EP2840603A4 - Kühlvorrichtung - Google Patents
KühlvorrichtungInfo
- Publication number
- EP2840603A4 EP2840603A4 EP13778035.9A EP13778035A EP2840603A4 EP 2840603 A4 EP2840603 A4 EP 2840603A4 EP 13778035 A EP13778035 A EP 13778035A EP 2840603 A4 EP2840603 A4 EP 2840603A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- refrigeration device
- refrigeration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005057 refrigeration Methods 0.000 title 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D23/00—General constructional features
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F1/00—Room units for air-conditioning, e.g. separate or self-contained units or units receiving primary air from a central station
- F24F1/06—Separate outdoor units, e.g. outdoor unit to be linked to a separate room comprising a compressor and a heat exchanger
- F24F1/20—Electric components for separate outdoor units
- F24F1/24—Cooling of electric components
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D31/00—Other cooling or freezing apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Inverter Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012096841A JP5397497B2 (ja) | 2012-04-20 | 2012-04-20 | 冷凍装置 |
PCT/JP2013/002400 WO2013157218A1 (ja) | 2012-04-20 | 2013-04-08 | 冷凍装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
EP2840603A1 EP2840603A1 (de) | 2015-02-25 |
EP2840603A4 true EP2840603A4 (de) | 2015-04-22 |
EP2840603B1 EP2840603B1 (de) | 2016-11-02 |
Family
ID=49383191
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP13778035.9A Active EP2840603B1 (de) | 2012-04-20 | 2013-04-08 | Kühlvorrichtung |
Country Status (9)
Country | Link |
---|---|
US (1) | US9377237B2 (de) |
EP (1) | EP2840603B1 (de) |
JP (1) | JP5397497B2 (de) |
KR (1) | KR101491432B1 (de) |
CN (1) | CN104247011B (de) |
AU (1) | AU2013250679B2 (de) |
BR (1) | BR112014025789B1 (de) |
ES (1) | ES2611228T3 (de) |
WO (1) | WO2013157218A1 (de) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9784506B2 (en) | 2011-07-20 | 2017-10-10 | Dakin Industries, Ltd. | Refrigerant pipe attachment structure |
JP5842905B2 (ja) * | 2013-12-24 | 2016-01-13 | ダイキン工業株式会社 | 冷凍装置 |
JP2016109350A (ja) * | 2014-12-05 | 2016-06-20 | ダイキン工業株式会社 | 冷凍装置 |
KR101744536B1 (ko) * | 2015-02-09 | 2017-06-08 | 엘지전자 주식회사 | 방열유닛 및 이를 포함하는 공기조화기의 실외기 |
KR102372021B1 (ko) * | 2015-10-02 | 2022-03-10 | 한온시스템 주식회사 | 전동식 압축기 |
CN106610060B (zh) * | 2015-10-26 | 2019-06-07 | Lg电子株式会社 | 空气调节器 |
WO2017077647A1 (ja) * | 2015-11-06 | 2017-05-11 | 三菱電機株式会社 | 室外機及びそれを用いた空気調和装置 |
JP6828516B2 (ja) * | 2017-03-02 | 2021-02-10 | ダイキン工業株式会社 | 電力変換装置 |
JP6394741B1 (ja) * | 2017-05-30 | 2018-09-26 | ダイキン工業株式会社 | 電力変換装置、冷凍装置 |
CN107493672B (zh) * | 2017-08-04 | 2019-07-30 | 广东美的制冷设备有限公司 | 电控板及制冷装置 |
US10631438B2 (en) * | 2017-12-23 | 2020-04-21 | International Business Machines Corporation | Mechanically flexible cold plates for low power components |
PL3598860T4 (pl) * | 2018-07-19 | 2024-04-08 | Abb Schweiz Ag | Chłodzenie jednostek energoelektronicznych |
JP7225666B2 (ja) * | 2018-10-18 | 2023-02-21 | 日本電産株式会社 | 冷却ユニット |
JP7208550B2 (ja) * | 2021-03-30 | 2023-01-19 | ダイキン工業株式会社 | 電装品および冷凍装置 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61260660A (ja) * | 1985-05-15 | 1986-11-18 | Mitsubishi Electric Corp | 半導体素子冷却用ヒ−トシンク |
EP0777271A2 (de) * | 1995-11-30 | 1997-06-04 | Mitsubishi Denki Kabushiki Kaisha | Halbleiteranordnung mit einem Leitergitter und einer Wärmesenke |
JPH1041441A (ja) * | 1996-07-19 | 1998-02-13 | Nec Corp | 半導体装置およびその製造方法 |
