EP0644558A1 - Kabelisolierstruktur - Google Patents
Kabelisolierstruktur Download PDFInfo
- Publication number
- EP0644558A1 EP0644558A1 EP94402087A EP94402087A EP0644558A1 EP 0644558 A1 EP0644558 A1 EP 0644558A1 EP 94402087 A EP94402087 A EP 94402087A EP 94402087 A EP94402087 A EP 94402087A EP 0644558 A1 EP0644558 A1 EP 0644558A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- matrix
- une
- structure according
- semiconductor layer
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B9/00—Power cables
- H01B9/02—Power cables with screens or conductive layers, e.g. for avoiding large potential gradients
- H01B9/027—Power cables with screens or conductive layers, e.g. for avoiding large potential gradients composed of semi-conducting layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B9/00—Power cables
- H01B9/02—Power cables with screens or conductive layers, e.g. for avoiding large potential gradients
Definitions
- the present invention relates to an isolation structure for medium, high and very high voltage cables carrying direct or alternating current.
- These cables generally consist of a conductive core surrounded by an isolation structure which is coaxial with it.
- This structure comprises at least a first semiconductor layer placed in contact with the core of the cable, itself surrounded by a second electrically insulating layer, in turn covered by a third semiconductor layer.
- Other outer layers are used to protect the cable.
- the insulating layer is usually based on high density or low density polyethylene, crosslinked polyethylene, or alternatively ethylenepropylene-diene terpolymer with methylene main chain (EPDM).
- EPDM ethylenepropylene-diene terpolymer with methylene main chain
- the semiconductor layers are generally composed of a polar matrix, most often a copolymer of ethylene and alkyl acrylate, which is loaded with carbon black.
- the amount of filler varies according to the nature of the carbon black used. For an acetylene black or an oven black, the proportion of filler is generally between 28% and 40%.
- the dielectric strength of such a cable is very much linked to the quality of the interface between the semiconductor layer and the insulating layer.
- the slightest roughness at this interface can cause a strengthening of the electric field and lead to breakdown and perforation of the insulating layer.
- the matrix of semiconductor layers of high-voltage cables currently on the market is generally based on a polymer with a high melt index or "melt index" of around of 17 (A high "melt index” is the sign of the presence of low molar masses, it is measured according to ASTM standards reference D1238 or NFT 51-016), and having a very wide distribution in molar masses.
- a high "melt index” is the sign of the presence of low molar masses, it is measured according to ASTM standards reference D1238 or NFT 51-016), and having a very wide distribution in molar masses.
- Nonpolar matrices based on an ethylene copolymer (EPR: thermoplastic ethylene-propylene elastomer, or EPDM: ethylene-propylene-diene terpolymer with methylene main chain), to which they add oils or plasticizers to facilitate obtaining a good surface condition of the semiconductor layer.
- EPR thermoplastic ethylene-propylene elastomer
- EPDM ethylene-propylene-diene terpolymer with methylene main chain
- the object of the present invention is to provide an insulation structure for medium, high and very high voltage cables carrying direct or alternating current, having dielectric characteristics more stable over time than those known up to now.
- the object of the present invention is an insulation structure for a cable comprising at least a first semiconductor layer contiguous and coaxial with the core of the cable, surrounded by a second electrically insulating layer, itself covered by a third semiconductor layer.
- the semiconductor layers are composed exclusively of a matrix comprising apolar polymers whose components have a molar mass greater than 1000 and of a conductive filler.
- the components of the matrix have a molecular weight greater than 5000.
- the semiconductor layers contain low molecular weight compounds or additives, such as oils or plasticizers, these compounds migrate into the insulating layer. This phenomenon results in the formation of space charges which will cause an electrical field reinforcement and may subsequently lead to breakdowns.
- This field reinforcement is linked to the quantity of charges formed but also to their mobility: a quantity of uniformly distributed charges not giving as strong a field reinforcement as the same quantity of localized charges. This migration can occur during installation or during cable operation.
- composition according to the invention comprising only compounds of high molar mass, prevents the migration of species in the insulating layer and thereby the accumulation of space charges nearby interfaces.
