JP2002353374A - Ceramic circuit board - Google Patents
Ceramic circuit boardInfo
- Publication number
- JP2002353374A JP2002353374A JP2001157698A JP2001157698A JP2002353374A JP 2002353374 A JP2002353374 A JP 2002353374A JP 2001157698 A JP2001157698 A JP 2001157698A JP 2001157698 A JP2001157698 A JP 2001157698A JP 2002353374 A JP2002353374 A JP 2002353374A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- circuit board
- ceramic
- metal terminal
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structure Of Printed Boards (AREA)
- Multi-Conductor Connections (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、セラミック基板に
金属回路板及び金属端子を取着してなるセラミック回路
基板に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ceramic circuit board in which a metal circuit board and metal terminals are attached to a ceramic substrate.
【０００２】[0002]
【従来の技術】近年、パワーモジュール用基板やスイッ
チングモジュール用基板等の回路基板として、セラミッ
ク基板上に被着させたメタライズ金属層に銀−銅合金等
のロウ材を介して銅等から成る金属回路板及び金属端子
を接合させたセラミック回路基板、あるいはセラミック
基板上に銀−銅共晶合金にチタン、ジルコニウム、ハフ
ニウムまたはその水素化物を添加した活性金属ロウ材を
介して銅等から成る金属回路板及び金属端子を直接接合
させたセラミック回路基板が用いられている。2. Description of the Related Art In recent years, as a circuit board such as a power module board or a switching module board, a metallized metal layer adhered on a ceramic substrate is formed of a metal made of copper or the like via a brazing material such as a silver-copper alloy. A ceramic circuit board in which a circuit board and metal terminals are joined, or a metal circuit made of copper or the like via an active metal brazing material obtained by adding titanium, zirconium, hafnium or a hydride thereof to a silver-copper eutectic alloy on a ceramic substrate A ceramic circuit board in which a plate and a metal terminal are directly bonded is used.
【０００３】かかるセラミック回路基板、例えば、セラ
ミック基板上に被着させたメタライズ金属層にロウ材を
介して銅等から成る金属回路板及び金属端子を接合させ
たセラミック回路基板は、一般に酸化アルミニウム質焼
結体、窒化アルミニウム質焼結体、窒化珪素質焼結体、
ムライト質焼結体等の電気絶縁性のセラミックス材料か
ら成るセラミック基板の表面にメタライズ金属層を被着
させておき、該メタライズ金属層に銅等の金属材料から
成る金属回路板や金属端子を銀ロウ等のロウ材を介しロ
ウ付けすることによって形成されており、具体的には、
例えば、セラミック基板が酸化アルミニウム質焼結体か
ら成る場合には、酸化アルミニウム、酸化珪素、酸化マ
グネシウム、酸化カルシウム等の原料粉末に適当な有機
バインダー、可塑剤、溶剤等を添加混合して泥漿状と成
すとともにこれを従来周知のドクターブレード法やカレ
ンダーロール法等のテープ成形技術を採用して複数のセ
ラミックグリーンシートを得、次に前記セラミックグリ
ーンシート上にタングステンやモリブデン等の高融点金
属粉末に適当な有機バインダー、可塑剤、溶剤を添加混
合して得た金属ペーストをスクリーン印刷法等の厚膜形
成技術を採用することによって所定パターンに印刷塗布
し、次に前記金属ペーストが所定パターンに印刷塗布さ
れたセラミックグリーンシートを必要に応じて上下に積
層するとともに還元雰囲気中、約１６００℃の温度で焼
成し、セラミックグリーンシートと金属ペーストを焼結
一体化させて表面にメタライズ金属層を有する酸化アル
ミニウム質焼結体から成るセラミック基板を形成し、最
後に前記セラミック基板表面のメタライズ金属層上に銅
等から成る所定パターンの金属回路板や金属端子を間に
銀ロウ等のロウ材を挟んで載置させるとともにこれを還
元雰囲気中、約９００℃の温度に加熱してロウ材を溶融
させ、該溶融したロウ材でメタライズ金属層と金属回路
板及び金属端子とを接合することによって製作される。[0003] Such a ceramic circuit board, for example, a metal circuit board made of copper or the like and a metal terminal bonded to a metallized metal layer adhered on the ceramic substrate via a brazing material are generally made of aluminum oxide. Sintered body, aluminum nitride based sintered body, silicon nitride based sintered body,
A metallized metal layer is applied to the surface of a ceramic substrate made of an electrically insulating ceramic material such as a mullite sintered body, and a metal circuit board or a metal terminal made of a metal material such as copper is applied to the metallized metal layer. It is formed by brazing through a brazing material such as brazing, and specifically,
For example, when the ceramic substrate is made of an aluminum oxide-based sintered body, an appropriate organic binder, a plasticizer, a solvent, etc. are added to raw material powders such as aluminum oxide, silicon oxide, magnesium oxide, and calcium oxide and mixed to form a slurry. Along with this, a plurality of ceramic green sheets are obtained by employing a tape forming technique such as a doctor blade method or a calendar roll method, which is conventionally known, and then a high melting point metal powder such as tungsten or molybdenum is formed on the ceramic green sheet. A metal paste obtained by adding and mixing an appropriate organic binder, a plasticizer, and a solvent is printed and applied in a predetermined pattern by employing a thick film forming technique such as a screen printing method, and then the metal paste is printed in a predetermined pattern. Lay the applied ceramic green sheets up and down as necessary and return Firing at a temperature of about 1600 ° C. in an atmosphere, and sintering and integrating the ceramic green sheet and the metal paste to form a ceramic substrate made of an aluminum oxide sintered body having a metallized metal layer on the surface; A metal circuit board or a metal terminal of a predetermined pattern made of copper or the like is placed on a metallized metal layer on the substrate surface with a brazing material such as silver brazing interposed therebetween, and heated to a temperature of about 900 ° C. in a reducing atmosphere. Then, the brazing material is melted, and the metallized metal layer is bonded to the metal circuit board and the metal terminals with the melted brazing material.
