EP0392398A2 - Méthode pour produire et envelopper des minifusibles et microfusibles - Google Patents

Méthode pour produire et envelopper des minifusibles et microfusibles Download PDF

Info

Publication number
EP0392398A2
EP0392398A2 EP90106691A EP90106691A EP0392398A2 EP 0392398 A2 EP0392398 A2 EP 0392398A2 EP 90106691 A EP90106691 A EP 90106691A EP 90106691 A EP90106691 A EP 90106691A EP 0392398 A2 EP0392398 A2 EP 0392398A2
Authority
EP
European Patent Office
Prior art keywords
housing parts
housing
pins
connections
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP90106691A
Other languages
German (de)
English (en)
Other versions
EP0392398B1 (fr
EP0392398A3 (fr
Inventor
Detlef Plegge
Nikolaus Träger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wickmann Werke GmbH
Original Assignee
Wickmann Werke GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wickmann Werke GmbH filed Critical Wickmann Werke GmbH
Priority to AT90106691T priority Critical patent/ATE87394T1/de
Publication of EP0392398A2 publication Critical patent/EP0392398A2/fr
Publication of EP0392398A3 publication Critical patent/EP0392398A3/fr
Application granted granted Critical
Publication of EP0392398B1 publication Critical patent/EP0392398B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H69/00—Apparatus or processes for the manufacture of emergency protective devices
    • H01H69/02—Manufacture of fuses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/05—Component parts thereof
    • H01H85/165—Casings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/0013—Means for preventing damage, e.g. by ambient influences to the fuse
    • H01H85/0021—Means for preventing damage, e.g. by ambient influences to the fuse water or dustproof devices
    • H01H2085/0034—Means for preventing damage, e.g. by ambient influences to the fuse water or dustproof devices with molded casings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/0013—Means for preventing damage, e.g. by ambient influences to the fuse
    • H01H85/0021—Means for preventing damage, e.g. by ambient influences to the fuse water or dustproof devices
    • H01H85/003—Means for preventing damage, e.g. by ambient influences to the fuse water or dustproof devices casings for the fusible element

