WO2000033625A1 - Process for depositing conducting layer on substrate - Google Patents
Process for depositing conducting layer on substrate Download PDFInfo
- Publication number
- WO2000033625A1 WO2000033625A1 PCT/GB1999/004064 GB9904064W WO0033625A1 WO 2000033625 A1 WO2000033625 A1 WO 2000033625A1 GB 9904064 W GB9904064 W GB 9904064W WO 0033625 A1 WO0033625 A1 WO 0033625A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- layer
- conducting layer
- ink
- electrically conducting
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 56
- 230000008569 process Effects 0.000 title claims abstract description 45
- 239000000758 substrate Substances 0.000 title claims abstract description 39
- 238000000151 deposition Methods 0.000 title claims abstract description 26
- 230000008021 deposition Effects 0.000 claims abstract description 16
- 238000010899 nucleation Methods 0.000 claims abstract description 15
- 238000007639 printing Methods 0.000 claims abstract description 14
- 229920005989 resin Polymers 0.000 claims description 18
- 239000011347 resin Substances 0.000 claims description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 12
- 238000009713 electroplating Methods 0.000 claims description 11
- 239000000203 mixture Substances 0.000 claims description 8
- 239000011236 particulate material Substances 0.000 claims description 7
- 229920000642 polymer Polymers 0.000 claims description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 239000004952 Polyamide Substances 0.000 claims description 5
- 229920001577 copolymer Polymers 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 229920002647 polyamide Polymers 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 229910052799 carbon Inorganic materials 0.000 claims description 4
- 239000003960 organic solvent Substances 0.000 claims description 4
- 229920001940 conductive polymer Polymers 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 125000003368 amide group Chemical group 0.000 claims description 2
- 229910052763 palladium Inorganic materials 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 2
- 229910052697 platinum Inorganic materials 0.000 claims 1
- 229920000307 polymer substrate Polymers 0.000 claims 1
- 239000010410 layer Substances 0.000 description 49
- 238000004519 manufacturing process Methods 0.000 description 8
- 229920000728 polyester Polymers 0.000 description 6
- -1 polyethylene Polymers 0.000 description 6
- 239000002245 particle Substances 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000009472 formulation Methods 0.000 description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 229920000180 alkyd Polymers 0.000 description 3
- 239000003963 antioxidant agent Substances 0.000 description 3
- 230000003078 antioxidant effect Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 229920002492 poly(sulfone) Polymers 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 239000003638 chemical reducing agent Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- RRAFCDWBNXTKKO-UHFFFAOYSA-N eugenol Chemical compound COC1=CC(CC=C)=CC=C1O RRAFCDWBNXTKKO-UHFFFAOYSA-N 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 229910001385 heavy metal Inorganic materials 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 235000015112 vegetable and seed oil Nutrition 0.000 description 2
- 239000008158 vegetable oil Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- NPBVQXIMTZKSBA-UHFFFAOYSA-N Chavibetol Natural products COC1=CC=C(CC=C)C=C1O NPBVQXIMTZKSBA-UHFFFAOYSA-N 0.000 description 1
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 1
- 101100049144 Escherichia phage 186 dhr gene Proteins 0.000 description 1
- 239000005770 Eugenol Substances 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- UVMRYBDEERADNV-UHFFFAOYSA-N Pseudoeugenol Natural products COC1=CC(C(C)=C)=CC=C1O UVMRYBDEERADNV-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical class [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000002738 chelating agent Substances 0.000 description 1
- 150000001868 cobalt Chemical class 0.000 description 1
- 238000010960 commercial process Methods 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000002274 desiccant Substances 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 229960002217 eugenol Drugs 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000002372 labelling Methods 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- 238000010329 laser etching Methods 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 150000004668 long chain fatty acids Chemical class 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 239000002480 mineral oil Substances 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 235000019198 oils Nutrition 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000006722 reduction reaction Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000002383 tung oil Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
- H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1173—Differences in wettability, e.g. hydrophilic or hydrophobic areas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Definitions
- the present invention relates to a process for forming an electrically conductive layer on a substrate, and in particular to a process for forming such a layer on a substrate which can be used as a circuit board in an electrical assembly.
