EP1164208A3 - Electroplating method using combination of vibrational flow in plating bath and plating current of pulse - Google Patents
Electroplating method using combination of vibrational flow in plating bath and plating current of pulse Download PDFInfo
- Publication number
- EP1164208A3 EP1164208A3 EP01112689A EP01112689A EP1164208A3 EP 1164208 A3 EP1164208 A3 EP 1164208A3 EP 01112689 A EP01112689 A EP 01112689A EP 01112689 A EP01112689 A EP 01112689A EP 1164208 A3 EP1164208 A3 EP 1164208A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- plating
- value
- plating bath
- time
- electroplating method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/18—Electroplating using modulated, pulsed or reversing current
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F31/00—Mixers with shaking, oscillating, or vibrating mechanisms
- B01F31/44—Mixers with shaking, oscillating, or vibrating mechanisms with stirrers performing an oscillatory, vibratory or shaking movement
- B01F31/441—Mixers with shaking, oscillating, or vibrating mechanisms with stirrers performing an oscillatory, vibratory or shaking movement performing a rectilinear reciprocating movement
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/20—Electroplating using ultrasonics, vibrations
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
- C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000155046 | 2000-05-25 | ||
JP2000155046 | 2000-05-25 | ||
JP2000243249 | 2000-08-10 | ||
JP2000243249 | 2000-08-10 | ||
JP2001129994 | 2001-04-26 | ||
JP2001129994A JP2002121699A (ja) | 2000-05-25 | 2001-04-26 | めっき浴の振動流動とパルス状めっき電流との組み合わせを用いた電気めっき方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1164208A2 EP1164208A2 (en) | 2001-12-19 |
EP1164208A3 true EP1164208A3 (en) | 2003-10-08 |
Family
ID=27343513
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP01112689A Withdrawn EP1164208A3 (en) | 2000-05-25 | 2001-05-25 | Electroplating method using combination of vibrational flow in plating bath and plating current of pulse |
Country Status (9)
Country | Link |
---|---|
US (1) | US20010045360A1 (ko) |
EP (1) | EP1164208A3 (ko) |
JP (1) | JP2002121699A (ko) |
KR (1) | KR100461908B1 (ko) |
CN (1) | CN1335419A (ko) |
CA (1) | CA2349156A1 (ko) |
HK (1) | HK1041715A1 (ko) |
SG (1) | SG94828A1 (ko) |
TW (1) | TW526295B (ko) |
Families Citing this family (42)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20040019089A (ko) * | 2001-07-31 | 2004-03-04 | 세키스이가가쿠 고교가부시키가이샤 | 도전성 미립자의 제조 방법 |
JP3681670B2 (ja) * | 2001-09-25 | 2005-08-10 | シャープ株式会社 | 半導体集積回路の製造装置および製造方法 |
US6818115B2 (en) * | 2001-10-19 | 2004-11-16 | Viasystems Group, Inc. | System and method for electrolytic plating |
WO2003083181A2 (en) * | 2002-03-27 | 2003-10-09 | Isle Coat Limited | Process and device for forming ceramic coatings on metals and alloys, and coatings produced by this process |
GB2386907B (en) | 2002-03-27 | 2005-10-26 | Isle Coat Ltd | Process and device for forming ceramic coatings on metals and alloys, and coatings produced by this process |
JP3964263B2 (ja) * | 2002-05-17 | 2007-08-22 | 株式会社デンソー | ブラインドビアホール充填方法及び貫通電極形成方法 |
US7345868B2 (en) * | 2002-10-07 | 2008-03-18 | Presidio Components, Inc. | Multilayer ceramic capacitor with terminal formed by electroless plating |
US20050061660A1 (en) * | 2002-10-18 | 2005-03-24 | Kempen Hein Van | System and method for electrolytic plating |
US6884335B2 (en) * | 2003-05-20 | 2005-04-26 | Novellus Systems, Inc. | Electroplating using DC current interruption and variable rotation rate |
US7626179B2 (en) * | 2005-09-30 | 2009-12-01 | Virgin Island Microsystems, Inc. | Electron beam induced resonance |