【０００４】なお、前記セラミック回路基板の金属端子
はセラミック基板の上面に接合される接合部と立脚部と
を有するＬ字型をなしており、該Ｌ字型金属端子の立脚
部が外部電気回路に電気的に接続されるようになってい
る。また前記セラミック基板の上面にはスイッチング素
子や容量素子、抵抗素子等が搭載され、該スイッチング
素子、容量素子、抵抗素子等を金属回路板を介しお互い
に接続することによって所定の電気回路が構成されてセ
ラミック回路基板として機能する。The metal terminal of the ceramic circuit board has an L-shape having a joint portion and a standing portion joined to the upper surface of the ceramic substrate, and the standing portion of the L-shaped metal terminal is connected to an external electric circuit. To be electrically connected to the A switching element, a capacitor, a resistor, and the like are mounted on the upper surface of the ceramic substrate, and a predetermined electric circuit is configured by connecting the switching element, the capacitor, the resistor, and the like to each other via a metal circuit board. Functions as a ceramic circuit board.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、この従
来のセラミック回路基板においては金属端子はセラミッ
ク基板の上面に接合される接合部と立脚部とを有するＬ
字型をなしており、その屈曲部は略直角（略９０°）に
形成されている。そのためこのセラミック回路基板の金
属回路板及び金属端子に２０Ａ以上の電流を流した場
合、前記Ｌ字型をなす金属端子はその屈曲部における電
流密度が高くなって金属端子に抵抗発熱が発生してしま
い、該発熱によって金属端子が溶断したり、セラミック
回路基板に搭載されているスイッチング素子や容量素
子、抵抗素子等を高温として誤動作を招来させてしまう
という欠点を有する。However, in this conventional ceramic circuit board, the metal terminal has an L-shaped portion having a joining portion joined to the upper surface of the ceramic substrate and a standing portion.
The bent portion is formed at a substantially right angle (approximately 90 °). Therefore, when a current of 20 A or more is applied to the metal circuit board and the metal terminals of the ceramic circuit board, the current density at the bent portion of the L-shaped metal terminal is increased, and resistance heating is generated in the metal terminal. As a result, there is a disadvantage that the metal terminal is melted by the heat generation, and a switching element, a capacitor element, a resistance element, and the like mounted on the ceramic circuit board are heated to a high temperature, thereby causing a malfunction.
【０００６】本発明は上記欠点に鑑み案出されたもの
で、その目的はセラミック回路基板に２０Ａ以上の電流
が流れ、金属端子に２０Ａ以上の大きな電流が印加され
たとしても金属端子に大きな発熱が発生することはな
く、金属端子に溶断が生じたり、搭載されるスイッチン
グ素子等に誤動作が発生したりするのを有効に防止し得
る高信頼性のセラミック回路基板を提供することにあ
る。SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned drawbacks, and its purpose is to generate a large amount of heat in a metal terminal even when a large current of 20 A or more is applied to the metal terminal. Accordingly, it is an object of the present invention to provide a highly reliable ceramic circuit board capable of effectively preventing a metal terminal from being blown, and a malfunction from occurring in a mounted switching element or the like.
【０００７】[0007]
【課題を解決するための手段】本発明は、セラミック基
板の上面に金属回路板と該金属回路板に電気的に接続す
る金属端子とを取着して成るセラミック回路基板であっ
て、前記金属端子はセラミック基板の上面に接合される
接合部と立脚部とを有するＬ字型をなしており、かつ該
Ｌ字型金属端子の屈曲部には１００°未満の角度を有す
る角部が非形成であることを特徴とするものである。According to the present invention, there is provided a ceramic circuit board having a metal circuit board and a metal terminal electrically connected to the metal circuit board on an upper surface of the ceramic board. The terminal has an L-shape having a joint portion to be joined to the upper surface of the ceramic substrate and a standing portion, and a corner having an angle of less than 100 ° is not formed at the bent portion of the L-shaped metal terminal. It is characterized by being.
