EP1191833B1 - Einrichtung zur Montage von elektronischen Bauteilen - Google Patents

Einrichtung zur Montage von elektronischen Bauteilen Download PDF

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Publication number
EP1191833B1
EP1191833B1 EP01123084A EP01123084A EP1191833B1 EP 1191833 B1 EP1191833 B1 EP 1191833B1 EP 01123084 A EP01123084 A EP 01123084A EP 01123084 A EP01123084 A EP 01123084A EP 1191833 B1 EP1191833 B1 EP 1191833B1
Authority
EP
European Patent Office
Prior art keywords
nozzle
data
electronic component
component
suction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP01123084A
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English (en)
French (fr)
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EP1191833A1 (de
Inventor
Kazuyoshi Oyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi High Tech Instruments Co Ltd
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Hitachi High Tech Instruments Co Ltd
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Filing date
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Publication of EP1191833A1 publication Critical patent/EP1191833A1/de
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53087—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53183—Multilead component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part

Definitions

  • This invention relates to an electronic component mounting apparatus, in which a suction nozzle mounted on a mounting head picks up electronic components from an electronic component feeding apparatus and mounts the electronic components on a print board.
  • the conventional electronic component mounting apparatus is configured in such a way that each of the suction, recognition, and mounting operation of an electronic component can be designated in detail by parts library data in order to establish the individual handling control for the component.
  • the doubly framed parts in the screen displayed on the CRT are the switch portion of a touch panel switch, with which each data of each electronic component can be edited and set up.
  • the component ID is "QFP100-0001-0500”
  • the component form is “flat packaged”
  • the lighting mode is "reflection”
  • the nozzle ID of the nozzle type is "MF01”.
  • Shape data, recognition data, control data and feeder data can also be entered.
  • the nozzle type is classified by its tip size, shape, length and other characteristics of the nozzle and managed by a nozzle ID.
  • the nozzle ID is a four-digit combination of letters and numbers and designates for each component "a nozzle” for picking up the component.
  • the nozzle ID "MF01" in the screen denotes a standard nozzle with a hollow and round cross section at its suction part (it will be referred to a round nozzle hereinafter).
  • the type, size, thickness, and polarity of the component can be selected or entered.
  • the recognition algorithm, lighting data, component size capacity and other data can be selected and entered.
  • the pick-up retention time, the placement retention time, and the speed of each suction, transportation and mounting operation can be selected and entered.
  • the mode of component feeding and the speed of component feeding can be selected and entered.
  • a control device controls the movement of a mounting head based on the data of the parts library data corresponding to each electronic component stored in the RAM, for picking up electronic component from a component feeding apparatus by a suction nozzle mounted on the mounting head and for mounting the component on a print board.
  • the ID of the alternative nozzle should be set up as the nozzle type.
  • the direction to reduce the speed needs to be changed accordingly and the data should be altered and managed as a new parts library data (the data should be newly registered with a different component ID).
  • an electronic component mounting apparatus having a mounting head with several suction nozzles and a computer for controlling the apparatus.
  • the computer comprises a memory device that stores specific characteristics of the several suction nozzles, and it comprises further a control device to control which of the several suction nozzles is to be used for mounting of the specific electronic component.
  • a part library is stored that contains data for each of the electronic components to be mounted, the data comprising a data field indicating the type of the suction nozzle to be used for mounting the particular electronic component.
  • a similar mounting apparatus is disclosed in EP-A-0 821 549, the mounting head having a plurality of nozzles arranged on a circumference of a nozzle holder.
  • the nozzles can be of different types, and by turning of the nozzle holder an active nozzle is selected.
  • a first electronic component is picked up using a first nozzle, and after mounting of this electronic component the mounting head moves to pick up another electronic component.
  • a control device determines whether the second electronic component can be handled by the nozzle currently active, and if required rotates the nozzle holder to select another nozzle type as the new active nozzle that is appropriated to the electronic component to be mounted next.
  • the known mounting apparatus suffers under severe performance degradation or even break down in the case that the designated nozzle type becomes compromised or unavailable by wear the nozzle breaks or its data is being accidentally overwritten by an operator.
