ES2113023T3 - Composiciones organosiloxanos electroconductoras cargadas de plata. - Google Patents
Composiciones organosiloxanos electroconductoras cargadas de plata.Info
- Publication number
- ES2113023T3 ES2113023T3 ES94115688T ES94115688T ES2113023T3 ES 2113023 T3 ES2113023 T3 ES 2113023T3 ES 94115688 T ES94115688 T ES 94115688T ES 94115688 T ES94115688 T ES 94115688T ES 2113023 T3 ES2113023 T3 ES 2113023T3
- Authority
- ES
- Spain
- Prior art keywords
- organosiloxanic
- organosiloxane compositions
- silver loaded
- compositions
- organosiloxane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/045—Polysiloxanes containing less than 25 silicon atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Silicon Polymers (AREA)
Abstract
LAS PROPIEDADES ELECTRICAS, PARTICULARMENTE LA RESISTENCIA AL CONTACTO Y LA RESISTIVIDAD DE VOLUMEN, DE MATERIALES PREPARADOS MEDIANTE LA POLIMERIZACION DE COMPOSICIONES DE ORGANOSILOXANO QUE CONTENGAN PLATA FINAMENTE DIVIDIDA COMO RELLENO ELECTROCONDUCTOR, SE MEJORAN SORPRENDENTEMENTE TRATANDO LAS PARTICULAS DE PLATA CON UN COMPUESTO DE ORGANOSILICIO ANTES DE INCORPORAR LAS PARTICULAS A DICHAS COMPOSICIONES.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27489393 | 1993-10-06 | ||
JP05274892A JP3130193B2 (ja) | 1993-10-06 | 1993-10-06 | シリコーンゴム用銀粉末、その製造方法、およびシリコーンゴム組成物 |
JP31126593A JP2868986B2 (ja) | 1993-10-06 | 1993-11-17 | 導電性シリコーンゴム組成物 |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2113023T3 true ES2113023T3 (es) | 1998-04-16 |
Family
ID=27336215
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES94115688T Expired - Lifetime ES2113023T3 (es) | 1993-10-06 | 1994-10-05 | Composiciones organosiloxanos electroconductoras cargadas de plata. |
Country Status (4)
Country | Link |
---|---|
US (2) | US6797772B2 (es) |
EP (1) | EP0647682B1 (es) |
DE (1) | DE69407137T2 (es) |
ES (1) | ES2113023T3 (es) |
Families Citing this family (47)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69407137T2 (de) * | 1993-10-06 | 1998-04-09 | Dow Corning Toray Silicone | Mit Silber gefüllte, elektrisch leitfähige Organosiloxan-Zusammensetzungen |
US6017587A (en) * | 1998-07-09 | 2000-01-25 | Dow Corning Corporation | Electrically conductive silicone compositions |
US6534581B1 (en) * | 2000-07-20 | 2003-03-18 | Dow Corning Corporation | Silicone composition and electrically conductive silicone adhesive formed therefrom |
US6361716B1 (en) * | 2000-07-20 | 2002-03-26 | Dow Corning Corporation | Silicone composition and electrically conductive silicone adhesive formed therefrom |
US6433055B1 (en) * | 2000-09-13 | 2002-08-13 | Dow Corning Corporation | Electrically conductive hot-melt silicone adhesive composition |
JP2003031028A (ja) | 2001-07-17 | 2003-01-31 | Shin Etsu Chem Co Ltd | 導電性組成物 |
JP3999994B2 (ja) * | 2002-04-03 | 2007-10-31 | 東レ・ダウコーニング株式会社 | 導電性シリコーンゴム組成物 |
CN100334134C (zh) * | 2002-05-01 | 2007-08-29 | 陶氏康宁公司 | 有机氢硅化合物 |
ATE363518T1 (de) * | 2002-05-01 | 2007-06-15 | Dow Corning | Zusammensetzungen mit verlängerter verarbeitungszeit |
WO2004015002A2 (en) * | 2002-08-07 | 2004-02-19 | Dow Corning Toray Silicone Co., Ltd. | Thermoconductive filler, thermocoductive silicone elastomer composition, and semiconductor devices |
JP4676671B2 (ja) * | 2002-11-21 | 2011-04-27 | 東レ・ダウコーニング株式会社 | 熱伝導性シリコーンエラストマー組成物 |
JP4568472B2 (ja) | 2002-11-29 | 2010-10-27 | 東レ・ダウコーニング株式会社 | 銀粉末の製造方法および硬化性シリコーン組成物 |
JP4925026B2 (ja) * | 2002-12-20 | 2012-04-25 | ダウ・コーニング・コーポレイション | 有機水素シリコン化合物由来の分岐ポリマーの調製方法 |
CN100347223C (zh) * | 2002-12-20 | 2007-11-07 | 陶氏康宁公司 | 由有机氢硅化合物得到的支化聚合物 |
ATE399830T1 (de) * | 2003-03-17 | 2008-07-15 | Dow Corning | Lösemittelfreie druckempfindliche siliconklebemittel mit verbesserter hoch- temperatur kohäsion |
