EP3136819B1 - Heater and ignition device - Google Patents
Heater and ignition device Download PDFInfo
- Publication number
- EP3136819B1 EP3136819B1 EP15782910.2A EP15782910A EP3136819B1 EP 3136819 B1 EP3136819 B1 EP 3136819B1 EP 15782910 A EP15782910 A EP 15782910A EP 3136819 B1 EP3136819 B1 EP 3136819B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- conductive layer
- heat
- heater
- ceramic
- generating resistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000919 ceramic Substances 0.000 claims description 84
- 239000002737 fuel gas Substances 0.000 claims description 8
- 230000007423 decrease Effects 0.000 claims description 2
- 239000007789 gas Substances 0.000 description 11
- 229910052581 Si3N4 Inorganic materials 0.000 description 5
- 230000020169 heat generation Effects 0.000 description 5
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 230000007774 longterm Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- 229910052681 coesite Inorganic materials 0.000 description 2
- 229910052906 cristobalite Inorganic materials 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 229910052682 stishovite Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052905 tridymite Inorganic materials 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 229910020968 MoSi2 Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910008814 WSi2 Inorganic materials 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000002283 diesel fuel Substances 0.000 description 1
- VQCBHWLJZDBHOS-UHFFFAOYSA-N erbium(III) oxide Inorganic materials O=[Er]O[Er]=O VQCBHWLJZDBHOS-UHFFFAOYSA-N 0.000 description 1
- 239000003350 kerosene Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000003345 natural gas Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 229910001404 rare earth metal oxide Inorganic materials 0.000 description 1
- 229910052702 rhenium Inorganic materials 0.000 description 1
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
- FIXNOXLJNSSSLJ-UHFFFAOYSA-N ytterbium(III) oxide Inorganic materials O=[Yb]O[Yb]=O FIXNOXLJNSSSLJ-UHFFFAOYSA-N 0.000 description 1
- RUDFQVOCFDJEEF-UHFFFAOYSA-N yttrium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[Y+3].[Y+3] RUDFQVOCFDJEEF-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
- H05B3/06—Heater elements structurally combined with coupling elements or holders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F23—COMBUSTION APPARATUS; COMBUSTION PROCESSES
- F23Q—IGNITION; EXTINGUISHING-DEVICES
- F23Q7/00—Incandescent ignition; Igniters using electrically-produced heat, e.g. lighters for cigarettes; Electrically-heated glowing plugs
- F23Q7/001—Glowing plugs for internal-combustion engines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/18—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor the conductor being embedded in an insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/40—Heating elements having the shape of rods or tubes
- H05B3/42—Heating elements having the shape of rods or tubes non-flexible
- H05B3/48—Heating elements having the shape of rods or tubes non-flexible heating conductor embedded in insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/027—Heaters specially adapted for glow plug igniters
Definitions
- the present invention relates to a heater and an ignition device.
- a heater (ceramic heater) in which a heat-generating body is disposed in a ceramic body is known as an example of a heater for use in a gas stove, an on-vehicle heating device, a kerosene fan heater, a glow plug of an automobile engine, or the like.
- Patent Document 1 discloses an example of a ceramic heater.
- EP 1 696 704 A1 discloses that a ceramic heater comprises a ceramic body, a heat generating resistor buried in the ceramic body, an electrode pad that is electrically connected to the heat generating resistor and is formed on the surface of the ceramic body and a lead member bonded onto the electrode pad (cf. Abstract).
- WO 2013/047849 A1 discloses that a heater comprises an insulating base made of ceramic, and an electrically conductive line embedded in the insulating base, wherein the electrically conductive line contains electrically conductive grains and ceramic grains, and the ceramic grains in the electrically conductive line have a smaller average grain size than the ceramic grains in the insulating base (cf. Abstract).
- a heater includes a ceramic multilayer body including a plurality of ceramic layers that are stacked together; a heat-generating resistor having a belt shape, the heat-generating resistor being disposed between the ceramic layers and arranged, and including both ends that are at a side surface of the ceramic multilayer body; and conductive layers having a belt shape, disposed between the ceramic layers and stacked on both end portions of the heat-generating resistor in such a manner that one end of each conductive layer is at the side surface.
- a heater 10 will be described with reference to the drawings.