Definitions

  • the invention relates to a method for closing an electrical component, in particular a fuse, the housing of which is formed from two parts and which is provided with at least two connections for electrical connection, with the method steps of provisionally joining the housing parts and overmolding the housing with a plastic .
  • the housing parts Before the encapsulation, the housing parts have to be connected to one another in a relatively complex manner, so that there are no larger passages or the like through which the molding compound can penetrate into the interior, for example of a fuse. There, it would very easily result in the destruction of the fuse wire, which is often only a few meters thick, and fill in the cavity required for the characteristic of a fuse.
  • the housing parts are therefore welded together, glued or locked together. In any case, the fastening is generally so solid that it would also be sufficient in itself to ensure the safety of the fuse and to offer an appealing lifespan.
  • the invention proposes that the housing parts are pressed together with the aid of pressure plates or pins or shaped surfaces during the extrusion coating process using the pressure plates or pins or the shaped surfaces as a shaped element and / or modeling of the molding compound.
  • the housing parts are not left to their own devices immediately before the encapsulation and are therefore dependent on a correspondingly solid design, but rather the housing parts are pressed against one another with sufficient pretension so that a controlled hold is present. It is therefore sufficient if the housing parts are loosely plugged together with the aid of means to be explained or are otherwise precisely aligned with one another.
  • the pressure exerted by the pressure plates or pins or the shaped surfaces ensures that the housing parts abut each other so that gas tightness is usually present at this stage immediately before the encapsulation.
  • the housing parts are made almost without exception as plastic parts, the elasticity of which ensures that the desired tightness is present even with unfavorable manufacturing tolerances.
  • the pressure plates or pins or the molding surfaces are therefore part of the molding chamber, within which the molding compound spreads during the encapsulation. You thus influence the shape of the extrusion coating, of course by leaving channels or the like Ribs or other, later projecting designs can be created.
  • the pressure plates or molding surfaces can themselves be modeled on the shape of the component or can bring about a change in shape overall, for example producing a cylindrical shape if the original shape of the housing which has not yet been overmolded is a cuboid.
  • pressure pins When pressure pins are used, they later form depressions in the spray skin on the molded housing, which do not cause any further problems. It is only important that the housing parts are pressed together by the pressure or molded parts and so there are areas where there is a system for passing on the contact pressure.
  • an overmolding of the parting joint takes place with a more or less strong overlap, which can be particularly supported by designing the housing parts in the region of the parting joint in such a way that the parting joint has the greatest extent and the adjacent areas are continuous or in jumps have a smaller scope. If e.g. two housing halves are used, it is particularly expedient to design the outer contour conically or beveled in the case of a cuboid, so that in addition to the interlocking of the shape in the micro range, the extrusion coating also provides a visible and effective conventional form fit.
  • the gas tightness existing in the preliminary stage is maintained even after the encapsulation, if the pressure plates or surfaces for the shaping of the electrical component have been removed.
  • connections Due to the overmoulding which increases the strength, it is expedient to include the connections in the overmolding. Irrespective of the anchoring in the corresponding housing part, bends can then occur on the sections located outside the component of the connections no longer have any effect inside, it being irrelevant whether deformations of the connections are part of the further production process, for example a fuse, or are carried out accidentally.
  • a particularly good anchoring can be achieved if the overmolded area of each connection contains an opening penetrated by the spray compound. At this point, there is a weakening of the flat connection material and a continuous plastic connection in the overmolded area.
  • housing parts can be strung together to form a chain with the aid of webs, in which case such pin-hole pairs can lie in the region of the webs.
  • the actual housing area then contains no precautions for cohesion, rather the mutually facing surfaces of the housing parts lie flat against one another.
  • connections When manufacturing miniature fuses and miniature fuses, it is common for the connections to be molded be connected to each other to form a self-contained stamped part so that the previously applied sensitive fuse elements at the later connection ends inside the housing are not damaged. If such stamped parts are used, it is particularly clever to place apertured sections of the stamped part, which do not necessarily have the function of connections later, between the web halves, the respective pins for the loose pre-connection passing through a corresponding opening in the section . In this way, a manageable unit is created from the lower housing parts, the stamped part including the connections and the fusible conductors and upper housing parts applied by bonding, for example, which are plugged together to form a loose connection.
  • the encapsulation takes place in the area of the parting line, which can also capture large parts of the housing. Deviating from this, the webs can also be cut off in the pressed state before spraying, so that the entire parting joint is overmoulded during the subsequent molding. After the encapsulation, the webs are cut off, the connections are cut free from the stamped part and, if necessary, bent under the component to form a so-called SMD fuse.
  • the housing parts can be made of different materials.
