EP1183723A1 - Circuit pouvant etre integre verticalement et son procede de production - Google Patents

Circuit pouvant etre integre verticalement et son procede de production

Info

Publication number
EP1183723A1
EP1183723A1 EP00925226A EP00925226A EP1183723A1 EP 1183723 A1 EP1183723 A1 EP 1183723A1 EP 00925226 A EP00925226 A EP 00925226A EP 00925226 A EP00925226 A EP 00925226A EP 1183723 A1 EP1183723 A1 EP 1183723A1
Authority
EP
European Patent Office
Prior art keywords
electrically conductive
vertical integration
contacts
circuits
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP00925226A
Other languages
German (de)
English (en)
Inventor
Thomas Grassl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Giesecke and Devrient GmbH
Original Assignee
Giesecke and Devrient GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Giesecke and Devrient GmbH filed Critical Giesecke and Devrient GmbH
Publication of EP1183723A1 publication Critical patent/EP1183723A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76898—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics formed through a semiconductor substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to a vertically integrable circuit and a method for its production.
  • Vertically integrable circuits are understood to be semiconductor circuits manufactured using planar technology, which are arranged vertically one above the other in several planes, as a result of which three-dimensional circuits are created.
  • the individual components and circuit components on the different levels are electrically connected to one another by vertical contacts. This can be compared to two-dimensional circuits, i. H. Circuits only in one level, a higher packing density can be achieved.
  • Vertical integration also offers advantages from safety-related aspects, since particularly sensitive circuit components can be arranged in levels or layers, which are surrounded on both sides by at least one further level or layer with active components.
  • the vertical contacts deviate from known technologies, since the individual vertically integrable circuits are produced in known and easily controllable planar technology. Several methods have become known for producing the vertical contacts.
  • a known method is based on depositing and recrystallizing polycrystalline silicon on a completely processed component layer. Additional components can be manufactured in the recrystallized layer.
  • the disadvantage of this method is that, due to the high temperatures during recrystallization, the properties of the already finished active components on the lower level can change. Will continue Due to the serial processing of the vertically integrated overall circuit, a correspondingly extended lead time is required for the production.
  • Another known method provides for the individual, vertically integrable circuits or levels of formwork to be produced separately on different substrates.
  • the substrates with the individual circuit planes are then thinned, provided with front and rear contacts and connected vertically by means of a bonding process. It is a disadvantage of this method that materials are sometimes used for the production of the front and rear side contacts which cannot easily be used in known semiconductor manufacturing processes.
  • DE 4433 845 AI discloses a method for producing a three-dimensional integrated circuit, in which two finished substrates or individual circuits are connected to one another. For the vertical electrical connection of the circuits contained on both substrates, after the connection of the two substrates, one of which has been thinned, further process steps are carried out in order to produce a metallization.
  • the disadvantage of the known method is that completely processed substrates have to be made available and that additional process steps are required to produce the vertical electrical connection.
  • FIG. 1 shows different process steps of a method for producing vertically integrable circuits
  • Figure 2 shows an embodiment of an electrically conductive connection for the vertical integration of circuits.
  • Figure 1 shows the sequence of process steps in the manufacture of vertically integrable circuits.
  • FIG. 1 a shows a substrate 1, 2 in which an insulating layer 3 is hidden.
  • the substrate 1, 2 can e.g. B. consist of silicon, the insulating layer 3 z. B. from silicon dioxide.
  • SOI substrates Silicon On Insulator
  • recesses 4 are made up to the insulating layer 3, e.g. B. by etching, the webs 5 in the substrate 1 surrounded.
  • the webs 5 are dimensioned such that they can be completely oxidized in a subsequent process step.
  • Recesses 4 and webs 5 are dimensioned so that their area is sufficient to accommodate contacts for vertical integration and to form insulation for these contacts.
  • alignment marks (not shown) can also be etched, which will later be used to align the circuits or the substrate for vertical integration.
  • Figure lb shows the SOI substrate 1, 2, 3 after further process steps.
  • Different doped wells 6 and oxide layers 8 and 9 were produced.
  • the doped wells 6 and field oxide 8 and gate oxide 9 later form the active components of the vertically integrable circuit. Their manufacture and mode of operation are known and therefore do not need to be described, especially since they are not important for understanding the present invention.
  • In the place of the recesses 4 and webs 5 from Figure la is after the oxidation, for. B. a high temperature oxidation, an oxide that is part of the field oxide 8 and extends to the insulating layer 3. During the oxidation, it must be ensured that the field oxide is free of voids and that the surface is as planar as possible.
  • Figure lc shows the substrate 1, 2, 3 after completion of the components, for. B. by introducing different doping materials 11 and 12 or by applying poly crystalline silicon 10.
  • FIG. 1d shows the cutouts 13 and 14 made for a first metallization level, which can be produced, for example, by etching and are referred to as vias.
  • the cutouts 14 serve to connect a component, here a transistor, the cutouts 13 are provided for later vertical integration.
  • FIG. 1 shows the through metallization 15 and 16 introduced for the first metallization level, which fill the vias 13 and 14 from FIG. 1d.
  • a metallization for connecting the through metallizations 15 and 16 is applied to the surface of the planing layer 7.
  • Aluminum is usually used for the metallizations.
  • Figure lf shows the substrate 1, 3 after thinning.
  • the illustrated use of a substrate with a hidden insulating layer 3 proves to be particularly advantageous, since this serves as an etching stop. In principle, however, is that Use of other substrates possible.
  • an oxide deposition For handling the substrate during thinning and during subsequent processing, the processed surface 1 of the substrate can be applied to a handling waver, from which it is detached after complete processing. In this case, the substrate is thinned down to oxide 8. In both cases it can also be provided that the through-metallization 15 is carried out up to the end of the oxide 8, that is to say it is etched accordingly deep beforehand.
  • FIG. 1g shows the processed substrate 1, 3, in which cutouts 17 from the rear side 3 have been etched at the locations of the contacts for vertical integration.
  • the etching which can be carried out, for example, using wet chemistry, extends to the through-metallizations 15.
  • FIG. 1h shows a final rear-side metallization 18 of the substrate 1, 3.
  • the rear-side metallization 18 is carried out in such a way that the contacts 15, 18 required for vertical integration result, i. H. the rear side metallization 18 is interrupted at the locations of the through metallization 15, as shown in FIG. 1h.
  • end layers can also be applied to the rear side metallization, as described above for the front side of the substrate.
  • the oxide 8 was dimensioned at the location of the contact for vertical integration 15, 18 such that it completely encloses the contact for vertical integration 15, 18 for electrical insulation.
  • circuits or substrates for the vertical integration produced by means of the method described above are then joined together, for example with the rear side metallizations 18, the adjustment being carried out by the adjustment marks mentioned above can be used.
  • the connection of more than two substrates is made possible if the contacts for the vertical integration are also led onto the surface of the processed substrate 1. In this case, infrared techniques may have to be used for the adjustment, since the adjustment marks can be hidden by the vertical integration.
  • backside metallizations or metallizations can be provided on the surfaces of the processed substrates, which melt or melt at low temperatures in order to provide a secure electrical connection.
  • Placing the surfaces, on the front or back of the substrate, with contacts for vertical integration must also not be covered by the above-mentioned sealing layers, so that an electrical connection can be made.
  • these points can either be excluded from the creation of the closing layers or these points are, for example, etched free after the closing layers have been created.
  • the method according to the invention can also be used for processes based on other semiconductor materials.
  • FIG. 2 shows an advantageous embodiment of a contact according to the invention for vertical integration.
  • a further metallization 19 is provided within the insulating oxide 8.
  • the metallization 19 is, for. B. designed annular and completely surrounds the metallization of the contact for the vertical integration 15.
  • the ring-shaped metallization 19 is connected in an electrically conductive manner by means of the metallization applied to the surface in a later process step in such a way that it is connected to ground during operation. In this way it can be achieved that the signal flow through the vertical contact 15, 18 is shielded. Then an evaluation of the signal flow through the contact for the vertical integration is also not possible from one of the end faces of the substrate if the contact for the vertical integration is in the vicinity of one of the end faces of the substrate.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)

