EP1708553B1 - Lead mounting method - Google Patents
Lead mounting method Download PDFInfo
- Publication number
- EP1708553B1 EP1708553B1 EP05113090A EP05113090A EP1708553B1 EP 1708553 B1 EP1708553 B1 EP 1708553B1 EP 05113090 A EP05113090 A EP 05113090A EP 05113090 A EP05113090 A EP 05113090A EP 1708553 B1 EP1708553 B1 EP 1708553B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- lead
- secondary battery
- printed board
- terminal
- principal surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
- H05K3/3426—Leaded components characterised by the leads
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
- H01M50/202—Casings or frames around the primary casing of a single cell or a single battery
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
- H01M50/284—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders with incorporated circuit boards, e.g. printed circuit boards [PCB]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
- H01M50/296—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders characterised by terminals of battery packs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/05—Accumulators with non-aqueous electrolyte
- H01M10/052—Li-accumulators
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10818—Flat leads
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
- Y10T29/49149—Assembling terminal to base by metal fusion bonding
Definitions
- This invention relates to a secondary battery protecting module having a protection circuit for protecting a chargeable battery (secondary battery) such as a lithium ion battery and, in particular, to a method of mounting a lead to be connected to a terminal, such as a terminal of a secondary battery, to a printed board.
- a chargeable battery secondary battery
- a method of mounting a lead to be connected to a terminal such as a terminal of a secondary battery
- the secondary battery protection circuit comprises an overdischarge preventing mechanism and an overcharge preventing mechanism.
- the secondary battery protection circuit is disclosed in Japanese Patent (JP-B) No. 2872365 or Japanese Unexamined Patent Application Publication (JP-A) No. 2001-169477 .
- an IC chip protecting IC is used as the secondary battery protection circuit.
- the above-mentioned secondary battery protection circuit (protection IC) is disposed on a printed board (circuit board) (for example, see Japanese Unexamined Patent Application Publication (JP-A) No. 2001-268808 ).
- a power MOSFET power IC
- a plurality of electronic components such as a resistor and a capacitor
- a combination of the printed board, the secondary battery protection circuit, the power MOSFET, and the electronic components is called a secondary battery protection module.
- the secondary battery protection module is electrically connected to terminals of the secondary battery such as the lithium ion battery.
- a combination of the secondary battery protection module and the secondary battery is called a battery pack.
- the secondary battery has an anode terminal and a cathode terminal as the terminals.
- the secondary battery protection module has a pair of leads on the printed board.
- each lead comprises a nickel lead.
- One of the leads which is to be connected to the anode terminal of the secondary battery is called an anode lead.
- the other lead to be connected to the cathode terminal of the secondary battery is called a cathode lead.
- the secondary battery protection module has a pair of external connection terminals on the printed board.
- One of the external connection terminals is a positive terminal.
- the other external connection terminal is a negative terminal.
- the secondary battery protection module 10A comprises the printed board (circuit board) 11 having a principal surface 11a and a back surface 11b opposite to each other.
- the secondary battery protection circuit protection IC
- the power MOSFET power IC
- the electronic components and the leads (the anode lead and the cathode lead) 21A (only the anode lead being illustrated in Fig. 1 ) are disposed.
- the back surface 11b of the printed board 11 On the other hand, on the external connection terminals (the positive terminal and the negative terminal) and so on are disposed.
- the secondary battery protection circuit (protection IC) is connected through an internal wiring of the printed board 11.
- the power MOSFET power IC is connected through another internal wiring of the printed board.
- each of the leads 21A to be connected to the a node terminal and the cathode terminal of the secondary battery has an L shape.
- the L-shaped lead 21A has a mounted part 21Aa to be mounted (or disposed) on the principal surface 11a of the printed board 11 and a connected part 21Ab to be connected to the terminal (the anode terminal or the cathode terminal) of the secondary battery.