  • the invention lies in the features of the independent claims; preferred embodiments in those of the dependent claims. Since the data regarding the control during component handling is influenced by the designation of the nozzle, this invention includes the independent set-up and registration of the control data for each nozzle.
  • the electronic component mounting apparatus of this invention where electronic component is picked up by a suction nozzle mounted on a mounting head from an electronic component feeding apparatus and mounted on a print board, includes a memory device storing parts library data which includes nozzle designation data for each of the electronic components from a plurality of suction nozzle types and a control device which controls the apparatus so that the designated nozzle picks up and mounts the electronic component based on the parts library data stored in the memory device.
  • the parts library stored in the memory device further comprises data for designating a plurality of suction nozzle types with respective priorities as a designated suction nozzle for each of the electronic components, and which preferably stores the corresponding control data on the suction nozzle, and the control device which controls the apparatus so that it chooses one of the designated plurality of nozzle types for mounting the electronic component based on the parts library data stored in the memory device.
  • the parts library data is used to designate a suction nozzle from a plurality of the suction nozzle types based on the order of priority.
  • the component mounting apparatus of this invention also includes a nozzle stocker for storing the suction nozzles, a memory device which stores the nozzle positioning data on the location of a nozzle stored in the nozzle stocker, and a control device which selects a suction nozzle based on the order of priority using the nozzle positioning data as well as the parts library data both stored in the memory device.
  • the parts library data which can be used to designate a suction nozzle from a plurality of suction nozzle types, also includes the data for showing whether the designation of the suction nozzle is valid or invalid for each type of the nozzle.
  • control data is the data on the transportation speed of the suction nozzle.
  • the ID of the alternative nozzle should be set up as the nozzle type.
  • the direction to reduce the speed needs to be changed accordingly and the data should be altered and managed as new parts library data (the data should be newly registered with a different component ID).
  • the mounting apparatus of this invention can prevent this sort of problem since it enables the designation of an alternative nozzle along with the designation of the recommended nozzle.
  • the control data can be independently set up and registered for each nozzle, because the control data for component handling changes according to the designation of the nozzle.
  • Fig. 1 is a plan view of an electronic component mounting apparatus 1.
  • a plurality of component feeding units 3 that feed one component of various kinds of electronic components at a time to each component pick-up portion (component suction position) are juxtaposed.
  • feeding conveyers 4 Between the groups of the unit 3 facing each other, feeding conveyers 4, a positioning portion 5 and exhausting conveyers 6 are mounted.
  • the feeding conveyer 4 receives the print board P from upper stream and sends the print board to the positioning portion 5. After an electronic component is mounted on the print board positioned by a positioning mechanism, not shown in the figure, of the positioning portion 5, the print board is sent to the exhausting conveyer 6.
  • Reference numeral 8 denotes a pair of beams that extends in X direction, and moves the print board P or the upper part of the component pick-up portion (component suction position) of the feeding unit 3 individually in Y direction along with a pair of the parallel guides 11 by rotating the screw axis 10 by the drive of Y axis motor 9.
  • a mounting head 7 that moves in X direction, which is the longitudinal direction, along the guide (not shown in the figure) by the drive of an X axis motor 12 is mounted on each beam 8.
  • two vertical axis motors 14 that move two suction nozzles (not shown in the figure) in vertical direction and two ⁇ axis motors for rotating the suction nozzles around vertical axis are mounted on each mounting head 7. Therefore, it is possible for each of the two suction nozzles on the mounting head to move in X and Y directions, to rotate around vertical axis, and to move upwards and downwards. Also, by mounting one ⁇ axis motor that makes mounting head rotate around the vertical axis and one vertical axis motor that moves mounting head upwards and downwards, it is possible to move only the selected suction nozzles upwards and downwards.
  • Reference numerical 16 denotes a recognition camera for recognizing component position. There are two cameras for each of the mounting heads 7 and four cameras in total. The camera performs the imaging of an electronic component for recognizing the amount of positioning error of the electronic component relative to the suction nozzle in X and Y direction, and rotation angle. Each camera can perform imaging of each electronic component that is picked up by the suction nozzle.