【０００８】本発明のセラミック回路基板によれば、Ｌ
字型をなす金属端子の屈曲部において１００°未満の角
度を有する角部が非形成とされていることからセラミッ
ク回路基板に２０Ａ以上の大きな電流が流れ金属端子に
２０Ａ以上の大きな電流が印加されたとしても、金属端
子の屈曲部において電流密度が高くなり大きな抵抗発熱
を発生することはなく、その結果、金属端子に溶断が生
じたり、セラミック回路基板に搭載されているスイッチ
ング素子や容量素子、抵抗素子等を高温として誤動作を
招来させることが有効に防止され、セラミック回路基板
としての信頼性を極めて高いものとなすことができる。According to the ceramic circuit board of the present invention, L
Since a corner having an angle of less than 100 ° is not formed in the bent portion of the metal terminal having a letter shape, a large current of 20 A or more flows to the ceramic circuit board, and a large current of 20 A or more is applied to the metal terminal. Even if the current density is high at the bent portion of the metal terminal, there is no generation of large resistance heating, as a result, the metal terminal is melted, or the switching element or the capacitor element mounted on the ceramic circuit board, It is possible to effectively prevent a malfunction due to a high temperature of the resistance element or the like, and it is possible to make the reliability as a ceramic circuit board extremely high.
【０００９】[0009]
【発明の実施の形態】次に、本発明を添付図面に示す実
施例に基づき詳細に説明する。図１は本発明のセラミッ
ク回路基板の一実施例の断面図、図２はその要部拡大図
を示し、１はセラミック基板、２はメタライズ金属層、
３は金属回路板、４は金属端子である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail with reference to the embodiments shown in the accompanying drawings. FIG. 1 is a cross-sectional view of one embodiment of a ceramic circuit board of the present invention, FIG. 2 is an enlarged view of a main part thereof, 1 is a ceramic board, 2 is a metallized metal layer,
3 is a metal circuit board and 4 is a metal terminal.
【００１０】前記セラミック基板１は四角形状をなし、
その上面にメタライズ金属層２が被着されており、該メ
タライズ金属層２には金属回路板３や金属端子４がロウ
付けされている。The ceramic substrate 1 has a rectangular shape,
A metallized metal layer 2 is adhered on the upper surface, and a metal circuit board 3 and metal terminals 4 are brazed to the metallized metal layer 2.
【００１１】前記セラミック基板１は金属回路板３や金
属端子４を支持する支持部材として作用し、酸化アルミ
ニウム質焼結体、ムライト質焼結体、窒化珪素質焼結
体、窒化アルミニウム質焼結体、炭化珪素質焼結体等の
電気絶縁材料で形成されている。The ceramic substrate 1 acts as a support member for supporting the metal circuit board 3 and the metal terminals 4, and is made of aluminum oxide sintered body, mullite sintered body, silicon nitride sintered body, aluminum nitride sintered body. And an electrically insulating material such as a silicon carbide sintered body.
【００１２】前記セラミック基板１は、例えば、酸化ア
ルミニウム質焼結体で形成されている場合は、酸化アル
ミニウム、酸化珪素、酸化マグネシウム、酸化カルシウ
ム等の原料粉末に適当な有機バインダー、可塑剤、溶剤
を添加混合して泥漿状となすとともに該泥漿物を従来周
知のドクターブレード法やカレンダーロール法を採用す
ることによってセラミックグリーンシート（セラミック
生シート）を形成し、次に前記セラミックグリーンシー
トに適当な打ち抜き加工を施し、所定形状となすととも
に必要に応じて複数枚を積層して成形体となし、しかる
後、これを約１６００℃の高温で焼成することによっ
て、あるいは酸化アルミニウム等の原料粉末に適当な有
機溶剤、溶媒を添加混合して原料粉末を調整するととも
に該原料粉末をプレス成形技術によって所定形状に成形
し、しかる後、前記成形体を約１６００℃の温度で焼成
することによって製作される。When the ceramic substrate 1 is formed of, for example, a sintered body of aluminum oxide, an organic binder, a plasticizer, and a solvent suitable for a raw material powder such as aluminum oxide, silicon oxide, magnesium oxide, and calcium oxide. Is mixed and formed into a slurry, and the slurry is formed into a ceramic green sheet (green ceramic sheet) by employing a conventionally known doctor blade method or calender roll method. A punching process is performed, a predetermined shape is formed, and a plurality of sheets are laminated as necessary to form a molded body. Thereafter, the molded body is fired at a high temperature of about 1600 ° C. The raw material powder is prepared by adding and mixing an organic solvent and a solvent. By molding techniques and molded into a predetermined shape, and thereafter, is manufactured by firing the molded body at a temperature of about 1600 ° C..