- the L-shaped lead 21A is mounted on the principal surface 11 a of the printed board 11 in the following manner. It is noted here that, on the principal surface 11a of the printed board 11, a land 50 is formed. At first, a flat lead is prepared. The mounted part 21Aa of the flat lead is connected and fixed to the land 50 of the principal surface 11a of the printed board 11 by using a solder 52. Thereafter, the connected part 21Ab of the flat lead is bent by 90° (right angle) with respect to the mounted part 21Aa. Thus, the flat lead is formed into the L-shaped lead 21 A.
- the lead is mounted on the principal surface 11a of the printed board 11 by connecting and fixing the flat lead to the land 50 of the principal surface 11a of the printed board 11 using the solder 52 and thereafter bending the flat lead by 90° to form the flat lead into the L-shaped lead 21 A.
- the flat lead when the flat lead is bent by 90°, a crack may be caused to occur in the solder 52.
- the flat lead is bent at a position spaced by a predetermined distance from an edge of the land 50 as shown in Fig. 1 . Therefore, the mounted part 21Aa has a length Lm' greater than a length LI of the land 50 in a bending direction.
- US20030034169A discloses a flat conductor strip for connecting a circuit board substrate to a rechargeable battery cell wherein the conductor strip includes cut-out portions.
- the flat conductor strip is soldered to the circuit board and then bent about the cut-out portions; the cut-out portions increasing the peel strength of the conductor strip from the circuit board.
- EP1403942A discloses a battery pack including a cell connected to a circuit substrate by an L-shaped lead plate, the circuit substrate including external battery pack terminals.
- the invention consists in a lead mounting method of mounting, onto a principal surface of a printed board, a lead adapted to be connected to a terminal, characterized in that said method comprises the steps of:
- the flat lead is preliminarily formed into an L shape and thereafter mounted onto the principal surface of the printed board by soldering. It is therefore possible to completely avoid occurrence of a crack in a soldering portion.
- a secondary battery protection module 10 to which a lead mounting method according to the embodiment of this invention is applicable.
- the secondary battery protection module 10 is electrically connected to a secondary battery (not shown) such as a lithium ion battery.
- the secondary battery has an anode terminal and a cathode terminal.
- a combination of the secondary battery protection module 10 and the secondary battery is called a battery pack.
- the secondary battery protection module 10 comprises a printed board 11.
- the printed board 11 has a principal surface 11 a and a back surface 11 b opposite to each other.
- the printed board 11 illustrated in the figure has a thickness of about 0.7 mm.
- a secondary battery protection circuit protection IC 12
- a power MOSFET power IC 13 serving as a discharge control switch and a charge control switch
- a plurality of electronic components 14 such as a resistor and a capacitor are disposed.
- the secondary battery protection circuit 12 is a circuit for detecting an overdischarged state and an overcharged state of the secondary battery to protect the secondary battery from the overdischarged state and the overcharged state.
- the power MOSFET 13 serves as a switching member for turning on and off discharge and charge of the secondary battery under control of the secondary battery protection circuit 12.
- the secondary battery protection module 10 has a pair of leads 21 and 22 on the principal surface 11a of the printed board 11.
- each of the leads 21 and 22 comprises a nickel lead containing 99% of a nickel component.
- One lead 21 to be connected to the anode terminal of the secondary battery is called an anode lead while the other lead 22 to be connected to the cathode terminal of the secondary battery is called a cathode lead.
- the secondary battery protection module 10 in order to establish electrical connection with a lead or a battery charger, has a pair of external connection terminals 31 and 32 on the back surface 11 b of the printed board 11.
- One of the external connection terminals is a positive terminal 31 and the other is a negative terminal 32.
- Each of the positive terminal 31 and the negative terminal 32 is plated with gold and has a thickness greater than 0.5 ⁇ m.
- the secondary battery protection circuit (protection IC) 12 is connected through an internal wiring (not shown) of the printed board 11.
- the power MOSFET (power IC) 13 is connected through another internal wiring (not shown) of the printed board 11.
- each of the leads 21 and 22 to be connected to the anode terminal and the cathode terminal of the secondary battery has an L shape.
