EP3325264A1 - Substrat destiné à un circuit électrique et procédé de fabrication dudit substrat - Google Patents

Substrat destiné à un circuit électrique et procédé de fabrication dudit substrat

Info

Publication number
EP3325264A1
EP3325264A1 EP16741600.7A EP16741600A EP3325264A1 EP 3325264 A1 EP3325264 A1 EP 3325264A1 EP 16741600 A EP16741600 A EP 16741600A EP 3325264 A1 EP3325264 A1 EP 3325264A1
Authority
EP
European Patent Office
Prior art keywords
layer
paper
adhesive
ceramic
ceramic layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP16741600.7A
Other languages
German (de)
English (en)
Inventor
Andreas Meyer
Karsten Schmidt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rogers Germany GmbH
Original Assignee
Rogers Germany GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rogers Germany GmbH filed Critical Rogers Germany GmbH
Publication of EP3325264A1 publication Critical patent/EP3325264A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/017—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of aluminium or an aluminium alloy, another layer being formed of an alloy based on a non ferrous metal other than aluminium
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/043—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/12—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of paper or cardboard
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B29/00—Layered products comprising a layer of paper or cardboard
    • B32B29/002—Layered products comprising a layer of paper or cardboard as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B29/00—Layered products comprising a layer of paper or cardboard
    • B32B29/08—Corrugated paper or cardboard
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B32B5/12—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer characterised by the relative arrangement of fibres or filaments of different layers, e.g. the fibres or filaments being parallel or perpendicular to each other
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
    • B32B5/20—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material foamed in situ
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/041—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/06—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of paper or cardboard
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/005—Apparatus specially adapted for electrolytic conversion coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/06—Coating on the layer surface on metal layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/20—Inorganic coating
    • B32B2255/205—Metallic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/26—Polymeric coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/28—Multiple coating on one surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/107—Ceramic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/54—Yield strength; Tensile strength
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2605/00—Vehicles
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C25D11/06—Anodisation of aluminium or alloys based thereon characterised by the electrolytes used
    • C25D11/08—Anodisation of aluminium or alloys based thereon characterised by the electrolytes used containing inorganic acids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1126—Firing, i.e. heating a powder or paste above the melting temperature of at least one of its constituents

Definitions

  • the invention relates to a substrate for electrical circuits according to the preamble of claim 1 and to a method for producing such a substrate according to the preamble of claim 18.
  • substrates of this type have a multilayer structure and have at least one insulation layer and at least one metal layer or metallization connected to this insulation layer.
  • the metal layer or metallization is areally connected to the insulation layer either directly or optionally via further metal or insulation layers and is structured to form conductor tracks, contacts, contact surfaces and / or connection surfaces in a plurality of metalization surface sections.
  • metal-ceramic substrates are often used whose insulation layer is characterized by at least one high
  • the ceramic layer is made of, for example, an oxide, nitride or carbide ceramic such as alumina
  • Al2O3 + ZrO2 aluminum oxide with zirconium oxide
  • Main fillers for the paper structure are, for example, in particular Al 2 O 3, Si 3 N 4, AlN, ZrO 2, MgO, SiC and BeO or else a combination such as ZTA, in particle sizes of ⁇ 5 ⁇ m, preferably ⁇ 1 ⁇ m.
  • Further sintering aids are the ceramic fillers or secondary fillers respective main fillers, namely Y 2 O 3, CaO, MgO, SiO 2, etc., were incorporated into the paper structure. From this preceramic ceramic structure enriched with sinterable ceramic fillers, a so-called sintered paper or a paper ceramic is optionally produced after a further deformation process by thermal conversion, inter alia by carrying out a two-stage thermal conversion.
  • the organic components of the preceramic papers such as pulp, starch and latex, are oxidatively removed to form a so-called "brownling.”
  • the "brownling" is sintered
  • the result is a ceramic material with the typical bending strength of a ceramic.
  • the microstructure of this sintered paper or of the paper ceramic shows, among other things, the typical for ceramics Material properties, for example, a high insulation resistance.
  • the advantages of ceramic materials can be combined with the papering advantages, such as ease of deformation and light weight.
  • the present invention seeks to provide a substrate for electrical circuits and an associated method for producing such a substrate, which is simple and inexpensive to produce compared to the known substrates and its insulation layer made of a paper ceramic a has improved insulation resistance.
