ES2106906T3 - Componente con circuitos integrados. - Google Patents
Componente con circuitos integrados.Info
- Publication number
- ES2106906T3 ES2106906T3 ES93103992T ES93103992T ES2106906T3 ES 2106906 T3 ES2106906 T3 ES 2106906T3 ES 93103992 T ES93103992 T ES 93103992T ES 93103992 T ES93103992 T ES 93103992T ES 2106906 T3 ES2106906 T3 ES 2106906T3
- Authority
- ES
- Spain
- Prior art keywords
- component
- integrated circuits
- recess
- integrated circuit
- carrier element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
- G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07743—External electrical contacts
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L24/19—Manufacturing methods of high density interconnect preforms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Credit Cards Or The Like (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Semiconductor Integrated Circuits (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
Abstract
LA INVENCION SE REFIERE A UN SOPORTE DE DATOS CON CIRCUITO DE CONMUTACION INTEGRADO Y UN PROCESO PARA SU FABRICACION. EN LA FABRICACION SE UTILIZA UN ELEMENTO SOPORTE EQUIPADO CON UN CIRCUITO DE CONMUTACION INTEGRADO Y CON SUPERFICIES DE CONTACTOS DISPUESTO EN UNA ESCOTADURA DEL MATERIAL BRUTO DE SOPORTE DE DATOS. PARA LA FIJACION EN LA ESCOTADURA SE SUPLEMENTA EL ELEMENTO SOPORTE CON UNA LAMINA DE PEGADO MEDIANTE FUSION. PARA LA PROTECCION DEL CIRCUITO DE CONMUTACION INTEGRADO DE CARGAS MECANICAS SE HA PREVISTO ENTRE EL CIRCUITO DE CONMUTACION Y LA LAMINA DE PEGADO MEDIANTE FUSION DE FORMA ADICIONAL UNA TIRA LAMINAR DE UN MATERIAL CON ALTO PODER DE DEFORMACION ELASTICA.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19863639630 DE3639630A1 (de) | 1986-11-20 | 1986-11-20 | Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2106906T3 true ES2106906T3 (es) | 1997-11-16 |
Family
ID=6314346
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES93103992T Expired - Lifetime ES2106906T3 (es) | 1986-11-20 | 1987-10-21 | Componente con circuitos integrados. |
ES87115451T Expired - Lifetime ES2049724T3 (es) | 1986-11-20 | 1987-10-21 | Soporte de datos con circuito integrado incorporado y procedimiento para su fabricacion. |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES87115451T Expired - Lifetime ES2049724T3 (es) | 1986-11-20 | 1987-10-21 | Soporte de datos con circuito integrado incorporado y procedimiento para su fabricacion. |
Country Status (7)
Country | Link |
---|---|
US (2) | US4897534A (es) |
EP (2) | EP0554916B1 (es) |
JP (1) | JP2591630B2 (es) |
AT (2) | ATE156613T1 (es) |
DE (3) | DE3639630A1 (es) |
ES (2) | ES2106906T3 (es) |
HK (1) | HK62395A (es) |
Families Citing this family (115)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3639630A1 (de) * | 1986-11-20 | 1988-06-01 | Gao Ges Automation Org | Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben |
DE3723547C2 (de) * | 1987-07-16 | 1996-09-26 | Gao Ges Automation Org | Trägerelement zum Einbau in Ausweiskarten |
FR2629236B1 (fr) * | 1988-03-22 | 1991-09-27 | Schlumberger Ind Sa | Procede de realisation d'une carte a memoire electronique et carte telle qu'obtenue par la mise en oeuvre dudit procede |