  • Reference numerical 17 denotes a stocker for storing nozzles. Although the stocker can store ten nozzles, it stores only nine nozzles in this embodiment leaving at least one place for the suction nozzle to be replaced.
  • Fig. 2 is a block diagram for controlling the electronic component mounting apparatus.
  • X axis motors 12, Y axis motors 9, ⁇ axis motors 15 and vertical axis motors 14 are shown in the figure as a matter of convenience.
  • Reference numerical 20 indicates a CPU (mounting controlling unit) as a controlling unit that controls the mounting apparatus 1.
  • CPU 20 controls the movements related to the component mounting procedure of electronic component mounting apparatus 1 based on the data stored in the RAM 22 and in accordance with the program stored in the ROM 23.
  • CPU 20 controls the movements of the X axis motor 12 through interface 24 and driver circuit 25, the movements of the Y axis motor 9 through interface 24 and driver circuit 28, the movements of the ⁇ axis motor 15 through interface 24 and driver circuit 32, and the movements of the vertical axis motor 14 through interface 24 and driver circuit 30.
  • Mounting data related to component mounting as shown in Fig. 3 is stored in the RAM 22.
  • the information on X direction (indicated by X), Y direction (indicated by Y) and angle (indicated by ⁇ ) in a print board and the information on positioning number (indicated by FDR) of each component feeding unit 3 are stored.
  • the component positioning data as shown in Fig. 4, is stored.
  • the type of each component (component ID) corresponding to the positioning number of the component feeding unit 3 is stored.
  • the parts library data that identify characteristics of each component is stored. This will be explained in detail later.
  • Reference numerical 33 denotes a recognition processing unit connected to the CPU 20 through interface 24 and the recognition processing of the images taken by the recognition camera 16 is performed based on the parts library data at the recognition processing unit 33, and then the result of the processing is sent to CPU 20. That is, CPU 20 outputs the direction to the recognition processing unit 33 to perform recognition processing (to calculate the amount of adjustment) on the image taken by the recognition camera 16, and receives the result of the recognition processing from the recognition processing unit 33.
  • Reference numeral 34 denotes a touch panel switch mounted on a screen of CRT 36 of the mounting equipment not shown in the figures.
  • the entire surface of the glass substrate of the touch panel 34 is coated with transparent conduction film, and an electrode is printed on each of the four sides of the panel. Also, electric current of extremely small amplitude is applied on the surface of the touch panel 34.
  • the circuit board connected to the electrodes calculates the X Y coordinates of the place being touched.
  • the operation starts.
  • the doubly framed parts in the screen displayed on the CRT 36 are stored as the switch portion for each of the displayed screen (see Fig. 5).
  • a plurality of formats for preparing the parts library data is stored.
  • Fig. 5 which is the editorial screen of the parts library displayed on the CRT 36, the component ID is "QFP100-0001-0500", the component form is “flat packaged”, and the lighting mode is "reflection”. Shape data, recognition data, and feeder data can also be entered.
  • the recommended nozzle is set up as “the first preferred” nozzle and the alternative nozzle as “the second preferred” nozzle. That is, in this embodiment, as “the first preferred” nozzle, the suction nozzle with the nozzle ID "MF01”, and as “the second preferred” nozzle, the suction nozzle with the nozzle ID “MA06” are set up by pressing the switch portion of the each key.
  • the nozzle ID "MF01” indicates a standard round nozzle
  • the nozzle ID "MA06” indicates a nozzle with narrower external and internal diameters compared to those of the "MF01" nozzle.
  • the second preferred" nozzle is designated as the alternative nozzle, a plurality of additional nozzles such as “the third preferred” nozzle can also be designated.
  • the switch portion displaying "shape data” By pressing the switch portion displaying "shape data”, the editorial screen of the “shape data” appears on the CRT 36, and the selections or inputs of the type, size, thickness and polarity of the component become possible. Likewise, by pressing the switch portion displaying "recognition data”, the selections or inputs of the recognition algorithm, the lighting data, the component size capacity become possible. Also, by pressing the switch portion displaying "feeder data”, the selections or inputs of the mode of component feeding and the speed of component transportation become possible.
