ES2008845B3 - Equipo para la soldadura de componentes electronicos sobre un circuitoimpreso. - Google Patents
Equipo para la soldadura de componentes electronicos sobre un circuitoimpreso.Info
- Publication number
- ES2008845B3 ES2008845B3 ES86114281T ES86114281T ES2008845B3 ES 2008845 B3 ES2008845 B3 ES 2008845B3 ES 86114281 T ES86114281 T ES 86114281T ES 86114281 T ES86114281 T ES 86114281T ES 2008845 B3 ES2008845 B3 ES 2008845B3
- Authority
- ES
- Spain
- Prior art keywords
- soldering
- beams
- equipment
- printed circuit
- electronic components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005476 soldering Methods 0.000 abstract 7
- 238000004519 manufacturing process Methods 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0673—Dividing the beam into multiple beams, e.g. multifocusing into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
- B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0465—Surface mounting by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laser Beam Processing (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
ESTE DISPOSITIVO PARA SOLDAR SIMULTANEAMENTE DOS ACCESORIOS DE EMPALME (52), COMO MINIMO, DE UN ELEMENTO DE CONSTRUCCION ELECTRONICO (54) SOBRE UNA PLETINA DE CIRCUITOS (50) DISPONE DE UNA SUPERFICIE DE APOYO PARA LAS PIEZAS DE TRABAJO (44) Y DE UN LASER (10) PARA LA PRODUCCION DE LA ENERGIA PARA SOLDADURA. SE HAN PREVISTO DOS RAYOS DE SOLDADURA (20) DE LA MISMA INTENSIDAD, POR LO MENOS APROXIMADAMENTE. PARA EL ENFOQUE DE LOS RAYOS DE SOLDADURA (20) HACIA LOS PUNTOS DE SOLDADURA SE HAN COLOCADO LENTE OPTICAS (30) EN EL CAMINO RECORRIDO POR CADA UNO DE LOS RAYOS. EL RESONADOR DEL LASER (10) DISPONE EN CADA UNO DE SUS DOS LADOS ESTRECHOS DE UN ESPEJO DE TRANSPARENCIA PARCIAL (12) QUE SIRVEN PARA PRODUCIR RAYOS (20) DE LA MISMA INTENSIDAD. CON EL FIN DE PROVOCAR UN MOVIEMIENTO RELATIVO ENTRE LOS RAYOS DE SOLDADURA (20) Y LA SUPERFICIE DE APOYO PARA LAS PIEZAS DE TRABAJO (44), EL INVENTO PREVEE UN DISPOSITIVO DESVIADOR (28), RESPECTIVAMENTE. ESTE (28) DISPONE DE DOS ESPEJOS (38, 40) QUE PUEDEN AJUSTARSE INDEPENDIENTEMENTE MEDIANTE UN MECANISMO DE MANDO (48), QUE SIRVEN PARA LA DESVIACION DE LOS RAYOS DE SOLDADURA (20) DURANTE SU FUNCIONAMIENTO.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19853539933 DE3539933A1 (de) | 1985-11-11 | 1985-11-11 | Vorrichtung zum aufloeten elektronischer bauelemente auf eine schaltungsplatine |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2008845B3 true ES2008845B3 (es) | 1989-08-16 |
Family
ID=6285669
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES86114281T Expired ES2008845B3 (es) | 1985-11-11 | 1986-10-15 | Equipo para la soldadura de componentes electronicos sobre un circuitoimpreso. |
Country Status (6)
Country | Link |
---|---|
US (1) | US4792658A (es) |
EP (1) | EP0223066B1 (es) |
JP (1) | JPS62144875A (es) |
AT (1) | ATE43528T1 (es) |
DE (2) | DE3539933A1 (es) |
ES (1) | ES2008845B3 (es) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63168086A (ja) * | 1986-12-29 | 1988-07-12 | 株式会社東芝 | 電子部品の半田付け方法 |
US4806728A (en) * | 1988-02-01 | 1989-02-21 | Raytheon Company | Laser process apparatus |
DE3829350A1 (de) * | 1988-08-30 | 1990-03-01 | Messerschmitt Boelkow Blohm | Verfahren und einrichtung zur positionierung von loetlasern |
DE3831743A1 (de) * | 1988-09-17 | 1990-03-29 | Philips Patentverwaltung | Vorrichtung zur bearbeitung eines werkstueckes mit laserlicht und verwendung dieser vorrichtung |
US5233580A (en) * | 1988-12-19 | 1993-08-03 | Rohm Co., Ltd. | Laser diode unit welded to a mounting member by laser light |
JPH0724112B2 (ja) * | 1988-12-19 | 1995-03-15 | ローム株式会社 | レーザダイオードユニットの取り付け方法 |
FR2653367A1 (fr) * | 1989-10-24 | 1991-04-26 | Quantel Sa | Procede et appareil de brasage au laser. |
