EP2494656A1 - Mobile vorrichtung - Google Patents
Mobile vorrichtungInfo
- Publication number
- EP2494656A1 EP2494656A1 EP10775781A EP10775781A EP2494656A1 EP 2494656 A1 EP2494656 A1 EP 2494656A1 EP 10775781 A EP10775781 A EP 10775781A EP 10775781 A EP10775781 A EP 10775781A EP 2494656 A1 EP2494656 A1 EP 2494656A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- antenna
- film
- housing element
- antenna radiator
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 229910052751 metal Inorganic materials 0.000 claims abstract description 58
- 239000002184 metal Substances 0.000 claims abstract description 58
- 239000006258 conductive agent Substances 0.000 claims abstract description 56
- 238000004519 manufacturing process Methods 0.000 claims abstract description 56
- 238000000034 method Methods 0.000 claims abstract description 37
- 239000010410 layer Substances 0.000 claims description 153
- 238000007639 printing Methods 0.000 claims description 116
- 239000004020 conductor Substances 0.000 claims description 24
- 239000000853 adhesive Substances 0.000 claims description 13
- 230000001070 adhesive effect Effects 0.000 claims description 13
- 238000000465 moulding Methods 0.000 claims description 12
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 12
- 239000012790 adhesive layer Substances 0.000 claims description 11
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 10
- 239000011241 protective layer Substances 0.000 claims description 10
- 229910052709 silver Inorganic materials 0.000 claims description 10
- 239000004332 silver Substances 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000003292 glue Substances 0.000 claims description 9
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 9
- 229910052737 gold Inorganic materials 0.000 claims description 9
- 239000010931 gold Substances 0.000 claims description 9
- 239000004411 aluminium Substances 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 150000002739 metals Chemical class 0.000 claims description 6
- 229910052697 platinum Inorganic materials 0.000 claims description 6
- 238000004080 punching Methods 0.000 claims description 6
- 238000010008 shearing Methods 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 claims description 5
- 238000003780 insertion Methods 0.000 claims description 5
- 230000037431 insertion Effects 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims description 2
- PEZNEXFPRSOYPL-UHFFFAOYSA-N (bis(trifluoroacetoxy)iodo)benzene Chemical compound FC(F)(F)C(=O)OI(OC(=O)C(F)(F)F)C1=CC=CC=C1 PEZNEXFPRSOYPL-UHFFFAOYSA-N 0.000 claims 1
- 239000000243 solution Substances 0.000 description 15
- 239000011347 resin Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 238000004891 communication Methods 0.000 description 6
- 230000007613 environmental effect Effects 0.000 description 6
- 229920000515 polycarbonate Polymers 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 230000010354 integration Effects 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 3
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 238000010295 mobile communication Methods 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 238000007592 spray painting technique Methods 0.000 description 3
- 230000000007 visual effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- -1 Poly Ethylene Terephthalate Polymers 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
- H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
- H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
- H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/40—Radiating elements coated with or embedded in protective material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3431—Telephones, Earphones
- B29L2031/3437—Cellular phones
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3456—Antennas, e.g. radomes
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/0279—Improving the user comfort or ergonomics
- H04M1/0283—Improving the user comfort or ergonomics for providing a decorative aspect, e.g. customization of casings, exchangeable faceplate
Definitions
- the present invention relates to the field of housing elements and antennas for mobile devices, such as mobile phones.
- the invention also covers the field of methods to manufacture a housing element for a mobile device as well as mobile devices comprising such a housing element.
- a mobile device is defined as a portable communication and/or computer device.
- a drawback with this solution is that the conductivity of the conductive ink limits the antenna performance at low GSM frequencies and the carrier film can cause dents visible at the outer surface of the phone.
- the possibilities for decorative printing are limited as this printing can only be made on one of the two surfaces of the carrier film.
- flexfilm with the antenna pattern to an outside or inside surface of the cover. If applied on the outside it results in visual problems and if applied on the inside, antenna efficiency can be decreased.
- glue is used to attach the flexfilm to the cover it will result in positioning accuracy problems as well as visual and cost problems.
- the flexfilm typically includes a plastic substrate of polyimide. This makes the flexfilm difficult to stretch which means that the flexfilm is unsuitable for use in a moulding process.
- ⁇ a mobile device comprising the housing element to solve the problem to achieve an improved antenna performance especially at low frequencies, to allow multiband operation and to achieve an improved appearance of the external surface of the housing element as well as improved possibilities for decorative printing.
- the object is achieved by providing a housing element for a mobile device.
- the mobile device comprises radio frequency circuits and at least one antenna radiator arranged to be moulded to a non-conductive element of the housing element wherein said antenna radiator is a metal antenna radiator integrated in an antenna.
- the antenna comprises at least a first film.
- the housing element comprises the antenna and the non-conductive element, said antenna radiator is arranged to be attached to the first film via a conductive agent located between said antenna radiator and the first film.
- the antenna is arranged to be moulded to the non-conductive element. At least one hole and/or aperture is arranged in the non-conductive element to allow contacting between said antenna radiator and the radio frequency circuits.
- the object is further achieved by a method to manufacture a housing element for a mobile device.
- the mobile device comprises radio frequency circuits and at least one antenna radiator being moulded to the housing element wherein:
- said antenna radiator is integrated in an antenna comprising at least a first film, the housing element comprising the antenna and the non- conductive element,
- said antenna radiator is attached to the first film via a conductive agent located between said antenna radiator and the first film,
- the antenna is moulded to the non-conductive element
- the object is further achieved by an antenna for a mobile device.
- the antenna comprises at least one antenna radiator and the mobile device comprises radio frequency circuits, wherein said antenna radiator is a metal antenna radiator integrated in an antenna comprising at least a first film.
- Said antenna radiator is arranged to be attached to the first film via a conductive agent located between said antenna radiator and the first film.
- the object is further achieved by providing a mobile device comprising a housing element according to any one of claims 1 -17.
- said antenna radiator is made of a well conductive metal.
- said antenna radiator is made of gold or silver or copper or aluminium or platinum or a combination of metals.
- said housing element is at least a part of an external cover of the mobile device.
- said housing element is a back cover of a mobile phone.
- said hole/s and/or aperture/s in the non-conductive element is/are filled with a conductive material such that the conductive filling is substantially flush with an inner surface of the housing element or said hole/s and/or aperture/s is/are open or partially filled with the conductive material.
- the conductive filling is conductive glue.
- the first film has a decorative printing applied to a top surface of the first film.
- the first film has a number of sub layers and decorative printing is applied to at least one top surface and/or at least one bottom surface of a sub layer, the top surface being the surface closest to the exterior of the mobile device and the bottom surface being the surface closest to the interior of the mobile device.
- the sub layers comprises at least one adhesive sub layer and/or at least one technical sub layer.
- the antenna comprises a second film with a decorative printing and the first film with said antenna radiator.