【００１３】また前記セラミック基板１はその表面にメ
タライズ金属層２が被着されており、該メタライズ金属
層２は金属回路板３や金属端子４をセラミック基板１に
ロウ付けする際の下地金属層として作用する。On the surface of the ceramic substrate 1, a metallized metal layer 2 is adhered. The metallized metal layer 2 is a base metal layer for brazing the metal circuit board 3 and the metal terminals 4 to the ceramic substrate 1. Act as
【００１４】前記メタライズ金属層２は、タングステ
ン、モリブデン、マンガン等の高融点金属材料より成
り、例えば、タングステン粉末に適当な有機バインダ
ー、可塑材、溶剤を添加混合して得た金属ペーストを焼
成によってセラミック基板１となるセラミックグリーン
シート（セラミック生シート）の表面に予め従来周知の
スクリーン印刷法により所定パターンに印刷塗布してお
くことによってセラミック基板１の上面に所定パター
ン、所定厚み（１０〜５０μｍ）に被着される。The metallized metal layer 2 is made of a high melting point metal material such as tungsten, molybdenum, and manganese. For example, a metal paste obtained by adding an appropriate organic binder, a plasticizer, and a solvent to tungsten powder and mixing the resulting mixture is fired. A predetermined pattern and a predetermined thickness (10 to 50 μm) are formed on the upper surface of the ceramic substrate 1 by printing and applying a predetermined pattern on a surface of a ceramic green sheet (ceramic raw sheet) serving as the ceramic substrate 1 in advance by a conventionally known screen printing method. Is adhered to.
【００１５】なお、前記メタライズ金属層２はその表面
にニッケル、金等の良導電性で、耐蝕性及びロウ材との
濡れ性が良好な金属をメッキ法により１μｍ〜２０μｍ
の厚みに被着させておくと、メタライズ金属層２の酸化
腐蝕を有効に防止することができるとともにメタライズ
金属層２と金属回路板３及び金属端子４とのロウ付けを
極めて強固になすことができる。従って、前記メタライ
ズ金属層２の酸化腐蝕を有効に防止し、メタライズ金属
層２と金属回路板３及び金属端子４とのロウ付けを強固
となすにはメタライズ金属層２の表面にニッケル、金等
の良導電性で、耐蝕性及びロウ材との濡れ性が良好な金
属を１μｍ〜２０μｍの厚みに被着させておくことが好
ましい。The metallized metal layer 2 is made of a metal having good conductivity, such as nickel or gold, having good corrosion resistance and good wettability with a brazing material on its surface by a plating method of 1 μm to 20 μm.
The metallized metal layer 2 can be effectively prevented from being oxidized and corroded, and the metallized metal layer 2 can be extremely firmly brazed to the metal circuit board 3 and the metal terminals 4. it can. Accordingly, in order to effectively prevent the metallized metal layer 2 from being oxidized and corroded, and to firmly braze the metallized metal layer 2 to the metal circuit board 3 and the metal terminals 4, nickel, gold, etc. It is preferable that a metal having good conductivity, good corrosion resistance and good wettability with the brazing material is applied to a thickness of 1 μm to 20 μm.
【００１６】また前記メタライズ金属層２はその上面に
金属回路板３や金属端子４がロウ材５を介して取着され
ている。The metallized metal layer 2 has a metal circuit board 3 and metal terminals 4 attached to the upper surface thereof via a brazing material 5.
【００１７】前記金属回路板３や金属端子４は銅やアル
ミニウム等の金属材料から成り、セラミック基板１の表
面に形成されたメタライズ金属層２上に金属回路板３や
金属端子４を、例えば、銀ロウ材（銀：７２重量％、
銅：２８重量％）やアルミニウムロウ材（アルミニウ
ム：８８重量％、シリコン：１２重量％）等から成るロ
ウ材５を挟んで載置させ、しかる後、これを真空中もし
くは中性、還元雰囲気中、所定温度（銀ロウ材の場合は
約９００℃、アルミニウムロウ材の場合は約６００℃）
で加熱処理し、ロウ材５を溶融せしめるとともにメタラ
イズ金属層２の上面と金属回路板３や金属端子４の下面
とに接合させることによってセラミック基板１の表面に
取着されることとなる。The metal circuit board 3 and the metal terminals 4 are made of a metal material such as copper and aluminum. The metal circuit board 3 and the metal terminals 4 are formed on the metallized metal layer 2 formed on the surface of the ceramic substrate 1, for example. Silver brazing material (silver: 72% by weight,
A brazing material 5 made of copper (28% by weight), aluminum brazing material (aluminum: 88% by weight, silicon: 12% by weight) or the like is interposed and then placed in a vacuum or in a neutral or reducing atmosphere. , Predetermined temperature (about 900 ° C for silver brazing material, about 600 ° C for aluminum brazing material)
Then, the brazing material 5 is melted, and is joined to the upper surface of the metallized metal layer 2 and the lower surfaces of the metal circuit board 3 and the metal terminals 4 to be attached to the surface of the ceramic substrate 1.
