Classifications

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  • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
  • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
  • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
  • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
  • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
  • G06K19/07745—Mounting details of integrated circuit chips
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  • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
  • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
  • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
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Definitions

• the present invention relates to the manufacture of a r ⁇ icromodule intended to be inserted in a storage medium of the smart card type. It also relates to a method of manufacturing a storage medium of the chip card type with flush contacts.
• Chip cards are intended for carrying out various operations, such as, for example, banking operations, telephone communications or various identification operations.
• Contact cards include metallizations flush with the surface of the card, arranged at a precise location on the card body, defined by the usual standard ISO 7816. These metallizations are intended to come into contact with a read head of a reader for electrical data transmission.
• smart cards are thin portable objects whose dimensions are standardized.
• the usual ISO 7810 standard corresponds to a standard format card 85 mm long, 54 mm wide and 0.76 mm thick.
• a conventional method illustrated in FIG. 1, consists in gluing an integrated circuit chip 20 by placing its active face with its contact pads 22 upwards, and by gluing the opposite face on a dielectric support sheet 28.
• the dielectric sheet 28 is itself disposed on a contact grid 24 of a metallic plate of nickel-plated and gilded copper.
• Connection wells 21 are formed in the dielectric sheet 28 and connection wires 26 connect the contact pads 22 of the chip 20 to the contact pads of the grid 24 via its connection wells 21.
• a encapsulation resin 30, based on epoxy protects the chip 20 and the connection wires 26 welded.
• the module is then cut and then inserted into the cavity of a card body previously decorated.
• An object of the present invention is therefore to produce a smart card at a reduced price.
• Processes for manufacturing smart cards, without an intermediate step of making a micromodule, have already been studied to reduce the cost of the cards.
• a first solution described in patent applications FR2671416, FR2671417, and FR2671418, consists in inserting an integrated circuit chip directly into a card body. For this, the card holder is locally softened and the chip is pressed in the softened area. No cavity is therefore formed in the card body.
• a card obtained using this technology is shown schematically in plan view in FIG. 2. The chip 20 is arranged so that its contact pads 22 are flush with the surface of the card 10.
• the chip must also be perfectly positioned so that its contact pads 22 are arranged parallel to the lateral edges of the card and make it possible to produce the contact pads 25 parallel to the lateral edges of the card.
• the chip being placed in a locally softened area, it is not easy to position it correctly, and the chip cards whose contact pads are arranged slightly at an angle are intended for scrap.
• the application of the conductive tracks in the housing can be carried out in three different ways.
• a first way is to carry out hot stamping.
• a sheet comprising metallizations of copper, optionally covered with tin or nickel, and provided with a hot-activatable glue, is cut and then glued hot in the housing.
• a second way consists in applying, by means of a pad, a lacquer containing a palladium catalyst, at the places intended to be metallized, and in heating the lacquer; then metallizing, by depositing copper and / or nickel, using an electrochemical process of autocatalysis.
• a third way is to make a lithogravure from laser holograms.
• This lithography allows three-dimensional metallization deposits to be produced with very high precision and high resolution. All these methods of applying conductive tracks are however complex to implement and therefore expensive. They often require the use of specific tools.
• the contact pads and connections are made by depositing metallizations which still use copper and / or nickel, which are expensive elements, so that the cost price of the cards remains very high.
• the "Chrysalis" technology therefore calls for processes that are too complex and uses metal elements that are too expensive to be suitable for mass industrial production.
• the invention provides a method of manufacturing a storage medium of the chip card type with flush contacts, comprising a micromodule comprising a support film carrying contact pads, connection tracks and a chip. integrated circuit connected to the contact pads, characterized in that it comprises the following stages according to which:
• connection pads and connection tracks are produced by printing conductive ink on the support film, - the support film is deformed so that the connection tracks are at least partially at a lower level compared to the contact pads. contact.
• the advantage provided by the first step of the process is that it allows manufacturing in large quantities of contacts and connection tracks in a single step.
• the difference between the lower level and the contact pads is provided to be sufficient to accommodate the chip and to be able to cover it with a coating material.
• the connection tracks and the contacts are on the same face, the process thus avoids an additional step.
• the method also consists in carrying out the following steps: fixing and connecting the chip before deformation, then deforming the support film by pressing it in a card body recess with a punch comprising a housing.
• the method also consists in connecting the chip after deformation.
• the film is pressed and glued by a punch in a recess (or cavity) formed in advance in a card body.