  • the material of the molding compound only has to harmonize with the material of the housing, otherwise it can be chosen freely.
  • the encapsulation can also take place at a temperature which can lead to melting of the then thermoplastic material of the housing. In this way, not only does a microscopic and macroscopic form fit occur, but the molding compound even sticks to the component, which further improves the cohesion of the housing.
  • the security blank shown in FIG. 1 consists of a housing 2, which is formed from two identical housing halves 3 and 4. Through cutouts 18 (FIG. 3) in the housing halves 3 and 4, connections 5 and 6 made of copper protrude into the interior of the housing 2, to which a fuse element 7 is fastened, for example by bonding.
  • the prefabrication stage consisting of these parts is stretched for overmolding between pressure plates 12 (FIG. 2), the injection mold forming the overmolding 8, of course, also being placed around this prefabricated securing blank 1. The details of the form are not shown.
  • the extrusion coating 8 which can be seen in FIG. 1, is formed, which essentially only covers the flanks of the housing halves 3 and 4 while simultaneously enclosing the connections 5 and 6.
  • the pressure plates 12 press the housing halves 3 and 4 firmly against one another, which, moreover, are pre-positioned relative to one another by means to be explained.
  • the slight inclination of the side walls of the housing halves has two advantages: On the one hand, the incline counteracts the injection forces, which can be considerable. On the other hand, this creates a macroscopic form fit because the parting line between the two housing halves 3 and 4 is the location of the largest circumference and all neighboring areas are smaller in circumference.
  • the encapsulation 8 sits like a clamp on the two housing halves 3 and 4 and holds them together under the same pretension that was originally given up by the pressure plates 12.
  • FIG. 2 shows the side view of a finished fuse 10.
  • SMD surface Mounted Device
  • the wave soldering process requires the components to be glued to the circuit board.
  • a rib 13 can optionally be formed between the ends of the connections 5 and 6, which arises during the encapsulation, by a corresponding shaping of the pressure plate 12 lying on this side, which is indicated schematically in FIG. If it is already clear beforehand that the fuse 10 is only attached in the reflow process, such a rib 13 is not required.
  • the assigned plate 12 is then designed as well the pressure plate 12 shown in the upper half of the picture, namely with a continuous, flat bottom.
  • the protrusion of the web 11 from the extrusion coating 8 is harmless because the separated point lies directly next to the actual housing halves 3 and 4, which are pressed against one another with considerable pretension as a result of the pressure plates 12, and are further exposed to this pretensioning stress even after the encapsulation.
  • housing half strips 15 are mass-produced on automatic sprayers from a plastic. Each strip 15 contains five housing halves 3 or 4, three pins 16 and three holes 17. After the selection of two strips, one is used to form the lower housing halves 3 and the other strip 15 to form the upper housing halves 4.
  • Each strip 15 carries cutouts 18 for receiving the connections 5 and 6 in the area of the housing halves, and a recess 19 is also formed in the area of each pin 16 or each hole 17, which serves to receive a section 21 which is part of a stamped part 20 for Formation of connections 5 and 6 are.
  • the stamped part 20 is shown in its entirety in the lower part of FIG. 3.
  • the layer structure thus formed is placed in the mold for extrusion coating, the loose cohesion which is formed by the pins 16 and the holes 17 being sufficient.
  • pressure plates 12 rest against the respective housing halves 3 and 4, and the rest of the mold is also closed. After the extrusion coating, the layer structure mentioned can be removed, the cohesion now being final.
  • Openings 24 are provided in the area of the connections 5 and 6, which are in the area of the encapsulation 8 and improve the anchoring of the connections 5 and 6, which will be bent later. In this way it is reliably prevented that the connections 5 or 6 are pulled out of the closed housing during bending.
  • the unit is then divided along the cutting lines 25 or along the cutting lines 26 and 27 into individual securing blanks, preferably initially with cuts be placed along the cutting lines 26 and 27.
  • a very easy-to-use unit of a total of five fuse blanks is retained, which in this form can be brought very easily into the shape shown in FIG. 2 by bending the connections 5 and 6. Only then are the cuts made along lines 25, as a result of which the strip-shaped unit breaks down into individual fuses 10.
  • FIG. 1 The representation given in the figures is greatly exaggerated. Even Figure 3 shows the actual backups in double size.
  • smaller versions are also possible.
  • the invention is by no means limited to miniature fuses, but can be used with good success on small fuses and even larger units, since the cohesion of the housing parts is excellent, so the switching capacity of a corresponding fuse is considerable with the smallest external dimensions.
  • the units in the form presented can be tinned in a galvanic bath, with of course only the connections 5 and 6 being given a tin coating.
  • This late tinning in the galvanic bath is completely harmless for the unit.
  • the cut surfaces also have a tin layer, which often facilitates the flow of solder.
  • a tinplate strip tinned from the outset can be used, which, however, then has no tinning on the cut surfaces.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Fuses (AREA)
EP90106691A 1989-04-13 1990-04-06 Méthode pour produire et envelopper des minifusibles et microfusibles Expired - Lifetime EP0392398B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AT90106691T ATE87394T1 (de) 1989-04-13 1990-04-06 Verfahren zum herstellen und verschliessen von klein- und kleinstsicherungen.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3912063A DE3912063A1 (de) 1989-04-13 1989-04-13 Verfahren zum verschliessen eines elektrischen bauteils
DE3912063 1989-04-13