  • control data the first preferred nozzle
  • the editorial screen of the “control data (the first preferred nozzle)” appears on the CRT 36, and the pick-up retention time, the placement retention time, the speed of vertical movements for pick-up, and the speed of vertical movements for mounting can be selected or entered.
  • the editorial screen of the “control data (the second preferred nozzle)” appears on the CRT 36, and the pick-up retention time, the placement retention time, the speed of vertical movements for suction, and the speed of vertical movements for mounting can be selected or entered. That is, for the electronic component with component ID "QFP100-0001-0500, a plurality of suction nozzles (two nozzles in this embodiment) can be designated and the "control data" corresponding to each nozzle can be registered.
  • control data is explained in detail hereinafter.
  • the data on “the pick-up retention time” is the data for setting up the retention time at the lowest limit of the nozzle during the pick-up. This data can be used when the suction is unstable due to the influence from component surface or the mismatch between a component and a nozzle.
  • the input data range is from 0.00 to 1.99 seconds.
  • the data on “the placement retention time” is the data for setting up the retention time at the lowest limit of the nozzle during mounting, and the input data range is from 0.00 to 1.99 seconds.
  • the "speed data” is the data for controlling the movement of the beam 8, pick-up decent, pick-up ascent, placement decent, placement ascent, and nozzle rotation during the time from the suction to the mounting. This can be done by controlling the X-axis motor 12, the Y-axis motor 9, the ⁇ axis motor 15 and the vertical motor 14 by using the data for designating the acceleration or deceleration rate in relation to the standard driving waveform, or the data for designating the deceleration from full speed. The designation ranging from “no deceleration” to "90% deceleration” is possible.
  • the data on "recognition processing” is the data about the approximate time for component recognition processing, and is used to achieve the optimum processing in the apparatus (for example, it is used for the automatic mounting data sorting processing which arranges the order of the components to be mounted in order to shorten the mounting time).
  • the next one is the "component position correction” data.
  • the standard position at the time of suction of each type of the component in component feeding unit 3 is managed by this data.
  • the position is corrected by using this data.
  • the input data range is from -99.9 mm to +99.9 mm.
  • "pick-up location correction” data is used for shifting the pick-up location from the center of the component when the suction at the center of the component is difficult because of the presence of a groove or a projected object at the center. In this case, the automatic feeder axis adjustment mechanism of the pick-up location works to maintain a correct location for pick-up.
  • the input data range is from - 99.9 mm to + 99.9 mm.
  • automatic feeder axis adjustment data is used to decide if the automatic feeder axis adjustment mechanism of the pick-up location correction (in X and Y- directions) should be used or not based on the result of component recognition. This adjustment mechanism will be operational by setting the "on" up.
  • the next one is the "pick-up level” data for adjusting the level of downward movement of the mounting head 7 at the time of suction.
  • embossed carrier tape When embossed carrier tape is used, a gap between the tape depth and the component thickness is created in some cases. This data can be used for adjusting the movements in those cases.
  • the input data range is - 99.9 mm to + 99.9 mm.
  • the "placement level” data is the data for adjusting the level of downward movement of the mounting head 7 at the time of component mounting.
  • the level of downward movement of the mounting head at the time of mounting is controlled based on the data on the component thickness in the "shape data"
  • the adjustment can be made by using this data when the downward stroke of the mounting head 7 needs to be altered.
  • the value capable of absorbing the downward curvature of the base (plus value) is set up.
  • the input data range is - 99.9 mm to + 99.9 mm.
  • the "focus adjustment” data is the data for adjusting the focus level at the time of component recognition.
  • the level of the height at the time of component recognition is decided based on the data on the component thickness in the "shape data".
  • this data is used for the necessary adjustment.
  • the input data range is - 99.9 mm to + 99.9 mm.
  • the "error processing 1" data is for the cases when a component can not be picked up (no-component).