• the chip is then connected, the film being fixed in the recess.
• the film is also placed in an impression of a mold, pressed against an internal wall and after the introduction of the material into the impression, the support film is deformed either by the pressure of the material against a punch having the complementary shape of a recess to be formed and / or either by the displacement of the punch.
• the invention also provides a method of manufacturing a micromodule at low cost without using expensive metallic elements such as copper, nickel or gold.
• the invention therefore also relates to a method of manufacturing a micromodule comprising an integrated circuit chip provided with contact pads which are electrically connected to contact pads, via conductive tracks, characterized in that '' it includes the following stages: production, on a strip of insulating material, of a printing of conductive ink for form a repeating pattern consisting of the contact pads and the conductive tracks, then, in an indifferent order:
• the conductive ink used to form the contacts has a very advantageous cost compared to copper, nickel or gold conventionally used to produce metallizations. This lower cost is due to the fact that the process is additive and not subtractive. In fact, the ink is only deposited where it is really needed. In conventional cases, on the contrary, we start from a solid strip and we remove all that is not necessary, which is penalizing for a pattern integrating "empty" zones constituting the spaces between the metallizations. In addition, the method according to the invention is rapid since it can be implemented continuously, using the concept of automatic tape transport (TAB) to size the substrate.
• TAB automatic tape transport
• Another object of the invention relates to a method of manufacturing a storage medium of the chip card type with flush contacts, comprising a micromodule produced in accordance with the method of manufacturing a micromodule according to the invention, characterized in that that it consists of:
• - provide a card body with a cavity having inclined walls, - transfer the micromodule into the cavity, by pressure bonding, so that the support substrate of the micromodule matches the shape of the cavity; in order to position the chip and the conductive tracks of the micromodule in the cavity and the contact pads flush with the surface of the card body,
• Another object of the invention relates to another embodiment of a method of manufacturing a storage medium of the chip card type with flush contacts, comprising an integrated circuit chip which is embedded in the card body. and which comprises contact pads connected, via conductive tracks, to contact pads, characterized in that:
• said conductive tracks and contact pads form a pattern, which is produced beforehand by printing conductive ink on an insulating strip in accordance with the process which is the first object of the invention, and which is cut to obtain an insulating substrate forming a support, and in that the method further comprises the following steps:
• a card body with a cavity having inclined walls transfer, into the cavity, the pre-cut substrate, by pressure bonding, so that it matches the shape of the cavity; so that the conductive tracks line the walls and the bottom of the cavity and the contact pads are flush with the surface of the card body,
• FIG. 1 already described, a diagram in cross section which illustrates a traditional method of manufacturing smart cards with contacts
• FIG. 4A a top view of a substrate supporting a pattern obtained by printing conductive ink
• FIGS. 4B and 4C respectively a top view and a sectional view of a micromodule according to the invention
• FIGS. 4D and 4E respectively a top view and a sectional view of another micromodule according to the invention.
• FIGS. 4F and 4G two top views of a substrate supporting a pattern obtained by printing conductive ink, on which a chip is respectively transferred, then connected by wire wiring,
• FIGS. 5A and 5B two sectional views of a smart card during its manufacture, in which a micromodule according to the invention is inserted
• FIGS. 6A and 6B two sectional views of another smart card during its manufacture.
• FIG. 3 shows schematically a strip 170 with patterns 130 intended to allow the production of micromodules continuously.
• This strip consists of an insulating material. It may include regular perforations 160, distributed along its longitudinal edges, on one of its sides or on its two sides. These perforations 160 are used for driving the strip by a toothed wheel system for automatically transporting strips.
• TAB automatic transport
• the strip can also be transported using a roller conveyor system, replacing the perforations with sights, printed at the same time as the pattern, and whose role is to allow indexing by an optical device.
• the micromodule manufacturing method according to the invention consists firstly in producing, on this strip 170, a repeating pattern 130 by printing conductive ink.
• This repetitive pattern 130 consists on the one hand of contact pads 131 of a connection terminal block and on the other hand of conductive tracks 132 capable of establishing an electrical connection between the contact pads of an integrated circuit chip and the contact pads 131.
• the insulating strip 170 therefore makes it possible to manufacture micromodules continuously, from the pattern 130, printed repeatedly on this strip, and from integrated circuit chips which are transferred and connected to each copy of the pattern.
• the strip 170 therefore forms the main support of integrated circuit chips, which constitute the heart of micromodules.