US7586097B2 (en) | 2006-01-05 | 2009-09-08 | Virgin Islands Microsystems, Inc. | Switching micro-resonant structures using at least one director |
US7791290B2 (en) | 2005-09-30 | 2010-09-07 | Virgin Islands Microsystems, Inc. | Ultra-small resonating charged particle beam modulator |
JP2006131926A (ja) * | 2004-11-02 | 2006-05-25 | Sharp Corp | 微細孔に対するメッキ方法、及びこれを用いた金バンプ形成方法と半導体装置の製造方法、並びに半導体装置 |
JP4856896B2 (ja) * | 2005-06-02 | 2012-01-18 | 新光電気工業株式会社 | リードフレームのめっき方法およびリードフレーム |
US20070012576A1 (en) * | 2005-07-13 | 2007-01-18 | Rohm And Haas Electronic Materials Llc | Plating method |
JP4458057B2 (ja) * | 2005-07-28 | 2010-04-28 | Tdk株式会社 | めっき装置及びめっき方法 |
US7876793B2 (en) | 2006-04-26 | 2011-01-25 | Virgin Islands Microsystems, Inc. | Micro free electron laser (FEL) |
US7732786B2 (en) | 2006-05-05 | 2010-06-08 | Virgin Islands Microsystems, Inc. | Coupling energy in a plasmon wave to an electron beam |
US7986113B2 (en) | 2006-05-05 | 2011-07-26 | Virgin Islands Microsystems, Inc. | Selectable frequency light emitter |
US7728702B2 (en) | 2006-05-05 | 2010-06-01 | Virgin Islands Microsystems, Inc. | Shielding of integrated circuit package with high-permeability magnetic material |
US7728397B2 (en) | 2006-05-05 | 2010-06-01 | Virgin Islands Microsystems, Inc. | Coupled nano-resonating energy emitting structures |
US8188431B2 (en) | 2006-05-05 | 2012-05-29 | Jonathan Gorrell | Integration of vacuum microelectronic device with integrated circuit |
US7990336B2 (en) | 2007-06-19 | 2011-08-02 | Virgin Islands Microsystems, Inc. | Microwave coupled excitation of solid state resonant arrays |
CA2701557A1 (en) | 2008-09-01 | 2010-03-04 | Japan Techno Co., Ltd. | Method to produce a fluid hydrogen-oxygen mixture |
JP5504147B2 (ja) * | 2010-12-21 | 2014-05-28 | 株式会社荏原製作所 | 電気めっき方法 |
JP6113154B2 (ja) * | 2011-06-24 | 2017-04-12 | エーシーエム リサーチ (シャンハイ) インコーポレーテッド | 基板上に均一な金属膜を形成するための方法及び装置 |
US20130248374A1 (en) * | 2012-03-23 | 2013-09-26 | Apple Inc. | Chemical polishing of aluminum |
JP5980735B2 (ja) * | 2012-08-07 | 2016-08-31 | 株式会社荏原製作所 | スルーホールの電気めっき方法及び電気めっき装置 |
CN102899708B (zh) * | 2012-11-05 | 2015-02-25 | 无锡宏联电镀设备有限公司 | 电镀槽用阴极移动装置 |
CN104060304A (zh) * | 2014-06-13 | 2014-09-24 | 安徽省宁国天成电工有限公司 | 一种酸性镀锡电解液 |
JP6463622B2 (ja) * | 2014-11-27 | 2019-02-06 | Ykk株式会社 | めっき装置、めっきユニット、及びめっきライン |
JP6222145B2 (ja) * | 2015-03-11 | 2017-11-01 | トヨタ自動車株式会社 | 金属皮膜の成膜装置およびその成膜方法 |
CN105714331B (zh) * | 2016-05-11 | 2017-11-17 | 盐城云林环保工程有限公司 | 正弦波齿盘、磁筒双脉动式电解除杂槽 |
CN105862085B (zh) * | 2016-05-11 | 2017-09-19 | 吉首大学 | 磁盘搅拌脉冲、正弦波齿盘、磁筒三脉动式电解除杂槽 |
CN105908215B (zh) * | 2016-05-11 | 2017-11-07 | 吉首大学 | 超声波脉冲、正弦波齿盘双脉动式电解除杂槽 |
CN105862086B (zh) * | 2016-05-11 | 2017-09-22 | 吉首大学 | 磁盘脉冲、正弦波齿盘、磁筒三脉动式电解除杂槽 |
CA3049907C (en) | 2017-01-26 | 2023-02-28 | Curium Us Llc | Systems and methods for electroplating sources for alpha spectroscopy |
JP6329681B1 (ja) * | 2017-10-31 | 2018-05-23 | 株式会社荏原製作所 | めっき装置及びめっき方法 |
CN107952395A (zh) * | 2017-11-27 | 2018-04-24 | 新乡市永振机械设备有限公司 | 拌和振动器 |
TWI690620B (zh) * | 2018-08-22 | 2020-04-11 | 華紹國際有限公司 | 化學鍍裝置及金屬化基板的製造方法 |
CN109023494A (zh) * | 2018-10-12 | 2018-12-18 | 扬州市金杨电镀设备有限公司 | 振动式卧式滚镀装置 |
CN110359069B (zh) * | 2019-07-16 | 2021-01-29 | 吉林大学 | 一种液相多金属混合增材制造装置及方法 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4316786A (en) * | 1980-09-19 | 1982-02-23 | The United States Of America As Represented By The United States Department Of Energy | Apparatus for electroplating particles of small dimension |
GB2118973A (en) * | 1982-04-27 | 1983-11-09 | Corrintec Uk Ltd | Electrical connector and manufacture thereof |
JPH06330395A (ja) * | 1993-05-17 | 1994-11-29 | Nippon Techno Kk | クロムのバレルめっき方法と装置 |
EP0915182A1 (en) * | 1997-10-21 | 1999-05-12 | Nihon Techno Kabushiki Kaisha | Plating method |