  • the object is achieved by a substrate according to the
  • the at least one metal layer is connected via at least one adhesive layer with the paper ceramic layer, which is prepared by applying at least one adhesive to the metal layer and / or on the paper ceramic layer, wherein by means of the applied adhesive, the pore-shaped cavities in the paper ceramic layer filled at least on the surface side.
  • the residual porosity of the paper-ceramic layer is particularly advantageous due to at least the surface side
  • the paper-ceramic layer particularly advantageously has a porosity of less than 10%, preferably less than 5%.
  • a paper-ceramic layer according to the invention is understood as meaning a paper structure enriched in papermaking with a sinterable ceramic filler, preferably alumina powder, from which a preceramic paper structure is produced.
  • the preceramic paper structure is subjected to a two-stage thermal conversion process and firstly from the preceramic paper structure ("green body") a "Braunling" is produced in which the organic components of the preceramic paper structure, such as pulp, starch and latex are oxidatively removed.
  • the "Braunling" is fed to a sintering process, whereby a ceramic material, namely the paper ceramics, is produced.
  • a ceramic material namely the paper ceramics
  • the paper ceramics layer exhibits the typical material properties of a ceramic material, namely a high bending and insulation resistance the well-known ceramic layer in the case of metal-ceramic substrates
  • the paper-ceramic layer is lighter in comparison to a conventional ceramic layer and individually deformable prior to the implementation of the thermal conversion process. Also advantageously, the starting material of the paper-ceramic layer can be stored and further processed as a roll product due to the deformability.
  • the paper-ceramic layer is produced particularly advantageously from a paper structure enriched with a sinterable ceramic filler by means of thermal conversion, in which the proportion of sinterable ceramic fillers of the enriched paper structure is greater than 80% by weight, preferably between 80 and 90% by weight.
  • ceramic fillers of the paper structure Al 2 O 3, Si 3 N 4, AlN, ZrO 2, MgO, SiC, BeO or a combination thereof and associated typical sintering aids such as Y 2 O 3, CaO, MgO, SiO 2 are provided.
  • Composite layer via at least one adhesive layer or a solder layer connected to the paper-ceramic layer, depending on the respective formation of the metal layer or composite layer.
  • the at least one metal layer is connected to at least one further metal layer to form a composite layer.
  • the composite layer according to the invention is in turn connected to the paper-ceramic layer via an adhesive layer.
  • the substrate may also comprise a plurality of composite layers, for example a first and second
  • Composite layer which are connected at the top and bottom of the paper-ceramic layer in each case over an adhesive layer surface.
  • the paper-ceramic layer has a layer thickness between 50 .mu.m and 600 .mu.m, preferably 80 .mu.m and 150 .mu.m, and an E-modulus between 90 GPa and 150 GPa.
  • the paper-ceramic layer has a top and bottom side, wherein the upper side is connected in a planar manner by means of an adhesive layer to a first metal layer and the underside by means of a further adhesive layer to a second metal layer.
  • Such a three-layer substrate has good insulation properties for use in the "low-voltage" range and high mechanical stability with low substrate thickness.
  • an adhesive having a viscosity of less than 30 Pas is particularly advantageously used for producing an adhesive layer having a layer thickness of between 1 and 30 ⁇ m, preferably between 1 and 10 ⁇ m.
  • the layer thickness gives the distance between the top and bottom sides / or bottom of the paper-ceramic layer and the surface of the adjoining layer, in particular metal or composite layer.
  • the adhesive layer is made of a chemically and / or physically curable adhesive from the group of polyurethanes, epoxy resins, polyimides or
  • Methyl metacrylate manufactured, whereby the penetration depth of the adhesive into the
  • Paper ceramic layer or its pore-shaped cavities preferably at least one third of the adjoining the adhesive layer layer thickness of the paper-ceramic layer.
  • at least one side surface becomes advantageous
  • One third of the pore-shaped cavities of the paper-ceramic layer are filled with adhesive, preferably both from the top and from the underside of the paper-ceramic layer, ie in total at least two-thirds of the pore-shaped cavities.
  • the pore-shaped cavities in the paper-ceramic layer are almost completely filled with adhesive in order to obtain optimum insulation properties.
  • the adhesive layer can
  • the at least one metal layer is advantageously produced from copper, aluminum, gold, silver, tin, zinc, molybdenum, tungsten, Cr or their alloys.
  • the composite layer may comprise a metal layer and at least one aluminum layer or aluminum alloy layer, wherein in this embodiment variant the metal layer is preferably realized in the form of a copper layer or copper alloy layer.