GB8901189D0 (en) * | 1989-01-19 | 1989-03-15 | Avery W & T Limited | Portable electronic token |
GB2225283A (en) * | 1988-10-07 | 1990-05-30 | De La Rue Co Plc | Laminated IC card |
USRE35385E (en) * | 1988-12-12 | 1996-12-03 | Sgs-Thomson Microelectronics, Sa. | Method for fixing an electronic component and its contacts to a support |
USRE35578E (en) * | 1988-12-12 | 1997-08-12 | Sgs-Thomson Microelectronics, Inc. | Method to install an electronic component and its electrical connections on a support, and product obtained thereby |
DE3912891A1 (de) * | 1989-04-19 | 1990-11-08 | Siemens Ag | Montagevorrichtung zur kontaktierung und zum einbau eines integrierten schaltkreissystems fuer eine wertkarte |
EP0417887B1 (en) * | 1989-09-09 | 1995-06-14 | Mitsubishi Denki Kabushiki Kaisha | IC card |
DE4007221A1 (de) * | 1990-03-07 | 1991-09-12 | Gao Ges Automation Org | Pruefkopf fuer kontaktflaechen von wertkarten mit eingelagertem halbleiterchip |
FR2662000A1 (fr) * | 1990-05-11 | 1991-11-15 | Philips Composants | Carte a microcircuit. |
US6067062A (en) * | 1990-09-05 | 2000-05-23 | Seiko Instruments Inc. | Light valve device |
US7198969B1 (en) * | 1990-09-24 | 2007-04-03 | Tessera, Inc. | Semiconductor chip assemblies, methods of making same and components for same |
US5148265A (en) | 1990-09-24 | 1992-09-15 | Ist Associates, Inc. | Semiconductor chip assemblies with fan-in leads |
US20010030370A1 (en) * | 1990-09-24 | 2001-10-18 | Khandros Igor Y. | Microelectronic assembly having encapsulated wire bonding leads |
US5679977A (en) * | 1990-09-24 | 1997-10-21 | Tessera, Inc. | Semiconductor chip assemblies, methods of making same and components for same |
DE4038126C2 (de) * | 1990-11-27 | 1993-12-16 | Mannesmann Ag | Verfahren und Vorrichtung zur Herstellung einer dekorierten Chip-Karte |
DE4040770C2 (de) * | 1990-12-19 | 1999-11-11 | Gao Ges Automation Org | Datenträger mit integriertem Schaltkreis |
JPH07182471A (ja) * | 1991-01-10 | 1995-07-21 | Nec Corp | Icカード |
FR2677785A1 (fr) * | 1991-06-17 | 1992-12-18 | Philips Composants | Procede de fabrication d'une carte a microcircuit. |
DE4122049A1 (de) * | 1991-07-03 | 1993-01-07 | Gao Ges Automation Org | Verfahren zum einbau eines traegerelements |
DE4126874C2 (de) * | 1991-08-14 | 1997-05-22 | Orga Kartensysteme Gmbh | Datenträger mit integriertem Schaltkreis |
DE9113601U1 (de) * | 1991-10-31 | 1993-03-04 | Schneider, Edgar, 8057 Günzenhausen | Multifunktionaler Schutzschild für mikroelektronische Schaltungen und Sensoren insbesondere für sog. Chip-Karten |
DE4142410C2 (de) * | 1991-12-20 | 2000-11-09 | Gao Ges Automation Org | Vorrichtung zum Herstellen von flachen Kunststoff-Formstücken, beispielsweise Ausweiskarten durch Spritzgießen |
ES2100701T5 (es) * | 1993-03-18 | 2002-03-01 | Nagraid Sa | Procedimiento de fabricacion de una tarjeta que comprende al menos un elemento electronico y tarjeta obtenida por tal procedimiento. |
DE4325458A1 (de) * | 1993-07-29 | 1995-02-09 | Orga Bond Technik Gmbh | Trägerelement für einen IC-Baustein |