- particulate conductive material with a particulate surface treatment (e.g. a coating of a long chain fatty acid) to enable the particles to be dispersed in the resin in such a manner as to render the dried ink electrically conductive.
- a particulate surface treatment e.g. a coating of a long chain fatty acid
- this surface treatment precludes further treatment of the dried ink, for example it prevents deposition of a further conductive layer by electroless deposition.
- a process for forming a conductive layer on the substrate comprising the steps of depositing ink on the substrate by means of lithographic printing to form a seeding layer, and depositing a first electrically conducting layer on the seeding layer by electroless deposition.
- Electroless deposition is a well-known technique which involves coating an object (or part of an object) by means of a chemical reduction process, which, once initiated, is also-catalytic. The process is similar to electroplating except that no external current is required.
- a seeding layer of suitable geometry and electrical and chemical characteristics must be formed on the object in order to provide nucleation sites for the metal to be deposited. It is thought that the seeding layer acts as a catalyst, in that it reduces the activation energy for the deposition step.
- lithographic printing referred to herein is a printing process which utilizes differences in surface chemistry of the printing plate, including hydrophilic and hydrophobic properties. It does not refer to the commonly used process involving photoresist and etching occurring during the production of etched circuit boards and/or silicon semiconductor micro electronics.
- the term “ink” is intended to mean any material suitable for printing.
- the ink which is employed in the present invention preferably comprises a particulate material suspended in a mixture of a resin and an organic solvent.
- the particulate material is particulate metal or carbon.
- Particularly suitable materials include silver, gold, copper, zinc or nickel.
- the particle size may be from 0J to 10 micrometers, and preferably from 0.25 to 1 micrometers, more preferably greater than 0.1 micrometers and less than (but not equal to) 1 micrometer, and most preferably from 0.25 to 0.75 micrometers.
- Nypol 3 comprises a modified polyamide and tung oil and vegetable oil blends.
- resins which have exhibited acceptable performance include phenolic modified resin and alkyd resins, which are blended with modified mineral oils and vegetable oils.
- the resin is mixed with a solvent and a suspension of the particulate material is formed.
- the solvent or diluent
- the solvent can be any suitable organic solvent with a boiling point of about 250°C.
- the substrate is formed from a polyester, polyethylene, polypropylene or a polyamide, with or without a copolymer adhesive layer.
- the substrate is a copolymer coated polyester, such as that available commercially from GBC (UK) Ltd of Rutherford Road, Basingstoke, Hampshire, RG24 8PD.
- GBC GBC
- modified polyamide resins work acceptably well with substrates formed from polyethylene, polypropylene, polyamide and polysulphone.
- Modified phenolic resins work acceptably well with polyester, polyimide or polysulphone substrates. Alkyd resins adhere reasonable well to polyester substrates.
- the ink is deposited onto a substrate by means of a lithographic printing process in order to form a seeding layer for electroless deposition.
- the thickness of the seeding layer in the present invention is preferably from 3 to 5 micrometers.
- Electroless deposition of a first electrically conductive layer is carried out by conventional means.
- the conducting layer may be formed from any suitable electrically conductive material which can be deposited by electroless deposition, for example copper, silver, nickel or gold.
- the thickness of the first conducting layer may be up to 4 micrometers and is preferably about 1 micrometer (although the thickness will be determined by the required electrical specifications).
- the process of the present invention may comprise the step of electroplating a second electrically conducting layer onto the first conducting layer.
- the first layer does not need to be as much as 1 micrometer thick; a thickness which render the substrate conductive is required, for example from 0.25 to 0.5 ⁇ m.
- the second layer may comprise any suitable electrically conducting material which can be electroplated.
- the thickness of the second conducting layer may be anything up to 35 micrometers, depending on the required specification of the circuit board.
- a conducting layer can be electroplated onto an electrical circuit prepared according to the process disclosed in WO 97/48257, the resulting circuit board is structurally unstable due to the poor adhesion of the conducting ink onto the substrate.
- One example application of the present invention is in the manufacture of electronic circuit boards.
- the lithographically deposited seeding layer is printed in the graphical configuration of an electrical or electronic circuit.