- the ceramic multilayer body 1 is a member in which the heat-generating resistor 2 and the conductive layers 3 are embedded.
- the durability of the heat-generating resistor 2 and the conductive layers 3 can be increased by placing the heat-generating resistor 2 and the conductive layers 3 in the ceramic multilayer body 1.
- the ceramic multilayer body 1 is, for example, a rod-shaped or plate-shaped member.
- the ceramic multilayer body 1 is made of an electrically insulative ceramic, such as an insulating ceramic, a nitride ceramic, or a carbide ceramic. More specifically, the ceramic multilayer body 1 is made of, for example, an alumina ceramic, a silicon nitride ceramic, an aluminum nitride ceramic, or a silicon carbide ceramic.
- the ceramic multilayer body 1 made of a silicon nitride ceramic may be obtained by the following method.
- silicon nitride which is the main component, is mixed with 5 to 15 mass% of rare earth oxide, such as Y 2 O 3 , Yb 2 O 3 , or Er 2 O 3 , which functions as a sintering additive; 0.5 to 5 mass% of Al 2 O 3 ; and SiO 2 , the amount of which is adjusted so that the amount of SiO 2 in the sintered body is 1.5 to 5 mass%.
- the thus-obtained material is formed in a predetermined shape, and is then fired at a temperature of 1650°C to 1780°C.
- Hot press firing for example, may be performed in the firing process.
- the heat-generating resistor 2 is a layer-shaped member that generates heat when a voltage is applied thereto.
- the heat-generating resistor 2 is disposed between the adjacent ceramic layers 11.
- a voltage is applied to the heat-generating resistor 2
- a current flows through the heat-generating resistor 2
- the heat-generating resistor 2 generates heat.
- the generated heat is transferred through the ceramic multilayer body 1, so that the temperature of the surface of the ceramic multilayer body 1 increases.
- the heat is transferred from the surface of the ceramic multilayer body 1 to an object to be heated, thereby providing the function of the heater 10.
- the object to be heated that receives the heat from the surface of the ceramic multilayer body 1 is, for example, diesel oil to be supplied to an automobile diesel engine.
- the heat-generating resistor 2 is designed so as to generate a large amount of heat in a region near the front end of the ceramic multilayer body 1. More specifically, the conductive layers 3 are stacked on both end portions of the heat-generating resistor 2 in a region near the rear end of the ceramic multilayer body 1. Accordingly, a current flows through both the heat-generating resistor 2 and the conductive layers 3 in the region near the rear end of the ceramic multilayer body 1. As a result, the amount of heat generated by the heat-generating resistor 2 is small in the region near the rear end of the ceramic multilayer body 1. In contrast, the current flows only through the heat-generating resistor 2 in the region near the front end of the ceramic multilayer body 1. As a result, the amount of heat generated by the heat-generating resistor 2 is large in the region near the front end of the ceramic multilayer body 1.
- the heat-generating resistor 2 is made of, for example, a material having a carbide, nitride, silicide, etc., of tungsten (W), molybdenum (Mo), titanium (Ti), etc., as the main component.
- the heat-generating resistor 2 is preferably made of a material having tungsten carbide as the main component. In this case, the coefficient of thermal expansion of the ceramic multilayer body 1 and that of the heat-generating resistor 2 can be made close to each other.
- the second conductive layer 32 is formed of grains having a large average grain diameter, the number of grain boundaries of the grains of the second conductive layers 32 can be reduced. Therefore, the resistance of the second conductive layer 32 can be reduced. Accordingly, unnecessary heat generation by each conductive layer 3 can be suppressed.
- the first conductive layer 31 and the second conductive layer 32 preferably partially overlap.
- each conductive layer 3 can be formed so as to have a coefficient of thermal expansion that changes gradually in the length direction thereof. As a result, the possibility that cracks will be formed in the conductive layers 3 in a heat cycle can be reduced.
- the first conductive layer 31 is located between the second conductive layer 32 and the heat-generating resistor 2, and, in a region in which the first conductive layer 31 is located between the second conductive layer 32 and the heat-generating resistor 2, the first conductive layer 31 has a thickness that decreases toward the other end thereof.