US5477611A (en) * | 1993-09-20 | 1995-12-26 | Tessera, Inc. | Method of forming interface between die and chip carrier |
DE4344297A1 (de) * | 1993-12-23 | 1995-06-29 | Giesecke & Devrient Gmbh | Verfahren zur Herstellung von Ausweiskarten |
US5776796A (en) * | 1994-05-19 | 1998-07-07 | Tessera, Inc. | Method of encapsulating a semiconductor package |
US5834339A (en) | 1996-03-07 | 1998-11-10 | Tessera, Inc. | Methods for providing void-free layers for semiconductor assemblies |
KR100355209B1 (ko) * | 1994-09-22 | 2003-02-11 | 로무 가부시키가이샤 | 비접촉형ic카드및그제조방법 |
DE4443767A1 (de) * | 1994-12-08 | 1996-06-13 | Giesecke & Devrient Gmbh | Elektronisches Modul und Datenträger mit elektrischem Modul |
US5952713A (en) * | 1994-12-27 | 1999-09-14 | Takahira; Kenichi | Non-contact type IC card |
US5929517A (en) | 1994-12-29 | 1999-07-27 | Tessera, Inc. | Compliant integrated circuit package and method of fabricating the same |
DE19502398A1 (de) * | 1995-01-26 | 1996-08-01 | Giesecke & Devrient Gmbh | Verfahren zur Montage eines elektronischen Moduls in einem Kartenkörper |
US5671525A (en) * | 1995-02-13 | 1997-09-30 | Gemplus Card International | Method of manufacturing a hybrid chip card |
FR2731538B1 (fr) * | 1995-03-08 | 1997-04-11 | Solaic Sa | Procede pour fixer a un corps de carte electronique un module comportant un microcircuit et carte electronique comportant un module fixe selon ce procede |
DE19509233A1 (de) * | 1995-03-19 | 1996-09-26 | Melzer Maschinenbau Gmbh | Verfahren zum Herstellen von Elektronik-Komponenten enthaltenden Kunststoffkarten |
US5975420A (en) * | 1995-04-13 | 1999-11-02 | Dai Nippon Printing Co., Ltd. | Apparatus and method of manufacturing an integrated circuit (IC) card with a protective IC module |
FR2735257B1 (fr) * | 1995-06-09 | 1997-08-29 | Solaic Sa | Carte laminee a circuit integre |
JP4015717B2 (ja) * | 1995-06-29 | 2007-11-28 | 日立マクセル株式会社 | 情報担体の製造方法 |
DE19528730A1 (de) * | 1995-08-04 | 1997-02-06 | Giesecke & Devrient Gmbh | Verfahren zur Herstellung eines Datenträgers |
DE19535324C1 (de) * | 1995-09-22 | 1997-01-23 | Siemens Ag | Chipkarte |
US6072698A (en) * | 1995-09-27 | 2000-06-06 | Siemens Aktiengesellschaft | Chip module with heat insulation for incorporation into a chip card |
DE19535989C3 (de) * | 1995-09-27 | 2003-03-27 | Siemens Ag | Chipmodul |
US5817207A (en) | 1995-10-17 | 1998-10-06 | Leighton; Keith R. | Radio frequency identification card and hot lamination process for the manufacture of radio frequency identification cards |
US5703350A (en) * | 1995-10-31 | 1997-12-30 | Lucent Technologies Inc. | Data carriers having an integrated circuit unit |
DE19541039B4 (de) * | 1995-11-03 | 2006-03-16 | Assa Abloy Identification Technology Group Ab | Chip-Modul sowie Verfahren zu dessen Herstellung |
FR2744270A1 (fr) * | 1996-01-30 | 1997-08-01 | Solaic Sa | Carte a memoire et procede de fabrication d'une telle carte |
DE19703990A1 (de) * | 1997-02-03 | 1998-08-06 | Giesecke & Devrient Gmbh | Modular aufgebauter, elektronischer Datenträger |