- the seeding layer can then be electrolessly plated with copper and a further layer of tin or other protective layer.
- Ink layers deposited by the preferred lithographic printing process are about 5 micrometers (5 x 10 "6 m) thick. This may be compared to about 25 micrometers for conductive layers deposited by screen printing, and 20-75 micrometers of copper typically laminated onto a conventional printed circuit board.
- the adopted approach has been to formulate an ink from particles suspended in an organic resin. Manipulation of the resin formulation permits a degree of control over certain mechanical characteristics of the ink (e.g. viscosity).
- the particulate material should be such as to enable the electroless deposition step.
- Suitable materials include silver, copper, carbon and palladium.
- a drying agent such as a cobalt salt can be included to dry the resin once the antioxidant is used up.
- An example of a preferred formulation of an ink is:
- the resulting ink formulation exhibits Newtonian properties, exhibiting a viscosity of about 5 4 to 10 mPaS @ 25 degrees C. Suitable viscosities of ink formulations are considered to lie in the range 10 3 mPaS @ 25 degrees C to 10 5 mPaS @ 25 °C.
- the required artwork (that is, the pattern which is to become the electrical circuit) is applied to an anodised aluminium plate using the standard photoresist method used in the lithographic printing process.
- the aluminium plate is used as a template in a lithographic process to apply the ink to the substrate in the required artwork pattern.
- the electroless process involves placing the inked substrate in an electroless bath (such as the bath supplied by Shipley Ronal Limited) which contains a commercially available electroless plating solution.
- an electroless bath such as the bath supplied by Shipley Ronal Limited
- This comprises a solution of a copper salt (such as copper sulphate); a chelating agent e.g. EDTA; stabilisers such as sulphur compounds or heavy metals; an aqueous alkaline solution, for example aqueous sodium hydroxide; a reducing agent for example formaldehyde; and, optionally, a surfactant.
- a copper salt such as copper sulphate
- a chelating agent e.g. EDTA
- stabilisers such as sulphur compounds or heavy metals
- an aqueous alkaline solution for example aqueous sodium hydroxide
- a reducing agent for example formaldehyde
- a surfactant is known under the trade mark "CP78 process”.
- the substrate is subsequently to be electroplated, then it is not necessary to electroless deposit a 1 micrometer layer.
- a sufficiently thick layer to act as an electrode in the electroplating process will result from placing the substrate in the electroless bath for about three to seven minutes.
- Electroplating processes are well known in the art. For example, copper sulphate solution is used as the electrolyte. The rate of copper deposition is dependent upon the surface area of the cathode and the current density. A typical current density is 25 Amps per square decametre.
- the anode is copper and the cathode is the item to be plated (i.e. the conductive tracks).
Abstract
Description
Claims
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU15746/00A AU762686B2 (en) | 1998-12-03 | 1999-12-03 | Process for depositing conducting layer on substrate |
EP99958371A EP1142456A1 (en) | 1998-12-03 | 1999-12-03 | Process for depositing conducting layer on substrate |
JP2000586145A JP2002531961A (en) | 1998-12-03 | 1999-12-03 | Process for depositing a conductive layer on a substrate |
IL14344099A IL143440A0 (en) | 1998-12-03 | 1999-12-03 | A method for forming a conductive layer on a substrate |
CA002350506A CA2350506A1 (en) | 1998-12-03 | 1999-12-03 | Process for depositing conducting layer on substrate |
HK02102596.2A HK1042627A1 (en) | 1998-12-03 | 2002-04-08 | Process for depositing conducting layer on substrate |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GBGB9826446.8A GB9826446D0 (en) | 1998-12-03 | 1998-12-03 | Electrical battery interconnect device |
