PL3598860T4 - Chłodzenie jednostek energoelektronicznych - Google Patents
Chłodzenie jednostek energoelektronicznychInfo
- Publication number
- PL3598860T4 PL3598860T4 PL18184499.4T PL18184499T PL3598860T4 PL 3598860 T4 PL3598860 T4 PL 3598860T4 PL 18184499 T PL18184499 T PL 18184499T PL 3598860 T4 PL3598860 T4 PL 3598860T4
- Authority
- PL
- Poland
- Prior art keywords
- cooling
- power electronics
- electronics units
- units
- power
- Prior art date
Links
- 238000001816 cooling Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP18184499.4A EP3598860B1 (en) | 2018-07-19 | 2018-07-19 | Cooling of power electronics units |
Publications (2)
Publication Number | Publication Date |
---|---|
PL3598860T3 PL3598860T3 (pl) | 2024-03-11 |
PL3598860T4 true PL3598860T4 (pl) | 2024-04-08 |
Family
ID=63165152
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PL18184499.4T PL3598860T4 (pl) | 2018-07-19 | 2018-07-19 | Chłodzenie jednostek energoelektronicznych |
Country Status (2)
Country | Link |
---|---|
EP (1) | EP3598860B1 (pl) |
PL (1) | PL3598860T4 (pl) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11489417B2 (en) | 2020-04-30 | 2022-11-01 | Deere & Company | Packaging of wide bandgap power electronic power stages |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9307674B2 (en) * | 2011-05-06 | 2016-04-05 | International Business Machines Corporation | Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component |
JP5397497B2 (ja) * | 2012-04-20 | 2014-01-22 | ダイキン工業株式会社 | 冷凍装置 |
US9332674B2 (en) * | 2013-10-21 | 2016-05-03 | International Business Machines Corporation | Field-replaceable bank of immersion-cooled electronic components |
-
2018
- 2018-07-19 PL PL18184499.4T patent/PL3598860T4/pl unknown
- 2018-07-19 EP EP18184499.4A patent/EP3598860B1/en active Active
Also Published As
Publication number | Publication date |
---|---|
PL3598860T3 (pl) | 2024-03-11 |
EP3598860B1 (en) | 2023-07-19 |
EP3598860A1 (en) | 2020-01-22 |
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