- the second film has a number of sub layers and decorative printing is applied to at least one top surface and/or at least one bottom surface of a sub layer, the top surface being the surface closest to the exterior of the mobile device and the bottom surface being the surface closest to the interior of the mobile device.
- the sub layers comprises at least one adhesive sub layer and/or at least one technical sub layer.
- the first film, the second film and the sub layers are transparent or non transparent or a combination of transparent and non-transparent films and sub layers within one antenna.
- the non-conductive element has a first hole and a second hole where the first hole is arranged for RF connection and the second hole is arranged for connection to ground.
- the antenna comprises one or several metal antenna radiators.
- the top surface of the first film and/or the second film comprises a protective layer.
- the method comprises: • printing the antenna radiator pattern and position marks, using a conductive agent, on one of the surfaces of the first film or one of the surfaces of a sub layer,
- the method comprises:
- a shearing operation where the production sheet is cut into smaller pieces and/or a contacting step is added, in the contacting step said hole/s and/or said aperture/s in the non-conductive element is/are filled with a conductive material or said hole/s and/or aperture/s are open or partially filled with the conductive material.
- the first film has a decorative printing applied to a top surface of the first film.
- the first film has a number of sub layers and in that decorative printing is applied to at least one top surface and/or at least one bottom surface of a sub layer, the top surface being the surface closest to the exterior of the mobile device and the bottom surface being the surface closest to the interior of the mobile device.
- the sub layers comprises at least one adhesive sub layer and/or at least one technical sub layer.
- the antenna comprises a second film with a decorative printing and the first film with said antenna radiator.
- the second film has a number of sub layers and decorative printing is applied to at least one top surface and/or at least one bottom surface of a sub layer, the top surface being the surface closest to the exterior of the mobile device and the bottom surface being the surface closest to the interior of the mobile device.
- the sub layers comprises at least one adhesive sub layer and/or at least one technical sub layer.
- the first film, the second film and the sub layers are transparent or non transparent or a combination of transparent and non-transparent films and sub layers within one antenna.
- said antenna radiator has two connections, one for connecting said antenna radiator to the Radio Frequency, RF, circuits of the mobile device and one for connecting to a ground of the mobile device, the connections being arranged through said hole/s and/or aperture/s in the non-conductive element.
- the antenna comprises one or several antenna radiators of metal.
- at least one of said antenna radiators is a PIFA and/or a patch antenna radiator.
- said antenna radiator is made of a well conductive metal.
- said antenna radiator is made of gold or silver or copper or aluminium or platinum or a combination of metals.
- the invention integrates the antenna in the housing element of the mobile device. This saves space in the interior of the mobile device where the antenna is located in many prior art solutions of today.
- the invention also provides a solution for providing connection pads for the antenna radiator, used to connect the antenna radiator with the radio frequency circuits of the mobile device. By locating the antenna radiator close to the exterior of the mobile device, as far away as possible from electronic parts of the mobile device, the antenna performance can be improved.
- a standard In Mould Label (IML) manufacturing process can be used which means a stable and cost effective manufacturing with a high yield.
- the antenna performance is improved further by the antenna radiator being made of metal.
- Figure 1 schematically illustrates an example of a mobile device.
- Figure 2a schematically illustrates a side view of a housing element realized in a one film version of the invention.
- Figures 2b - 2f schematically illustrates side views of further examples of a housing element in a one film version of the invention.
- Figure 3 schematically shows in a partially exploded perspective view an example of the first film with decorative printing, conductive agent, antenna radiator and position marks (one film version)
- Figure 4 schematically illustrates in a partially exploded perspective view an example of the first film with five sub layers (one film version).
- Figure 5 schematically illustrates a side view of a housing element realized in a two film version of the invention.
- Figure 6 schematically shows an example of a two film version of the invention in a partially exploded perspective view.
- Figure 7 schematically illustrates in a partially exploded perspective view an example of a two film version of the invention, with the first film holding an antenna radiator and a second film with decorative printing on three sub layers.
- Figure 8 is a block diagram of an example of the manufacturing method for the one film version of the invention.
- Figure 9 schematically illustrates a production sheet with a number of antennas.
- Figure 10 is a block diagram of an example of the manufacturing method for the two film version of the invention.
- Figure 1 1 is in a partially exploded perspective view of a one film version of the invention with the housing element being a back cover of an external cover for a mobile phone.
- Figure 12 is in a partially exploded perspective view of a two film version of the invention with the housing element being a back cover of an external cover for a mobile phone.
- the invention comprises a housing element with an integrated antenna for a mobile device defined as a portable communication and/or computer device.
- the mobile device can e.g. be a mobile phone, a handheld computer, a lap top, a PDA (Personal Digital Assistant) or any other mobile device with an integrated antenna.
- the housing element is integrated with the mobile device and may also include a decorative printing.
- the housing element can in a preferred example of the invention comprise at least a part of an external cover of the mobile device.
- the housing element can e.g. be a back cover of a mobile phone.
- Figure 1 shows a mobile device 101 , exemplified with a mobile phone, comprising a control unit 107 configured to control communication with a mobile communication system 103.
- a keyboard 1 13, a display 1 15 and radio frequency (RF) circuits 109 are connected to the control unit 107 which together with an antenna 1 1 1 are arranged to establish a radio-interface 105 for communication with the mobile communication system 103.
- the mobile device also normally comprises at least one ground plane.
- a common feature for the mobile devices is that an antenna radiator is connected to the RF circuits which in turn are connected to further electronic components and optionally the antenna can also be connected to the ground plane.
- Radio Frequency (RF) is a frequency of electromagnetic radiation below 300 GHz, i.e. it includes e.g.
- the housing element of the invention comprises a non-conductive element to which an antenna is moulded.
- the antenna comprises at least one film manufactured of e.g. a non conductive material such as plastic materials as PolyCarbonat (PC), Acrylonitrile Butadiene Styrene (ABS) and Poly Ethylene Terephthalate (PET).
- PC PolyCarbonat
- ABS Acrylonitrile Butadiene Styrene
- PET Poly Ethylene Terephthalate
- the film can be transparent or non-transparent.
- the invention can be realized in two main versions, a one film version and a two film version.
- the one film version at least one antenna radiator is applied to one surface of a first film and a decorative printing is preferably applied to an opposite surface, or the same surface, of the first film.
- the alternate two film version comprises two films where the optional decorative printing is applied to a second film and the at least one antenna radiator is applied to the first film.
- the antenna common to both main versions of the invention, comprises at least the first film with the at least one antenna radiator applied. In the two film version the antenna also incorporates the second film.
- a metal layer is added on top of a conductive agent being applied to the first film.
- the conductive agent may be of different types but should be a material with a reasonable conductivity, such as conductive ink (silver ink).
- the conductive agent can be applied by e.g. printing.
- the first and second films are laminated together.
- An electrolytically grown or laminated metal pattern has higher conductivity and a smoother surface than a pattern of conductive ink.
