 1997-12-30 | 2003-05-27 | Intel Corporation | Integrated circuit device having an embedded heat slug |
| US6214647B1 (en) | 1998-09-23 | 2001-04-10 | International Business Machines Corporation | Method for bonding heatsink to multiple-height chip |
| US6352104B1 (en) | 1999-10-19 | 2002-03-05 | International Business Machines Corporation | Heat sink with enhanced heat spreading and compliant interface for better heat transfer |
| US6448642B1 (en) * | 2000-01-27 | 2002-09-10 | William W. Bewley | Pressure-bonded heat-sink system |
| KR100438404B1 (ko) * | 2001-11-28 | 2004-07-02 | 동부전자 주식회사 | 반도체 패키지의 조립 공정 단축 및 접촉불량 방지방법 |
| US7385821B1 (en) | 2001-12-06 | 2008-06-10 | Apple Inc. | Cooling method for ICS |
| US7035104B2 (en) * | 2002-08-06 | 2006-04-25 | Mudawar Thermal Systems Inc. | Apparatus for heat transfer and critical heat flux enhancement |
| US6822465B1 (en) * | 2002-08-09 | 2004-11-23 | Unisys Corporation | Method of regulating the temperature of integrated circuit modules, using a heat exchanger with a face of a solid malleable metal and a release agent |
| US20060088746A1 (en) * | 2004-10-25 | 2006-04-27 | 3M Innovative Properties Company | Passive dual-phase cooling for fuel cell assemblies |
| US20060090881A1 (en) * | 2004-10-29 | 2006-05-04 | 3M Innovative Properties Company | Immersion cooling apparatus |
| US7581585B2 (en) | 2004-10-29 | 2009-09-01 | 3M Innovative Properties Company | Variable position cooling apparatus |
| US7394659B2 (en) * | 2004-11-19 | 2008-07-01 | International Business Machines Corporation | Apparatus and methods for cooling semiconductor integrated circuit package structures |
| KR100736891B1 (ko) * | 2006-01-13 | 2007-07-10 | 서울반도체 주식회사 | Ｌｅｄ 램프 |
| US7492594B2 (en) * | 2007-05-03 | 2009-02-17 | Hamilton Sundstrand Corporation | Electronic circuit modules cooling |
| US8369090B2 (en) | 2009-05-12 | 2013-02-05 | Iceotope Limited | Cooled electronic system |
| GB2467805C (en) * | 2009-05-12 | 2011-06-01 | Iceotope Ltd | Cooled electronic system |
| US11421921B2 (en) | 2012-09-07 | 2022-08-23 | David Lane Smith | Cooling electronic devices installed in a subsurface environment |
| SG11201501690SA (en) | 2012-09-07 | 2015-04-29 | David Smith | Apparatus and method for geothermally cooling electronic devices installed in a subsurface environment |
| US11191186B2 (en) | 2014-06-24 | 2021-11-30 | David Lane Smith | System and method for fluid cooling of electronic devices installed in an enclosure |
| US9699939B2 (en) | 2014-06-24 | 2017-07-04 | David Lane Smith | System and method for fluid cooling of electronic devices installed in a sealed enclosure |
| US9560789B2 (en) | 2014-06-24 | 2017-01-31 | David Lane Smith | System and method for fluid cooling of electronic devices installed in a sealed enclosure |
| US9258926B2 (en) | 2014-06-24 | 2016-02-09 | David Lane Smith | System and method for fluid cooling of electronic devices installed in a sealed enclosure |
| US11744041B2 (en) | 2014-06-24 | 2023-08-29 | David Lane Smith | System and method for fluid cooling of electronic devices installed in an enclosure |
| US9408332B2 (en) | 2014-06-24 | 2016-08-02 | David Lane Smith | System and method for fluid cooling of electronic devices installed in a sealed enclosure |
| US20160360639A1 (en) * | 2015-06-08 | 2016-12-08 | Advantech Co., Ltd. | Dynamic heat conduction system |
| GB2543549B (en) * | 2015-10-21 | 2020-04-15 | Andor Tech Limited | Thermoelectric Heat pump system |
| US10980151B2 (en) * | 2018-07-31 | 2021-04-13 | Hewlett Packard Enterprise Development Lp | Flexible heat transfer mechanism configurations |
| US20220015262A1 (en) * | 2020-07-09 | 2022-01-13 | Intel Corporation | Technologies for dynamic cooling in a multi-chip package with programmable impingement valves |
| JP7267494B1 (ja) * | 2022-09-29 | 2023-05-01 | Kddi株式会社 | サーバシステム |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3573569A (en) * | 1969-08-12 | 1971-04-06 | Gen Motors Corp | Controlled rectifier mounting assembly |
| DE2107549A1 (de) * | 1970-02-19 | 1971-09-02 | Texas Instruments Inc | Trager einer elektronischen Schaltung mit einem Sammelsystem mit Warmeleitungs eigenschaften fur alle Richtungen |
| US3852805A (en) * | 1973-06-18 | 1974-12-03 | Gen Electric | Heat-pipe cooled power semiconductor device assembly having integral semiconductor device evaporating surface unit |
| US3972063A (en) * | 1973-10-19 | 1976-07-27 | Mitsubishi Denki Kabushiki Kaisha | Vapor cooled semiconductor device enclosed in an envelope having a compression mechanism for holding said device within said envelope |
| JPS50108367U (it) * | 1974-02-14 | 1975-09-04 | ||
| JPS5241149B2 (it) * | 1974-03-16 | 1977-10-17 | ||
| US4028783A (en) * | 1975-03-26 | 1977-06-14 | King Label Company | Idler roll for printing press drying stage |
| US4027728A (en) * | 1975-03-31 | 1977-06-07 | Mitsubishi Denki Kabushiki Kaisha | Vapor cooling device for semiconductor device |
| US4045245A (en) * | 1976-01-05 | 1977-08-30 | Motorola, Inc. | Solar cell package |
| US4138692A (en) * | 1977-09-12 | 1979-02-06 | International Business Machines Corporation | Gas encapsulated cooling module |
-
1978
- 1978-07-11 US US05/923,592 patent/US4203129A/en not_active Expired - Lifetime
-
1979
- 1979-06-08 CA CA329,381A patent/CA1115822A/en not_active Expired
- 1979-06-18 EP EP79102007A patent/EP0007015B1/de not_active Expired
- 1979-06-18 DE DE7979102007T patent/DE2966253D1/de not_active Expired
- 1979-06-27 JP JP8026579A patent/JPS5512798A/ja active Granted
- 1979-06-28 IT IT23939/79A patent/IT1162748B/it active
Also Published As
| Publication number | Publication date |
|---|---|
| DE2966253D1 (en) | 1983-11-10 |
| JPS6211509B2 (it) | 1987-03-12 |
| EP0007015A1 (de) | 1980-01-23 |
| JPS5512798A (en) | 1980-01-29 |
| CA1115822A (en) | 1982-01-05 |
| US4203129A (en) | 1980-05-13 |
| IT7923939A0 (it) | 1979-06-28 |
| EP0007015B1 (de) | 1983-10-05 |
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