FR2817656B1 - Isolation electrique de microcircuits regroupes avant collage unitaire - Google Patents

Isolation electrique de microcircuits regroupes avant collage unitaire

Info

Publication number
FR2817656B1
FR2817656B1 FR0015941A FR0015941A FR2817656B1 FR 2817656 B1 FR2817656 B1 FR 2817656B1 FR 0015941 A FR0015941 A FR 0015941A FR 0015941 A FR0015941 A FR 0015941A FR 2817656 B1 FR2817656 B1 FR 2817656B1
Authority
FR
France
Prior art keywords
microcircuits
grouped
electrical insulation
before unit
unit bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0015941A
Other languages
English (en)
Other versions
FR2817656A1 (fr
Inventor
Philippe Patrice
Jean Christophe Fidalgo
Olivier Brunet
Yves Pierre Cuenot
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gemplus SA
Original Assignee
Gemplus Card International SA
Gemplus SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemplus Card International SA, Gemplus SA filed Critical Gemplus Card International SA
Priority to FR0015941A priority Critical patent/FR2817656B1/fr
Priority to PCT/FR2001/003846 priority patent/WO2002047151A2/fr
Priority to AU2002216182A priority patent/AU2002216182A1/en
Priority to PCT/FR2001/003834 priority patent/WO2002047161A2/fr
Priority to AU2002216172A priority patent/AU2002216172A1/en
Publication of FR2817656A1 publication Critical patent/FR2817656A1/fr
Application granted granted Critical
Publication of FR2817656B1 publication Critical patent/FR2817656B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01073—Tantalum [Ta]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01087—Francium [Fr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19042—Component type being an inductor

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Dicing (AREA)
  • Die Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
FR0015941A 2000-12-05 2000-12-05 Isolation electrique de microcircuits regroupes avant collage unitaire Expired - Fee Related FR2817656B1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FR0015941A FR2817656B1 (fr) 2000-12-05 2000-12-05 Isolation electrique de microcircuits regroupes avant collage unitaire
PCT/FR2001/003846 WO2002047151A2 (fr) 2000-12-05 2001-12-05 Method de fabrication d'une puce semi-conductrice a l'aide d'une couche de rigidite integree
AU2002216182A AU2002216182A1 (en) 2000-12-05 2001-12-05 Method for making a semiconductor chip using an integrated rigidity layer
PCT/FR2001/003834 WO2002047161A2 (fr) 2000-12-05 2001-12-05 Barriere anti debordement de colle fixation d'une puce semi-conductrice
AU2002216172A AU2002216172A1 (en) 2000-12-05 2001-12-05 Barrier against overflow for fixing adhesive of a semiconductor chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0015941A FR2817656B1 (fr) 2000-12-05 2000-12-05 Isolation electrique de microcircuits regroupes avant collage unitaire

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FR2817656A1 FR2817656A1 (fr) 2002-06-07
FR2817656B1 true FR2817656B1 (fr) 2003-09-26

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Publication number Priority date Publication date Assignee Title
FR2845805B1 (fr) * 2002-10-10 2005-06-03 Gemplus Card Int Adhesif d'encartage formant navette
DE102006010523B3 (de) 2006-02-20 2007-08-02 Siemens Ag Verfahren zur Herstellung von planaren Isolierschichten mit positionsgerechten Durchbrüchen mittels Laserschneiden und entsprechend hergestellte Vorrichtungen
JP4303282B2 (ja) * 2006-12-22 2009-07-29 Ｔｄｋ株式会社 プリント配線板の配線構造及びその形成方法
EP2357875A1 (fr) * 2010-02-16 2011-08-17 Gemalto SA Procédé pour fabriquer un boîtier électronique

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Publication number Priority date Publication date Assignee Title
JPS535970A (en) * 1976-07-07 1978-01-19 Toshiba Corp Semiconductor device
JPS53120271A (en) * 1977-03-29 1978-10-20 Mitsubishi Electric Corp Semiconductor device
JPS5760844A (en) * 1980-09-30 1982-04-13 Nec Corp Semiconductor device
US5144407A (en) * 1989-07-03 1992-09-01 General Electric Company Semiconductor chip protection layer and protected chip
JP3212110B2 (ja) * 1991-07-15 2001-09-25 沖電気工業株式会社 半導体素子の製造方法
JP3128878B2 (ja) * 1991-08-23 2001-01-29 ソニー株式会社 半導体装置
FR2735284B1 (fr) * 1995-06-12 1997-08-29 Solaic Sa Puce pour carte electronique revetue d'une couche de matiere isolante et carte electronique comportant une telle puce
FR2779272B1 (fr) * 1998-05-27 2001-10-12 Gemplus Card Int Procede de fabrication d'un micromodule et d'un support de memorisation comportant un tel micromodule
FR2779851B1 (fr) * 1998-06-12 2002-11-29 Gemplus Card Int Procede de fabrication d'une carte a circuit integre et carte obtenue
DE19845296A1 (de) * 1998-09-03 2000-03-16 Fraunhofer Ges Forschung Verfahren zur Kontaktierung eines Schaltungschips
FR2791471B1 (fr) * 1999-03-22 2002-01-25 Gemplus Card Int Procede de fabrication de puces de circuits integres
FR2806189B1 (fr) * 2000-03-10 2002-05-31 Schlumberger Systems & Service Circuit integre renforce et procede de renforcement de circuits integres

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Publication number Publication date
WO2002047161A2 (fr) 2002-06-13
WO2002047151B1 (fr) 2004-02-26
WO2002047151A2 (fr) 2002-06-13
FR2817656A1 (fr) 2002-06-07
AU2002216182A1 (en) 2002-06-18
WO2002047151A3 (fr) 2003-02-13
WO2002047161A3 (fr) 2003-04-24
AU2002216172A1 (en) 2002-06-18

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