- the higher conductivity leads to better RF properties when using a metal pattern instead of conductive ink as a radiator, which results in an improved antenna performance, especially at low GSM frequencies.
- Metal has better and consistent conductivity compared to other conductive substances.
- the achieved surface smoothness of th e metal radiator improves the performance of the metal radiator due to the known fact that the currents of the antenna radiator primarily use only the top surface of the metal radiator.
- An antenna radiator using conductive ink changes its conductivity when the moulding pressure is changed. Variations in moulding pressure thus leads to variations in conductivity which decreases the yield or the statistical quality of the antenna radiator using conductive ink.
- the thickness of the metal radiator is typically around 10 micrometer (10 ⁇ ) for GSM frequencies but can also be thicker or thinner depending on the actual frequency, choice of metal or combinations of metal and the required performance. Normally the thickness of the radiator is within a range of 1 -20 micrometer (1 -20 ⁇ ). The inventive concept does however not restrict the use of a radiator thickness also outside this range. A thicker layer generally gives better performance but higher costs and lower frequencies require a thicker radiator than higher frequencies.
- the antenna can e.g. in one example of the invention be designed to cover low GSM frequencies, around 850 MHz, and high GSM frequencies around 1800-1900 MHz as well as UMTS frequencies around 2 GHz using one antenna radiator.
- one antenna radiator can cover high and low GSM frequencies.
- the antenna can use one or several antenna radiators, each radiator covering a certain frequency band or bands or combination of frequency bands used for, above GSM and UMTS, Near Field Communication (NFC)/RFID (Radio Frequency Identification), FM-radio, DVB-H (Digital Video Broadcasting-Handheld) used for TV, Bluetooth, WLAN (Wireless Local Area Network), Wimax, UWB (Ultra Wideband), GPS (Global Positioning System) and LTE (Long Term Evolution).
- NFC Near Field Communication
- RFID Radio Frequency Identification
- FM-radio Digital Video Broadcasting-Handheld
- WLAN Wireless Local Area Network
- Wimax Wireless Local Area Network
- UWB User Wideband
- GPS Global Positioning System
- LTE Long Term Evolution
- An additional advantage with both main versions is that in combination with improved conductivity of the radiator there are also no visible dents from a carrier of an antenna radiator, as the antenna radiator is either on the same film as the decorative printing (one film version) or the film with the antenna radiator and the film with the decorative printing have the same size and are covering substantially the complete outer surface area of th e housing element (two film solution).
- the outer surface of the housing element is defined as the surface of the housing element located closest to the exterior of the mobile device and the inner surface is defined as the surface closest to the interior of the mobile device.
- the housing element comprises at least a part of the external cover of the mobile device
- the outer surface of the housing element is also the exterior surface of the external cover of the mobile device.
- the invention also covers a method for manufacturing the housing element using IML technology and the housing element as well as an antenna manufactured according to the method.
- the invention further covers a mobile device equipped with the housing element.
- Figure 2a to 2f are side views of a housing element showing different examples of the invention in the one film version of the invention.
- the housing element 201 is the back cover of a mobile device.
- the housing element can however also be an interior part of the mobile device or another part of the external cover of the mobile device.
- the housing element comprises a non-conductive element 202 with at least one hole 206 and/or at least one aperture 210 and an antenna 209 with a first film 203 comprising a decorative printing 204 and an antenna radiator 205.
- the decorative printing 204 is, except for the example shown in figure 2f, applied to a top surface 207 of the first film, by e.g. ink printing, screen printing, spray painting or an NCVM (Non Conductive Vacuum Metallization) layer.
- the decorative printing can also be applied on a bottom surface 208 of the first film.
- the example illustrated in figure 2f does not have to comprise a decorative printing as will be explained.
- the first film can also have several sub-layers as will be described later.
- the top surface of a film or sub layer is defined as the surface closest to the exterior of the mobile device while the bottom surface is the surface closest to the interior of the mobile device.
- the first film can be transparent or non transparent.
- the thickness of the first film can vary, among other things depending on the number of sub layers, within 0,01 - 0,9 mm, preferably within 0,1 - 0,3 mm and most preferably within 0,01 - 0,1 mm.
- the decorative printing can be made on the bottom or top surface of any of these sub-layers.
- the first film and its sub layers can be manufactured of plastics such as PC, ABS or PET.
- the first film can optionally also include an environmental protective layer on the top surface.
- the decorative printing is normally covering most of the top or bottom surface of the first film or most of the top or bottom surface of one of the sub layers included in the first film.
- a conductive agent is applied to the bottom surface of the first film or the bottom surface of one of the sub-layers.
- the conductive agent can be applied by e.g. printing.
- the area covered by the conductive agent corresponds to the pattern of the antenna radiator and position marks.
- the position marks can be located close to the edges of the first film.
- a metal layer, e.g. of copper, comprising the antenna radiator 205 is then applied over the area of the conductive agent except for the area of the position marks, using an electrolytic process, such as electroplating.
- An etching or laser process can be used to remove parts of the metal layer in case the area of the conductive agent is larger than the final radiator pattern e.g. in case a tuning of the antenna is desired.
- the antenna radiator can also be a stamped metal part that is applied to th e conductive agent.
- An antenna radiator of well conductive metal, and position marks comprising only the conductive agent, are thus applied to the bottom surface of the first film or the bottom surface of any of the sub-layers.
- the metal can e.g. be gold or silver or copper or aluminium or platinum or a combination of metals.
- the antenna radiator can thus be included in a mid layer of the first film.
- the decorative printing is normally made at a surface closer to the outer surface of the housing element than the surface where the antenna radiator is applied, the antenna radiator will be covered by the decorative printing and will not be visible from the outside. An antenna is thus accomplished including the first film, the decorative printing and the antenna radiator.
- an adhesive layer can preferably by applied to the bottom surface 208 of the first film or the bottom surface of the sub-layer closest to the interior of the mobile device for better attachment to the resin, used for the non-conductive element 202.
- an adhesive layer can also be applied to the top surface 207 of the first film or the top surface of the sub- layer closest to the exterior of the mobile device for better attachment to the resin, used for the non-conductive element 202.
- One or several contact pads for the antenna radiator used to connect the antenna radiator to e.g. a Printed Circuit Board (PCB) of the mobile device, is accomplished by using a conductive material such as conductive glue which is inserted in hole/s 206 and/or aperture/s 210 in the non-conductive element 202 of the housing element 201 , the holes being located at positions in register with a suitable contact point or suitable contact points at the antenna radiator.
- Figure 2a is illustrating a solution using one hole 206.
- Figure 2b shows an example with one aperture 210 uncovering the complete area of the antenna radiator from the non-conductive element.
- Figure 2c shows an example with one aperture 210 uncovering part of the area of the antenna radiator from the non-conductive element.
- Figure 2d shows an example with one aperture 210 uncovering part of the area of the antenna radiator from the non-conductive element and one hole 206.