FR2769130B1 (fr) * | 1997-09-30 | 2001-06-08 | Thomson Csf | Procede d'enrobage d'une puce electronique et carte electronique comportant au moins une puce enrobee selon ce procede |
DE19861187B4 (de) * | 1998-02-09 | 2006-01-19 | Peter Kammer | Vorrichtung zum kontinuierlichen Laminieren |
US6161761A (en) * | 1998-07-09 | 2000-12-19 | Motorola, Inc. | Card assembly having a loop antenna formed of a bare conductor and method for manufacturing the card assembly |
JP2000099678A (ja) * | 1998-09-18 | 2000-04-07 | Hitachi Ltd | Icカード及びその製造方法 |
FR2789505B1 (fr) * | 1999-02-08 | 2001-03-09 | Gemplus Card Int | Procede de fabrication de support de memorisation portable de type carte a puce |
US6179210B1 (en) * | 1999-02-09 | 2001-01-30 | Motorola, Inc. | Punch out pattern for hot melt tape used in smartcards |
US6214640B1 (en) | 1999-02-10 | 2001-04-10 | Tessera, Inc. | Method of manufacturing a plurality of semiconductor packages |
FR2793330B1 (fr) * | 1999-05-06 | 2001-08-10 | Oberthur Card Systems Sas | Procede de montage d'un microcircuit dans une cavite d'une carte formant support et carte ainsi obtenue |
DE19921230B4 (de) * | 1999-05-07 | 2009-04-02 | Giesecke & Devrient Gmbh | Verfahren zum Handhaben von gedünnten Chips zum Einbringen in Chipkarten |
FR2794264B1 (fr) * | 1999-05-27 | 2001-11-02 | Gemplus Card Int | Adaptateur pour dispositif electronique portable a circuit integre, de type carte a puce, d'un format reduit par rapport au format standard d'une mini-carte |
FR2795203B1 (fr) * | 1999-06-15 | 2001-08-31 | Gemplus Card Int | Module comportant au moins une puce et son interface de communication, objet comportant un module et procede de realisation desdits modules |
DE19929912A1 (de) * | 1999-06-29 | 2001-01-18 | Orga Kartensysteme Gmbh | Trägerelement für einen IC-Baustein |
FR2799857A1 (fr) * | 1999-10-14 | 2001-04-20 | Gemplus Card Int | Procede pour le renforcement d'un module de circuit integre de carte a puce |
FI112288B (fi) | 2000-01-17 | 2003-11-14 | Rafsec Oy | Menetelmä älytarrasyöttörainan valmistamiseksi |
FI112121B (fi) * | 2000-12-11 | 2003-10-31 | Rafsec Oy | Älytarraraina, menetelmä sen valmistamiseksi, menetelmä kantorainan valmistamiseksi ja älytarrarainan älytarran rakenneosa |
FR2817832A1 (fr) * | 2000-12-12 | 2002-06-14 | Schlumberger Systems & Service | Supports d'informations en forme de plaques emballes en lot, procede et installation d'emballage |
AU2002226093A1 (en) * | 2000-12-15 | 2002-06-24 | Electrox Corp. | Process for the manufacture of novel, inexpensive radio frequency identificationdevices |
DE10109993A1 (de) * | 2001-03-01 | 2002-09-05 | Giesecke & Devrient Gmbh | Verfahren zur Herstellung eines Moduls |
DE10111028A1 (de) * | 2001-03-07 | 2002-09-19 | Infineon Technologies Ag | Chipkartenmodul |
FI117331B (fi) | 2001-07-04 | 2006-09-15 | Rafsec Oy | Menetelmä ruiskuvaletun tuotteen valmistamiseksi |
JP2003037124A (ja) * | 2001-07-24 | 2003-02-07 | Dainippon Printing Co Ltd | 半導体パッケージの製造方法 |
DE10145752B4 (de) * | 2001-09-17 | 2004-09-02 | Infineon Technologies Ag | Nicht-leitendes, ein Band oder einen Nutzen bildendes Substrat, auf dem eine Vielzahl von Trägerelementen ausgebildet ist |