JPH11274107A (ja) * | 1998-03-24 | 1999-10-08 | Japan Energy Corp | 銅めっき方法及び銅めっき液 |
WO1999054527A2 (en) * | 1998-04-21 | 1999-10-28 | Applied Materials, Inc. | Electro-chemical deposition system and method of electroplating on substrates |
WO2000020662A1 (en) * | 1998-10-05 | 2000-04-13 | Semitool, Inc. | Submicron metallization using electrochemical deposition |
JP2000129490A (ja) * | 1998-10-21 | 2000-05-09 | Ebara Corp | 電解めっき方法及び電解めっき装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62235714A (ja) * | 1986-04-07 | 1987-10-15 | Hitachi Ltd | 磁性合金薄膜の形成方法及びその装置 |
JPS63312996A (ja) * | 1987-06-15 | 1988-12-21 | Seiko Instr & Electronics Ltd | アモルファス合金の電着方法 |
US4720330A (en) * | 1987-07-06 | 1988-01-19 | The Dow Chemical Company | Device and method for electroplating a workpiece having axial symmetry |
JPH0230790A (ja) * | 1988-07-15 | 1990-02-01 | Seiko Instr Inc | 合金電着方法 |
DE4322378A1 (de) * | 1993-07-06 | 1995-01-12 | Hans Henig | Verfahren und Einrichtung zur Oberflächenbehandlung vornehmlich plattenförmiger Werkstücke in horizontaler Betriebslage |
US5684683A (en) * | 1996-02-09 | 1997-11-04 | Wisconsin Alumni Research Foundation | DC-to-DC power conversion with high current output |
US6126808A (en) * | 1998-03-23 | 2000-10-03 | Pioneer Metal Finishing | Method and apparatus for anodizing objects |
-
2001
- 2001-04-26 JP JP2001129994A patent/JP2002121699A/ja active Pending
- 2001-05-23 US US09/864,650 patent/US20010045360A1/en not_active Abandoned
- 2001-05-23 TW TW090112350A patent/TW526295B/zh not_active IP Right Cessation
- 2001-05-24 CA CA002349156A patent/CA2349156A1/en not_active Abandoned
- 2001-05-25 SG SG200103168A patent/SG94828A1/en unknown
- 2001-05-25 EP EP01112689A patent/EP1164208A3/en not_active Withdrawn
- 2001-05-25 CN CN01118269A patent/CN1335419A/zh active Pending
- 2001-05-25 KR KR10-2001-0030237A patent/KR100461908B1/ko not_active IP Right Cessation
-
2002
- 2002-05-06 HK HK02103418.6A patent/HK1041715A1/zh unknown
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4316786A (en) * | 1980-09-19 | 1982-02-23 | The United States Of America As Represented By The United States Department Of Energy | Apparatus for electroplating particles of small dimension |
GB2118973A (en) * | 1982-04-27 | 1983-11-09 | Corrintec Uk Ltd | Electrical connector and manufacture thereof |
JPH06330395A (ja) * | 1993-05-17 | 1994-11-29 | Nippon Techno Kk | クロムのバレルめっき方法と装置 |
EP0915182A1 (en) * | 1997-10-21 | 1999-05-12 | Nihon Techno Kabushiki Kaisha | Plating method |
JPH11274107A (ja) * | 1998-03-24 | 1999-10-08 | Japan Energy Corp | 銅めっき方法及び銅めっき液 |
WO1999054527A2 (en) * | 1998-04-21 | 1999-10-28 | Applied Materials, Inc. | Electro-chemical deposition system and method of electroplating on substrates |
WO2000020662A1 (en) * | 1998-10-05 | 2000-04-13 | Semitool, Inc. | Submicron metallization using electrochemical deposition |
JP2000129490A (ja) * | 1998-10-21 | 2000-05-09 | Ebara Corp | 電解めっき方法及び電解めっき装置 |
Non-Patent Citations (3)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 1995, no. 02 31 March 1995 (1995-03-31) * |
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 01 31 January 2000 (2000-01-31) * |
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 08 6 October 2000 (2000-10-06) * |
Also Published As
Publication number | Publication date |
---|---|
SG94828A1 (en) | 2003-03-18 |
US20010045360A1 (en) | 2001-11-29 |
EP1164208A2 (en) | 2001-12-19 |
CA2349156A1 (en) | 2001-11-25 |
CN1335419A (zh) | 2002-02-13 |
KR100461908B1 (ko) | 2004-12-14 |
TW526295B (en) | 2003-04-01 |
KR20010107788A (ko) | 2001-12-07 |
JP2002121699A (ja) | 2002-04-26 |
HK1041715A1 (zh) | 2002-07-19 |
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