- the L-shaped lead 21 has a mounted part 21a to be mounted (disposed) on the principal surface 11a of the printed board 11 and a connected part 21 b to be connected to the anode terminal of the secondary battery.
- the L-shaped lead 22 has a mounted part 22a to be mounted (disposed) on the principal surface 11a of the printed board 11 and a connected part 22b to be connected to the cathode terminal of the secondary battery.
- Those circuit components mounted on the principal surface 11a of the printed board 11, i.e., the secondary battery protection circuit 12, the power MOSFET 13, and the electronic components 14 are encapsulated by a resin 40.
- Fig. 3 in addition to Figs. 2A to 2D , description will be mad e of a lead mounting method of mounting the L-shaped leads 21 and 22 onto the principal surface 11a of the printed board 11 according to the embodiment.
- a land 50 is formed on the principal surface 11a of the printed board 11.
- the anode lead 21 alone is shown in an enlarged scale.
- the cathode lead 22 is similar in structure.
- the two flat leads are prepared.
- the two flat leads are bent into an L shape so that the mounted parts 21a and 22a to be disposed on the principal surface 11a of the printed board 11 are perpendicular to the connected parts 21b and 22b to be connected to the terminals (the anode terminal and the cathode terminal) of the secondary battery.
- the L-shaped leads 21 and 22 are obtained.
- the mounted parts 21a and 22a of the L-shaped leads 21 and 22 are connected and fixed onto the land 50 of the principal surface 11a of the printed board 11 by using a solder 52.
- the L-shaped leads 21 and 22 are mounted on the principal su rface 11a of the printed board 11.
- the flat lead is preliminarily formed into the L shape and thereafter mounted onto the principal surface 11a of the printed board 11. Therefore, as compared with the above-mentioned lead mounting method in which the flat lead is bent by 90° after soldering using the solder 50, it is possible to completely avoid occurrence of a crack in a soldering portion by the solder 50.
- the mounted part 21a has a length Lm substantially equal to a length LI of the land 50 in a bending direction.
- the length LI of the land 50 is equal to the length Lm of the mounted part 21a.
- the length Lm of the mounted part 21a is slightly shorter than the length LI of the land 50 so as to form a fillet.
- the nickel lead is used as the lead.
- the material of the lead is not limited to nickel. Further, in the foregoing embodiment, description has been directed to the lead mounting method in which the lead is electrically connected to the terminal (the anode terminal or the cathode terminal) of the secondary battery.
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Battery Mounting, Suspending (AREA)
- Connection Of Batteries Or Terminals (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
- Secondary Cells (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
- This invention relates to a secondary battery protecting module having a protection circuit for protecting a chargeable battery (secondary battery) such as a lithium ion battery and, in particular, to a method of mounting a lead to be connected to a terminal, such as a terminal of a secondary battery, to a printed board.
- Among various secondary batteries, in particular, a lithium ion battery is easily damaged by overdischarge and overcharge. It is therefore essential and indispensable to provide a secondary battery protection circuit for detecting an overdisharged state and an overcharged state of the lithium ion battery as a secondary battery to protect the secondary battery from the overdischarged state and the overcharged state. The secondary battery protection circuit comprises an overdischarge preventing mechanism and an overcharge preventing mechanism. For example, the secondary battery protection circuit is disclosed in Japanese Patent (JP-B) No.
2872365 2001-169477 - The above-mentioned secondary battery protection circuit (protection IC) is disposed on a printed board (circuit board) (for example, see Japanese Unexamined Patent Application Publication (JP-A) No.
2001-268808 - The secondary battery protection module is electrically connected to terminals of the secondary battery such as the lithium ion battery. A combination of the secondary battery protection module and the secondary battery is called a battery pack.
- The secondary battery has an anode terminal and a cathode terminal as the terminals. In order to establish electrical connection with the anode terminal and the cathode terminal of the secondary battery, the secondary battery protection module has a pair of leads on the printed board. For example, each lead comprises a nickel lead. One of the leads which is to be connected to the anode terminal of the secondary battery is called an anode lead. The other lead to be connected to the cathode terminal of the secondary battery is called a cathode lead.