  • the data is used to designate the number of consecutive erroneous operations of no-component for making an emergency stop of the apparatus. If the alternate mechanism is set up, the designated number works as the condition for starting the alternate mechanism. And if the set-up value is "1", the apparatus will stop at the first detection of a no-component. If the set-up value is "2", the apparatus will stop when two consecutive errors of no-component are detected in the same component feeding unit 3.
  • the input data range is from 1 to 9.
  • the "error processing 2" data is the data for inspecting the consecutive erroneous pick-up caused by the erroneous component recognition (erroneous pick-up of a component).
  • the data is used to designate the number of consecutive erroneous operations for making an emergency stop of the apparatus. If the alternate mechanism is set up, the designated number works as the condition for starting the alternate mechanism. And if the set-up value is "1", the apparatus will stop at the first detection of an erroneous component recognition. If the set-up value is "2", the apparatus will stop when two consecutive errors of the component recognition are detected in the same component feeding unit 3.
  • the input data range is from 1 to 9.
  • control data the first preferred nozzle
  • control data the second preferred nozzle
  • the alternative nozzle set up as the "second preferred” nozzle is the suction nozzle with ID of "MA06” and the round nozzle with the narrower external and internal diameters compared to those of the recommended nozzle with ID of "MF01".
  • the "valid" and “invalid" set-up data for deciding whether the nozzle type data set up as described above should be used or not is also added (see Fig. 5). That is, in case that the second preferred nozzle is not designated, the space for designating the ID of the second preferred nozzle as the nozzle type can be left blank (not entered). Also, the "invalid" key overrides the data set for the second preferred nozzle and the apparatus operates as if there is no data set for the nozzle. In Fig. 5, both the first and the second preferred nozzles are set up as "valid.”
  • the each of the suction nozzles stored in the nozzle stocker 17 is managed by the nozzle positioning data stored in the RAM 22. That is, the data defines location (address) of nozzles (nozzle ID) stored in the nozzle stocker. And, before the component pick-up operation, the CPU 20 decides what kind of nozzle should be used for picking up the particular component, then picks up a suitable nozzle from the nozzle stocker and then mounts the nozzle to the mounting head 7. Usually, this procedure is performed as a nozzle replacement procedure (the suction nozzle which has already mounted on the mounting head 7 is now being stored in the designated address of the stocker 17 and then the necessary nozzle is taken out from the nozzle stocker 17 and mounted on the mounting head 7). The targeted nozzle is expressed as the first preferred nozzle or the second preferred nozzle.
  • the print board P is transported by the conveyer not shown in the figures from upper stream through the feeding conveyer 4 to the positioning portion 5, and then positioned by the positioning mechanism.
  • the component type C3216 of the electronic components with the mounting step numbers 0001 and 0002 and the suction nozzle corresponding to component type C3216 are designated.
  • the suction nozzle picks up the electronic component from the designated component feeding unit 3 by suction. That is, each of the mounting head 7 moves to the position located above each of the designated component feeding unit 3 which stores the electronic component to be picked up.
  • the driver circuit 28 the Y axis motor 9 drives to move the beam 8 along with a pair of guides 9 in Y direction and by the driver circuit 25, the X axis motor 12 drives to move the mounting head 7 in X direction.
  • Each of the designated component feeding units 3 has already been driven to enable the component pick-up at the component pick-up position.
  • the vertical motor 14 is now driven by the driver circuit 30 to move the suction nozzle downward to the upper surface of the component for picking it up by suction.
  • two suction nozzles mounted on one of the mounting head 7 pick up electronic component simultaneously or independently.
  • the suction nozzle moves up by the drive of each vertical axis motor 14.
  • the Y axis motor 9 drives to move the beam 8 along with a pair of guides 9 in Y direction
  • the X axis motor 12 drives to move the mounting head 7 in X direction for transporting each of the mounting head 7 to the position above the print board P.
  • the parts library data is set up to mount the component after the recognition processing.
  • each of the mounting heads 7 stops at the position above each of the recognition camera 16 and the imaging of the component being picked up by each of the mounting heads 7 (the suction nozzle) is performed by each of the recognition camera 16.