TWI345576B (en) | 2003-11-07 | 2011-07-21 | Dow Corning Toray Silicone | Curable silicone composition and cured product thereof |
US7663582B2 (en) * | 2003-12-18 | 2010-02-16 | Palo Alto Research Center Incorporated | Disordered percolation layer for forming conductive islands on electric paper |
US8018410B2 (en) * | 2003-12-18 | 2011-09-13 | Palo Alto Research Center Incorporated | Flexible and transparent ground plane for electric paper |
US7357978B2 (en) * | 2003-12-18 | 2008-04-15 | Palo Alto Research Center Incorporated | Flexible electric paper display apparatus |
JP2005268405A (ja) * | 2004-03-17 | 2005-09-29 | Dow Corning Toray Co Ltd | 光学装置用金属ベース回路基板およびその製造方法 |
US7477443B2 (en) * | 2004-08-27 | 2009-01-13 | Palo Alto Research Center Incorporated | Disordered three-dimensional percolation technique for forming electric paper |
GB0427164D0 (en) * | 2004-12-11 | 2005-01-12 | Eastman Kodak Co | Conductive silver dispersions and uses thereof |
JP4931366B2 (ja) | 2005-04-27 | 2012-05-16 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物および電子部品 |
DE102005028250A1 (de) * | 2005-06-17 | 2006-12-28 | Siemens Ag | Leiterpaste zum Herstellen einer elektrischen Leiterbahn und Herstellungsverfahren der elektrischen Leiterbahn unter Verwendung der Leiterpaste |
WO2007015944A2 (en) * | 2005-07-28 | 2007-02-08 | Dow Corning Corporation | Release coating compositions having improved release forse profiles |
JP5285846B2 (ja) | 2006-09-11 | 2013-09-11 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物および電子部品 |
US7834083B2 (en) * | 2006-10-11 | 2010-11-16 | Samsung Electro-Mechanics Co., Ltd. | Nanocomposite composition comprising transparent nanoparticles |
US8243358B2 (en) * | 2006-11-24 | 2012-08-14 | The Hong Kong University Of Science & Technology | Constructing planar and three-dimensional microstructures with PDMS-based conducting composite |
AU2007345046A1 (en) * | 2007-01-24 | 2008-07-31 | Convatec Technologies Inc. | An elastomeric particle having an electrically conducting surface, a pressure sensor comprising said particles, a method for producing said sensor and a sensor system comprising sais sensors |
WO2009022436A1 (en) | 2007-08-16 | 2009-02-19 | Kazufumi Ogawa | Conductive paste and method for manufacturing the same, wiring using the conductive paste and method for manufacturing the same |
DE102007044789A1 (de) * | 2007-09-19 | 2009-04-02 | Wacker Chemie Ag | Selbsthaftende additionsvernetzende Siliconzusammensetzung |
TW200925199A (en) | 2007-10-11 | 2009-06-16 | Dow Corning Toray Co Ltd | Metal particle dispersion structure, microparticles comprising this structure, articles coated with this structure, and methods of producing the preceding |
SG187387A1 (en) | 2007-12-19 | 2013-02-28 | Lam Res Corp | Film adhesive for semiconductor vacuum processing apparatus |
KR101553422B1 (ko) | 2007-12-19 | 2015-09-15 | 램 리써치 코포레이션 | 플라즈마 처리 장치를 위한 복합 샤워헤드 전극 어셈블리 |
US20120061625A1 (en) * | 2010-09-09 | 2012-03-15 | Eckert Karissa L | Transparent conductive films, compositions, articles, and methods |
JP5304812B2 (ja) * | 2011-02-16 | 2013-10-02 | 信越化学工業株式会社 | 導電性パターン形成用組成物及び導電性パターンの形成方法 |
JP5704049B2 (ja) * | 2011-10-13 | 2015-04-22 | 信越化学工業株式会社 | 導電性回路形成方法 |
JP6065780B2 (ja) | 2012-08-30 | 2017-01-25 | 信越化学工業株式会社 | 導電性回路描画用インク組成物、導電性回路形成方法及びそれにより形成された導電性回路 |
US11130924B2 (en) | 2012-11-02 | 2021-09-28 | Ab Specialty Silicones, Llc | Silicone lubricant |
JP2015005564A (ja) * | 2013-06-19 | 2015-01-08 | 信越化学工業株式会社 | 導電性回路の形成方法、導電性回路及び導電性回路描画用インク組成物 |
EP3142550B1 (en) | 2014-05-13 | 2022-03-02 | Ecole Polytechnique Fédérale de Lausanne (EPFL) | Method for the electrical passivaton of conductive paths in general |