Abstract

L'invention concerne un circuit pouvant être intégré verticalement et son procédé de production. A la différence des procédés de réalisation des connexions électriques verticales, le procédé selon l'invention comprend des étapes de processus auxquelles il est également fait appel pour la production du circuit pouvant être intégré verticalement, afin de permettre l'intégration verticale. Le déroulement de la production de circuits pouvant être intégrés verticalement et par conséquent du circuit intégré tridimensionnel est ainsi globalement simplifié, ce qui permet d'optimiser les durées de fonctionnement des installations, en raison des économies d'étapes de processus réalisées. Etant donné que l'on n'utilise plus de substrats, dont le traitement est achevé, pour la réalisation des connexions électriques verticales, on obtient un meilleur rendement, car les étapes de processus qui pourraient notamment modifier les composants de circuit actifs déjà produits, par ex. des étapes à des températures de processus élevées, ne sont plus nécessaires après la production des composants de circuit.
EP00925226A 1999-04-23 2000-04-19 Circuit pouvant etre integre verticalement et son procede de production Withdrawn EP1183723A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19918671A DE19918671B4 (de) 1999-04-23 1999-04-23 Vertikal integrierbare Schaltung und Verfahren zu ihrer Herstellung
DE19918671 1999-04-23
PCT/EP2000/003575 WO2000065648A1 (fr) 1999-04-23 2000-04-19 Circuit pouvant etre integre verticalement et son procede de production