- each conductive layer 3 can be formed so as to have a coefficient of thermal expansion that changes smoothly. As a result, the possibility that cracks will be formed in the conductive layers 3 in a heat cycle can be further reduced.
- the layer used as the third conductive layer 33 may be formed of grains having an average grain diameter smaller than that of the grains of the second conductive layer 32. In such a case, the number of crystal grain boundaries of the grains of the third conductive layer 33 can be increased. Accordingly, the resistance of the third conductive layer 33 can be set to a value higher than that of the second conductive layer 32. Therefore, the amount of heat generated by the heat-generating resistor 2 can be changed gradually. Accordingly, the surface of the heater 10 can be heated in such a manner that the temperature thereof changes gradually. As a result, the risk that a large local thermal stress will be generated in the ceramic multilayer body 1 can be reduced.
- the first to third conductive layers 31 to 33 are made of, for example, a highly heat-resistant metal material, such as molybdenum (Mo), tungsten (W), or rhenium (Re). MoSi 2 , WSi 2 , etc., are preferably mixed in the material to make the coefficient of thermal expansion close to that of the ceramic multilayer body 1.
- the length of a portion of the first conductive layer 31 that extends in the length direction of the heat-generating resistor 2 is set to about 2 to 10 mm.
- the thickness of the first conductive layer 31 is set to about 5 to 30 ⁇ m.
- the length of a portion of the second conductive layer 32 that extends in the length direction of the heat-generating resistor 2 is set to about 5 to 20 mm.
- the thickness of the second conductive layer 32 is set to about 25 to 75 ⁇ m.
- the length of the overlapping region is set to, for example, about 500 ⁇ m.
- the average grain diameter of the first conductive layer 31 is preferably less than 1 ⁇ m. In such a case, entrance of the outside air into the first conductive layer 31 through the spaces between the grains can be suppressed, and therefore the risk that the outside air will flow into the first conductive layer 31 can be reduced.
- the voidage of the first conductive layer is preferably less than 20%. In such a case, entrance of the outside air into the first conductive layer 31 can be suppressed.
- the average grain diameter of each conductive layer 3 can be determined by, for example, the following method. That is, the heater 10 is cut along a plane that passes through the conductive layer 3 and that is perpendicular to the conductive layer 3 by using a diamond cutter. Then, the cut surface is ground by using diamond powder. After that, the first conductive layer 31 and the second conductive layer 32 are observed by using a scanning electron microscope or metallographic microscope. More specifically, five arbitrary straight lines are drawn on the image obtained by the scanning electron microscope or metallographic microscope. Then, the average of the lengths of portions of the five straight lines, each portion passing through ten grains, is determined. The average grain diameter is determined by dividing the average by ten, which is the number of grains. The average grain diameter may instead be calculated by using an image analyzing device (LUZEX-FS produced by Nireco Corporation). This image analyzing device can also be used to measure the voidage of the first conductive layer 31.
- an image analyzing device (LUZEX-FS produced by Nireco Corporation). This image
- the heater 10 is used in, for example, an ignition device 100 illustrated in Fig. 5 .
- the ignition device 100 includes the heater 10 and a channel 20 through which fuel gas is supplied to the heater 10.
- the channel 20 includes, for example, a gas valve 21 and a gas flow pipe 22 having ejection holes 23.
- the gas valve 21 has a function of controlling the flow rate of the fuel gas.
- the fuel gas supplied from the gas valve 21 is, for example, natural gas or propane gas.
- the gas flow pipe 22 ejects the fuel gas, which is supplied from the gas valve 21, toward the heater 10 through the ejection holes 23.
- the ejected fuel gas can be ignited by heating the fuel gas with the heater 10.
- the ignition device 100 which includes the heater 10 having improved long-term reliability, has increased fuel-gas ignition stability.