  • the recognition processing unit 33 calculates the amount of adjustment in X and Y directions and rotating angle of the electronic component relative to the mounting head.
  • the CPU 20 outputs the directions to move the beam 8 in Y direction by the drive of Y axis motor 9, move the mounting head 7 in X direction by the drive of the X axis motor 12, and rotate the suction nozzle by the drive of ⁇ axis motor 15.
  • the necessary adjustments of the position of one of the electronic component C3216 being picked up by the suction nozzle in X and Y directions and in rotating angle are made.
  • the suction nozzle moves downward and one of the electronic component is mounted at the right position on the print board P. Then the suction nozzle goes up by the drive of the vertical axis motor 14.
  • the other electronic component C3216 is mounted on the print board P. If it is judged that the adjustment is needed based on the result of the recognition, the necessary adjustment is made before the mounting. And if the adjustment is not necessary, the component is immediately mounted on the print board P.
  • the recommended nozzle is set up as "the first preferred” nozzle and the alternative nozzle as "the second preferred nozzle". However, if the place for the nozzle ID of the second preferred nozzle is left blank or the second preferred nozzle is set up as "invalid", the nozzle replacement with the suction nozzle with the nozzle ID "MF01" (the recommended nozzle) stored in the nozzle stocker 17 is made.
  • control data (the first preferred nozzle) of the parts library data of the electronic component stored in the RAM 22
  • the CPU 20 controls the X axis motor 12, Y axis motor 9, ⁇ axis motor 15 and vertical axis motor 14 during the time from the suction to the mounting operations for controlling the movement of the beam 8, pick-up decent, pick-up ascent, placement decent, placement ascent, and nozzle rotation.
  • both the first and second preferred nozzle types are set up as “valid” and both types of the nozzle are stored in the nozzle stocker 17, the nozzle replacement with the suction nozzle with the nozzle ID "MF01" (the recommended nozzle) stored in the nozzle stocker 17 is made.
  • the CPU 20 controls the operation as described above according to the "control data (the first preferred nozzle).
  • the CPU 20 recognizes which nozzle is available by using the nozzle positioning data. Since the recommended nozzle is not available, the replacement with the alternative nozzle (the second preferred nozzle) is made, and the CPU 20 controls the operation according to the "control data (the second preferred nozzle)" of the alternative nozzle.
  • the alternative nozzle (nozzle ID "MA06”) is the round nozzle with the narrower external and internal diameters compared to those of the recommended nozzle with ID of "MF01".
  • nozzle ID "MA06” is the round nozzle with the narrower external and internal diameters compared to those of the recommended nozzle with ID of "MF01".
  • the CPU 20 controls the movements of the X axis motor 12 through interface 24 and driver circuit 25, the movements of the Y axis motor 9 through interface 24 and driver circuit 28, the movements of the ⁇ axis motor 15 through interface 24 and driver circuit 32, and the movements of the vertical axis motor 14 through interface 24 and driver circuit 30 accordingly.
  • Both the first and second preferred nozzle types are set up as "valid" and both types of the nozzle are stored in the nozzle stocker 17.
  • the component mounting operation of a group of the components with the designation of the first preferred nozzle is performed through the nozzle replacement of the mounting head 7.
  • a group of components with the designations of both the first and second preferred nozzle comes up.
  • the following situation will take place due to the sequence of the mounting head 7. That is, the first preferred nozzle has been already replaced with the second preferred nozzle on the mounting head 7 for the next component to be picked up.
  • the right selection can be made instantly during the operation. That is, the CPU 20 calculates the required time for each case and automatically chooses the shorter sequence, as shown in Fig. 8.
  • the continuous mounting operation with the second preferred nozzle without nozzle replacement will be selected. However, this selection is made only if the substitution by the second preferred nozzle takes place once. If the same kind of components should be mounted for a plurality of times, the total length of required times will be compared and then the better sequence is selected.
  • the mounting program is prepared to decrease the number of nozzle replacement procedures meaning that the replacement of the same nozzle is not repeated many times. Thus, the selection should be made between the one replacement and the replacements at continuous steps.