- On the other hand, in order to establish electrical connection with a load or a battery charger, the secondary battery protection module has a pair of external connection terminals on the printed board. One of the external connection terminals is a positive terminal. The other external connection terminal is a negative terminal.
- Referring to
Fig. 1 , a related secondarybattery protection module 10A will be described. The secondarybattery protection module 10A comprises the printed board (circuit board) 11 having aprincipal surface 11a and aback surface 11b opposite to each other. On theprincipal surface 11a of the printedboard 11, the secondary battery protection circuit (protection IC), the power MOSFET (power IC), the electronic components, and the leads (the anode lead and the cathode lead) 21A (only the anode lead being illustrated inFig. 1 ) are disposed. On the other hand, on theback surface 11b of the printedboard 11, the external connection terminals (the positive terminal and the negative terminal) and so on are disposed. Between theanode lead 21A and the cathode lead, the secondary battery protection circuit (protection IC) is connected through an internal wiring of the printedboard 11. Between the cathode lead and the negative terminal, the power MOSFET (power IC) is connected through another internal wiring of the printed board. - As shown in
Fig. 1 , each of theleads 21A to be connected to the a node terminal and the cathode terminal of the secondary battery has an L shape. Specifically, the L-shaped lead 21A has a mounted part 21Aa to be mounted (or disposed) on theprincipal surface 11a of the printedboard 11 and a connected part 21Ab to be connected to the terminal (the anode terminal or the cathode terminal) of the secondary battery. - In the secondary
battery protection module 10A, the L-shaped lead 21A is mounted on theprincipal surface 11 a of the printedboard 11 in the following manner. It is noted here that, on theprincipal surface 11a of the printedboard 11, aland 50 is formed. At first, a flat lead is prepared. The mounted part 21Aa of the flat lead is connected and fixed to theland 50 of theprincipal surface 11a of the printedboard 11 by using asolder 52. Thereafter, the connected part 21Ab of the flat lead is bent by 90° (right angle) with respect to the mounted part 21Aa. Thus, the flat lead is formed into the L-shaped lead 21 A. - As described above, in the secondary
battery protection module 10A, the lead is mounted on theprincipal surface 11a of the printedboard 11 by connecting and fixing the flat lead to theland 50 of theprincipal surface 11a of the printedboard 11 using thesolder 52 and thereafter bending the flat lead by 90° to form the flat lead into the L-shaped lead 21 A. - In the above-mentioned lead mounting method, when the flat lead is bent by 90°, a crack may be caused to occur in the
solder 52. In order to avoid occurrence of the crack, the flat lead is bent at a position spaced by a predetermined distance from an edge of theland 50 as shown inFig. 1 . Therefore, the mounted part 21Aa has a length Lm' greater than a length LI of theland 50 in a bending direction. - However, even if the flat lead is bent at the position spaced from the edge of the
land 50, thesolder 52 is subjected to a force in a direction of separating thesolder 52 from theland 50. As a result, it is difficult to completely avoid occurrence of the crack in thesolder 52. -
US20030034169A discloses a flat conductor strip for connecting a circuit board substrate to a rechargeable battery cell wherein the conductor strip includes cut-out portions. The flat conductor strip is soldered to the circuit board and then bent about the cut-out portions; the cut-out portions increasing the peel strength of the conductor strip from the circuit board. -
EP1403942A discloses a battery pack including a cell connected to a circuit substrate by an L-shaped lead plate, the circuit substrate including external battery pack terminals. - It is therefore an object of this invention to provide a lead mounting method capable of completely avoiding occurrence of a crack in a soldering portion.
- It is another object of this invention to provide a secondary battery protection module having a lead mounted by the method.