【００１８】前記銅やアルミニウム等から成る金属回路
板３や金属端子４は、銅やアルミニウム等のインゴット
（塊）に圧延加工法等の薄板形成法により金属板を製作
した後、打ち抜き加工法、折り曲げ加工法等の従来周知
の金属加工法を施すことによって、例えば、厚さが５０
０μｍで、メタライズ金属層２のパターン形状に対応す
る所定パターン形状やＬ字型に製作される。The metal circuit board 3 and the metal terminals 4 made of copper, aluminum or the like are manufactured by forming a metal plate on an ingot (lumps) of copper, aluminum, or the like by a rolling method or the like, and then punching. By applying a conventionally known metal working method such as a bending method, for example, a thickness of 50
It is manufactured in a predetermined pattern shape or an L-shape corresponding to the pattern shape of the metallized metal layer 2 at 0 μm.
【００１９】前記金属回路板３や金属端子４はまた銅か
ら成る場合、金属回路板３や金属端子４を無酸素銅で形
成しておくと、該無酸素銅はロウ付けの際に銅の表面が
銅中に存在する酸素により酸化されることなくロウ材５
との濡れ性が良好となり、メタライズ金属層２へのロウ
材５を介しての接合が強固となる。従って、前記金属回
路板３や金属端子４はこれを無酸素銅で形成しておくこ
とが好ましい。When the metal circuit board 3 and the metal terminals 4 are also made of copper, if the metal circuit board 3 and the metal terminals 4 are formed of oxygen-free copper, the oxygen-free copper will be made of copper when brazing. The brazing material 5 whose surface is not oxidized by oxygen existing in copper
And the bonding to the metallized metal layer 2 via the brazing material 5 becomes strong. Therefore, it is preferable that the metal circuit board 3 and the metal terminal 4 are formed of oxygen-free copper.
【００２０】更に前記金属回路板３や金属端子４はその
表面にニッケルから成る良導電性で、かつ耐蝕性及びロ
ウ材との濡れ性が良好な金属をメッキ法により被着させ
ておくと、金属回路板３と金属端子４及び金属端子４と
外部電気回路との電気的接続を良好と成すとともに金属
回路板３にスイッチング素子や容量素子、抵抗素子等の
電子部品を半田を介して強固に接着させることができ
る。従って、前記金属回路板３や金属端子４はその表面
にニッケルから成る良導電性で、かつ耐蝕性及びロウ材
との濡れ性が良好な金属をメッキ法により被着させてお
くことが好ましい。Further, if the metal circuit board 3 and the metal terminal 4 are coated with a metal having good conductivity and good corrosion resistance and good wettability with the brazing material by plating on the surface thereof, The electrical connection between the metal circuit board 3 and the metal terminal 4 and between the metal terminal 4 and the external electric circuit are made good, and electronic components such as switching elements, capacitance elements, and resistance elements are firmly attached to the metal circuit board 3 via solder. Can be glued. Therefore, it is preferable that the metal circuit board 3 and the metal terminals 4 are coated with a metal having good conductivity and good corrosion resistance and good wettability with the brazing material by a plating method.
【００２１】また更に前記金属回路板３や金属端子４の
表面にニッケルから成るメッキ層を被着させる場合、内
部に燐を８〜１５重量％含有させてニッケル−燐のアモ
ルファス合金としておくとニッケルから成るメッキ層の
表面酸化を良好に防止してロウ材との濡れ性等を長く維
持することができる。従って、前記金属回路板３や金属
端子４の表面にニッケルから成るメッキ層を被着させる
場合、内部に燐を８〜１５重量％含有させてニッケル−
燐のアモルファス合金としておくことが好ましい。Further, when a plating layer made of nickel is applied to the surface of the metal circuit board 3 or the metal terminal 4, it is preferable to add 8 to 15% by weight of phosphorus therein to form a nickel-phosphorus amorphous alloy. The oxidation of the surface of the plating layer made of satisfactorily can be prevented and the wettability with the brazing material can be maintained for a long time. Therefore, when a plating layer made of nickel is applied to the surface of the metal circuit board 3 or the metal terminals 4, the content of phosphorus is 8 to 15% by weight, and the content of nickel is reduced.
It is preferable to use an amorphous alloy of phosphorus.
【００２２】なお、前記金属回路板３や金属端子４の表
面にニッケル−燐のアモルファス合金からなるメッキ層
を被着させる場合、ニッケルに対する燐の含有量が８重
量％未満、あるいは１５重量％を超えたときニッケル−
燐のアモルファス合金を形成するのが困難となってメッ
キ層に半田を強固に接着させることができなくなる危険
性がある。従って、前記金属回路板３や金属端子４の表
面にニッケル−燐のアモルファス合金からなるメッキ層
を被着させる場合にはニッケルに対する燐の含有量を８
〜１５重量％の範囲としておくことが好ましく、好適に
は１０〜１５重量％の範囲がよい。When a plating layer made of a nickel-phosphorus amorphous alloy is applied to the surface of the metal circuit board 3 or the metal terminals 4, the content of phosphorus with respect to nickel is less than 8% by weight or 15% by weight. Nickel when exceeded
There is a danger that it becomes difficult to form an amorphous alloy of phosphorus and the solder cannot be firmly bonded to the plating layer. Therefore, when a plating layer made of an amorphous alloy of nickel-phosphorus is applied to the surface of the metal circuit board 3 or the metal terminals 4, the content of phosphorus with respect to nickel is set to 8%.