Publications (3)

Publication Number Publication Date
EP0392398A2 true EP0392398A2 (fr) 1990-10-17
EP0392398A3 EP0392398A3 (fr) 1992-03-04
EP0392398B1 EP0392398B1 (fr) 1993-03-24

Family

ID=6378547

Family Applications (1)

Application Number Title Priority Date Filing Date
EP90106691A Expired - Lifetime EP0392398B1 (fr) 1989-04-13 1990-04-06 Méthode pour produire et envelopper des minifusibles et microfusibles

Country Status (4)

Country Link
EP (1) EP0392398B1 (fr)
JP (1) JP2869811B2 (fr)
AT (1) ATE87394T1 (fr)
DE (2) DE3912063A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2725304A1 (fr) * 1994-10-03 1996-04-05 Soc Corp Fusible pour microplaquette
DE102005027681A1 (de) * 2005-06-15 2006-12-28 Autecto Industrievertretungen Gmbh Schmelzsicherung und Verfahren zu deren Herstellung
CN101599393B (zh) * 2009-07-03 2011-06-01 杨光 一种微型保险丝的制作方法及其制成品

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3194931A (en) * 1961-05-10 1965-07-13 American Radiator & Standard Improved block-electrical brush assembly
DE1463530A1 (de) * 1963-06-29 1969-03-06 Siemens Ag Verfahren zur Herstellung von Schmelzsicherungen,insbesondere NH-Sicherungen,mit Kunstharzummantelung
FR2358253A1 (fr) * 1976-07-13 1978-02-10 Caillot Raymond Procede d'assemblage etanche par surmoulage de deux elements en matiere plastique
EP0157938A2 (fr) * 1984-03-23 1985-10-16 Siemens Aktiengesellschaft Boîtier pour composants électriques

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3194931A (en) * 1961-05-10 1965-07-13 American Radiator & Standard Improved block-electrical brush assembly
DE1463530A1 (de) * 1963-06-29 1969-03-06 Siemens Ag Verfahren zur Herstellung von Schmelzsicherungen,insbesondere NH-Sicherungen,mit Kunstharzummantelung
FR2358253A1 (fr) * 1976-07-13 1978-02-10 Caillot Raymond Procede d'assemblage etanche par surmoulage de deux elements en matiere plastique
EP0157938A2 (fr) * 1984-03-23 1985-10-16 Siemens Aktiengesellschaft Boîtier pour composants électriques

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2725304A1 (fr) * 1994-10-03 1996-04-05 Soc Corp Fusible pour microplaquette
NL1000560C2 (nl) * 1994-10-03 1997-07-30 Soc Corp Microchipsmeltveiligheid.
DE102005027681A1 (de) * 2005-06-15 2006-12-28 Autecto Industrievertretungen Gmbh Schmelzsicherung und Verfahren zu deren Herstellung
CN101599393B (zh) * 2009-07-03 2011-06-01 杨光 一种微型保险丝的制作方法及其制成品

Also Published As

Publication number Publication date
DE3912063A1 (de) 1990-10-18
EP0392398B1 (fr) 1993-03-24
JP2869811B2 (ja) 1999-03-10
EP0392398A3 (fr) 1992-03-04
DE59001060D1 (de) 1993-04-29
JPH02299118A (ja) 1990-12-11
ATE87394T1 (de) 1993-04-15

