SG94828A1 - Electroplating method using combination of vibrational flow in plating bath and plating current of pulse - Google Patents

Electroplating method using combination of vibrational flow in plating bath and plating current of pulse

Info

Publication number
SG94828A1
SG94828A1 SG200103168A SG200103168A SG94828A1 SG 94828 A1 SG94828 A1 SG 94828A1 SG 200103168 A SG200103168 A SG 200103168A SG 200103168 A SG200103168 A SG 200103168A SG 94828 A1 SG94828 A1 SG 94828A1
Authority
SG
Singapore
Prior art keywords
plating
pulse
combination
electroplating method
plating bath
Prior art date
Application number
SG200103168A
Inventor
Omasa Ryushin
Original Assignee
Japan Techno Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Techno Co Ltd filed Critical Japan Techno Co Ltd
Publication of SG94828A1 publication Critical patent/SG94828A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/20—Electroplating using ultrasonics, vibrations
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F31/00—Mixers with shaking, oscillating, or vibrating mechanisms
    • B01F31/44—Mixers with shaking, oscillating, or vibrating mechanisms with stirrers performing an oscillatory, vibratory or shaking movement
    • B01F31/441—Mixers with shaking, oscillating, or vibrating mechanisms with stirrers performing an oscillatory, vibratory or shaking movement performing a rectilinear reciprocating movement
SG200103168A 2000-05-25 2001-05-25 Electroplating method using combination of vibrational flow in plating bath and plating current of pulse SG94828A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000155046 2000-05-25
JP2000243249 2000-08-10
JP2001129994A JP2002121699A (en) 2000-05-25 2001-04-26 Electroplating method using combination of vibrating flow and impulsive plating current of plating bath

Publications (1)

Publication Number Publication Date
SG94828A1 true SG94828A1 (en) 2003-03-18

Family

ID=27343513

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200103168A SG94828A1 (en) 2000-05-25 2001-05-25 Electroplating method using combination of vibrational flow in plating bath and plating current of pulse

Country Status (9)

Country Link
US (1) US20010045360A1 (en)
EP (1) EP1164208A3 (en)
JP (1) JP2002121699A (en)
KR (1) KR100461908B1 (en)
CN (1) CN1335419A (en)
CA (1) CA2349156A1 (en)
HK (1) HK1041715A1 (en)
SG (1) SG94828A1 (en)
TW (1) TW526295B (en)

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JP3681670B2 (en) * 2001-09-25 2005-08-10 シャープ株式会社 Semiconductor integrated circuit manufacturing apparatus and manufacturing method
US6818115B2 (en) * 2001-10-19 2004-11-16 Viasystems Group, Inc. System and method for electrolytic plating
GB2386907B (en) 2002-03-27 2005-10-26 Isle Coat Ltd Process and device for forming ceramic coatings on metals and alloys, and coatings produced by this process
CN100503899C (en) * 2002-03-27 2009-06-24 岛屿涂层有限公司 Process for forming ceramic coatings on metals and alloys, and coatings produced by this process
JP3964263B2 (en) * 2002-05-17 2007-08-22 株式会社デンソー Blind via hole filling method and through electrode forming method
US7345868B2 (en) * 2002-10-07 2008-03-18 Presidio Components, Inc. Multilayer ceramic capacitor with terminal formed by electroless plating
US20050061660A1 (en) * 2002-10-18 2005-03-24 Kempen Hein Van System and method for electrolytic plating
US6884335B2 (en) * 2003-05-20 2005-04-26 Novellus Systems, Inc. Electroplating using DC current interruption and variable rotation rate
US7626179B2 (en) * 2005-09-30 2009-12-01 Virgin Island Microsystems, Inc. Electron beam induced resonance
US7791290B2 (en) 2005-09-30 2010-09-07 Virgin Islands Microsystems, Inc. Ultra-small resonating charged particle beam modulator
US7586097B2 (en) 2006-01-05 2009-09-08 Virgin Islands Microsystems, Inc. Switching micro-resonant structures using at least one director
JP2006131926A (en) * 2004-11-02 2006-05-25 Sharp Corp Plating method for micropore, method for forming gold bump using the same, method for producing semiconductor device, and semiconductor device
JP4856896B2 (en) * 2005-06-02 2012-01-18 新光電気工業株式会社 Lead frame plating method and lead frame
US20070012576A1 (en) * 2005-07-13 2007-01-18 Rohm And Haas Electronic Materials Llc Plating method
JP4458057B2 (en) * 2005-07-28 2010-04-28 Ｔｄｋ株式会社 Plating apparatus and plating method
US7876793B2 (en) 2006-04-26 2011-01-25 Virgin Islands Microsystems, Inc. Micro free electron laser (FEL)
US7728702B2 (en) 2006-05-05 2010-06-01 Virgin Islands Microsystems, Inc. Shielding of integrated circuit package with high-permeability magnetic material
US8188431B2 (en) 2006-05-05 2012-05-29 Jonathan Gorrell Integration of vacuum microelectronic device with integrated circuit
US7732786B2 (en) 2006-05-05 2010-06-08 Virgin Islands Microsystems, Inc. Coupling energy in a plasmon wave to an electron beam
US7728397B2 (en) 2006-05-05 2010-06-01 Virgin Islands Microsystems, Inc. Coupled nano-resonating energy emitting structures
US7986113B2 (en) 2006-05-05 2011-07-26 Virgin Islands Microsystems, Inc. Selectable frequency light emitter
US7990336B2 (en) 2007-06-19 2011-08-02 Virgin Islands Microsystems, Inc. Microwave coupled excitation of solid state resonant arrays
CN101815812A (en) 2008-09-01 2010-08-25 日本科技股份有限公司 Liquid material comprising hydrogen and oxygen, regasified gas comprising hydrogen and oxygen produced from the liquid material, process and apparatus for producing the liquid material and regasified gas, and fuel that does not evolve carbon dioxide
JP5504147B2 (en) * 2010-12-21 2014-05-28 株式会社荏原製作所 Electroplating method
US9666426B2 (en) * 2011-06-24 2017-05-30 Acm Research (Shanghai) Inc. Methods and apparatus for uniformly metallization on substrates
US20130248486A1 (en) * 2012-03-23 2013-09-26 Apple Inc. Electron beam polishing of aluminum
JP5980735B2 (en) * 2012-08-07 2016-08-31 株式会社荏原製作所 Through-hole electroplating method and electroplating apparatus
CN102899708B (en) * 2012-11-05 2015-02-25 无锡宏联电镀设备有限公司 Cathode moving device for electroplating bath
CN104060304A (en) * 2014-06-13 2014-09-24 安徽省宁国天成电工有限公司 Acid tinning electrolyte
JP6463622B2 (en) * 2014-11-27 2019-02-06 Ykk株式会社 Plating equipment, plating unit, and plating line
JP6222145B2 (en) * 2015-03-11 2017-11-01 トヨタ自動車株式会社 Metal film forming apparatus and film forming method
CN105862086B (en) * 2016-05-11 2017-09-22 吉首大学 Disk pulse, sine wave fluted disc, the pulsating of magnetic cylinder three electrolysis deblending slot
CN105908215B (en) * 2016-05-11 2017-11-07 吉首大学 The double pulsating electrolysis deblending slots of ultrasonic pulse, sine wave fluted disc
CN105714331B (en) * 2016-05-11 2017-11-17 盐城云林环保工程有限公司 The double pulsating electrolysis deblending slots of sine wave fluted disc, magnetic cylinder
CN105862085B (en) * 2016-05-11 2017-09-19 吉首大学 Disk stirring pulse, sine wave fluted disc, the pulsating of magnetic cylinder three electrolysis deblending slot
EP3574132A4 (en) 2017-01-26 2020-11-04 Curium US LLC Systems and methods for electroplating sources for alpha spectroscopy
JP6329681B1 (en) * 2017-10-31 2018-05-23 株式会社荏原製作所 Plating apparatus and plating method
CN107952395A (en) * 2017-11-27 2018-04-24 新乡市永振机械设备有限公司 Mix and stir vibrator
TWI690620B (en) * 2018-08-22 2020-04-11 華紹國際有限公司 Electroless plating device and manufacturing method of metallized substrate
CN109023494A (en) * 2018-10-12 2018-12-18 扬州市金杨电镀设备有限公司 The horizontal Tumble-plating device of oscillatory type
CN110359069B (en) * 2019-07-16 2021-01-29 吉林大学 Liquid-phase multi-metal mixed additive manufacturing device and method