It is preferably in the range of 15 to 15% by weight, and more preferably in the range of 10 to 15% by weight.
【００２３】また、前記金属回路板３や金属端子４の表
面に被着されるニッケルから成るメッキ層は、その厚み
が１．５μｍ未満の場合、金属回路板３や金属端子４の
表面をニッケルから成るメッキ層で完全に被覆すること
ができず、金属回路板３や金属端子４の酸化腐蝕を有効
に防止することができなくなる危険性があり、また３μ
ｍを超えるとニッケルから成るメッキ層の内部に内在す
る内在応力が大きくなってセラミック基板１に反りや割
れ等が発生してしまう。特にセラミック基板１の厚さが
７００μｍ以下の薄いものになった場合にはこのセラミ
ック基板１の反りや割れ等が顕著となってしまう。従っ
て、前記金属回路板３や金属端子4の表面に被着される
ニッケルから成るメッキ層はその厚みを１．５μｍ〜３
μｍの範囲としておくことが好ましい。When the thickness of the nickel plating layer applied to the surface of the metal circuit board 3 or the metal terminal 4 is less than 1.5 μm, the surface of the metal circuit board 3 or the metal terminal 4 is coated with nickel. There is a risk that the metal circuit board 3 and the metal terminals 4 cannot be effectively prevented from being oxidized and corroded.
If it exceeds m, the internal stress inside the plating layer made of nickel will increase, and the ceramic substrate 1 will be warped or cracked. In particular, when the thickness of the ceramic substrate 1 is as thin as 700 μm or less, warpage or cracking of the ceramic substrate 1 becomes remarkable. Accordingly, the thickness of the nickel plating layer applied to the surface of the metal circuit board 3 or the metal terminal 4 is 1.5 μm to 3 μm.
It is preferable to keep the range of μm.
【００２４】更に前記金属端子４はセラミック基板１の
上面に接合される接合部４ａと立脚部４ｂとで構成され
てＬ字型をなしており、接合部４ａはセラミック基板１
の上面に被着されているメタライズ金属層２にロウ材５
を介して接合され、立脚部４ｂは外部電気回路に接続さ
れる。Further, the metal terminal 4 has an L-shape constituted by a joining portion 4a joined to the upper surface of the ceramic substrate 1 and a standing leg portion 4b.
Metallized metal layer 2 deposited on the upper surface of
And the standing portion 4b is connected to an external electric circuit.
【００２５】本発明のセラミック回路基板においては、
図２に示すごとく前記Ｌ字型をなす金属端子４の接合部
４ａと立脚部４ｂとの間に形成される屈曲部、特に上部
側の屈曲部４ｃに１００°未満の角度を有する角部を非
形成としておくことが重要である。In the ceramic circuit board of the present invention,
As shown in FIG. 2, a bent portion formed between the joint portion 4a and the standing leg portion 4b of the L-shaped metal terminal 4, particularly a corner portion having an angle of less than 100 ° is formed at the upper bent portion 4c. It is important that they remain unformed.
【００２６】前記Ｌ字型をなす金属端子４の屈曲部４ｃ
において１００°未満の角度を有する角部を非形成とし
ておくとセラミック回路基板に２０Ａ以上の大きな電流
が流れ金属端子４に２０Ａ以上の大きな電流が印加され
たとしても、金属端子４の屈曲部４ｃにおいて電流密度
が高くなり大きな抵抗発熱を発生することはなく、その
結果、金属端子４に溶断が生じたり、セラミック回路基
板に搭載されているスイッチング素子や容量素子、抵抗
素子等を高温として誤動作を招来させることが有効に防
止され、セラミック回路基板としての信頼性を極めて高
いものとなすことができる。The bent portion 4c of the L-shaped metal terminal 4
In this case, if a corner having an angle of less than 100 ° is not formed, a large current of 20 A or more flows to the ceramic circuit board, and even if a large current of 20 A or more is applied to the metal terminal 4, the bent portion 4 c of the metal terminal 4 is formed. In this case, the current density is not increased and large resistance heat is not generated. As a result, the metal terminals 4 are melted, and the switching elements, capacitance elements, resistance elements, etc. mounted on the ceramic circuit board are erroneously operated at high temperatures. This can be effectively prevented, and the reliability as a ceramic circuit board can be made extremely high.