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Resistance Heating (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014090911 | 2014-04-25 | ||
PCT/JP2015/062651 WO2015163483A1 (ja) | 2014-04-25 | 2015-04-27 | ヒータおよび点火装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
EP3136819A1 EP3136819A1 (en) | 2017-03-01 |
EP3136819A4 EP3136819A4 (en) | 2017-12-27 |
EP3136819B1 true EP3136819B1 (en) | 2020-05-06 |
Family
ID=54332639
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP15782910.2A Active EP3136819B1 (en) | 2014-04-25 | 2015-04-27 | Heater and ignition device |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP3136819B1 (ja) |
JP (1) | JP6027289B2 (ja) |
CN (1) | CN106105384B (ja) |
WO (1) | WO2015163483A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6987995B2 (ja) * | 2018-07-31 | 2022-01-05 | 京セラ株式会社 | ヒータ |
EP4018127A4 (en) * | 2019-08-19 | 2023-03-01 | SCP Holdings, an Assumed Business Name of Nitride Igniters, LLC. | THERMALLY OPERATED GAS VALVE WITH CERAMIC HEATING ELEMENT |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01272078A (ja) * | 1988-04-21 | 1989-10-31 | Rinnai Corp | セラミックヒータ |
JP2537271B2 (ja) * | 1988-09-09 | 1996-09-25 | 日本特殊陶業株式会社 | セラミツク発熱体 |
JPH0429192U (ja) * | 1990-07-02 | 1992-03-09 | ||
JP3121860B2 (ja) * | 1991-06-06 | 2001-01-09 | 京セラ株式会社 | セラミックヒータ |
JP2828575B2 (ja) * | 1993-11-12 | 1998-11-25 | 京セラ株式会社 | 窒化珪素質セラミックヒータ |
DE19731900A1 (de) * | 1997-07-24 | 1999-02-11 | Heraeus Electro Nite Int | Leitfähige Schicht mit veränderlichem elektrischen Widerstand, Verfahren zu ihrer Herstellung und Verwendung |
JP3691649B2 (ja) * | 1997-10-28 | 2005-09-07 | 日本特殊陶業株式会社 | セラミックヒータ |
JP2001244053A (ja) * | 2000-02-29 | 2001-09-07 | Tdk Corp | 発熱用抵抗素子 |
JP3924193B2 (ja) * | 2001-05-02 | 2007-06-06 | 日本特殊陶業株式会社 | セラミックヒータ、それを用いたグロープラグ及びセラミックヒータの製造方法 |
US7947933B2 (en) * | 2003-11-25 | 2011-05-24 | Kyocera Corporation | Ceramic heater and method for manufacture thereof |
WO2005069690A1 (ja) * | 2003-12-24 | 2005-07-28 | Kyocera Corporation | セラミックヒータ及びその製造方法 |
JP4183186B2 (ja) * | 2004-03-29 | 2008-11-19 | 京セラ株式会社 | セラミックヒータ |
KR101441595B1 (ko) * | 2007-02-22 | 2014-09-19 | 쿄세라 코포레이션 | 세라믹 히터, 이 세라믹 히터를 이용한 글로 플러그 및 세라믹 히터의 제조 방법 |
JP5357628B2 (ja) * | 2009-05-26 | 2013-12-04 | 日本特殊陶業株式会社 | セラミックヒータの製造方法 |
JP5721584B2 (ja) * | 2011-08-10 | 2015-05-20 | 京セラ株式会社 | ヒータおよびこれを備えたグロープラグ |
WO2013047849A1 (ja) * | 2011-09-29 | 2013-04-04 | 京セラ株式会社 | ヒータおよびこれを備えたグロープラグ |
US10309650B2 (en) * | 2013-04-27 | 2019-06-04 | Kyocera Corporation | Ceramic heater |
-
2015
- 2015-04-27 CN CN201580012328.8A patent/CN106105384B/zh active Active
- 2015-04-27 WO PCT/JP2015/062651 patent/WO2015163483A1/ja active Application Filing
- 2015-04-27 JP JP2016515248A patent/JP6027289B2/ja active Active
- 2015-04-27 EP EP15782910.2A patent/EP3136819B1/en active Active
Non-Patent Citations (1)
Title |
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None * |
Also Published As
Publication number | Publication date |
---|---|
CN106105384B (zh) | 2019-08-02 |
EP3136819A1 (en) | 2017-03-01 |
EP3136819A4 (en) | 2017-12-27 |
JPWO2015163483A1 (ja) | 2017-04-20 |
JP6027289B2 (ja) | 2016-11-16 |
WO2015163483A1 (ja) | 2015-10-29 |
CN106105384A (zh) | 2016-11-09 |
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