- Figure 2e shows an example with two holes.
- the hole/s 206 are only uncovering a small area of the antenna radiator from the non-conductive element at positions in register with a suitable contact point or suitable contact points at the antenna radiator while the aperture/s 210 are uncovering larger areas, including suitable contact point/s, of the antenna radiator from the non-conductive element.
- the hole/s and/or aperture/s in the housing element is/are filled with the conductive material such as conductive glue such that the conductive filling will be substantially flush with the inner surface of the housing element.
- the hole/s and/or the aperture/s can also in other examples of the invention be partially filled with the conductive filling.
- There may be a conventional contact such as a pogo pin to arrange the contact between the conductive pad or pads and the PCB of the mobile device.
- a non-galvanic connection such as a capacitive coupling, may also be used for contact between the conductive pad or pads and the PCB.
- the hole/s and/or aperture/s is/are open, i.e. not filled by the conductive filling or partially filled by the conductive filling.
- the contacting to the electronic components of the mobile device can then be arranged in any conventional way by galvanic or non galvanic means.
- Figure 2f shows an example of a one film version of the housing element 201 with the radiator 205 applied to the first film 203 as explained for the examples according to figures 2a - 2e above.
- the antenna 209 comprises the antenna radiator 205 applied to the first film 203.
- the antenna is surrounded by the non-conductive element 202 except for around the hole/s and/or the aperture/s.
- the outer surface 21 1 of the housing element is in the example of figure 2f also the exterior surface of the external cover of the mobile device.
- the housing element can also be an interior part of the mobile device as explained earlier.
- Adhesive layers can also be applied to the top surface 207 and /or the bottom surface 208 of the first film or the top surface of the sub-layer closest to the exterior of the mobile device and/or the bottom surface of the sub-layer closest to the interior of the mobile device for better attachment to the resin, used for the non-conductive element 202.
- An environmental protective layer can optionally be applied to the outer surface 21 1 of the housing element.
- decorative printing can be applied to the first film in the same way as described for the examples according to figures 2a- 2e.
- An advantage with the one film solution is that it allows for a very thin solution as the first film can be used to hold both the decorative printing and the antenna radiator as shown in the examples according to figures 2a - 2e.
- Figure 3 shows the first film 301 realized with a transparent film.
- the first film has a decorative printing, in this case a wave pattern on a coloured background applied to the top surface 302 of the first film.
- the coloured background is not shown for clarity reasons.
- the antenna radiator 304 is applied to the conductive agent 305.
- the antenna radiator can be of any type such as e.g. a Planar Inverted F Antenna (PIFA) or a patch.
- Position marks 306 are located close to the edges of the first film. Some or all of the position marks can in other examples of the invention be located within a borderline 307.
- the position marks are printed with the conductive agent either on the top or bottom surface of the first film.
- the rectangular borderline 307 represents the outline of the final shape of the first film when it will be inserted in a mould for integration with the non-conductive element of the housing element.
- the shape of the borderline is adapted to the desired shape of the housing element and does not have to be rectangular.
- Figure 4 shows in a partially exploded perspective view the first film 401 realized with 5 sub layers, 402-406.
- the top surface 407 of the first film which is also the top surface of the first sub layer 402, has in this example a decorative printing comprising a colour covering the complete top surface 407. The colour is not shown for clarity reasons.
- the top surface of the second sub layer 403 has a decorative printing comprising a wave pattern and the top surface of the third sub layer 404 has a decorative printing comprising an elliptical pattern.
- the decorative printing can also be applied to the bottom surface of each sub layer.
- the top and bottom surface of a sub layer is defined in analogy with the definition for top and bottom surface for a film, i.e.
- the top surface is defined as the surface closest to the exterior of the mobile device while the bottom surface is the surface closest to the interior of the mobile device.
- the decorative printing is thus applied to at least one top surface and/or at least one bottom surface of a sub layer.
- the fourth sub layer 405 in the example of figure 4 can be a technical sub layer which can be used for various reasons such as bonding layers together, adding mechanical strength or chemical resistance.
- the technical sub layer can also shade sub layers, which are closer to the interior of the mobile device or provide a smooth background for sub layers with decorative printing which are closer to the exterior of the mobile device.
- the shading can for example be made by covering the technical sub layer with a black colour.
- the fifth sub layer 406 is used to apply the conductive agent 408 to the bottom surface of the fifth sub layer.
- the antenna radiator 409 is then applied to the conductive agent.
- the position marks 410 can be printed at the bottom or top surface of the fifth sub layer using the conductive agent.
- a further adhesive sub layer can be applied to the bottom surface of the fifth sub layer to improve the adhesion to the non conductive element 202.
- Adhesive sub layers can also be inserted in between top and bottom sub layers to improve bonding between layers.
- the first film 401 can optionally also include an environmental protective layer on the top surface 407.
- the sub layers are transparent. They can also be non transparent. In this example it will not be possible to see the antenna radiator from the outside of the mobile device as the decorative printing on the first sub layer will obscure from insight.
- the number of sub layers can however be more than 5 layers, typically 10-20 sub layers, including one or several technical sub layers and adhesive layers as well as additional layers with decorative printing and the protective layer.
- the sub layers may thus include at least one adhesive sub layer and/or at least one technical sub layer.
- the invention is not limited to a certain number of sub layers as long as the thickness of the film is within the range mentioned above.
- the rectangular borderline 41 1 represents the outline of the final shape of the first film when it will be inserted in a mould for integration with the non- conductive element of the housing element.
- the borderline can also have other shapes e.g. with curved side edges adapted e.g. to the shape of a back cover of a mobile device such as a mobile phone.
- the antenna element 400 is thus accomplished including the first film 401 , with its sub layers and decorative printing and the antenna radiator 409 applied with the conductive agent 408.
- the part of the antenna element inside the rectangular borderline is the actual antenna to be used in the mobile device.
- Figure 5 is a side view of a housing element in an example of the two film version of the invention.
- the housing element 501 is the back cover of a mobile device.
- the housing element can however also be an interior part of the mobile device or another part of the external cover of the mobile device.
- the housing element comprises the non-conductive element 502 with the hole 504, the first film 503 and a second film 505.
- the second film is for clarity reasons separated with a small gap 506 from the first film.
- the two films are laminated together and the gap 506 thus disappears.
- the difference from the one film version of the invention, in the example shown in figure 5, is that the decorative printing is now arranged on the second film 505.
- the first film is used for attachment of the antenna radiator and the second film is used for the decorative printing.
- a further example of a two film solution is that the second film with the decorative printing is laminated to the one film solution described above, i.e. further decorative printing is added using the second film.
- a first decorative printing 507 is applied to the top surface of the second film and a second decorative printing 508 is applied to the bottom surface of the second film, by e.g. ink printing, screen printing, spray painting or an NCVM layer.
- the second film can be transparent or non transparent.