【００２７】なお、前記Ｌ字型をなす金属端子４の屈曲
部４ｃに１００°未満の角度を有する角部が形成されて
いるとセラミック回路基板に２０Ａ以上の大きな電流が
流れ金属端子４に２０Ａ以上の大きな電流が印加された
場合、屈曲部４ｃにおける電流密度が高くなって金属端
子４に大きな抵抗発熱が発生してしまい、該発熱によっ
て金属端子４が溶断したり、セラミック回路基板に搭載
されているスイッチング素子や容量素子、抵抗素子等を
高温として誤動作を招来させてしまう。従って、前記Ｌ
字型をなす金属端子４はその屈曲部４ｃにおいて１００
°未満の角度を有する角部を非形成としておくことに特
定される。If a bent portion 4c of the L-shaped metal terminal 4 has a corner having an angle of less than 100 °, a large current of 20 A or more flows through the ceramic circuit board and the metal terminal 4 has a current of 20 A or more. When the above-mentioned large current is applied, the current density in the bent portion 4c increases, and large resistance heat is generated in the metal terminal 4, and the metal terminal 4 is melted by the heat and mounted on the ceramic circuit board. The switching element, the capacitance element, the resistance element, and the like, which are in a high temperature state, cause a malfunction. Therefore, the L
The metal terminal 4 having a character shape has 100
It is specified that a corner having an angle of less than ° is not formed.
【００２８】なお、前記Ｌ字型をなす金属端子４の屈曲
部４ｃにおいて１００°未満の角度を有する角部を非形
成としておくには、例えば、Ｌ字型の金属端子４を折り
曲げ金型によって製作する場合、前記曲げ金型の屈曲部
形成領域を予め１００°以上の角部で形成しておけば金
属端子４の屈曲部内側４ｃは１００°未満の角部が非形
成となるようにして製作される。In order to keep the corners having an angle of less than 100 ° at the bent portion 4c of the L-shaped metal terminal 4, for example, the L-shaped metal terminal 4 is bent by a metal mold. In the case of manufacturing, if the bent portion forming region of the bending mold is formed with a corner portion of 100 ° or more in advance, the bent portion inside 4c of the metal terminal 4 is formed such that the corner portion of less than 100 ° is not formed. Be produced.
【００２９】かくして上述のセラミック回路基板によれ
ば、セラミック基板１の上面にスイッチング素子や容量
素子、抵抗素子等を搭載するとともに該スイッチング素
子、容量素子、抵抗素子等の電極を金属回路板３に接続
することによって所定の電気回路が構成され、金属端子
４を外部電気回路に接続することによって前記所定の電
気回路が外部電気回路に接続されることとなる。Thus, according to the above-described ceramic circuit board, the switching element, the capacitance element, the resistance element and the like are mounted on the upper surface of the ceramic substrate 1 and the electrodes such as the switching element, the capacitance element and the resistance element are mounted on the metal circuit board 3. A predetermined electric circuit is formed by the connection, and the predetermined electric circuit is connected to the external electric circuit by connecting the metal terminal 4 to the external electric circuit.
【００３０】なお、本発明は上述の実施例に限定される
ものではなく、本発明の要旨を逸脱しない範囲であれば
種々の変更は可能であり、例えば、本発明のセラミック
回路基板はセラミック基板の上面に予めＬ字型に形成さ
れた金属端子を取着する例を示したが、板状の金属板の
一端をセラミック基板に接合させた後、金属板の他端側
を垂直に起こしてＬ字型の金属端子を形成してもよい。
この場合、板状の金属板の他端側を垂直に起こす際、１
００°以上の角部が非形成の押さえ治具を準備し、この
押さえ治具に沿って板状金属板を垂直に起こせばＬ字型
金属端子の屈曲部に１００°未満の角度を有する角部が
非形成となる。It should be noted that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention. Although an example in which a metal terminal formed in an L shape in advance is attached to the upper surface of the plate is shown, after joining one end of the plate-shaped metal plate to the ceramic substrate, the other end of the metal plate is vertically raised. An L-shaped metal terminal may be formed.
In this case, when raising the other end side of the plate-shaped metal plate vertically, 1
A holding jig having no corners of 00 ° or more is prepared, and if the plate-shaped metal plate is vertically raised along the holding jig, a corner having an angle of less than 100 ° is formed at the bent portion of the L-shaped metal terminal. The part is not formed.
【００３１】また、上述の実施例ではセラミック基板が
アルミニウム質焼結体で形成された例を示したが、電子
部品が多量の熱を発し、この熱を効率良く除去したい場
合にはセラミック基板を熱伝導率の高い窒化アルミニウ
ム質焼結体や窒化珪素質焼結体で形成すればよく、金属
回路板に高速で電気信号を伝播させたい場合にはセラミ
ック基板を誘電率の低いムライト質焼結体で形成すれば
よい。In the above-described embodiment, the ceramic substrate is formed of an aluminum sintered body. However, when the electronic component generates a large amount of heat and the heat is desired to be removed efficiently, the ceramic substrate is removed. It may be formed of an aluminum nitride sintered body or silicon nitride sintered body having high thermal conductivity. If it is desired to transmit electric signals at high speed to a metal circuit board, a ceramic substrate having a low dielectric constant is mullite sintered. What is necessary is just to form with a body.