EP1372367A1 (de) * | 2001-03-02 | 2003-12-17 | Sanyo Electric Co., Ltd. | Elektronische einrichtung |
US20050218505A1 (en) * | 2004-04-01 | 2005-10-06 | Delphi Technologies, Inc. | Multi-substrate circuit assembly |
EP2109138A1 (de) * | 2006-12-26 | 2009-10-14 | Kyocera Corporation | Wärmeabführendes substrat und elektronische anordnung damit |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4293175A (en) * | 1978-06-08 | 1981-10-06 | Cutchaw John M | Connector for integrated circuit packages |
US4720981A (en) * | 1986-12-23 | 1988-01-26 | American Standard Inc. | Cooling of air conditioning control electronics |
US6518868B1 (en) * | 2000-08-15 | 2003-02-11 | Galaxy Power, Inc. | Thermally conducting inductors |
JP4323116B2 (ja) * | 2001-07-12 | 2009-09-02 | 株式会社明電舎 | ヒートシンク |
US6979784B1 (en) * | 2003-10-17 | 2005-12-27 | Advanced Micro Devices, Inc. | Component power interface board |
US6950310B2 (en) * | 2003-12-31 | 2005-09-27 | Texas Instruments Incorporated | System and method for self-leveling heat sink for multiple height devices |
US20090205810A1 (en) * | 2008-02-19 | 2009-08-20 | Man Zai Industrialco., Ltd. | Liquid cooling device |
JP2009295916A (ja) * | 2008-06-09 | 2009-12-17 | Daikin Ind Ltd | 冷凍装置 |
JP2010007974A (ja) * | 2008-06-27 | 2010-01-14 | Daikin Ind Ltd | 冷凍装置 |
JP4488093B2 (ja) * | 2008-07-24 | 2010-06-23 | ダイキン工業株式会社 | 空気調和機 |
JP2010114121A (ja) * | 2008-11-04 | 2010-05-20 | Daikin Ind Ltd | 電装部品の放熱器 |
-
2012
- 2012-04-20 JP JP2012096841A patent/JP5397497B2/ja active Active
-
2013
- 2013-04-08 EP EP13778035.9A patent/EP2840603B1/de active Active
- 2013-04-08 WO PCT/JP2013/002400 patent/WO2013157218A1/ja active Application Filing
- 2013-04-08 CN CN201380020792.2A patent/CN104247011B/zh active Active
- 2013-04-08 BR BR112014025789-2A patent/BR112014025789B1/pt active IP Right Grant
- 2013-04-08 US US14/395,301 patent/US9377237B2/en active Active
- 2013-04-08 AU AU2013250679A patent/AU2013250679B2/en active Active
- 2013-04-08 ES ES13778035.9T patent/ES2611228T3/es active Active
- 2013-04-08 KR KR1020147032258A patent/KR101491432B1/ko active IP Right Grant
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61260660A (ja) * | 1985-05-15 | 1986-11-18 | Mitsubishi Electric Corp | 半導体素子冷却用ヒ−トシンク |
EP0777271A2 (de) * | 1995-11-30 | 1997-06-04 | Mitsubishi Denki Kabushiki Kaisha | Halbleiteranordnung mit einem Leitergitter und einer Wärmesenke |
JPH1041441A (ja) * | 1996-07-19 | 1998-02-13 | Nec Corp | 半導体装置およびその製造方法 |
EP1372367A1 (de) * | 2001-03-02 | 2003-12-17 | Sanyo Electric Co., Ltd. | Elektronische einrichtung |
US20050218505A1 (en) * | 2004-04-01 | 2005-10-06 | Delphi Technologies, Inc. | Multi-substrate circuit assembly |
EP2109138A1 (de) * | 2006-12-26 | 2009-10-14 | Kyocera Corporation | Wärmeabführendes substrat und elektronische anordnung damit |
Non-Patent Citations (1)
Title |
---|
See also references of WO2013157218A1 * |
Also Published As
Publication number | Publication date |
---|---|
EP2840603A1 (de) | 2015-02-25 |
US20150114021A1 (en) | 2015-04-30 |
ES2611228T3 (es) | 2017-05-05 |
JP5397497B2 (ja) | 2014-01-22 |
CN104247011B (zh) | 2015-11-25 |
WO2013157218A1 (ja) | 2013-10-24 |
KR101491432B1 (ko) | 2015-02-06 |
US9377237B2 (en) | 2016-06-28 |
BR112014025789B1 (pt) | 2022-02-22 |
AU2013250679A1 (en) | 2014-11-13 |
CN104247011A (zh) | 2014-12-24 |
JP2013225582A (ja) | 2013-10-31 |
BR112014025789A2 (de) | 2017-06-20 |
AU2013250679B2 (en) | 2015-02-12 |
EP2840603B1 (de) | 2016-11-02 |
KR20140142374A (ko) | 2014-12-11 |
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