- the thickness of the second film can vary, among other things depending on the number of sub layers, within 0,01 - 0,9 mm, preferably within 0,1 - 0,3 mm and most preferably within 0,01 - 0,1 mm.
- the second film can also have several sub- layers as will be described later.
- the decorative printing can be made on the bottom or top surface of any of these sub-layers.
- the second film and its sub layers can be manufactured of plastic material such as PC, ABS or PET.
- the second film can optionally also include an environmental protective layer on the top surface.
- the decorative printing is normally covering most of the top or bottom surface of the second film or most of the top or bottom surface of one of the sub layers included in the second film.
- the bottom surface of the first film is preferably covered by an adhesive layer to improve adhesion to the non-conductive element.
- the conductive agent is applied to the bottom surface of the first film 503.
- the thickness of the first film in the example of figure 5 without decorative printing is about 0,03 mm.
- the thickness of the first film can however vary, among other things depending on the number of sub layers, within 0,01 - 0,9 mm, preferably within 0,1 - 0,3 mm and most preferably within 0,01 - 0,1 mm.
- the conductive agent can be applied e.g. by printing.
- the area covered by the conductive agent corresponds to the pattern of the antenna radiator and position marks. The position marks can be located close to the edges of the first film.
- a metal layer e.g.
- the antenna radiator 509 is then applied over the area of the conductive agent except for the area of the position marks, using an electrolytic process such as electroplating.
- An etching or laser process can be used to remove parts of the metal layer in case the area of the conductive agent is larger than the final radiator pattern e.g. in case a tuning of the antenna is desired.
- the antenna radiator can also be a stamped metal part that is applied to the conductive agent.
- An antenna radiator of a well conductive metal, and position marks comprising only the conductive agent, are thus applied to the bottom surface of the first film.
- the metal can e.g. be gold or silver or copper or aluminium or platinum or a combination of metals.
- the antenna radiator will be covered by the decorative printing and will not be visible from the outside.
- An antenna is thus accomplished including the second film with the decorative printing and the first film with the antenna radiator.
- the decorative printing can be left out, which also means that the second film can be left out.
- An advantage with the two film version is that a full size second film with decorative printing covering the main part of the outer surface of the housing element, or the surface of the housing element most distal from the interior of the mobile device, is laminated with the first film having an area larger than the second film and overlapping the second film and also having an area outside the overlapping part.
- the position marks may then advantageously be located on the area of the first film outside the overlapping part.
- the position marks have two purposes for the two film version of the invention: 1 . to position the first film in relation to the second film
- the position marks are only used for the second purpose. In some applications, e.g. when accuracy in positioning is not critical, the position marks can be left out.
- the area of the first film outside the borderline 307, 41 1 holding the position marks, as shown in figures 3 and 4, is cut away before the moulding process.
- the position marks can , for both the one film version and the two film version, be located both within the borderline 307, 41 1 , or outside this borderline.
- Position marks for the first purpose are often located outside the borderline and position marks for the second purpose can be located within the borderline when the accuracy demand is high for positioning the antenna in the pre-forming tool and/or the mould or the positioning in the pre-forming tool and/or the mould cannot be made by just using the shape of the antenna.
- An antenna element 400 can thus have position marks both within the borderline and outside the borderline.
- a further advantage with the two film version is that there will be no visual marks on the top surface of the second film from the underlying first film which could be the case if the first film has a smaller area than the second film. If the first film has a smaller area than the second film the borders from the smaller first film could be seen on the top surface of the second film when it is laminated to the second film.
- An adhesive layer can preferably by applied to the bottom surface of the first film and the antenna radiator for better attachment to the resin used for the non-conductive element.
- One or several contact pads for each antenna radiator, used to connect the antenna radiator to e.g. a PCB of the mobile device, is accomplished by using a conductive material such as conductive glue which is inserted in holes 504 in the non-conductive element 502 of the housing element 501 , the holes being located at positions in register with a suitable contact point or contact points at the antenna radiator.
- Figure 5 is illustrating a solution using one hole 504 and one antenna radiator 509.
- the hole or holes in the housing element is/are filled with the conductive material e.g. the conductive glue such that the conductive filling will be substantially flush with the inner surface of the housing element.
- the hole 504 of figure 5 can be replaced with hole/s and/or aperture/s in the same way as described for the one film version in figures 2b to 2e.
- the hole/s and/or aperture/s can also be filled with the conductive filling in the same way as described for the one film version of the invention in association with figure 2.
- the hole/s and/or aperture/s is/are open, i.e. not filled by the conductive filling or partially filled with the conductive filling.
- the contacting to the electronic components of the mobile device can then be arranged in any conventional way by galvanic or non galvanic means.
- a special advantage with the two film version of the invention is that the decoration and metallization is made in two separate processes where each process can be optimized for maximum yield independent of the other. This increases the total yield.
- a typical antenna radiator as a dual band PIFA normally needs two connections for connecting the at least one antenna radiator to the mobile device, one for connecting said antenna radiator to the Radio Frequency (RF) circuits of the mobile device and one for connecting to a ground of the mobile device. If a half-wave antenna is used one RF connection can be sufficient.
- the antenna radiator connections are arranged through the hole/s and/or aperture/s in the non-conductive element.
- the antenna radiator can be of any type such as a patch or a PIFA here can be one or several antenna radiators e.g. two metal antenna radiators comprising one main antenna radiator for the GSM/UMTS and a separate Bluetooth or GPS (Global Positioning System) antenna radiator.
- the non-conductive element may thus comprise a first hole and a second hole 206, 504 where the first hole is arranged for RF connection and the second hole is arranged for connection to ground.
- Figure 6 shows in a partially exploded perspective view an example of a two film version of the invention with the antenna element 601 comprising the second film 602 with the decorative printing, the first film 603 with the at least one antenna radiator 604 and position marks 605.
- both carriers are realized with transparent films.
- the second film has a decorative printing, in this case a colour applied to cover the top surface 607 of the second film.
- the colour is not shown for clarity reasons.
- the antenna radiator 604 is applied to the conductive agent.
- the conductive agent is not shown in figure 6 but is applied directly to the bottom surface of the first film and the antenna radiator is then applied to the conductive agent.
- the antenna radiator can be of any type such as e.g. a PIFA or a patch antenna.
- Position marks 605 are located close to the edges of the first film. In another example of the invention some or all the position marks can also be located within a borderline 606. The position marks are printed with the conductive agent either on the top or bottom surface of the first film.
- the position marks are used to position the antenna in the pre-forming tool and/or the mould as will be explained further in association with figures 8 and 10.
- the position marks are also used to position the first film in relation to the second film.
- the rectangular borderline 606 represents the outline of the final shape of the first film, representing the antenna, when it will be inserted in a mould for integration with the non- conductive element of the housing element.
- the borderline can also have other shapes than rectangular as described in association with figures 3 and 4.