  • the layer thickness of the copper layer or copper alloy layer is then, for example, between 35 ⁇ and 2 mm and the layer thickness of the aluminum layer or aluminum alloy layer between 10 jum and 300 ⁇ .
  • the aluminum layer of the composite layer has an aluminum-silicon layer.
  • the invention likewise provides a process for the production of a substrate for electrical circuits comprising at least one metal layer and at least one paper ceramic layer having a top and bottom, in which at least the top or bottom surface are connected to the at least one metal layer, wherein the paper ceramic layer Variety of pore-shaped
  • An essential aspect of the method according to the invention is to be seen in that on the at least one metal layer and / or on the top and / or bottom of the paper ceramic layer adhesive for the production of at least one adhesive layer is applied surface, in such a way that by means of the applied adhesive the pore-shaped voids in the paper-ceramic layer be filled at least on the surface side.
  • the applied in a suitably sized amount surface adhesive penetrates at least superficially
  • the adhesive is applied over the surface only on the surface side of the at least one metal layer and then glued to the top or bottom of the paper-ceramic layer.
  • the adhesive comes after the joining of the metal layer with the
  • the adhesive is applied over the surface exclusively to the top and / or bottom side of the paper-ceramic layer and then bonded to the at least one metal layer.
  • at least partial filling of the pore-shaped cavities takes place already during adhesive application, i. before the actual joining process.
  • the adhesive is applied both to the
  • the viscosity of the adhesive applied to the paper ceramic layer adhesive is preferably less than the viscosity of the on the
  • Metal layer applied adhesive can be filled the pore-shaped cavities find a less liquid adhesive than for the production of the adhesive bond with the metal layer use.
  • the adhesive is applied over the surface exclusively on the top or bottom of the paper ceramic layer, wherein the
  • Adhesive amount is dimensioned such that the pore-shaped cavities are completely filled. The filling of the pore-shaped cavities thus takes place over one side of the paper-ceramic layer.
  • the amount of adhesive used is set such that, in the connected state, an adhesive layer having a layer thickness in the range between 1 and 30 ⁇ m, preferably between 1 and 10 ⁇ m, is formed.
  • Porosity below 10%, preferably below 5%.
  • the pore-shaped cavities along at least one third of the layer thickness of
  • a substrate according to the invention comprising a first metal layer and a paper-ceramic layer bonded thereto via an adhesive layer,
  • Fig. 2a-c is a simplified depicting development of selected steps of the method for
  • Fig. 3 is a simplified schematic sectional view through a
  • a substrate according to the invention comprising a composite layer and a paper-ceramic layer bonded thereto via an adhesive layer.
  • Figure 1 shows in a simplified schematic representation a section through an inventively designed substrate 1 for electrical circuits, which has a plate-shaped and multilayer structure, i. in the form of a
  • the substrate 1 according to the invention is particularly suitable for so-called "low-voltage” applications, ie for the construction of electrical circuits in a voltage range of less than 2.5 kV.
  • the substrate 1 according to the invention for electrical circuits here comprises at least one first metalization or metal 2 and a paper-ceramic layer 1 1 which is connected in a planar manner to the at least one first metalization and metal layer 2, wherein the paper-ceramic layer 1 1 has a multiplicity of pore-shaped cavities due to the production
  • the paper-ceramic layer 11 has an upper and lower side 11a, 11b, and the first metallization layer or metal layer 2 is connected in a planar manner to the upper side 11a of the paper-ceramic layer 11.
  • the substrate 1 in addition to the first metal layer 2, a second metal layer 3, which is connected to the underside 11 b of the paper-ceramic layer 11 area.
  • the paper-ceramic layer 11 has a first layer thickness d1 and the first or any second metal layer 2, 3 present a second layer thickness d2.
  • a paper-ceramic layer 11 or a paper-based ceramic is understood as meaning a paper structure enriched in papermaking with sinterable ceramic, preferably powdery, fillers, from which a preceramic paper structure is produced in an intermediate step.
  • the proportion of sinterable ceramic filler of the preceramic paper structure is greater than 80 wt .-%, preferably between 80 and 90 wt .-%.
  • suitable ceramic fillers or main fillers of the paper structure are Al.sub.2O.sub.3, Si.sub.3N.sub.4, AlN, ZrO.sub.2, MgO, SiC and BeO or combinations such as ZTA, in particle sizes of ⁇ 5 .mu.m ⁇ 1 vm.