- the matrix is chosen from polyethylene, polypropylene, polystyrene, and their copolymers, the polymer alloys chosen from polyethylene, polypropylene, polystyrene, and their copolymers, and mixtures of the selected compounds. among polyethylene, polypropylene, polystyrene, their copolymers, and the alloys mentioned above.
- the matrix is chosen from polyolefinic thermoplastic elastomers and their mixtures.
- the matrix will depend on the quality of its interface with the insulating layer and the mechanical properties of the semiconductor layer obtained, without requiring the use of additives.
- the present invention has the advantage of stabilizing the dielectric characteristics of the insulation structure by suppressing the migration of low molecular weight compounds. As a result, the quality of the interface between the different layers becomes a less critical parameter.
- the filler is a carbon black containing as few impurities as possible.
- the matrix also contains a crosslinking agent. After the material has been shaped by extrusion, it can be crosslinked in order to improve its thermomechanical properties. These properties are particularly critical for cables carrying alternating current.
- the pressure wave test is carried out using the installation shown in FIG. 1. This test makes it possible to evaluate the strengthening of the electric field in an isolation structure.
- the installation shown in Figure 1 consists of a laser 10 "YAg” whose beam is sent to a target 11 corresponding to the sample 1 of which each semiconductor constitutes an electrode (+) and (-).
- This beam absorbed at the surface of electrode 2 (-) decomposes this surface by pyrolysis, and the gases emitted cause a pressure wave which crosses the sample. This wave modulates the image charges on the electrodes and gives access to the volume charge density in the sample.
- a photodiode 12 makes it possible to synchronize a detector 13 with the laser 10.
- the circuit is electrically supplied by a high voltage supply 14 provided with a resistor 15.
- the recorded data are transferred to be processed by a computer 16 and represented as a function of time over a graphic recorder 17.
- the laser 10 sends a wave to the target 11 causing the appearance of space charges and the modification of the distribution of the electric field which is then measured by the detector 13.
- Example 4 A sample similar to that described in Example 4 is prepared but by adding to the matrix of the semiconductor layers, a paraffinic oil in an amount of 5% by weight relative to the matrix.
Landscapes
- Organic Insulating Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Conductive Materials (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Insulating Bodies (AREA)
- Installation Of Indoor Wiring (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9311234A FR2710447B1 (fr) | 1993-09-21 | 1993-09-21 | Structure d'isolement pour câble. |
FR9311234 | 1993-09-21 |
Publications (3)
Publication Number | Publication Date |
---|---|
EP0644558A1 true EP0644558A1 (de) | 1995-03-22 |
EP0644558B1 EP0644558B1 (de) | 1999-06-02 |
EP0644558B2 EP0644558B2 (de) | 2003-05-28 |
Family
ID=9451076
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP94402087A Expired - Lifetime EP0644558B2 (de) | 1993-09-21 | 1994-09-20 | Kabelisolierstruktur |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP0644558B2 (de) |
JP (1) | JP3658018B2 (de) |
KR (1) | KR100323179B1 (de) |
CN (1) | CN1122285C (de) |
DE (1) | DE69418804T3 (de) |
DK (1) | DK0644558T4 (de) |
FR (1) | FR2710447B1 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1634913A1 (de) * | 2004-09-10 | 2006-03-15 | Borealis Technology Oy | Halbleitende Polymerzusammensetzung |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004178867A (ja) * | 2002-11-25 | 2004-06-24 | Mitsubishi Cable Ind Ltd | 電力ケーブル |