- Figure 7 shows the two film version of the invention in a partially exploded perspective view with the antenna element 701 comprising the first film 702 and the second film 703.
- the decorative printing is in this example realized on the top surface of a first 704, second 705 and third 706 sub layer of the second film.
- the top surface of the second film 703, which is also the top surface of the first sub layer 704, has in this example a decorative printing comprising a colour covering the complete top surface.
- the colour is not shown for clarity reasons.
- the top surface of the second sub layer 705 has a decorative printing comprising a wave pattern and the top surface of the third sub layer 706 has a decorative printing comprising an elliptical pattern.
- the decorative printing can also be applied to the bottom surface of each sub layer.
- the top and bottom surface of a sub layer is defined in analogy with the definition for top and bottom surface for a film, i.e. the top surface is defined as the surface closest to the exterior of the mobile device while the bottom surface is the surface closest to the interior of the mobile device. In the example of figure 7 the decorative printing is thus applied to at least one top surface and/or at least one bottom surface of a sub layer.
- the second film can also comprise technical layers and adhesive layers as described for the first film in association with figure 4.
- the antenna radiator 707 is applied to the conductive agent.
- the conductive agent is not shown in figure 7 but is applied directly to the bottom surface of the first film and the antenna radiator is then applied to the conductive agent.
- the antenna radiator can be of any type such as e.g. a PIFA or a patch antenna.
- Position marks 708 are located close to the edges of the first film. In another example of the invention some or all of the position marks can also be located within a borderline 709.
- the position marks are printed with the conductive agent either on the top or bottom surface of the first film. These marks are used to position the antenna in the pre-forming tool and/or the mould as will be explained further in association with figures 8 and 10.
- the position marks are also used for to position the first film in relation to the second film.
- the rectangular borderline 709 represents the outline of the final shape of the first film, representing the antenna, when it will be inserted in a mould for integration with the non-conductive element of the housing element.
- the borderline can also have other shapes than rectangular as described in association with figures 3 and 4.
- the second film 703 can optionally also include an environmental protective layer on the top surface.
- the sub layers are transparent. They can also be non transparent. In this example it will not be possible to see the antenna radiator from the outside of the mobile device as the decorative printing on the first sub layer of the first film will obscure from insight.
- the second film has three sub layers.
- the number of sub layers can however be more than 3 layers, typically 10-20 sub layers, including one or several technical sub layers and adhesive layers as well as additional layers with decorative printing and the protective layer.
- the sub layers may thus include at least one adhesive sub layer and/or at least one technical sub layer.
- the invention is not limited to a certain number of sub layers as long as the thickness of the film is within the range mentioned above.
- the antenna element 701 is thus accomplished including the first film 702, with the antenna radiator 707 applied with the conductive agent and the second film 703 with its sub layers and decorative printing.
- the invention provides a housing element for a mobile device.
- the mobile device comprises radio frequency circuits and at least one antenna radiator arranged to be moulded to a non-conductive element of the housing element wherein said antenna radiator is a metal antenna radiator integrated in an antenna.
- the antenna comprises at least a first film.
- the housing element comprises the antenna and the non-conductive element, said antenna radiator is arranged to be attached to the first film via a conductive agent located between said antenna radiator and the first film.
- the antenna is arranged to be moulded to the non-conductive element. At least one hole and/or at least one aperture is arranged in the non-conductive element to allow contacting between said antenna radiator and the radio frequency circuits.
- the invention further provides an antenna for a mobile device.
- the antenna comprises at least one antenna radiator and the mobile device comprises radio frequency circuits, wherein said antenna radiator is a metal antenna radiator integrated in an antenna comprising at least a first film. Said antenna radiator is arranged to be attached to the first film via a conductive agent located between said antenna radiator and the first film.
- a first printing step 801 the printing of the antenna radiator pattern and position marks is performed, using a conductive agent, on one of the surfaces of the first film or one of the surfaces of a sub layer as described.
- the conductive agent can e.g. be a weakly conductive ink.
- the conductive agent can thus be any conductive material suitable for printing and having at least a weak conductivity.
- This first printing step also includes the optional insertion of technical and adhesive sub layers as well as an environmental protective layer to the first film.
- metal is applied onto the antenna radiator pattern.
- An electrolytic process as electroplating can be used for applying the antenna radiator.
- An etching or laser process can be used to remove parts of the metal layer in case the area of the conductive agent is larger than the final radiator pattern e.g. in case a tuning of the antenna is desired.
- the conductive material can be a metal such as e.g. copper, silver or gold.
- a third decorative printing step 803 the decorative printing is applied to at least one of the surfaces of the first film and/or its sub layers using e.g. ink printing, screen printing, spray painting or an NCVM layer as described. However when the antenna is applied to an interior housing element or when the configuration described in association with figure 2f is used, the decorative printing can be left out.
- a curing step 804 the printing of the antenna radiator pattern, the position marks and the decorative printing are allowed to dry e.g. by introducing the antenna in a heating chamber.
- the first film comprises a number of antenna elements 902 on a common production sheet 901 , see figure 9. Each antenna element is intended for one mobile device.
- a fifth punching step 805 e.g.
- the punching step can optionally include a shearing operation where the production sheet 901 is cut into smaller pieces, e.g. into a reduced production sheet comprising 8 antenna elements in the example of figure 9.
- the shearing operation can e.g. also result in a reduced production sheet comprising 4 antenna elements.
- the antenna is the part of the antenna element inside the outline border 904.
- a sixth pre-forming step 806 the production sheet, the reduced production sheet or the antenna element is inserted in a single- or multi-cavity preforming tool.
- the position holes can help to position the production sheet, the reduced production sheet or the antenna element in the pre-forming tool.
- a single cavity pre-forming tool can be used when the production sheet is cut into single antenna elements.
- the antenna element will normally have a 3D structure, i.e. the antenna element will be curved in a third dimension, after the pre-forming but can also be planar.
- the production sheet or the reduced production sheet will have the shape of the mould cavity which together with the position holes will help to position the antenna element, the production sheet or the reduced production sheet in the mould.
- a seventh cutting step 807 the area of the antenna element 902 outside the outline border 904 including the position marks, as shown in figure 9, are cut away.
- the position marks can, for both the one film version and the two film version, be located both within the outline border 904, or outside this border.
- Position marks for the first purpose are often located outside the border and position marks for the second purpose can be located within the border when the accuracy demand is high for positioning the antenna in the pre-forming tool and/or the mould or the positioning in the preforming tool and/or the mould cannot be made by just using the shape of the antenna.
- An antenna element 400 can thus have position marks both within the border and outside the border.
- the eighth moulding step 808 is a conventional IML process where the antenna is placed in the mould cavity and resin, to form the non-conductive element is injected into the mould cavity. The antenna is thus moulded to the non-conductive element.
- the resin material can e.g. comprise thermoplastic or thermosetting plastics, typically PC or a blend of PC and ABS. The resin attaches to the antenna and the output of the moulding step is the housing element.
