IT1138586B - Circuito stampato e relativo procedimento di fabbricazione - Google Patents
Circuito stampato e relativo procedimento di fabbricazioneInfo
- Publication number
- IT1138586B IT1138586B IT8123851A IT2385181A IT1138586B IT 1138586 B IT1138586 B IT 1138586B IT 8123851 A IT8123851 A IT 8123851A IT 2385181 A IT2385181 A IT 2385181A IT 1138586 B IT1138586 B IT 1138586B
- Authority
- IT
- Italy
- Prior art keywords
- printed circuit
- manufacturing procedure
- related manufacturing
- procedure
- printed
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09981—Metallised walls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/063—Lamination of preperforated insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4685—Manufacturing of cross-over conductors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8019462A FR2490059A1 (fr) | 1980-09-09 | 1980-09-09 | Circuit imprime et son procede de fabrication |
Publications (2)
Publication Number | Publication Date |
---|---|
IT8123851A0 IT8123851A0 (it) | 1981-09-09 |
IT1138586B true IT1138586B (it) | 1986-09-17 |
Family
ID=9245779
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT8123851A IT1138586B (it) | 1980-09-09 | 1981-09-09 | Circuito stampato e relativo procedimento di fabbricazione |
Country Status (11)
Country | Link |
---|---|
EP (1) | EP0059206B1 (it) |
JP (1) | JPS57501353A (it) |
AU (1) | AU7537981A (it) |
BE (1) | BE890272A (it) |
CA (1) | CA1171549A (it) |
DK (1) | DK204982A (it) |
ES (1) | ES8302403A1 (it) |
FR (1) | FR2490059A1 (it) |
IT (1) | IT1138586B (it) |
NO (1) | NO821481L (it) |
WO (1) | WO1982000938A1 (it) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2527036A1 (fr) * | 1982-05-14 | 1983-11-18 | Radiotechnique Compelec | Procede pour connecter un semiconducteur a des elements d'un support, notamment d'une carte portative |
US4747211A (en) * | 1987-02-09 | 1988-05-31 | Sheldahl, Inc. | Method and apparatus for preparing conductive screened through holes employing metallic plated polymer thick films |
IT1224236B (it) * | 1988-05-03 | 1990-09-26 | Cisel Spa | Circuito elettrico, per macchine elettroniche, stampato serigraficamente su pellicola in poliestere, avente struttura multistrato |
IE940943A1 (en) * | 1993-12-09 | 1995-06-14 | Methode Electronics Inc | Printed plastic circuits and contacts and method for making¹same |
IT1396077B1 (it) * | 2009-10-16 | 2012-11-09 | Automotive Lighting Italia Spa | Dispositivo di illuminazione per veicoli, in particolare autoveicoli, utilizzante diodi led |
DE102010040867A1 (de) * | 2010-09-16 | 2012-03-22 | Robert Bosch Gmbh | Elektronikbauteil mit verbesserter Leitungsstruktur |
WO2020086863A1 (en) * | 2018-10-25 | 2020-04-30 | Jabil Inc. | Printing of multilayer circuits on graphics |
CN118039460B (zh) * | 2024-04-15 | 2024-06-28 | 绵阳新能智造科技有限公司 | 一种硅晶片增厚的方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4876059A (it) * | 1972-01-14 | 1973-10-13 | ||
GB1565207A (en) * | 1975-09-05 | 1980-04-16 | Sinclair Radionics | Printed circuits |
DE2724399A1 (de) * | 1977-05-28 | 1978-11-30 | Martin Marietta Corp | Verfahren zur herstellung einer mehrschichtigen gedruckten schaltungsplatte mit integralen, flexiblen anschlusstuecken, sowie nach diesem verfahren gefertigte schaltungsplatte |
DE2831984A1 (de) * | 1977-07-21 | 1979-02-01 | Sharp Kk | Elektrische verbindung zwischen zwei auf getrennte traeger aufgebrachten elektrischen schaltkreisen |
FR2402379A1 (fr) * | 1977-08-31 | 1979-03-30 | Cayrol Pierre Henri | Perfectionnements apportes aux circuits imprimes |
-
1980
- 1980-09-09 FR FR8019462A patent/FR2490059A1/fr active Granted
-
1981
- 1981-08-28 AU AU75379/81A patent/AU7537981A/en not_active Abandoned
- 1981-08-28 WO PCT/FR1981/000109 patent/WO1982000938A1/en not_active Application Discontinuation
- 1981-08-28 JP JP56502909A patent/JPS57501353A/ja active Pending
- 1981-08-28 EP EP81902466A patent/EP0059206B1/fr not_active Expired
- 1981-09-08 ES ES505299A patent/ES8302403A1/es not_active Expired
- 1981-09-08 BE BE0/205905A patent/BE890272A/fr not_active IP Right Cessation
- 1981-09-09 CA CA000385491A patent/CA1171549A/en not_active Expired
- 1981-09-09 IT IT8123851A patent/IT1138586B/it active
-
1982
- 1982-05-05 NO NO821481A patent/NO821481L/no unknown
- 1982-05-06 DK DK204982A patent/DK204982A/da not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
EP0059206A1 (fr) | 1982-09-08 |
FR2490059A1 (fr) | 1982-03-12 |
EP0059206B1 (fr) | 1985-07-31 |
BE890272A (fr) | 1982-03-08 |
JPS57501353A (it) | 1982-07-29 |
NO821481L (no) | 1982-05-05 |
WO1982000938A1 (en) | 1982-03-18 |
DK204982A (da) | 1982-05-06 |
IT8123851A0 (it) | 1981-09-09 |
AU7537981A (en) | 1982-04-08 |
CA1171549A (en) | 1984-07-24 |
ES505299A0 (es) | 1983-01-01 |
ES8302403A1 (es) | 1983-01-01 |
FR2490059B1 (it) | 1984-07-27 |
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