  • Further typical ceramic fillers or secondary fillers are the respective typical ones
  • the corresponding preceramic paper structure is then subjected to a two-stage thermal conversion process and first a "Braunling" is produced from the preceramic paper structure ("green body"), in which the organic components of the preceramic paper structure, such as pulp, starch and latex are oxidatively removed. Then in the second stage of the "Braunling" one
  • Paper ceramics with the typical material properties of a ceramic material is created, such as a high bending and insulation strength.
  • the However, paper-ceramic layer 11 is compared to a conventional one
  • paper-ceramic layer 1 1 used according to the invention has a layer thickness d 1 between 50 ⁇ and 600 ⁇ , preferably 80 ⁇ and 1 50 ⁇ and has an E-modulus between 90 GPa and 1 50 GPa.
  • layer thickness d 1 between 50 ⁇ and 600 ⁇ , preferably 80 ⁇ and 1 50 ⁇ and has an E-modulus between 90 GPa and 1 50 GPa.
  • E-modulus between 90 GPa and 1 50 GPa.
  • Paper texture a variety of pore-shaped cavities.
  • the pore-shaped cavities can be opened on the surface side or vol lstieri in the
  • Paper ceramic layer 1 1 are included, i. within the
  • Paper ceramic layer 1 1 extend.
  • the pore-shaped cavities here often have the shape of the cellulose fibers removed by oxidation, and are approximately evenly distributed over the entire paper-ceramic layer 1 1.
  • Paper ceramic layer 1 1 has due to the large number of pore-shaped cavities, for example, a porosity or residual porosity smaller than 50%, preferably less than 30%, through which the insulation strength of the paper ceramic layer 1 1, in particular when using it in a substrate 1 for electrical
  • Adhesive 6a ', 6a ", 6b', 6b” closed.
  • the adhesive is preferably at least partially in on the upper and / or U nterseite 1 1 a, 1 1 b of the paper ceramic layer 1 1 subsequent or arranged in its area pore-shaped cavities and possibly ebens existing cracks in the paper ceramic layer 1 1 in the frame the manufacture ment of the adhesive bond between the at least one metal ltik 2, 3 and the paper ceramic layer 1 1 introduced, ie the adhesive 6a ', 6a ", 6b', 6b” penetrates into the pore-shaped cavities and closes them vol lstieri in the to the upper and / or U nterseite 1 1 a, 1 1 b of the paper-ceramic layer 1 1 subsequent section of the paper-ceramic layer 1 1.
  • this reduces the existing porosity of the paper-ceramic layer 11 to less than 10% and thus significantly improves its insulation resistance.
  • more than half of the pore-shaped cavities in the paper-ceramic layer 11 are at least partially filled with the adhesive, after the adhesive layers 6, 6a, 6b produced by the adhesive application 6a ', 6a ", 6b', 6b".
  • the penetration depth of the adhesive application 6a ', 6b' in the pore-shaped cavities of the paper ceramic layer 1 1 indicated by a dashed line drawn, ie the adhesive 6a ', 6b' is at least up to a third of the adhesive layer 6 anschl penetrating layer thickness d 1 penetrated into the paper-ceramic layer 1 1.
  • the penetration depth of the adhesive 6a ', 6b' is thus for example at least one third of the layer thickness d 1 of the paper-ceramic layer 1 1.
  • an adhesive layer 6, 6a, 6b with a layer thickness d3 is formed in the range between 1 and 30 ⁇ , preferably between 1 and 10 ⁇ .
  • the quantity of glue required for this purpose is dimensioned in such a way that it exceeds the predetermined volume by the desired layer thickness d3 and the dimensions of the metal layer 2, 3 or paper-ceramic layer of the adhesive layer 6, 6a, 6b, in such a way that with the additional amount of adhesive not only the pore-shaped cavities can be at least partially filled, but also, if necessary, a compensation of the surface roughness of the respective metal layer 2, 3 or the upper and / or lower surface 11a, 11b of the paper-ceramic layer 11 takes place.
  • the adhesive application can be carried out using known methods, wherein in particular a pre-hardening of the applied adhesive, in particular a temperature treatment can be carried out to optionally in the adhesive volatile components such as solvents or reaction products to remove.
  • the adhesive application can be made to different variants.
  • the production of the adhesive layer 6, 6a, 6b or the adhesive application 6a ', 6a ", 6b', 6b" required for this purpose and thus also the filling of the pore-shaped cavities of the paper-ceramic layer 11 can be effected by means of different process variants.