Citations (5)

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JPS62235714A (en) * 1986-04-07 1987-10-15 Hitachi Ltd Formation of magnetic alloy thin film and device therefor
JPS63312996A (en) * 1987-06-15 1988-12-21 Seiko Instr & Electronics Ltd Method for electrodepositing amorphous alloy
JPH0230790A (en) * 1988-07-15 1990-02-01 Seiko Instr Inc Method for electrodepositing alloy
DE4322378A1 (en) * 1993-07-06 1995-01-12 Hans Henig Method and device for the surface treatment, in the horizontal operating position, of workpieces which are primarily in the form of boards
EP0950728A2 (en) * 1998-03-23 1999-10-20 Pioneer Metal Finishing Method and apparatus for anodizing objects

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US4316786A (en) * 1980-09-19 1982-02-23 The United States Of America As Represented By The United States Department Of Energy Apparatus for electroplating particles of small dimension
GB2118973A (en) * 1982-04-27 1983-11-09 Corrintec Uk Ltd Electrical connector and manufacture thereof
US4720330A (en) * 1987-07-06 1988-01-19 The Dow Chemical Company Device and method for electroplating a workpiece having axial symmetry
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US5684683A (en) * 1996-02-09 1997-11-04 Wisconsin Alumni Research Foundation DC-to-DC power conversion with high current output
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KR100616198B1 (en) * 1998-04-21 2006-08-25 어플라이드 머티어리얼스, 인코포레이티드 Electro-chemical deposition system and method of electroplating on substrates
JP3641372B2 (en) * 1998-10-21 2005-04-20 株式会社荏原製作所 Electrolytic plating method and electrolytic plating apparatus

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62235714A (en) * 1986-04-07 1987-10-15 Hitachi Ltd Formation of magnetic alloy thin film and device therefor
JPS63312996A (en) * 1987-06-15 1988-12-21 Seiko Instr & Electronics Ltd Method for electrodepositing amorphous alloy
JPH0230790A (en) * 1988-07-15 1990-02-01 Seiko Instr Inc Method for electrodepositing alloy
DE4322378A1 (en) * 1993-07-06 1995-01-12 Hans Henig Method and device for the surface treatment, in the horizontal operating position, of workpieces which are primarily in the form of boards
EP0950728A2 (en) * 1998-03-23 1999-10-20 Pioneer Metal Finishing Method and apparatus for anodizing objects

Also Published As

Publication number Publication date
TW526295B (en) 2003-04-01
KR20010107788A (en) 2001-12-07
KR100461908B1 (en) 2004-12-14
HK1041715A1 (en) 2002-07-19
JP2002121699A (en) 2002-04-26
CN1335419A (en) 2002-02-13
EP1164208A2 (en) 2001-12-19
US20010045360A1 (en) 2001-11-29
CA2349156A1 (en) 2001-11-25
EP1164208A3 (en) 2003-10-08

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