US5302798A (en) * | 1991-04-01 | 1994-04-12 | Canon Kabushiki Kaisha | Method of forming a hole with a laser and an apparatus for forming a hole with a laser |
DE4302976A1 (de) * | 1992-07-22 | 1994-01-27 | Bosch Gmbh Robert | Vorrichtung und Verfahren zum Auflöten von Bauelementen auf Platinen |
US5495089A (en) * | 1993-06-04 | 1996-02-27 | Digital Equipment Corporation | Laser soldering surface mount components of a printed circuit board |
US5565119A (en) * | 1995-04-28 | 1996-10-15 | International Business Machines Corporation | Method and apparatus for soldering with a multiple tip and associated optical fiber heating device |
US7732732B2 (en) | 1996-11-20 | 2010-06-08 | Ibiden Co., Ltd. | Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board |
DE69737991T2 (de) | 1996-11-20 | 2008-04-30 | Ibiden Co., Ltd., Ogaki | Laserbearbeitungsvorrichtung, verfahren und vorrichtung zur herstellung einer mehrschichtigen, gedruckten leiterplatte |
JP3622714B2 (ja) * | 2001-09-28 | 2005-02-23 | 松下電器産業株式会社 | 加工方法 |
DE10234943B4 (de) * | 2002-07-31 | 2004-08-26 | Infineon Technologies Ag | Bearbeitungsvorrichtung für Wafer und Verfahren zu ihrer Bearbeitung |
US7614489B2 (en) * | 2004-12-07 | 2009-11-10 | Otis Elevator Company | Handrail guidance for a passenger conveyor |
US10631409B2 (en) * | 2016-08-08 | 2020-04-21 | Baker Hughes, A Ge Company, Llc | Electrical assemblies for downhole use |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3230475A (en) * | 1962-07-10 | 1966-01-18 | American Optical Corp | Structure for increasing light intensity at a distant point |
US3534462A (en) * | 1967-08-31 | 1970-10-20 | Western Electric Co | Simultaneous multiple lead bonding |
US3934073A (en) * | 1973-09-05 | 1976-01-20 | F Ardezzone | Miniature circuit connection and packaging techniques |
US4020319A (en) * | 1974-02-07 | 1977-04-26 | The Torrington Company | Method of forming a knitting needle latch pivot |
DE2624121A1 (de) * | 1976-05-28 | 1977-12-15 | Siemens Ag | Verfahren zum genauen bearbeiten eines im arbeitsfeld eines bearbeitungslasers angeordneten werkstueckes sowie vorrichtung zur ausuebung des verfahrens |
CA1123920A (en) * | 1978-08-24 | 1982-05-18 | Kevin R. Daly | Laser soldering apparatus |
US4327277A (en) * | 1978-08-24 | 1982-04-27 | Raytheon Company | Method for laser soldering |
US4278867A (en) * | 1978-12-29 | 1981-07-14 | International Business Machines Corporation | System for chip joining by short wavelength radiation |
JPS5812106A (ja) * | 1981-07-15 | 1983-01-24 | Hitachi Ltd | 磁気記録再生装置 |
JPS5840349A (ja) * | 1981-09-04 | 1983-03-09 | Asahi Chem Ind Co Ltd | 瀝青質を含む組成物 |
JPS58173095A (ja) * | 1982-04-05 | 1983-10-11 | Mitsubishi Heavy Ind Ltd | レーザ溶接方法 |
JPS60234768A (ja) * | 1984-05-08 | 1985-11-21 | Matsushita Electric Ind Co Ltd | レ−ザ−半田付装置 |
-
1985
- 1985-11-11 DE DE19853539933 patent/DE3539933A1/de active Granted
-
1986
- 1986-10-15 AT AT86114281T patent/ATE43528T1/de not_active IP Right Cessation
- 1986-10-15 ES ES86114281T patent/ES2008845B3/es not_active Expired
- 1986-10-15 DE DE8686114281T patent/DE3663633D1/de not_active Expired
- 1986-10-15 EP EP86114281A patent/EP0223066B1/de not_active Expired
- 1986-11-11 JP JP61268479A patent/JPS62144875A/ja active Granted
- 1986-11-12 US US06/930,139 patent/US4792658A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0223066A1 (de) | 1987-05-27 |
DE3539933C2 (es) | 1987-09-03 |
DE3539933A1 (de) | 1987-05-14 |
JPH038869B2 (es) | 1991-02-07 |
ATE43528T1 (de) | 1989-06-15 |
DE3663633D1 (en) | 1989-07-06 |
JPS62144875A (ja) | 1987-06-29 |
US4792658A (en) | 1988-12-20 |
EP0223066B1 (de) | 1989-05-31 |
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