GB9826447.6 | 1998-12-03 | ||
GB9826446.8 | 1998-12-03 | ||
GBGB9826447.6A GB9826447D0 (en) | 1998-12-03 | 1998-12-03 | Fabrication of a seeding layer to enable electroplating and electroless platingvia a lithographic printing process |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2000033625A1 true WO2000033625A1 (en) | 2000-06-08 |
Family
ID=26314771
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/GB1999/004064 WO2000033625A1 (en) | 1998-12-03 | 1999-12-03 | Process for depositing conducting layer on substrate |
Country Status (8)
Country | Link |
---|---|
EP (1) | EP1142456A1 (en) |
JP (1) | JP2002531961A (en) |
CN (1) | CN1242659C (en) |
AU (1) | AU762686B2 (en) |
CA (1) | CA2350506A1 (en) |
HK (1) | HK1042627A1 (en) |
IL (1) | IL143440A0 (en) |
WO (1) | WO2000033625A1 (en) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002096168A2 (en) * | 2001-05-25 | 2002-11-28 | Fci | Method for the manufacture of a printed circuit and planar antenna manufactured with this printed circuit |
WO2003009659A1 (en) * | 2001-07-17 | 2003-01-30 | Brunel University | Method for forming conducting layer onto substrate |
WO2004031444A2 (en) * | 2002-10-04 | 2004-04-15 | Qinetiq Limited | Method of fabricating a magnetic tag |
EP1602393A1 (en) | 2001-02-28 | 2005-12-07 | Medtronic Inc. | Electrode |
US7041595B2 (en) | 1999-08-27 | 2006-05-09 | Micron Technology, Inc. | Method of forming a barrier seed layer with graded nitrogen composition |
US7255782B2 (en) | 2004-04-30 | 2007-08-14 | Kenneth Crouse | Selective catalytic activation of non-conductive substrates |
US7979129B2 (en) | 2004-06-11 | 2011-07-12 | Medtronic Inc. | Deep brain stimulation of the zona incerta |
US20120031656A1 (en) * | 2009-04-24 | 2012-02-09 | Yoshio Oka | Substrate for printed wiring board, printed wiring board, and methods for producing same |
US10076028B2 (en) | 2015-01-22 | 2018-09-11 | Sumitomo Electric Industries, Ltd. | Substrate for printed circuit board, printed circuit board, and method for producing printed circuit board |
US10076032B2 (en) | 2014-03-20 | 2018-09-11 | Sumitomo Electric Industries, Ltd. | Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board |
US10237976B2 (en) | 2014-03-27 | 2019-03-19 | Sumitomo Electric Industries, Ltd. | Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board |
EP3530706A1 (en) | 2018-02-27 | 2019-08-28 | Fundación Cetena | Method for producing a conductive ink for offset printing and conductive ink thus produced |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6828713B2 (en) * | 2002-07-30 | 2004-12-07 | Agilent Technologies, Inc | Resonator with seed layer |
US20050241951A1 (en) * | 2004-04-30 | 2005-11-03 | Kenneth Crouse | Selective catalytic activation of non-conductive substrates |
EP2740818B1 (en) * | 2012-12-05 | 2016-03-30 | ATOTECH Deutschland GmbH | Method for manufacture of wire bondable and solderable surfaces on noble metal electrodes |
CN105405490A (en) * | 2015-12-23 | 2016-03-16 | 东洋油墨Sc控股株式会社 | Conductive paste for laser processing, conductive sheet, fabrication method of signal layout line and electronic device |
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EP0664664A1 (en) * | 1994-01-24 | 1995-07-26 | International Business Machines Corporation | Depositing a conductive metal onto a substrate |
WO1997048257A1 (en) * | 1996-06-12 | 1997-12-18 | Brunel University | Electrical circuit |
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DE2728465C2 (en) | 1977-06-24 | 1982-04-22 | Preh, Elektrofeinmechanische Werke, Jakob Preh, Nachf. Gmbh & Co, 8740 Bad Neustadt | Printed circuit |
CA1326720C (en) | 1987-12-31 | 1994-02-01 | Michael John Modic | Impact resistant blends of polar thermoplastic polymers and modified block copolymers |
US5158645A (en) | 1991-09-03 | 1992-10-27 | International Business Machines, Inc. | Method of external circuitization of a circuit panel |