  • the adhesive 6a ", 6b" can be applied exclusively to the respective surface side of the metal layer 2, 3, and subsequently subsequently adhesively bonded to the top or bottom 11a, 11b of the paper-ceramic layer 11.
  • the adhesive 6a ', 6b' exclusively on the top and / or bottom 11a, 11b of the
  • Paper ceramic layer 11 are applied and then the respective
  • Metal layer 2, 3 are bonded hereby.
  • the adhesive 6a ', 6b', 6a ", 6b" according to the embodiment shown in Figures 2a to 2c, both on the top and / or bottom 11a, 11b of the paper-ceramic layer 11 and on the metal layer 2, 3 applied become.
  • Paper ceramic layer 11 required.
  • the layers provided with the respective adhesive application, in particular the paper-ceramic layer 11 and / or the metal layers 2, 3, are preferably joined using a lamination process, namely under one
  • the pressure is in this case dimensioned such that an areal homogeneous and bubble-free connection of the metal layers 2, 3 is ensured on the paper ceramic layer 11.
  • the deflection of the substrate 1 is reduced to a minimum.
  • roll and / or flat laminators can be used in the lamination process.
  • adhesives for the production of the adhesive layer 6 6 'different adhesives can be used, which have a temperature stability of at least 100 ° C after curing.
  • adhesives for the production of the adhesive layer 6 6 'different adhesives can be used, which have a temperature stability of at least 100 ° C after curing.
  • chemically and / or physically hardenable adhesives from the group of polyurethanes, epoxy resins, polyimides and methyl methacrylate can be used, which are used as one or two
  • Component adhesives are applied and cure under temperature increase and / or pressure increase.
  • the correspondingly cured adhesive layers 6, 6a, 6b between the metal layers 2, 3 and the paper-ceramic layer 11 then preferably have a temperature stability of 100 ° C. to 350 ° C.
  • adhesive finely dispersed particles which, although electrically non-conductive, but have a good thermal conductivity, namely, for example, Si3N4, ALN or AL203 mixed.
  • adhesives or adhesives of low viscosity are preferably used, namely
  • Paper ceramic layer 5 to fill and thus increase the insulation resistance of the substrate 1.
  • different adhesives may be used, which for example a
  • the adhesives 6a ', 6b' provided for filling the pore-shaped cavities and producing the adhesive bond, which are applied directly to the top and / or bottom 11a, 11b of the paper-ceramic layer 11, should have a low viscosity, to ensure easy penetration into the pore-shaped cavities.
  • an additional adhesive 6a ", 6b" to the metal layers 2, 3 for producing the adhesive layers 6a, 6b different and / or thicker adhesives having a higher viscosity can then be used.
  • the metal layers or metallization layers 2, 3 are produced, for example, using thin metal sheets or metal foils.
  • Starting materials may be, for example, copper, aluminum, gold, silver, tin, zinc, molybdenum, tungsten, Cr or their alloys. Also, the use of composites, i. Laminates or powder metallurgical
  • the metal layers 2, 3 used have layer thicknesses d2 of between 10 ⁇ m and 5 mm. Also known per se
  • the top and bottom 1 1 a, 1 1 b of the paper-ceramic layer 5 can be bonded to metal layers 2, 3 or laminate or composite layers produced from different metals, for example a combination of a copper layer and an aluminum layer or a combination of one Manganintik and an aluminum layer.
  • Metal layers 2, 3 may be the same or different, irrespective of the layer thickness d1 of the paper-produced ceramic or
  • the second metal layer 3 or composite layer can form or have a heat sink, wherein the metal layer forming the heat sink can have a surface enlargement profile on its surface opposite the adhesive layer 6 '
  • the substrates 1 according to the invention serve as printed circuit boards for electrical or electronic circuits or circuit modules, in particular for electronic power circuits.
  • at least the first metal layer 2 by means of known masking and etching technologies in several
  • Metallleitersabroughe structured that form, for example, interconnects, contact and / or pads. Due to the very thin paper ceramic layer 11, preferably only one of the metallizations or metal layer 2, 3 of the substrate 1 is patterned in order to ensure sufficient stability of the substrate 1. In the case of a corresponding, stability-enhancing intermediate layer, however, structuring of the two metallizations or metal layers 2, 3 of the substrate 1 is also possible.
  • This type of structuring is one of the subtractive methods in which a part of the metallization is removed or weakened in a wet-chemical process.