【００３２】更に、上述の実施例ではセラミック基板の
表面に予めメタライズ金属層を被着させておき、該メタ
ライズ金属層に金属回路板や金属端子をロウ付けしてセ
ラミック回路基板となしたが、これをセラミック基板の
表面に、例えば、銀−銅共晶合金にチタンもしくは水素
化チタンを２〜５重量％添加した活性金属ロウ材を介し
て直接金属回路板や金属端子を取着させてセラミック回
路基板を形成してもよい。Further, in the above embodiment, a metallized metal layer was previously applied to the surface of the ceramic substrate, and a metal circuit board and metal terminals were brazed to the metallized metal layer to form a ceramic circuit board. A metal circuit board or a metal terminal is directly attached to the surface of the ceramic substrate via an active metal brazing material obtained by adding titanium or titanium hydride to a silver-copper eutectic alloy in an amount of 2 to 5% by weight. A circuit board may be formed.
【００３３】[0033]
【発明の効果】本発明のセラミック回路基板によれば、
Ｌ字型をなす金属端子の屈曲部において１００°未満の
角度を有する角部が非形成とされていることからセラミ
ック回路基板に２０Ａ以上の大きな電流が流れ金属端子
に２０Ａ以上の大きな電流が印加されたとしても、金属
端子の屈曲部において電流密度が高くなり大きな抵抗発
熱を発生することはなく、その結果、金属端子に溶断が
生じたり、セラミック回路基板に搭載されているスイッ
チング素子や容量素子、抵抗素子等を高温として誤動作
を招来させることが有効に防止され、セラミック回路基
板としての信頼性を極めて高いものとなすことができ
る。According to the ceramic circuit board of the present invention,
Since a corner having an angle of less than 100 ° is not formed in the bent portion of the L-shaped metal terminal, a large current of 20 A or more flows to the ceramic circuit board, and a large current of 20 A or more is applied to the metal terminal. Even if it is performed, the current density is not increased at the bent portion of the metal terminal and large resistance heat is not generated, and as a result, the metal terminal is melted or the switching element or the capacitor mounted on the ceramic circuit board is generated. In addition, it is possible to effectively prevent a malfunction due to a high temperature of the resistance element or the like, and it is possible to make the reliability of the ceramic circuit board extremely high.
【図１】本発明のセラミック回路基板の一実施例を示す
断面図である。FIG. 1 is a sectional view showing one embodiment of a ceramic circuit board of the present invention.
【図２】図１に示すセラミック回路基板の要部断面図で
ある。FIG. 2 is a cross-sectional view of a main part of the ceramic circuit board shown in FIG.
１・・・・セラミック基板 ２・・・・メタライズ金属層 ３・・・・金属回路板 ４・・・・金属端子 ４ａ・・・接合部 ４ｂ・・・立脚部 ４ｃ・・・屈曲部 ５・・・・ロウ材 DESCRIPTION OF SYMBOLS 1 ... Ceramic substrate 2 ... Metallized metal layer 3 ... Metal circuit board 4 ... Metal terminal 4a ... Joining part 4b ... Standing part 4c ... Bending part 5 ... ... Brazing material
Claims (1)
属回路板に電気的に接続する金属端子とを取着して成る
セラミック回路基板であって、前記金属端子はセラミッ
ク基板の上面に接合される接合部と立脚部とを有するＬ
字型をなしており、かつ該Ｌ字型金属端子の屈曲部には
１００°未満の角度を有する角部が非形成であることを
特徴とするセラミック回路基板。1. A ceramic circuit board having a metal circuit board and a metal terminal electrically connected to the metal circuit board mounted on an upper surface of a ceramic substrate, wherein the metal terminal is bonded to the upper surface of the ceramic substrate Having a joint and a standing portion to be connected
A ceramic circuit board having a letter shape, wherein a corner having an angle of less than 100 ° is not formed at a bent part of the L-shaped metal terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001157698A JP2002353374A (en) | 2001-05-25 | 2001-05-25 | Ceramic circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001157698A JP2002353374A (en) | 2001-05-25 | 2001-05-25 | Ceramic circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002353374A true JP2002353374A (en) | 2002-12-06 |
Family
ID=19001523
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001157698A Pending JP2002353374A (en) | 2001-05-25 | 2001-05-25 | Ceramic circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002353374A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006277970A (en) * | 2005-03-28 | 2006-10-12 | Mitsumi Electric Co Ltd | Secondary battery protection module and lead mounting method |
| JP2010272736A (en) * | 2009-05-22 | 2010-12-02 | Toshiba Lighting & Technology Corp | Light-emitting device |
-
2001
- 2001-05-25 JP JP2001157698A patent/JP2002353374A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006277970A (en) * | 2005-03-28 | 2006-10-12 | Mitsumi Electric Co Ltd | Secondary battery protection module and lead mounting method |
| JP2010272736A (en) * | 2009-05-22 | 2010-12-02 | Toshiba Lighting & Technology Corp | Light-emitting device |
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