• the patterns can be printed on a sheet.
• the patterns can also be printed on a discontinuous strip.
• a drop of resin is arranged so as to coat the chip and the connection connections with the chip, then the drop is optionally leveled to a predetermined height, and finally the micromodules are separated from the rest of the strip.
• the manufacture of the micromodules is not limited to this order of sequence of steps. We can indeed very well cut each printed pattern 130, in order to separate it from the rest of the strip 170, even before carrying out the transfer of the integrated circuit chip.
• An insulating substrate 150 is then obtained, as illustrated in top view in FIG. 4A. This substrate 150 forms the support for a previously printed connection terminal block, constituted by contact pads 131, and connected to conductive interconnection tracks 132.
• the interconnection tracks 132 are provided so as to be able to connect each pad of contact of the integrated circuit chip with the contact pad 131 associated therewith.
• the printing of conductive ink to form the contact pads 131 and the conductive tracks 132 can be carried out according to different techniques.
• the printing of conductive ink is obtained by a technique of pad printing.
• an ink pad allows to transfer the conductive ink, according to the desired pattern, on the surface of the insulating strip 170.
• This technique can be implemented either with a pad moving vertically towards the card, or with a pad with rotary movement.
• the printing of conductive ink is obtained by an offset printing technique using an inkwell, a polymer or metallic plate comprising the pattern to be printed hollow or in relief and a blanket-type roller for transfer. ink on the card.
• a third embodiment, for the printing of conductive ink consists in using an ink jet printing technique.
• the inkjet printing technique can be carried out in two different and well-known ways: either by deviated continuous inkjet, or by a so-called drop-on-demand method.
• the printing of conductive ink is obtained by screen printing.
• the conductive ink can be constituted by a solvent ink, comprising a polymer resin dissolved in a solvent with conductive fillers (metal particles), which hardens by evaporation of the solvent.
• the ink can also be a one-component or two-component thermosetting ink, an UV polymerization ink, a solder paste type compound or a metal alloy.
• the chip it can be transferred either directly to the strip 170, or to the precut substrate 150, according to three different types of arrangement.
• a first method consists in transferring the chip according to a “flip chip” type of assembly.
• This type of assembly is already well known and is shown in the diagrams in top view and in section of FIGS. 4B and 4C.
• FIG. 4C as well as in the other sectional views of FIGS. 4E, 5A, 5B, 6A and 6B described in the following, the contact pads 131 of the connection terminal block and the conductive tracks 132 are represented by a single line thick black to facilitate understanding. However, since they are obtained by printing conductive ink, their thickness is in reality negligible.
• the chip 200 is transferred by turning it over, the active face comprising the contact pads 220 oriented towards the substrate 150. It is then connected by applying its contact pads 220 to the conductive tracks 132 previously printed, without the use of wires conductors. In this case the interconnection tracks 132 must be printed with precision and they are brought to the exact location of the contact pads 220 of the integrated circuit chip 200.
• the chip 200 is connected to the conductive tracks 132 by means of an adhesive 350 with anisotropic electrical conduction well known and often used for mounting passive components on the surface.
• This adhesive 350 actually contains elastic conductive particles that can be deformed, which make it possible to establish electrical conduction along the z axis (that is to say along the thickness) when they are pressed between the pads contact 220 and the conductive tracks 132, while ensuring insulation in the other directions
• the electrical connection can be established by means of protuberances formed by a conductive adhesive, previously deposited on the contact pads 220 of the chip and reactivated hot when the chip is transferred.
• Another way of establishing the electrical connection between the chip and the conductive tracks consists in making, on the contact pads of the chip, bosses in conductive material intended to improve the electrical contact, then in applying the chip to the pattern beforehand. printed, before the conductive ink used for printing the pattern has completely polymerized. The fixing and the connection of the chip are then carried out simultaneously, during the polymerization of the conductive ink of the printed pattern. Finally, in the case where the conductive tracks 132 are produced by printing a metal alloy, it is conceivable to fix and connect the chip in a single welding step. For this, metal alloy bosses with a low melting point are produced on the contact pads of the chip and are remelted when the chip is transferred in order to weld them to the conductive tracks.
• FIGS. 4D and 4E respectively show a top view and a sectional view of the substrate 150 previously printed and cut on which the chip 200 is transferred.
• the interconnection tracks 132 are brought close to the location provided for the chip 200.