  • additive processes such as galvanic deposition in order to increase the layer thickness of the metallization locally or over the entire surface. This can also be done, for example, by soldering moldings at defined points of the structured substrate.
  • the singulation takes place in the substrates 1 according to the invention, for example by means of mechanical processing operations such as, for example, sawing, cutting or punching or by using a laser unit or a water jet cutting edge. Accordingly, the extends
  • the substrate 10 at least one composite layer 12 with a metal layer 13 and at least one aluminum layer 14, which is connected by means of an adhesive layer 6 with the paper-ceramic layer 11.
  • the aluminum layer 14 of the composite layer 12 may be formed at least partially anodized, so that an anodized layer 15 is formed, which is connected via the adhesive layer 16 with the paper-ceramic layer 11.
  • the anodizing layer 15 is provided as an adhesion promoter to replace the inherently smooth surface of the aluminum layer 14 with the roughened anodized layer 15, which ensures a high adhesive force of the adhesive bond between the paper-ceramic layer 11 and the composite layer 12.
  • the anodized layer 15 has a layer thickness between 1 ⁇
  • the respective adhesive layer 6 has at least two different adhesives, which are preferably applied in layers one behind the other.
  • adhesives are preferably applied in layers one behind the other.
  • multilayer composite layers 12 which have different metal layers and are connected to one another in a planar manner via further connection technologies known per se, such as, for example, a DCB or AMB connection.
  • a metal layer 2 and a paper-ceramic layer 11 having substrates 1 according to the invention can be glued, joined or soldered directly to a heat sink, using a
  • the paper manufacturing process subsequent pressing for example by means of calendering or a coating of the paper can contribute to a reduction of the pore-shaped cavities.
  • the already sintered paper-ceramic layer 11 can be coated, for example, on one or both sides, for example by means of sol-gel technology, dipping, spraying or brushing. Following this, however, re-sintering of the coated paper ceramic layer is required.
  • the pore-shaped cavities can at least partially be filled with similar or other ceramic materials, namely, for example by suspensions of fine ceramic powders or glass powder with grain sizes the deutl I caused lulosemaschinen by the Zel
  • materials such as

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  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention concerne un substrat (1, 10) destiné à un circuit électrique et comprenant au moins une couche métallique (2, 3, 14) et une couche de papier céramique (11) liée à plat à la couche ou aux couches métalliques (2, 3, 14) et présentant une face supérieure et une face inférieure (11a, 11b), la couche de papier céramique (11) présentant une pluralité de vides sous forme de pores. De manière particulièrement avantageuse, la ou les couches métalliques (2, 3, 14) sont liées à la couche de papier céramique (11) par au moins une couche adhésive (6, 6a, 6b) qui est produite par application d'au moins un adhésif (6a', 6a", 6b', 6b") sur la couche métallique (2, 3, 14) et/ou sur la couche de papier céramique (11), les vides sous forme de pores de la couche de papier céramique (11) étant remplis au moins côté surface par l'adhésif appliqué (6a', 6a", 6b', 6b").
EP16741600.7A 2015-07-17 2016-07-18 Substrat destiné à un circuit électrique et procédé de fabrication dudit substrat Withdrawn EP3325264A1 (fr)

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DE102015111667.7A DE102015111667A1 (de) 2015-07-17 2015-07-17 Substrat für elektrische Schaltkreise und Verfahren zur Herstellung eines derartigen Substrates
PCT/EP2016/067074 WO2017013075A1 (fr) 2015-07-17 2016-07-18 Substrat destiné à un circuit électrique et procédé de fabrication dudit substrat

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US10821704B2 (en) 2020-11-03
WO2017013073A1 (fr) 2017-01-26
JP6894425B2 (ja) 2021-06-30
KR102311944B1 (ko) 2021-10-13
WO2017013075A1 (fr) 2017-01-26
EP3325265A1 (fr) 2018-05-30
JP2018523593A (ja) 2018-08-23
JP2018533197A (ja) 2018-11-08
JP6803369B2 (ja) 2020-12-23
CN107848245A (zh) 2018-03-27
US10940671B2 (en) 2021-03-09
DE102015111667A1 (de) 2017-01-19
US20180200989A1 (en) 2018-07-19
KR20180030150A (ko) 2018-03-21
US20180200990A1 (en) 2018-07-19
CN107848246A (zh) 2018-03-27
KR102295797B1 (ko) 2021-08-31
KR20180030151A (ko) 2018-03-21

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