  • the recommended nozzles for the component mounting are prepared, but the number of the nozzles is not enough.
  • the pick-up and mounting operations are done by a plurality of beams and heads.
  • the utilization of one recommended nozzle should be shared by a plurality of heads for a plurality of mounting operations.
  • the following situation may happen. That is, when the recommended nozzles have already mounted on certain heads and are in operation, other beams or other heads may need the same nozzles because of the component pick-up sequence which requires the same nozzle.
  • the beams and heads which need the same nozzles should wait till other heads finish using the nozzle, or the processing of the component itself should be postponed.
  • the substitution by the second preferred nozzle is possible, it is not necessary to wait or to be postponed.
  • the continuous operation becomes possible, increasing the flexibility of the operation.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Claims (6)

  1. Elektronikbauteilmontagevorrichtung, die folgendes umfaßt:
    - einen Montagekopf (7), der von einer Elektronikbauteilbeschickungsvorrichtung (3) zum Beschicken mehrerer Elektronikbauteile ein Elektronikbauteil aufgreift und das Elektronikbauteil auf einer Leiterplatte (P) montiert;
    - eine Saugdüse, die am Montagekopf (7) angebracht ist und das Elektronikbauteil hält;
    - eine Speichereinrichtung (22, 23), die Teilebibliotheksdaten speichert, die Düsenbezeichnungsdaten beinhalten; und
    - eine Steuereinrichtung (20) zum Steuern der Vorrichtung derart, daß die Saugdüse das Elektronikbauteil aufgreift und montiert,

    dadurch gekennzeichnet, daß
    die in der Speichereinrichtung (22, 23) gespeicherte Teilebibliothek weiterhin Daten zum Bezeichnen mehrerer Düsenarten mit jeweiligen Prioritäten als eine bezeichnete Saugdüse für jedes der Elektronikbauteile umfaßt;
    und die Steuereinrichtung (20) so ausgelegt ist, daß sie einen der bezeichneten mehreren Düsentypen gemäß den Prioritäten zum Montieren des entsprechenden Elektronikbauelements auf der Basis der in der Speichereinrichtung gespeicherten Teilebibliotheksdaten wählt.
  2. Elektronikbauteilmontagevorrichtung nach Anspruch 1, wobei die Teilebibliothek weiterhin entsprechende Steuerdaten für die bezeichnete Düse umfaßt.
  3. Elektronikbauteilmontagevorrichtung nach den Ansprüchen 1 oder 2, wobei die Teilebibliotheksdaten eine Reihenfolge der Priorität zum Auswählen der Saugdüse für eine Verwendung beinhalten.
  4. Elektronikbauteilmontagevorrichtung nach Anspruch 3, die weiterhin folgendes umfaßt:
    - eine Düsenaufbewahrung (17) zum Aufbewahren der Saugdüsen;
    - eine Speichereinrichtung (22), die Düsenpositionierdaten hinsichtlich Stellen von in der Düsenaufbewahrung aufbewahrten Düsen aufbewahrt; und
    - eine Steuereinrichtung (20) zum Auswählen einer Saugdüse entsprechend der Priorität unter Verwendung der Düsenpositionierdaten und der Teilebibliotheksdaten.
  5. Elektronikbauteilmontagevorrichtung nach den Ansprüchen 1 oder 4, wobei die Teilebibliotheksdaten Daten beinhalten zum Bestimmen der Gültigkeit der Bezeichnung des Düsentyps.
  6. Elektronikbauteilmontagevorrichtung nach Anspruch 2, wobei die Steuerdaten Daten hinsichtlich Transportgeschwindigkeiten der Saugdüse beinhalten.