US6977440B2 (en) * | 2001-10-09 | 2005-12-20 | Tessera, Inc. | Stacked packages |
US7335995B2 (en) * | 2001-10-09 | 2008-02-26 | Tessera, Inc. | Microelectronic assembly having array including passive elements and interconnects |
AU2002337834A1 (en) * | 2001-10-09 | 2003-04-22 | Tessera, Inc. | Stacked packages |
DE10216652A1 (de) * | 2002-04-15 | 2003-10-23 | Orga Kartensysteme Gmbh | Spritzgussverfahren zur Herstellung einer Chipkarte und nach diesem Verfahren hergestellte Chipkarte |
JP4194298B2 (ja) * | 2002-05-17 | 2008-12-10 | キヤノン株式会社 | 情報記憶媒体、ユニット、プロセスカートリッジ、現像カートリッジおよび電子写真画像形成装置 |
EP1376462A1 (en) * | 2002-06-19 | 2004-01-02 | SCHLUMBERGER Systèmes | Method for manufacturing a tape |
US20040105244A1 (en) * | 2002-08-06 | 2004-06-03 | Ilyas Mohammed | Lead assemblies with offset portions and microelectronic assemblies with leads having offset portions |
GB2397272B (en) * | 2003-01-15 | 2006-11-15 | Hewlett Packard Co | Secure physical documents and methods and apparatus for publishing and reading them |
US7712675B2 (en) * | 2003-01-15 | 2010-05-11 | Hewlett-Packard Development Company, L.P. | Physical items for holding data securely, and methods and apparatus for publishing and reading them |
DE10327746A1 (de) * | 2003-06-18 | 2005-01-05 | Giesecke & Devrient Gmbh | Verfahren zum Fixieren einer Beschichtung auf einem Trägerband |
DE10361538A1 (de) * | 2003-12-23 | 2005-07-28 | Tesa Ag | Schmelzkleber zur Implantierung von elektrischen Modulen in einen Kartenkörper |
JP4334335B2 (ja) * | 2003-12-24 | 2009-09-30 | 三洋電機株式会社 | 混成集積回路装置の製造方法 |
US20150287660A1 (en) | 2007-01-05 | 2015-10-08 | Semiconductor Energy Laboratory Co., Ltd. | Laminating system, ic sheet, scroll of ic sheet, and method for manufacturing ic chip |
EP1655691A1 (en) * | 2004-11-08 | 2006-05-10 | Axalto SA | A smart card micro-electronic module manufacturing method |
US20060232589A1 (en) * | 2005-04-19 | 2006-10-19 | Microsoft Corporation | Uninterrupted execution of active animation sequences in orphaned rendering objects |
KR100651563B1 (ko) * | 2005-07-07 | 2006-11-29 | 삼성전기주식회사 | 전자부품이 내장된 배선기판의 제조방법 |
US8267327B2 (en) * | 2007-02-17 | 2012-09-18 | Qsecure, Inc. | Payment card manufacturing technology |
EP2034429A1 (en) * | 2007-09-05 | 2009-03-11 | Assa Abloy AB | Manufacturing method for a card and card obtained by said method |
DE102009023405A1 (de) * | 2009-05-29 | 2010-12-02 | Giesecke & Devrient Gmbh | Verfahren zur Herstellung tragbarer Datenträger |
DE102010011517A1 (de) * | 2010-03-15 | 2011-09-15 | Smartrac Ip B.V. | Laminataufbau für eine Chipkarte und Verfahren zu dessen Herstellung |
US8649820B2 (en) | 2011-11-07 | 2014-02-11 | Blackberry Limited | Universal integrated circuit card apparatus and related methods |
USD703208S1 (en) | 2012-04-13 | 2014-04-22 | Blackberry Limited | UICC apparatus |
US8936199B2 (en) | 2012-04-13 | 2015-01-20 | Blackberry Limited | UICC apparatus and related methods |
USD701864S1 (en) * | 2012-04-23 | 2014-04-01 | Blackberry Limited | UICC apparatus |
WO2014045139A1 (en) | 2012-09-18 | 2014-03-27 | Assa Abloy Ab | Method of protecting an electrical component in a laminate |