Similar Documents

Publication Publication Date Title
EP0706214A2 (fr) Module électronique et carte à puce
DE3808971A1 (de) Zusammengesetztes bauelement
EP1199913B1 (fr) Méthode de fabrication d'unités comprenant une feuille de circuit et un boítier de support
DE10161248A1 (de) Kastenartige Anschlussklemme einer elektrischen Vorrichtung
DE102008029104B3 (de) Verfahren zur Herstellung eines mehrteiligen Hybridbauteils
EP0960038A1 (fr) Mode de fabrication d'un harnais de cables
DE19738256C2 (de) Verfahren und Vorrichtung zum Herstellen von Borstenfeldern sowie damit hergestelltes Borstenfeld
DE2658789A1 (de) Steckverbindung
DE19625228C2 (de) Systemträger für die Montage einer integrierten Schaltung in einem Spritzgußgehäuse
DE19757587C2 (de) Drathverbindungsstruktur für Verbinder und Herstellungsverfahren hierfür
DE4410455C1 (de) Wasserdichte Kontaktstiftdurchführung durch gegossene Kunststoffteile, insbesondere von Steckergehäusen
DE2217218B1 (de) Kontaktfedersatz fur ein elektro magnetisches Relais und Verfahren zur Herstellung desselben
DE102009051392A1 (de) Verfahren zum Herstellen eines Verbundkörpers aus mindestens einem vorzufertigenden Metallbauteil und mindesten einem Kunststoffbauteil und formschlüssig gefügter Verbundkörper
EP2704544B1 (fr) Dispositif de détection
DE19719436C2 (de) Spritzgußgehäuse
EP0392398B1 (fr) Méthode pour produire et envelopper des minifusibles et microfusibles
DE102005044905A1 (de) Elektrisches Verbindungselement, insbesondere Ringkabelschuh
DE2165442C2 (de) Verfahren zur Herstellung eines Steckverbinders
EP3996894B1 (fr) Boîtier d'un module électronique et sa fabrication
DE4243575C2 (de) Verfahren zum Herstellen einer Kabeleinführung in ein Gehäuse eines Sensors
DE102016003325B4 (de) Verfahren zur Herstellung eines Kunststoff-Bauteils mit mehreren Trägerteilen mit zumindest einer elektrischen Leiterbahn und so hergestelltes Kunststoff-Bauteil
EP1365487B1 (fr) Procédé de fabrication d'un boîtier
DE4110585A1 (de) Verfahren und vorrichtung zum aufbringen einer isolationsschicht auf einen durch ein blechpaket gebildeten kern einer elektrischen spule
DE3149814C1 (de) Gehäuse aus Isoliermaterial für elektrische Schaltgeräte, insbeondere Relais, sowie Verfahren zur Herstellung eines solchen Gehäuses
EP0775368B1 (fr) Support en matiere plastique pour circuits electroniques a broches de contact permettant de realiser des liaisons

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AT BE CH DE DK ES FR GB GR IT LI LU NL SE

17P Request for examination filed

Effective date: 19901227

PUAL Search report despatched

Free format text: ORIGINAL CODE: 0009013

AK Designated contracting states

Kind code of ref document: A3

Designated state(s): AT BE CH DE DK ES FR GB GR IT LI LU NL SE

17Q First examination report despatched

Effective date: 19920915

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AT BE CH DE DK ES FR GB GR IT LI LU NL SE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRE;WARNING: LAPSES OF ITALIAN PATENTS WITH EFFECTIVE DATE BEFORE 2007 MAY HAVE OCCURRED AT ANY TIME BEFORE 2007. THE CORRECT EFFECTIVE DATE MAY BE DIFFERENT FROM THE ONE RECORDED.SCRIBED TIME-LIMIT

Effective date: 19930324

Ref country code: BE

Effective date: 19930324

Ref country code: DK

Effective date: 19930324

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 19930324

Ref country code: GB

Effective date: 19930324

Ref country code: FR

Effective date: 19930324

Ref country code: SE

Effective date: 19930324

Ref country code: ES

Free format text: THE PATENT HAS BEEN ANNULLED BY A DECISION OF A NATIONAL AUTHORITY

Effective date: 19930324

Ref country code: NL

Effective date: 19930324

REF Corresponds to:

Ref document number: 87394

Country of ref document: AT

Date of ref document: 19930415

Kind code of ref document: T

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: AT

Effective date: 19930406

REF Corresponds to:

Ref document number: 59001060

Country of ref document: DE

Date of ref document: 19930429

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LI

Effective date: 19930430

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 19930430

Ref country code: CH

Effective date: 19930430

EN Fr: translation not filed
NLV1 Nl: lapsed or annulled due to failure to fulfill the requirements of art. 29p and 29m of the patents act
GBV Gb: ep patent (uk) treated as always having been void in accordance with gb section 77(7)/1977 [no translation filed]

Effective date: 19930324

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed
PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 19990429

Year of fee payment: 10

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20010201