- the moulding step is a standard process well known to the skilled person and is therefore not further discussed here.
- the hole/s 206, 504 and/or aperture/s 210 in the non-conductive element can be filled with a conductive material such as e.g. conductive glue.
- the conductive filling is made such that the conductive filling will be substantially flush with the inner surface of the housing element.
- the hole/s or aperture/s can in another example of the invention be partially filled with the conductive material.
- There may be a conventional contact such as a pogo pin to arrange the contact between the conductive pad or pads and the PCB of the mobile device.
- a non-galvanic connection such as a capacitive coupling, may also be used for contact between the conductive pad or pads and the PCB.
- the hole/s and/or aperture/s in the non-conductive structure will be left open, i.e. not filled or partially filled by the conductive filling.
- the contacting to the electronic components of the mobile device can then be arranged in any conventional way by galvanic or non galvanic means.
- the manufacturing proceeds with further assembly steps not part of this invention.
- FIG 10 illustrates an example of the manufacturing method for the two film version of the invention.
- a first two film printing step 1001 comprises the printing of the antenna radiator pattern and position marks, using a conductive agent, on one of the surfaces of the first film or one of the surfaces of a sub layer as described.
- the first film normally comprises only one layer.
- the conductive agent can e.g. be a weakly conductive ink.
- the conductive agent can thus be any conductive material suitable for printing and having at least a weak conductivity.
- metal such as copper, gold or silver is applied onto the antenna radiator pattern.
- An electrolytic process as electroplating can be used for applying the antenna radiator.
- An etching or laser process can be used to remove parts of the metal layer in case the area of the conductive agent is larger than the final radiator pattern e.g. in case a tuning of the antenna is desired.
- the conductive material can be a metal such as e.g. copper, silver or gold.
- a third adhesion print step 1003 the bottom surface of the first film is preferably covered by an adhesive layer to improve adhesion to the non- conductive element.
- Decorative printing is applied to at least one surface of the second film and its sub layers in a two film decorative printing step 1004. This is performed in analogy with applying the decorative printing to the first film in the one film version of the invention. Curing is performed in a two film curing step 1005 in the same way as described for the one film version. The two films are laminated together in a separate lamination process step 1006 thus creating an antenna with decorative printing.
- This lamination process may be either a hot process, as e.g. using a heat activated glue layer between the films or a cold process, as e.g. using a pressure sensitive adhesive between the films.
- FIG. 8 and 10 show two examples of manufacturing methods for the housing element. Variations are possible within the scope of the invention. Common for the manufacturing method described in association with figures 8 and 10 is however that the invention provides a method to manufacture a housing element for a mobile device with the following features:
- said antenna radiator is integrated in an antenna comprising at least a first film, the housing element comprising the antenna and the non- conductive element,
- said antenna radiator is attached to the first film via a conductive agent located between said antenna radiator and the first film,
- At least one hole and/or at least one aperture is/are arranged for in the non-conductive element to allow contacting between said antenna radiator and the radio frequency circuits.
- the mobile device comprises radio frequency circuits and at least one antenna radiator being moulded to the housing element.
- position marks are used. For some applications, as mentioned earlier, e.g. when accuracy in positioning is not critical, the position marks can be left out.
- Figure 1 1 gives a partially exploded perspective view of a housing element 1 101 with an antenna 1 102 and a non-conductive element 1 103 in a one film version.
- the illustrated housing element can e.g. be a back cover of a mobile phone.
- a part of the antenna radiator 1 104 can be seen on the bottom surface of the first film.
- a contact pad 1 105 is filling up a hole, as shown in figure 1 1 , in the non-conductive element with a conductive material and is in galvanic contact with the antenna radiator. In other examples of the invention there can be at least one hole and/or at least one aperture.
- An opening 1 106 through the non-conductive element and the antenna can e.g. be used as an opening for a camera.
- Figure 12 gives a partially exploded perspective view of a housing element 1201 with an antenna 1202 and a non-conductive element 1208 in a two film version.
- the antenna comprises the first film 1203 with the antenna radiator 1205 and the second film 1204 with the decorative printing.
- the illustrated housing element can e.g. be a back cover of a mobile phone.
- a part of the antenna radiator 1205 can be seen on the bottom surface of the first film.
- a contact pad 1206 is filling up an opening, which can be a hole or an aperture, in the non-conductive element 1208 with a conductive material and is in galvanic contact with the antenna radiator 1205.
- An opening 1207 through the non-conductive element and the antenna can e.g. be used as an opening for a camera.
- the first film, the second film and the sub layers can be transparent or non transparent. It is further possible with a combination of transparent and non-transparent films and sub layers within one antenna.
- the invention also provides a mobile device comprising a housing element according to any one of claims 1 -17.
- the invention is not linnited solely to the examples described above, but instead many variations are possible within the scope of the inventive concept defined by the appended claims. Within the scope of the inventive concept the attributes of different examples and applications can be used in conjunction with or replace the attributes of another example or application.
