FR2817656B1 - Isolation electrique de microcircuits regroupes avant collage unitaire - Google Patents
Isolation electrique de microcircuits regroupes avant collage unitaireInfo
- Publication number
- FR2817656B1 FR2817656B1 FR0015941A FR0015941A FR2817656B1 FR 2817656 B1 FR2817656 B1 FR 2817656B1 FR 0015941 A FR0015941 A FR 0015941A FR 0015941 A FR0015941 A FR 0015941A FR 2817656 B1 FR2817656 B1 FR 2817656B1
- Authority
- FR
- France
- Prior art keywords
- microcircuits
- grouped
- electrical insulation
- before unit
- unit bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
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- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19042—Component type being an inductor
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Dicing (AREA)
- Die Bonding (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0015941A FR2817656B1 (fr) | 2000-12-05 | 2000-12-05 | Isolation electrique de microcircuits regroupes avant collage unitaire |
PCT/FR2001/003846 WO2002047151A2 (fr) | 2000-12-05 | 2001-12-05 | Method de fabrication d'une puce semi-conductrice a l'aide d'une couche de rigidite integree |
AU2002216182A AU2002216182A1 (en) | 2000-12-05 | 2001-12-05 | Method for making a semiconductor chip using an integrated rigidity layer |
PCT/FR2001/003834 WO2002047161A2 (fr) | 2000-12-05 | 2001-12-05 | Barriere anti debordement de colle fixation d'une puce semi-conductrice |
AU2002216172A AU2002216172A1 (en) | 2000-12-05 | 2001-12-05 | Barrier against overflow for fixing adhesive of a semiconductor chip |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0015941A FR2817656B1 (fr) | 2000-12-05 | 2000-12-05 | Isolation electrique de microcircuits regroupes avant collage unitaire |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2817656A1 FR2817656A1 (fr) | 2002-06-07 |
FR2817656B1 true FR2817656B1 (fr) | 2003-09-26 |
Family
ID=8857387
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0015941A Expired - Fee Related FR2817656B1 (fr) | 2000-12-05 | 2000-12-05 | Isolation electrique de microcircuits regroupes avant collage unitaire |
Country Status (3)
Country | Link |
---|---|
AU (2) | AU2002216182A1 (fr) |
FR (1) | FR2817656B1 (fr) |
WO (2) | WO2002047161A2 (fr) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2845805B1 (fr) * | 2002-10-10 | 2005-06-03 | Gemplus Card Int | Adhesif d'encartage formant navette |
DE102006010523B3 (de) | 2006-02-20 | 2007-08-02 | Siemens Ag | Verfahren zur Herstellung von planaren Isolierschichten mit positionsgerechten Durchbrüchen mittels Laserschneiden und entsprechend hergestellte Vorrichtungen |
JP4303282B2 (ja) * | 2006-12-22 | 2009-07-29 | Tdk株式会社 | プリント配線板の配線構造及びその形成方法 |
EP2357875A1 (fr) * | 2010-02-16 | 2011-08-17 | Gemalto SA | Procédé pour fabriquer un boîtier électronique |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS535970A (en) * | 1976-07-07 | 1978-01-19 | Toshiba Corp | Semiconductor device |
JPS53120271A (en) * | 1977-03-29 | 1978-10-20 | Mitsubishi Electric Corp | Semiconductor device |
JPS5760844A (en) * | 1980-09-30 | 1982-04-13 | Nec Corp | Semiconductor device |
US5144407A (en) * | 1989-07-03 | 1992-09-01 | General Electric Company | Semiconductor chip protection layer and protected chip |
JP3212110B2 (ja) * | 1991-07-15 | 2001-09-25 | 沖電気工業株式会社 | 半導体素子の製造方法 |
JP3128878B2 (ja) * | 1991-08-23 | 2001-01-29 | ソニー株式会社 | 半導体装置 |
FR2735284B1 (fr) * | 1995-06-12 | 1997-08-29 | Solaic Sa | Puce pour carte electronique revetue d'une couche de matiere isolante et carte electronique comportant une telle puce |
FR2779272B1 (fr) * | 1998-05-27 | 2001-10-12 | Gemplus Card Int | Procede de fabrication d'un micromodule et d'un support de memorisation comportant un tel micromodule |
FR2779851B1 (fr) * | 1998-06-12 | 2002-11-29 | Gemplus Card Int | Procede de fabrication d'une carte a circuit integre et carte obtenue |
DE19845296A1 (de) * | 1998-09-03 | 2000-03-16 | Fraunhofer Ges Forschung | Verfahren zur Kontaktierung eines Schaltungschips |
FR2791471B1 (fr) * | 1999-03-22 | 2002-01-25 | Gemplus Card Int | Procede de fabrication de puces de circuits integres |
FR2806189B1 (fr) * | 2000-03-10 | 2002-05-31 | Schlumberger Systems & Service | Circuit integre renforce et procede de renforcement de circuits integres |
-
2000
- 2000-12-05 FR FR0015941A patent/FR2817656B1/fr not_active Expired - Fee Related
-
2001
- 2001-12-05 WO PCT/FR2001/003834 patent/WO2002047161A2/fr not_active Application Discontinuation
- 2001-12-05 WO PCT/FR2001/003846 patent/WO2002047151A2/fr not_active Application Discontinuation
- 2001-12-05 AU AU2002216182A patent/AU2002216182A1/en not_active Abandoned
- 2001-12-05 AU AU2002216172A patent/AU2002216172A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
WO2002047161A2 (fr) | 2002-06-13 |
WO2002047151B1 (fr) | 2004-02-26 |
WO2002047151A2 (fr) | 2002-06-13 |
FR2817656A1 (fr) | 2002-06-07 |
AU2002216182A1 (en) | 2002-06-18 |
WO2002047151A3 (fr) | 2003-02-13 |
WO2002047161A3 (fr) | 2003-04-24 |
AU2002216172A1 (en) | 2002-06-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20090831 |