USD707682S1 (en) * | 2012-12-05 | 2014-06-24 | Logomotion, S.R.O. | Memory card |
FR2999753B1 (fr) * | 2012-12-13 | 2015-02-13 | Oberthur Technologies | Procede de fabrication par lamination en continu de cartes a microcircuit du type a contact |
USD759022S1 (en) | 2013-03-13 | 2016-06-14 | Nagrastar Llc | Smart card interface |
USD758372S1 (en) | 2013-03-13 | 2016-06-07 | Nagrastar Llc | Smart card interface |
US9888283B2 (en) | 2013-03-13 | 2018-02-06 | Nagrastar Llc | Systems and methods for performing transport I/O |
US9647997B2 (en) | 2013-03-13 | 2017-05-09 | Nagrastar, Llc | USB interface for performing transport I/O |
USD729808S1 (en) * | 2013-03-13 | 2015-05-19 | Nagrastar Llc | Smart card interface |
EP3062266B1 (en) * | 2013-10-22 | 2020-10-14 | Toppan Printing Co., Ltd. | Ic module, ic card, and ic module substrate |
USD780763S1 (en) | 2015-03-20 | 2017-03-07 | Nagrastar Llc | Smart card interface |
USD864968S1 (en) | 2015-04-30 | 2019-10-29 | Echostar Technologies L.L.C. | Smart card interface |
USD798868S1 (en) * | 2015-08-20 | 2017-10-03 | Isaac S. Daniel | Combined subscriber identification module and storage card |
CN105184357B (zh) * | 2015-10-09 | 2018-01-19 | 青岛融佳安全印务有限公司 | 一种社会保障复合卡 |
FR3047101B1 (fr) | 2016-01-26 | 2022-04-01 | Linxens Holding | Procede de fabrication d’un module de carte a puce et d’une carte a puce |
DE102016107031B4 (de) | 2016-04-15 | 2019-06-13 | Infineon Technologies Ag | Laminatpackung von Chip auf Träger und in Kavität, Anordnung diese umfassend und Verfahren zur Herstellung |
FR3063555B1 (fr) * | 2017-03-03 | 2021-07-09 | Linxens Holding | Carte a puce et procede de fabrication d’une carte a puce |
FR3065057A1 (fr) * | 2017-04-11 | 2018-10-12 | Valeo Vision | Dispositif lumineux avec contact electrique entre la glace et le boitier |
JP1647725S (es) * | 2018-02-01 | 2019-12-09 | ||
USD930000S1 (en) | 2018-10-12 | 2021-09-07 | Huawei Technologies Co., Ltd. | Memory card |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4222516A (en) * | 1975-12-31 | 1980-09-16 | Compagnie Internationale Pour L'informatique Cii-Honeywell Bull | Standardized information card |
DE2920012C2 (de) * | 1979-05-17 | 1988-09-29 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Ausweiskarte mit IC-Baustein und Verfahren zur Herstellung einer derartigen Ausweiskarte |
DE3029939A1 (de) * | 1980-08-07 | 1982-03-25 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Ausweiskarte mit ic-baustein und verfahren zu ihrer herstellung |
DE3123198C2 (de) * | 1980-12-08 | 1993-10-07 | Gao Ges Automation Org | Trägerelemente für einen IC-Baustein |
DE3153768C2 (de) * | 1981-04-14 | 1995-11-09 | Gao Ges Automation Org | Ausweiskarte |
DE3151408C1 (de) * | 1981-12-24 | 1983-06-01 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Ausweiskarte mit einem IC-Baustein |
FR2527036A1 (fr) * | 1982-05-14 | 1983-11-18 | Radiotechnique Compelec | Procede pour connecter un semiconducteur a des elements d'un support, notamment d'une carte portative |
JPS6056573U (ja) * | 1983-09-28 | 1985-04-20 | 共同印刷株式会社 | Idカ−ド |