- The invention consists in a lead mounting method of mounting, onto a principal surface of a printed board, a lead adapted to be connected to a terminal, characterized in that said method comprises the steps of:
- preparing a flat lead which has a mounted part having a lower surface to be disposed on the principal surface of said printed board and a connected part to be connected to said terminal;
- bending said flat lead into an L-shape so that said mounted part and said connected part are perpendicular to each other to obtain an L-shaped lead; and
- connecting and fixing the entire lower surface of the mounted part of said L-shaped lead to a land formed on the principal surface of said printed board by soldering so that the mounted part of said L-shaped lead has a length in a bending direction slightly less than a length of the land and so as to form a fillet of the soldering in order to firmly attach the lead on the land,
- In this invention, the flat lead is preliminarily formed into an L shape and thereafter mounted onto the principal surface of the printed board by soldering. It is therefore possible to completely avoid occurrence of a crack in a soldering portion.
-
-
Fig. 1 is a sectional view of a related secondary battery protection module; -
Figs. 2A to 2D show a secondary battery protection module to which a lead mounting method according to an embodiment of this invention is applicable,Fig. 2A being a plan view,Fig. 2B being a rear view,Fig. 2C being a front view,Fig. 2D being a side view; and -
Fig. 3 is a sectional view of the secondary battery protection module illustrated inFigs. 2A to 2D . - Now, an embodiment of this invention will be described in detail with reference to the drawing.
- Referring to
Figs. 2A to 2D , description will be made of a secondarybattery protection module 10 to which a lead mounting method according to the embodiment of this invention is applicable. - As will later be described, the secondary
battery protection module 10 is electrically connected to a secondary battery (not shown) such as a lithium ion battery. The secondary battery has an anode terminal and a cathode terminal. A combination of the secondarybattery protection module 10 and the secondary battery is called a battery pack. - The secondary
battery protection module 10 comprises a printedboard 11. The printedboard 11 has aprincipal surface 11 a and aback surface 11 b opposite to each other. - The printed
board 11 illustrated in the figure has a thickness of about 0.7 mm. - On the
principal surface 11a of the printedboard 11, a secondary battery protection circuit (protection IC) 12, a power MOSFET (power IC) 13 serving as a discharge control switch and a charge control switch, a plurality ofelectronic components 14 such as a resistor and a capacitor are disposed. - The secondary
battery protection circuit 12 is a circuit for detecting an overdischarged state and an overcharged state of the secondary battery to protect the secondary battery from the overdischarged state and the overcharged state. Thepower MOSFET 13 serves as a switching member for turning on and off discharge and charge of the secondary battery under control of the secondarybattery protection circuit 12. - In order to establish electrical connection with the anode terminal and the cathode terminal of the secondary battery, the secondary
battery protection module 10 has a pair ofleads principal surface 11a of the printedboard 11. For example, each of theleads lead 21 to be connected to the anode terminal of the secondary battery is called an anode lead while theother lead 22 to be connected to the cathode terminal of the secondary battery is called a cathode lead. - On the other hand, as illustrated in
Fig. 2B , in order to establish electrical connection with a lead or a battery charger, the secondarybattery protection module 10 has a pair ofexternal connection terminals back surface 11 b of the printedboard 11. One of the external connection terminals is apositive terminal 31 and the other is anegative terminal 32. Each of thepositive terminal 31 and thenegative terminal 32 is plated with gold and has a thickness greater than 0.5 µm. - Between the
anode lead 21 and thecathode lead 22, the secondary battery protection circuit (protection IC) 12 is connected through an internal wiring (not shown) of the printedboard 11. Between thecathode lead 22 and thenegative terminal 32, the power MOSFET (power IC) 13 is connected through another internal wiring (not shown) of the printedboard 11. - As illustrated in
Fig. 2D , each of theleads lead 21 has a mountedpart 21a to be mounted (disposed) on theprincipal surface 11a of the printedboard 11 and aconnected part 21 b to be connected to the anode terminal of the secondary battery. Likewise, the L-shapedlead 22 has a mountedpart 22a to be mounted (disposed) on theprincipal surface 11a of the printedboard 11 and aconnected part 22b to be connected to the cathode terminal of the secondary battery. - Those circuit components mounted on the