Publications (1)

Publication Number Publication Date
EP1183723A1 true EP1183723A1 (fr) 2002-03-06

Family

ID=7905744

Family Applications (1)

Application Number Title Priority Date Filing Date
EP00925226A Withdrawn EP1183723A1 (fr) 1999-04-23 2000-04-19 Circuit pouvant etre integre verticalement et son procede de production

Country Status (7)

Country Link
US (1) US7144757B1 (fr)
EP (1) EP1183723A1 (fr)
JP (1) JP2002543588A (fr)
KR (1) KR100614362B1 (fr)
AU (1) AU4401700A (fr)
DE (1) DE19918671B4 (fr)
WO (1) WO2000065648A1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19918671B4 (de) * 1999-04-23 2006-03-02 Giesecke & Devrient Gmbh Vertikal integrierbare Schaltung und Verfahren zu ihrer Herstellung
JP2001127243A (ja) * 1999-10-26 2001-05-11 Sharp Corp 積層半導体装置
JP4499412B2 (ja) 2001-08-24 2010-07-07 ショット アクチエンゲゼルシャフト コンタクトを形成するための方法およびプリント回路パッケージ
DE10141571B8 (de) * 2001-08-24 2005-05-25 Schott Ag Verfahren zum Zusammenbau eines Halbleiterbauelements und damit hergestellte integrierte Schaltungsanordnung, die für dreidimensionale, mehrschichtige Schaltungen geeignet ist
TW569416B (en) * 2002-12-19 2004-01-01 Via Tech Inc High density multi-chip module structure and manufacturing method thereof
JP4585561B2 (ja) * 2007-09-04 2010-11-24 株式会社東芝 半導体装置の製造方法
US8525168B2 (en) * 2011-07-11 2013-09-03 International Business Machines Corporation Integrated circuit (IC) test probe

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US3648131A (en) * 1969-11-07 1972-03-07 Ibm Hourglass-shaped conductive connection through semiconductor structures
JPS59132142A (ja) * 1983-01-18 1984-07-30 Mitsubishi Electric Corp 半導体装置の製造方法
US4893174A (en) * 1985-07-08 1990-01-09 Hitachi, Ltd. High density integration of semiconductor circuit
KR900008647B1 (ko) * 1986-03-20 1990-11-26 후지쓰 가부시끼가이샤 3차원 집적회로와 그의 제조방법
EP0316799B1 (fr) * 1987-11-13 1994-07-27 Nissan Motor Co., Ltd. Dispositif semi-conducteur
US5229647A (en) * 1991-03-27 1993-07-20 Micron Technology, Inc. High density data storage using stacked wafers
US5591678A (en) * 1993-01-19 1997-01-07 He Holdings, Inc. Process of manufacturing a microelectric device using a removable support substrate and etch-stop
US5426072A (en) * 1993-01-21 1995-06-20 Hughes Aircraft Company Process of manufacturing a three dimensional integrated circuit from stacked SOI wafers using a temporary silicon substrate
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KR0156115B1 (ko) 1994-06-16 1998-12-01 문정환 반도체 소자의 격리막 구조 및 형성방법
DE4433845A1 (de) * 1994-09-22 1996-03-28 Fraunhofer Ges Forschung Verfahren zur Herstellung einer dreidimensionalen integrierten Schaltung
EP0746875B1 (fr) * 1994-12-23 2002-03-06 Koninklijke Philips Electronics N.V. Procede de fabrication de dispositifs a semiconducteur dote d'elements en semiconducteur formes dans une couche de materiau semiconducteur collee sur une tranche de support
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DE19918671B4 (de) * 1999-04-23 2006-03-02 Giesecke & Devrient Gmbh Vertikal integrierbare Schaltung und Verfahren zu ihrer Herstellung
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Also Published As

Publication number Publication date
AU4401700A (en) 2000-11-10
KR20020006040A (ko) 2002-01-18
US7144757B1 (en) 2006-12-05
JP2002543588A (ja) 2002-12-17
DE19918671A1 (de) 2000-11-02
KR100614362B1 (ko) 2006-09-11
DE19918671B4 (de) 2006-03-02
WO2000065648A1 (fr) 2000-11-02

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