• the chip 200 is bonded by the face opposite to the active face, using an insulating adhesive 500.
• the adhesive used may for example be a crosslinking adhesive under the effect of exposure to ultraviolet radiation.
• the rate of this bonding operation can be particularly high, since it is possible, for example, to bond five to six thousand chips per hour.
• the electrical connections are made between the contact pads 220 of the chip 200 and the conductive tracks 132. These connections are made by dispensing a conductive resin 400 on the contact pads 220 of the chip and on the connection tracks 132.
• the conductive resin 400 may for example be a polymerizable adhesive loaded with conductive particles such as silver particles.
• This second connection step can be carried out at the same high rate as the bonding step of the chip. In addition, these two bonding and connection steps can be carried out using the same equipment.
• FIGS. 4D and 4E which have just been described show a configuration for which each contact pad is located opposite a pad of the chip which is associated with it.
• the chip is mounted according to a third method consisting of conventional wired cabling, it will be necessary to use an interdigital pattern as shown diagrammatically in FIGS. 4F and 4G and as described in patent application EP-A-0 753 827.
• This interdigitated reason thus makes it possible to bring the conductive tracks 132 of each contact pad 131 associated with a contact pad 220 of the chip 200 near this pad, and thus avoid entanglement of the connection wires 260.
• FIG. 4F represents more particularly the interdigitated pattern on which a chip 200 is carried over.
• FIG. 4G also represents the wire connections 260 between the pattern and the contact pads of the chip.
• the chip 200 is then coated in a resin 351.
• This resin 351 makes it possible to protect the chip against mechanical and climatic attacks.
• the use of this resin is completely optional (see Figures 4C and 4E).
• FIGS. 5A and 5B represent the steps of a method of manufacturing a storage medium of the chip card type with flush contacts according to a first embodiment.
• This embodiment consists in transferring, in the cavity 120 of a card body 100, the micromodule 180 previously produced on the insulating substrate 150 precut.
• the card body 100 is produced according to a conventional method, for example by injecting plastic material into a mold.
• the cavity 120 is obtained either by milling the card body, or at the time of manufacture by injection of the card body, which is more economical.
• the micromodule substrate 180 is transferred into the cavity 120 of the card body so that the support substrate 150 follows the shape of the cavity.
• the substrate 150 separated from the rest of the insulating strip 170, is made of a material flexible enough to be easily deformable during the insertion of the micromodule.
• This flexible material can furthermore be very inexpensive. It can be chosen from the materials in the following list given by way of non-exhaustive example: polyvinyl chloride (PVC), acrylonitrile butadiene styrene (ABS), polystyrene (PS), polyethylene terephthalate (PET), polyethylene (PE), polycarbonate (PC), polypropylene (PP), paper or cellulose derivative.
• PVC polyvinyl chloride
• ABS acrylonitrile butadiene styrene
• PS polystyrene
• PET polyethylene terephthalate
• PE polyethylene
• PC polycarbonate
• PP polypropylene
• the micromodule 180 has a sufficiently shallow depth, preferably between 100 and 600 ⁇ m, for example of the order of 300 ⁇ m.
• the cavity 120 must not have walls close to the vertical but only walls inclined at an angle of inclination preferably between 5 and 30 °.
• the cavity 120 is circular. It has a first horizontal plane defined inside a first circle 121 and forming the bottom of the cavity, located at a depth between 100 and 600 ⁇ m.
• a second inclined plane is defined inside a second circle 122 concentric to the first, and of larger diameter, and forms the walls of the cavity 120.
• a third horizontal plane is also defined inside a third circle 123 concentric with the first two and of even greater diameter. This third plane is produced over a depth equal to the thickness of the substrate 150, so that the contact pads 131 previously printed on the substrate 150 are flush with the surface of the card body 100. The depth of this third plane is therefore preferably between 50 and 100 ⁇ m.
• the shape of the cavity is not limited to a circle, it can just as easily be rectangular, lozenge, octagonal or any other form.
• the bottom of the cavity is intended to receive the portion of the micromodule 180 comprising the integrated circuit chip 200 coated in a protective resin 351 as well as the conductive tracks 132.
• the substrate 150 of the micromodule 180 is bonded into the cavity 120 using a tool 500, such as a press for example, whose shape is adapted to that of the cavity.
• the substrate which is sufficiently flexible, is therefore pressed by means of this tool 500, to adopt the shape of the cavity 120.