principal surface 11a of the printedboard 11, i.e., the secondarybattery protection circuit 12, thepower MOSFET 13, and theelectronic components 14 are encapsulated by aresin 40. - Next referring to
Fig. 3 in addition toFigs. 2A to 2D , description will be mad e of a lead mounting method of mounting the L-shaped leads 21 and 22 onto theprincipal surface 11a of the printedboard 11 according to the embodiment. On theprincipal surface 11a of the printedboard 11, aland 50 is formed. InFig. 3 , theanode lead 21 alone is shown in an enlarged scale. As will readily be understood, thecathode lead 22 is similar in structure. - At first, two flat leads are prepared. Next, the two flat leads are bent into an L shape so that the mounted
parts principal surface 11a of the printedboard 11 are perpendicular to theconnected parts parts land 50 of theprincipal surface 11a of the printedboard 11 by using asolder 52. Thus, the L-shaped leads 21 and 22 are mounted on theprincipal su rface 11a of the printedboard 11. - As described above, in the lead mounting method according to the embodiment of this invention, the flat lead is preliminarily formed into the L shape and thereafter mounted onto the
principal surface 11a of the printedboard 11. Therefore, as compared with the above-mentioned lead mounting method in which the flat lead is bent by 90° after soldering using thesolder 50, it is possible to completely avoid occurrence of a crack in a soldering portion by thesolder 50. - As illustrated in
Fig. 3 which relates to a comparative example, themounted part 21a has a length Lm substantially equal to a length LI of theland 50 in a bending direction. - In
Fig. 3 which relates to a comparative example, the length LI of theland 50 is equal to the length Lm of themounted part 21a. According to the invention, in order to more firmly attach the lead, the length Lm of themounted part 21a is slightly shorter than the length LI of theland 50 so as to form a fillet. - In the foregoing embodiment, the nickel lead is used as the lead. However, the material of the lead is not limited to nickel. Further, in the foregoing embodiment, description has been directed to the lead mounting method in which the lead is electrically connected to the terminal (the anode terminal or the cathode terminal) of the secondary battery.
Claims (2)
- A lead mounting method of mounting, onto a principal surface (11a) of a
printed board (11), a lead adapted to be connected to a terminal of a secondary battery, characterized in that said method comprises the steps of:preparing a flat lead which has a mounted part (21 a, 22a) having a lower surface to be disposed on the principal surface (11a) of said printed board (11) and a connected part (21b, 22b) to be connected to said terminal;bending said flat lead into an L-shape so that said mounted part (21 a, 22a) and said connected part (21b, 22b) are perpendicular to each other to obtain an L-shaped lead (21, 22); andconnecting and fixing the entire lower surface of the mounted part (21 a, 22a) of said L-shaped lead (21, 22) to a land (50) formed on the principal surface (11a) of said printed board (11) by soldering (52) so that the mounted part of said L-shaped lead has a length (Lm) in a bending direction slightly shorter than a length (LI) of the land (50) and so as to form a fillet of the soldering. - A lead mounting method as claimed in claim 1, wherein said lead is a nickel lead.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2005090691A JP4877455B2 (en) | 2005-03-28 | 2005-03-28 | Secondary battery protection module and lead mounting method |
Publications (3)
Publication Number | Publication Date |
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EP1708553A2 EP1708553A2 (en) | 2006-10-04 |
EP1708553A3 EP1708553A3 (en) | 2008-07-23 |
EP1708553B1 true EP1708553B1 (en) | 2012-10-03 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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EP05113090A Expired - Fee Related EP1708553B1 (en) | 2005-03-28 | 2005-12-30 | Lead mounting method |
Country Status (3)
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US (2) | US20060215376A1 (en) |
EP (1) | EP1708553B1 (en) |
JP (1) | JP4877455B2 (en) |
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Also Published As
Publication number | Publication date |
---|---|
EP1708553A2 (en) | 2006-10-04 |
US20090072008A1 (en) | 2009-03-19 |
US8305768B2 (en) | 2012-11-06 |
JP2006277970A (en) | 2006-10-12 |
EP1708553A3 (en) | 2008-07-23 |
JP4877455B2 (en) | 2012-02-15 |
US20060215376A1 (en) | 2006-09-28 |
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