EP3150672B1 (en) | 2015-10-02 | 2018-05-09 | Shin-Etsu Chemical Co., Ltd. | Thermal conductive silicone composition and semiconductor device |
JP6607166B2 (ja) | 2016-10-31 | 2019-11-20 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物及び半導体装置 |
US11834554B2 (en) | 2018-05-15 | 2023-12-05 | Threebond Co., Ltd. | Conductive silicone composition and cured product thereof |
EP3653260A1 (en) | 2018-11-13 | 2020-05-20 | GTX medical B.V. | Sensor in clothing of limbs or footwear |
WO2023205050A1 (en) * | 2022-04-20 | 2023-10-26 | Elkem Silicones USA Corp. | New silicone foam which is air foamed and syntactic and article such as a secondary battery pack comprising said foam |
CN115491168A (zh) * | 2022-08-22 | 2022-12-20 | 振德医疗用品股份有限公司 | 一种超微多孔有机硅凝胶及其制备方法 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL129346C (es) * | 1966-06-23 | |||
JPS59170617A (ja) | 1983-03-18 | 1984-09-26 | Hitachi Ltd | 比例燃焼方法 |
US4801445A (en) | 1985-07-29 | 1989-01-31 | Shiseido Company Ltd. | Cosmetic compositions containing modified powder or particulate material |
US4604424A (en) * | 1986-01-29 | 1986-08-05 | Dow Corning Corporation | Thermally conductive polyorganosiloxane elastomer composition |
JPH01249880A (ja) * | 1988-03-30 | 1989-10-05 | Sekisui Chem Co Ltd | 異方導電性接着シート |
US5075038A (en) * | 1988-11-04 | 1991-12-24 | Dow Corning Corporation | Electrically conductive silicone compositions |
JP2808296B2 (ja) * | 1989-02-28 | 1998-10-08 | 東芝シリコーン株式会社 | プライマー組成物 |
JPH0734325B2 (ja) | 1989-07-17 | 1995-04-12 | 信越ポリマー株式会社 | 異方導電性接着剤用導電性粒子および異方導電性接着剤 |
JP2974700B2 (ja) | 1989-11-30 | 1999-11-10 | 東レ・ダウコーニング・シリコーン株式会社 | 導電性接着剤 |
US5040774A (en) | 1990-04-09 | 1991-08-20 | The Pullman Company | Hydraulic damping bushing |
JPH0826225B2 (ja) * | 1990-06-13 | 1996-03-13 | 東レ・ダウコーニング・シリコーン株式会社 | 加熱硬化型シリコーンエラストマー組成物 |
US5182318A (en) | 1991-01-10 | 1993-01-26 | Savin Roland R | Coating composition containing metal-coated microspheres exhibiting improved resistance to environmental attack of metallic substrates |
JP3134333B2 (ja) * | 1991-03-27 | 2001-02-13 | ジェイエスアール株式会社 | 導電性エラストマー用組成物 |
US5227093A (en) * | 1991-11-29 | 1993-07-13 | Dow Corning Corporation | Curable organosiloxane compositions yielding electrically conductive materials |
JPH05271548A (ja) * | 1992-03-27 | 1993-10-19 | Shin Etsu Chem Co Ltd | オルガノポリシロキサン組成物及びその硬化物の形成方法 |
DE69407137T2 (de) * | 1993-10-06 | 1998-04-09 | Dow Corning Toray Silicone | Mit Silber gefüllte, elektrisch leitfähige Organosiloxan-Zusammensetzungen |
TW334469B (en) * | 1995-08-04 | 1998-06-21 | Doconitele Silicon Kk | Curable organosiloxane compositions and semiconductor devices |
JP3950493B2 (ja) * | 1996-04-26 | 2007-08-01 | 東レ・ダウコーニング株式会社 | 導電性シリコーンゴム組成物、半導体装置の製造方法およびその半導体装置 |
EP0903801B1 (en) * | 1997-09-17 | 2004-02-04 | Murata Manufacturing Co., Ltd. | Nonreciprocal circuit device |
US6017587A (en) * | 1998-07-09 | 2000-01-25 | Dow Corning Corporation | Electrically conductive silicone compositions |
-
1994
- 1994-10-05 DE DE69407137T patent/DE69407137T2/de not_active Expired - Lifetime
- 1994-10-05 ES ES94115688T patent/ES2113023T3/es not_active Expired - Lifetime
- 1994-10-05 EP EP94115688A patent/EP0647682B1/en not_active Expired - Lifetime
-
2002
- 2002-01-18 US US10/052,760 patent/US6797772B2/en not_active Expired - Fee Related
-
2004
- 2004-04-13 US US10/822,888 patent/US7074849B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US7074849B2 (en) | 2006-07-11 |
US6797772B2 (en) | 2004-09-28 |
US20020099114A1 (en) | 2002-07-25 |
EP0647682B1 (en) | 1997-12-03 |
US20040192834A1 (en) | 2004-09-30 |
EP0647682A1 (en) | 1995-04-12 |
DE69407137T2 (de) | 1998-04-09 |
DE69407137D1 (de) | 1998-01-15 |
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