EP01123084A 2000-09-26 2001-09-26 Einrichtung zur Montage von elektronischen Bauteilen Expired - Lifetime EP1191833B1 (de)

Applications Claiming Priority (2)

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JP2000292533 2000-09-26
JP2000292533A JP3624145B2 (ja) 2000-09-26 2000-09-26 電子部品装着装置

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EP1191833A1 EP1191833A1 (de) 2002-03-27
EP1191833B1 true EP1191833B1 (de) 2006-03-08

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KR100581427B1 (ko) * 2000-08-22 2006-05-17 마츠시타 덴끼 산교 가부시키가이샤 부품 실장 장치 및 방법
EP1586227B1 (de) * 2003-01-23 2008-04-16 Matsushita Electric Industrial Co., Ltd. Verfahren zur optimierung einer reihenfolge der komponentenanbringung, vorrichtung damit und anbringvorrichtung
CN100473270C (zh) * 2003-05-27 2009-03-25 松下电器产业株式会社 元件安装顺序优化方法,元件安装装置
KR20070042156A (ko) * 2004-07-30 2007-04-20 아셈블레온 엔. 브이. 컴포넌트 배치 장치
JP4757558B2 (ja) * 2005-07-29 2011-08-24 株式会社日立ハイテクインスツルメンツ 電子部品装着装置
JP4995745B2 (ja) * 2008-01-11 2012-08-08 ヤマハ発動機株式会社 部品実装装置
JP4997124B2 (ja) * 2008-01-21 2012-08-08 株式会社日立ハイテクインスツルメンツ 電子部品装着ヘッド及び電子部品装着装置
JP5103238B2 (ja) * 2008-03-25 2012-12-19 株式会社日立ハイテクインスツルメンツ 電子部品装着装置
JP5342159B2 (ja) * 2008-03-25 2013-11-13 株式会社日立ハイテクインスツルメンツ 電子部品装着装置
JP5246064B2 (ja) * 2009-06-29 2013-07-24 パナソニック株式会社 電子部品実装方法
JP5528193B2 (ja) * 2010-04-30 2014-06-25 株式会社日立ハイテクインスツルメンツ 部品実装装置およびその生産スループット低下原因特定方法
JP5440483B2 (ja) * 2010-12-09 2014-03-12 パナソニック株式会社 電子部品実装システムおよび電子部品実装方法
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CN103329645B (zh) * 2011-12-08 2016-04-06 松下知识产权经营株式会社 电子零件安装线及电子零件安装方法
JP5747168B2 (ja) * 2012-03-12 2015-07-08 パナソニックＩｐマネジメント株式会社 装着ヘッド及び部品装着装置
EP3684158B1 (de) * 2012-10-30 2023-03-08 FUJI Corporation Düsenverwaltungsmaschine
EP3128824B1 (de) * 2014-04-02 2019-01-02 FUJI Corporation Komponentenmontagemaschine
US10796353B2 (en) * 2014-11-25 2020-10-06 Fuji Corporation Order processing device, identification information plate, and order processing method
JP6587483B2 (ja) * 2015-09-29 2019-10-09 ヤマハ発動機株式会社 部品実装システム、部品実装方法
CN106217002B (zh) * 2016-08-31 2018-08-24 中山市拓电电子科技有限公司 一种cpu自动取放模组
JP6869734B2 (ja) * 2017-01-30 2021-05-12 ヤマハ発動機株式会社 表面実装機、表面実装機のノズル交換プログラムおよび表面実装機のノズルの交換方法
JP7012438B2 (ja) * 2017-02-09 2022-01-28 株式会社Fuji 生産プログラムの最適化方法及び部品実装機
WO2019171602A1 (ja) * 2018-03-09 2019-09-12 株式会社Ｆｕｊｉ 部品実装機
CN112219463B (zh) * 2018-06-29 2021-12-24 松下知识产权经营株式会社 部件组装装置以及作业***
CN112219461B (zh) * 2018-06-29 2022-01-18 松下知识产权经营株式会社 作业***以及馈送器台车的搬运方法
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Publication number Publication date
JP3624145B2 (ja) 2005-03-02
DE60117654T2 (de) 2006-12-21
DE60117654D1 (de) 2006-05-04
EP1191833A1 (de) 2002-03-27
US6860002B2 (en) 2005-03-01
JP2002111286A (ja) 2002-04-12
US20020042987A1 (en) 2002-04-18

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