JP4866545B2 (ja) * | 2004-12-03 | 2012-02-01 | 株式会社フジクラ | ケーブルおよび撚合せ型ケーブル |
CH698074B1 (de) * | 2005-11-11 | 2009-05-15 | Studer Ag Draht & Kabelwerk | Mehrleiterkabel für die Übertragung von rechteckig verlaufenden Wechselströmen. |
EP2711934B1 (de) * | 2012-09-25 | 2018-07-11 | Nexans | Mehrschichtige Silikonisolierung für Elektrokabel |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0057604A1 (de) * | 1981-01-30 | 1982-08-11 | Nippon Unicar Company Limited | Halbleitende Polyolefin-Zusammensetzungen, Laminate daraus und damit bedeckte Kabel |
JPH0456009A (ja) * | 1990-06-22 | 1992-02-24 | Central Res Inst Of Electric Power Ind | ポリオレフィン絶縁ケーブルの半導電層界面改良方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54115798A (en) † | 1978-03-01 | 1979-09-08 | Fujikura Ltd | Semiconductive composition for power cable |
JPS5562610A (en) † | 1978-10-31 | 1980-05-12 | Dainichi Nippon Cables Ltd | Power cable |
JPS57199108A (en) † | 1981-06-01 | 1982-12-07 | Showa Electric Wire & Cable Co | Crosslinked polyethylene insulated power cable |
HUT54722A (en) † | 1988-09-30 | 1991-03-28 | Exxon Chemical Patents Inc | Linear ethylene interpolymer mixtures |
US5246783A (en) † | 1991-08-15 | 1993-09-21 | Exxon Chemical Patents Inc. | Electrical devices comprising polymeric insulating or semiconducting members |
JP4056009B2 (ja) * | 2000-01-31 | 2008-03-05 | 東芝テック株式会社 | インライン型ポンプ |
-
1993
- 1993-09-21 FR FR9311234A patent/FR2710447B1/fr not_active Expired - Lifetime
-
1994
- 1994-09-17 KR KR1019940023808A patent/KR100323179B1/ko not_active IP Right Cessation
- 1994-09-20 EP EP94402087A patent/EP0644558B2/de not_active Expired - Lifetime
- 1994-09-20 DE DE69418804T patent/DE69418804T3/de not_active Expired - Lifetime
- 1994-09-20 DK DK94402087T patent/DK0644558T4/da active
- 1994-09-20 JP JP22505494A patent/JP3658018B2/ja not_active Expired - Fee Related
- 1994-09-21 CN CN94113695A patent/CN1122285C/zh not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0057604A1 (de) * | 1981-01-30 | 1982-08-11 | Nippon Unicar Company Limited | Halbleitende Polyolefin-Zusammensetzungen, Laminate daraus und damit bedeckte Kabel |
JPH0456009A (ja) * | 1990-06-22 | 1992-02-24 | Central Res Inst Of Electric Power Ind | ポリオレフィン絶縁ケーブルの半導電層界面改良方法 |
Non-Patent Citations (1)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 16, no. 254 (E - 1213) 9 June 1992 (1992-06-09) * |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1634913A1 (de) * | 2004-09-10 | 2006-03-15 | Borealis Technology Oy | Halbleitende Polymerzusammensetzung |
WO2006027262A1 (en) * | 2004-09-10 | 2006-03-16 | Borealis Technology Oy | Semiconductive polymer composition |
WO2006027261A1 (en) * | 2004-09-10 | 2006-03-16 | Borealis Technology Oy | Semiconductive polymer composition |
KR100839947B1 (ko) * | 2004-09-10 | 2008-06-19 | 보레알리스 테크놀로지 오와이 | 반도전성 고분자 조성물 |
EP1978040A1 (de) | 2004-09-10 | 2008-10-08 | Borealis Technology Oy | Halbleitende Polymerzusammensetzung |
US7732711B2 (en) | 2004-09-10 | 2010-06-08 | Borealis Technology Oy | Semiconductive polymer composition |
US8124877B2 (en) | 2004-09-10 | 2012-02-28 | Borealis Technology Oy | Semiconductive polymer composition |
Also Published As
Publication number | Publication date |
---|---|
DE69418804T2 (de) | 1999-12-09 |
EP0644558B1 (de) | 1999-06-02 |
CN1108789A (zh) | 1995-09-20 |
CN1122285C (zh) | 2003-09-24 |
DE69418804T3 (de) | 2004-04-01 |
DK0644558T4 (da) | 2003-09-22 |
KR100323179B1 (ko) | 2002-06-27 |
DK0644558T3 (da) | 1999-12-13 |
JPH07169324A (ja) | 1995-07-04 |
FR2710447B1 (fr) | 1995-11-10 |
DE69418804D1 (de) | 1999-07-08 |
EP0644558B2 (de) | 2003-05-28 |
KR950009752A (ko) | 1995-04-24 |
FR2710447A1 (fr) | 1995-03-31 |
JP3658018B2 (ja) | 2005-06-08 |
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