Landscapes
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Telephone Set Structure (AREA)
- Details Of Aerials (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US25638509P | 2009-10-30 | 2009-10-30 | |
SE0950810A SE534322C2 (sv) | 2009-10-30 | 2009-10-30 | Mobilenhet |
PCT/EP2010/066406 WO2011051408A1 (en) | 2009-10-30 | 2010-10-28 | Mobile device |
Publications (1)
Publication Number | Publication Date |
---|---|
EP2494656A1 true EP2494656A1 (de) | 2012-09-05 |
Family
ID=43921381
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP10775781A Withdrawn EP2494656A1 (de) | 2009-10-30 | 2010-10-28 | Mobile vorrichtung |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP2494656A1 (de) |
CN (1) | CN102668236B (de) |
SE (1) | SE534322C2 (de) |
WO (1) | WO2011051408A1 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104704677A (zh) * | 2013-03-21 | 2015-06-10 | 夏普株式会社 | 结构体和无线通信装置 |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SE530778C2 (sv) | 2006-12-08 | 2008-09-09 | Perlos Oyj | Antennanordning |
JP2013214909A (ja) * | 2012-04-03 | 2013-10-17 | Denso Corp | 車両用携帯機 |
US20140062799A1 (en) * | 2012-08-29 | 2014-03-06 | Motorola Mobility Llc | Wireless communication device and method with an enhanced antenna farm |
CN202817165U (zh) * | 2012-09-26 | 2013-03-20 | 华为终端有限公司 | 一种天线连接结构及其电子产品 |
US9413861B2 (en) | 2012-10-05 | 2016-08-09 | Nokia Technologies Oy | Metallization and anodization of plastic and conductive parts of the body of an apparatus |
US9300036B2 (en) | 2013-06-07 | 2016-03-29 | Apple Inc. | Radio-frequency transparent window |
WO2015101842A1 (en) * | 2014-01-06 | 2015-07-09 | Nokia Technologies Oy | A body of a portable electronic device that includes a near field coil |
WO2016027391A1 (ja) * | 2014-08-21 | 2016-02-25 | ソニー株式会社 | 筐体部品、電子機器、筐体部品の製造方法 |
US9985345B2 (en) * | 2015-04-10 | 2018-05-29 | Apple Inc. | Methods for electrically isolating areas of a metal body |
WO2018028486A1 (en) | 2016-08-08 | 2018-02-15 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Housing, method for manufacturing housing, and mobile terminal having housing |
WO2018028372A1 (en) * | 2016-08-08 | 2018-02-15 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Housing, method for manufacturing housing, and mobile terminal having housing |
CN107069179B (zh) * | 2017-01-25 | 2023-11-24 | Oppo广东移动通信有限公司 | 壳体、壳体制作方法、天线装置及移动终端 |
CN107146946A (zh) * | 2017-05-04 | 2017-09-08 | 深圳市金立通信设备有限公司 | 一种终端的天线制作方法、天线以及终端 |
CN110784564B (zh) * | 2018-07-31 | 2021-09-14 | 华为技术有限公司 | 一种移动终端及其天线的制备方法 |
CN108990345B (zh) * | 2018-08-24 | 2020-08-25 | Oppo(重庆)智能科技有限公司 | 壳体及壳体的装饰件安装方法 |
US11264691B2 (en) * | 2019-07-15 | 2022-03-01 | Kymeta Corporation | Ground plane heater |
WO2021095789A1 (ja) * | 2019-11-14 | 2021-05-20 | Nissha株式会社 | アンテナ機能付きカバー |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1489687A1 (de) * | 2003-06-19 | 2004-12-22 | Harris Corporation | Dielektrisches Substrat mit selektiv gesteuerter effektiver Permittivität und Verlust-Tangens |
EP1988601A1 (de) * | 2006-02-19 | 2008-11-05 | Nissha Printing Co., Ltd. | Zuführungsstruktur des gehäuses mit antenne |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2345196B (en) | 1998-12-23 | 2003-11-26 | Nokia Mobile Phones Ltd | An antenna and method of production |
US6486853B2 (en) * | 2000-05-18 | 2002-11-26 | Matsushita Electric Industrial Co., Ltd. | Chip antenna, radio communications terminal and radio communications system using the same and method for production of the same |
JP4507445B2 (ja) * | 2001-04-25 | 2010-07-21 | パナソニック株式会社 | 表面実装型アンテナ及びそれを用いた電子機器 |
KR100843442B1 (ko) * | 2007-01-02 | 2008-07-03 | 삼성전기주식회사 | 필름형 안테나 및 이를 이용한 이동통신 단말기 케이스 |
KR20080102461A (ko) * | 2007-05-21 | 2008-11-26 | 주식회사 이엠따블유안테나 | 무선 단말기 외장 케이스 안테나 |
JP4881247B2 (ja) * | 2007-07-13 | 2012-02-22 | 株式会社東芝 | 電子機器及びその製造方法 |
JP4756020B2 (ja) * | 2007-09-25 | 2011-08-24 | 株式会社東芝 | 筐体及びその製造方法、並びに電子機器 |
CN101327632A (zh) * | 2008-08-01 | 2008-12-24 | 华硕电脑股份有限公司 | 模内薄膜转印装置 |
-
2009
- 2009-10-30 SE SE0950810A patent/SE534322C2/sv unknown
-
2010
- 2010-10-28 EP EP10775781A patent/EP2494656A1/de not_active Withdrawn
- 2010-10-28 WO PCT/EP2010/066406 patent/WO2011051408A1/en active Application Filing
- 2010-10-28 CN CN201080048849.6A patent/CN102668236B/zh not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1489687A1 (de) * | 2003-06-19 | 2004-12-22 | Harris Corporation | Dielektrisches Substrat mit selektiv gesteuerter effektiver Permittivität und Verlust-Tangens |
EP1988601A1 (de) * | 2006-02-19 | 2008-11-05 | Nissha Printing Co., Ltd. | Zuführungsstruktur des gehäuses mit antenne |
Non-Patent Citations (1)
Title |
---|
See also references of WO2011051408A1 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104704677A (zh) * | 2013-03-21 | 2015-06-10 | 夏普株式会社 | 结构体和无线通信装置 |
CN104704677B (zh) * | 2013-03-21 | 2017-03-01 | 夏普株式会社 | 结构体和无线通信装置 |
Also Published As
Publication number | Publication date |
---|---|
CN102668236B (zh) | 2014-12-03 |
CN102668236A (zh) | 2012-09-12 |
SE534322C2 (sv) | 2011-07-12 |
SE0950810A1 (sv) | 2011-05-01 |
WO2011051408A1 (en) | 2011-05-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP2494656A1 (de) | Mobile vorrichtung | |
EP3355162B1 (de) | Gehäuse für eine elektronische vorrichtung und verfahren zur herstellung davon | |
EP2913988B1 (de) | Gehäuse, elektronische Vorrichtung damit und Verfahren zur Herstellung davon | |
US20120235879A1 (en) | Three dimensional antenna | |
US8150484B2 (en) | Protective housings for wireless transmission apparatus and associated methods | |
EP2223789B1 (de) | Spritzguss-RF-Antenne, Vorrichtung damit und zugehörige Verfahren | |
US8711041B2 (en) | Case of electronic device having antenna pattern embedded therein and mold and method for manufacturing the same | |
US9266266B2 (en) | Case of electronic device having antenna pattern frame embedded therein, mold therefor and method of manufacturing thereof | |
US20100283706A1 (en) | Housing with built-in antenna and method for fabricating the same | |
US8537072B2 (en) | Antenna for mobile terminal unit | |
US9680212B2 (en) | Capacitive grounding methods and apparatus for mobile devices | |
EP2580813A1 (de) | Verfahren der fertigung und das betriebs einer antennenanordnung für ein kommunikationsgerät | |
US8976074B2 (en) | Case of electronic device having low frequency antenna pattern embedded therein, mold therefor and method of manufacturing thereof | |
KR20080008633A (ko) | 이동통신 단말기 | |
KR20100113258A (ko) | 도전성재질을 이용한 안테나 제조방법과 그 제조방법에 의해 제조되는 안테나 | |
CN101682105B (zh) | 天线装置以及包括该天线装置的便携式无线通信装置 | |
TWI528628B (zh) | 天線製造方法和天線結構 | |
KR20170073321A (ko) | 안테나 일체형 모바일 기기 케이스의 제조 방법 | |
KR20060065837A (ko) | 휴대용 무선 통신기기에 내장된 rf 안테나 및 이의 제조방법 | |
KR20140085160A (ko) | 기구 일체형 안테나 제조 방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20120529 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
DAX | Request for extension of the european patent (deleted) | ||
17Q | First examination report despatched |
Effective date: 20160513 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20160924 |