DE3338597A1 (de) * | 1983-10-24 | 1985-05-02 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben |
DE3420051A1 (de) * | 1984-05-29 | 1985-12-05 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Datentraeger mit ic-baustein und verfahren zur herstellung eines derartigen datentraegers |
JPS60252992A (ja) * | 1984-05-30 | 1985-12-13 | Toshiba Corp | Icカ−ド |
US4727246A (en) * | 1984-08-31 | 1988-02-23 | Casio Computer Co., Ltd. | IC card |
JPS61123990A (ja) * | 1984-11-05 | 1986-06-11 | Casio Comput Co Ltd | Icカ−ド |
CH661808A5 (fr) * | 1985-01-21 | 1987-08-14 | Lupa Finances | Carte munie d'un microprocesseur et/ou d'au moins une memoire electronique. |
FR2579798B1 (fr) * | 1985-04-02 | 1990-09-28 | Ebauchesfabrik Eta Ag | Procede de fabrication de modules electroniques pour cartes a microcircuits et modules obtenus selon ce procede |
FR2581480A1 (fr) * | 1985-04-10 | 1986-11-07 | Ebauches Electroniques Sa | Unite electronique notamment pour carte a microcircuits et carte comprenant une telle unite |
FR2580416B1 (fr) * | 1985-04-12 | 1987-06-05 | Radiotechnique Compelec | Procede et dispositif pour fabriquer une carte d'identification electronique |
JPS62214998A (ja) * | 1986-03-17 | 1987-09-21 | 三菱電機株式会社 | 薄型半導体カ−ド |
US4717438A (en) * | 1986-09-29 | 1988-01-05 | Monarch Marking Systems, Inc. | Method of making tags |
DE3639630A1 (de) * | 1986-11-20 | 1988-06-01 | Gao Ges Automation Org | Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben |
-
1986
- 1986-11-20 DE DE19863639630 patent/DE3639630A1/de not_active Withdrawn
-
1987
- 1987-10-21 EP EP93103992A patent/EP0554916B1/de not_active Revoked
- 1987-10-21 ES ES93103992T patent/ES2106906T3/es not_active Expired - Lifetime
- 1987-10-21 EP EP87115451A patent/EP0268830B1/de not_active Expired - Lifetime
- 1987-10-21 AT AT93103992T patent/ATE156613T1/de not_active IP Right Cessation
- 1987-10-21 DE DE3752101T patent/DE3752101D1/de not_active Revoked
- 1987-10-21 AT AT87115451T patent/ATE100615T1/de not_active IP Right Cessation
- 1987-10-21 DE DE87115451T patent/DE3788856D1/de not_active Expired - Fee Related
- 1987-10-21 ES ES87115451T patent/ES2049724T3/es not_active Expired - Lifetime
- 1987-11-06 US US07/117,541 patent/US4897534A/en not_active Expired - Lifetime
- 1987-11-20 JP JP62293870A patent/JP2591630B2/ja not_active Expired - Lifetime
-
1989
- 1989-10-26 US US07/426,854 patent/US5055913A/en not_active Expired - Fee Related
-
1995
- 1995-04-27 HK HK62395A patent/HK62395A/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
ATE100615T1 (de) | 1994-02-15 |
ATE156613T1 (de) | 1997-08-15 |
JPS63212594A (ja) | 1988-09-05 |
DE3639630A1 (de) | 1988-06-01 |
DE3788856D1 (de) | 1994-03-03 |
DE3752101D1 (de) | 1997-09-11 |
HK62395A (en) | 1995-05-05 |
JP2591630B2 (ja) | 1997-03-19 |
EP0554916A2 (de) | 1993-08-11 |
EP0554916B1 (de) | 1997-08-06 |
US4897534A (en) | 1990-01-30 |
EP0554916A3 (es) | 1994-03-23 |
EP0268830B1 (de) | 1994-01-19 |
US5055913A (en) | 1991-10-08 |
ES2049724T3 (es) | 1994-05-01 |
EP0268830A2 (de) | 1988-06-01 |
EP0268830A3 (en) | 1989-03-08 |
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