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1999
- 1999-12-03 CA CA002350506A patent/CA2350506A1/en not_active Abandoned
- 1999-12-03 WO PCT/GB1999/004064 patent/WO2000033625A1/en not_active Application Discontinuation
- 1999-12-03 CN CNB998138053A patent/CN1242659C/en not_active Expired - Fee Related
- 1999-12-03 IL IL14344099A patent/IL143440A0/en unknown
- 1999-12-03 JP JP2000586145A patent/JP2002531961A/en active Pending
- 1999-12-03 EP EP99958371A patent/EP1142456A1/en not_active Withdrawn
- 1999-12-03 AU AU15746/00A patent/AU762686B2/en not_active Ceased
-
2002
- 2002-04-08 HK HK02102596.2A patent/HK1042627A1/en unknown
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EP0664664A1 (en) * | 1994-01-24 | 1995-07-26 | International Business Machines Corporation | Depositing a conductive metal onto a substrate |
WO1997048257A1 (en) * | 1996-06-12 | 1997-12-18 | Brunel University | Electrical circuit |
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US7041595B2 (en) | 1999-08-27 | 2006-05-09 | Micron Technology, Inc. | Method of forming a barrier seed layer with graded nitrogen composition |
EP1602393A1 (en) | 2001-02-28 | 2005-12-07 | Medtronic Inc. | Electrode |
FR2825228A1 (en) * | 2001-05-25 | 2002-11-29 | Framatome Connectors Int | METHOD FOR MANUFACTURING A PRINTED CIRCUIT AND PLANAR ANTENNA MANUFACTURED THEREWITH |
WO2002096168A3 (en) * | 2001-05-25 | 2004-03-11 | Framatome Connectors Int | Method for the manufacture of a printed circuit and planar antenna manufactured with this printed circuit |
WO2002096168A2 (en) * | 2001-05-25 | 2002-11-28 | Fci | Method for the manufacture of a printed circuit and planar antenna manufactured with this printed circuit |
CN1309282C (en) * | 2001-05-25 | 2007-04-04 | Fci公司 | Method for the manufactur of a printed circuit and planar antenna manufactured with this printed circuit |
US7060418B2 (en) | 2001-05-25 | 2006-06-13 | Fci | Method for the manufacture of a printed circuit and planar antenna manufactured with this printed circuit |
WO2003009659A1 (en) * | 2001-07-17 | 2003-01-30 | Brunel University | Method for forming conducting layer onto substrate |
WO2004031444A2 (en) * | 2002-10-04 | 2004-04-15 | Qinetiq Limited | Method of fabricating a magnetic tag |
WO2004031444A3 (en) * | 2002-10-04 | 2004-11-25 | Qinetiq Ltd | Method of fabricating a magnetic tag |
GB2394725A (en) * | 2002-10-04 | 2004-05-05 | Qinetiq Ltd | Method of forming a magnetic information tag by electroless deposition |
US7255782B2 (en) | 2004-04-30 | 2007-08-14 | Kenneth Crouse | Selective catalytic activation of non-conductive substrates |
US7979129B2 (en) | 2004-06-11 | 2011-07-12 | Medtronic Inc. | Deep brain stimulation of the zona incerta |
US20120031656A1 (en) * | 2009-04-24 | 2012-02-09 | Yoshio Oka | Substrate for printed wiring board, printed wiring board, and methods for producing same |
US10076032B2 (en) | 2014-03-20 | 2018-09-11 | Sumitomo Electric Industries, Ltd. | Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board |
US10237976B2 (en) | 2014-03-27 | 2019-03-19 | Sumitomo Electric Industries, Ltd. | Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board |
US10076028B2 (en) | 2015-01-22 | 2018-09-11 | Sumitomo Electric Industries, Ltd. | Substrate for printed circuit board, printed circuit board, and method for producing printed circuit board |
EP3530706A1 (en) | 2018-02-27 | 2019-08-28 | Fundación Cetena | Method for producing a conductive ink for offset printing and conductive ink thus produced |
Also Published As
Publication number | Publication date |
---|---|
AU1574600A (en) | 2000-06-19 |
CN1335045A (en) | 2002-02-06 |
CN1242659C (en) | 2006-02-15 |
JP2002531961A (en) | 2002-09-24 |
CA2350506A1 (en) | 2000-06-08 |
EP1142456A1 (en) | 2001-10-10 |
HK1042627A1 (en) | 2002-08-16 |
AU762686B2 (en) | 2003-07-03 |
IL143440A0 (en) | 2002-04-21 |
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