• the tool 500 comprises a housing 510 formed to the dimensions of the chip 200. In this way, the chip does not undergo the pressure stresses suffered by the substrate 150.
• the bonding of the substrate 150 to the bottom of the cavity 120 can be done using an adhesive which can be activated hot or cold.
• This adhesive can either be dispensed in the cavity 120 during the transfer of the micromodule 180, or coated on the insulating substrate 150 before the manufacture of the micromodule and then activated hot at the time of the transfer of the micromodule, or else deposited on the insulating substrate 150 just before the micromodule insertion phase.
• the material of the insulating substrate 150 can also be chosen so that it makes it possible to obtain excellent adhesion to the material constituting the card 100, without any adhesive, but by a simple hot pressing or by welding. ultrasonic or high frequency.
• the micromodule can also be thermoformed before or after the cutting operation. The transfer and paste operation is then made easier.
• the final step of the chip card manufacturing process consists in depositing a drop of resin 300 in the cavity 120 in order to protect the micromodule 180 and the conductive tracks 132 from climatic and mechanical constraints. This encapsulation resin is deposited so as to be flush with the surface of the card body 100. It must also be identical or compatible with the coating resin 351 of the chip of micromodule 180.
• FIGS. 6A and 6B represent the steps of the method of manufacturing a storage medium of the chip card type with flush contacts according to another embodiment.
• the micromodule is not entirely produced before it is inserted.
• the substrate 150 with a pre-printed pattern is separated from the rest of the strip 170 with patterns before the chip is transferred.
• the substrate 150 is deposited in the cavity 120 of the card body 100 by means of a tool 500, such as a press, the shape of which is adapted to that of the cavity 120.
• a tool 500 such as a press, the shape of which is adapted to that of the cavity 120.
• the press 500 it is not necessary for the press 500 to have a housing for protecting the chip.
• the pressure applied to the substrate 150 is therefore uniform over its entire surface.
• the method of bonding the substrate in the cavity 120 is identical to that which has been previously described.
• the substrate 150 is transferred into the cavity so that the contact pads 131 are flush with the surface of the card body 100 and that the conductive tracks 132, connected to the contact pads, line the walls and the bottom of the cavity 120.
• the chip 200 is then transferred to the bottom of the cavity and connected to the conductive tracks 132. It can be mounted according to the three types of assembly previously described with reference to FIGS. 4B to 4G.
• the final step of the chip card manufacturing process consists in depositing a drop of resin 300 in the cavity 120 in order to protect the chip 200 and its connections to the conductive tracks 132 from climatic and mechanical constraints.
• This encapsulation resin 300 is deposited so as to be flush with the surface of the card body 100. It must also be compatible with the adhesives used during the transfer of the chip.
• the micromodule 180 or the insulating substrate 150 supporting the pre-printed pattern without the chip, is inserted into the body of the storage medium during the injection of the latter.
• the substrate 150 is separated from the rest of the strip 170 and cut to the final dimensions of the micromodule.
• This substrate, with or without a deferred chip, is then clamped in the injection mold, in order to maintain it in position during the injection of the material constituting the card body, and to obtain a seal so that the injected material does not does not pass between the module and the mold and does not cover the preprinted connection areas.
• This clamping can be performed by suction or by an electrostatic process.
• the material constituting the card body is then injected.
• the substrate takes the form of the mold under the pressure of the injected material.
• the material is first injected, then the substrate is deformed by placing the core to the dimensions of the cavity just after the injection.
• a card is obtained provided with a module formed in the reliefs of the desired cavity with flush electrical contacts.
• the substrate 150 of the micromodule 180 may also include perforations made in its thickness. These perforations allow the encapsulation resin 300 to be in direct contact with the material of the card body, and thus to constitute an anchoring point of the module in the cavity 120. In addition, they make it possible to evacuate any air bubbles that can be trapped between the card body cavity and the substrate.

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• 1998
  • 1998-05-27 FR FR9806683A patent/FR2779272B1/fr not_active Expired - Fee Related
• 1999
  • 1999-05-12 AU AU36116/99A patent/AU3611699A/en not_active Abandoned
  • 1999-05-12 EP EP99918061A patent/EP1086492A1/de not_active Withdrawn
  • 1999-05-12 WO PCT/FR1999/001142 patent/WO1999062118A1/fr not_active Application Discontinuation
  • 1999-05-12 CN CN99806708A patent/CN1303521A/zh active Pending

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