EP0383972A1 - Transducteur ultrasonore à éléments de vibration trapézoidaux, et procédé et dispositif pour leur fabrication - Google Patents

Transducteur ultrasonore à éléments de vibration trapézoidaux, et procédé et dispositif pour leur fabrication Download PDF

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Publication number
EP0383972A1
EP0383972A1 EP89103112A EP89103112A EP0383972A1 EP 0383972 A1 EP0383972 A1 EP 0383972A1 EP 89103112 A EP89103112 A EP 89103112A EP 89103112 A EP89103112 A EP 89103112A EP 0383972 A1 EP0383972 A1 EP 0383972A1
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EP
European Patent Office
Prior art keywords
laser
laser light
ceramic
electrode
parallel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP89103112A
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German (de)
English (en)
Other versions
EP0383972B1 (fr
Inventor
Hans Dr. Rer Nat. Kaarmann
Wolfram Dipl.-Phys. Wersing
Martina Dipl.-Phys. Vogt
Reinhard Dr.-Ing. Lerch
Karl Dr. Dipl.-Phys. Lubitz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE89103112T priority Critical patent/DE58906448D1/de
Priority to EP89103112A priority patent/EP0383972B1/fr
Priority to AT89103112T priority patent/ATE98530T1/de
Priority to JP2039535A priority patent/JP2960093B2/ja
Priority to US07/484,352 priority patent/US5045746A/en
Publication of EP0383972A1 publication Critical patent/EP0383972A1/fr
Priority to US08/116,800 priority patent/USRE35011E/en
Application granted granted Critical
Publication of EP0383972B1 publication Critical patent/EP0383972B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0644—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element
    • B06B1/0648—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element of rectangular shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface

Definitions

  • the invention relates to an ultrasound array with a number of juxtaposed oscillator elements, which are covered with an electrode material on a first and second electrode surface, which are opposite one another, all oscillator elements being arranged with their second electrode surface in a base surface, and the first and have a second boundary surface which are opposite one another and are aligned non-parallel to one another.
  • the invention further relates to a method and an apparatus for producing such an array.
  • This is an ultrasound array which has a number of ultrasound transducer or oscillating elements of a trapezoidal cross section lying next to one another on a carrier or damping body.
  • the first and second electrode surfaces, which are covered with electrode material and lie opposite one another in parallel, are each rectangular. Two flat boundary surfaces run towards each other in a wedge shape.
  • Such an ultrasound array is not suitable as a phased-array applicator, since the two types of oscillating element that are adjacent to each other have different radiation characteristics.
  • the width of the radiation area of each vibrating element must be less than or equal to ⁇ / 2, where ⁇ is the wavelength of the ultrasound emitted in the propagation medium. This condition cannot be met or can only be met incompletely in an ultrasound array with two different types of vibrating elements.
  • the invention is therefore based on the requirement that only identical oscillator elements should be used in an ultrasound array used as a phased array applicator.
  • the older German patent application P 37 39 226.3 states that acoustic cross-couplings between the individual ultrasonic transducers of an ultrasonic transducer array can be reduced if the second electrode base surfaces facing the carrier body are larger than their end faces or first electrode surfaces facing away from the carrier body.
  • ultrasonic transducers are thus created, the cross-sectional area of which runs parallel to the longitudinal direction of the array and has the shape of an isosceles trapezoid.
  • the opposite side surfaces of the parting lines located between the ultrasonic transducers are then no longer parallel and the cross-sectional area of the parting line then has a trapezoidal shape.
  • Such separating joints with a trapezoidal cross section can be produced, for example, by means of two saw cuts inclined at an acute angle to one another.
  • the angle of attack of the saw blade is limited relative to the end face of the array.
  • exact bevel cuts can only be achieved with great technical effort.
  • the invention has set itself the goal of specifying an ultrasound array constructed from individual oscillator elements, which enables the generation of short ultrasound pulses with a center frequency in the range from 1 to 50 MHz with a high bandwidth.
  • the vibrating elements which consist of a piezoelectric ceramic material covered on both sides with electrode material, are intended to work as thickness transducers.
  • the directional diagrams of the individual oscillator elements, namely all oscillator elements, should have the largest possible opening angle so that the ultrasound array can be used as a linear phased array antenna which is used to scan (scan) acoustically transparent media with the aid of ultrasound pulses , preferably for ultrasound examination of patients.
  • the individual vibrating elements should have high transmission and reception transmission factors.
  • the invention is therefore based on the object of specifying an ultrasound array of the type mentioned at the outset, which can be used as a phased array antenna for scanning acoustically transparent media. Furthermore, a method for the production of such an ultrasound array and a device for the production are to be specified.
  • the first-mentioned object is achieved according to the invention in that the oscillator elements are aligned in such a way that their cross-section changes in the same way in the direction from the first to the second electrode surface.
  • All identical vibrating elements with non-parallel boundary surfaces are used; All transducer elements thus have the same directional characteristic and - with a suitable dimensioning - all the same opening angle of a suitable size.
  • the arrangement is such that the first electrode surface facing the radiation surface of the oscillating elements is smaller than the second electrode surface facing the damping body.
  • the method for producing such an ultrasound array is based on a method in which a piezoelectric material is irradiated with a laser cutting beam on lines spaced in parallel.
  • the second-mentioned object is achieved on the basis of this method according to the invention in that a piezoelectric ceramic is irradiated on only one side with converging laser light on the parallel spaced lines in such a way that incisions are made in the ceramic which are juxtaposed with non-parallel walls.
  • a device for carrying out the method contains a laser, the laser beam of which can be directed onto a piezoelectric material. According to the invention, it is characterized in that a focusing device is arranged between the piezoelectric material and the laser, which produces a converging laser light cutting beam on the piezoelectric material.
  • an ultrasound array 2 suitable as a phased array for medical purposes contains a number of oscillating elements 4 lying next to one another.
  • the core of each oscillating element 4 is a piezoelectric material 6, in particular a piezoceramic such as. B. of the PZT-5 type that against each other in parallel overlying first and second electrode surfaces is covered with an electrode material 8 and 10, respectively.
  • All (non-cuboid) vibrating elements 4 are the same and are aligned so that their cross-section changes continuously in the direction from the first to the second electrode surface 8 or 10 in the same way, here the first electrode surface 8 is smaller than the second electrode surface 10.
  • All Vibrator elements are arranged with their second electrode surface 10 in a base surface.
  • oscillator elements 4 with mutually opposite, non-parallel first and second boundary surfaces 12 and 14 are used in the transverse direction x.
  • the third and fourth boundary surfaces in the longitudinal direction y of each vibrating element 4, which are designated 16 and 18 in FIG. 1, are preferably non-parallel to one another.
  • a vibrating element 4 with a trapezoidal cross section is suitable for this, as shown in FIG. 1.
  • the lateral boundary lines of the trapezoid can be thought of as approximated by a staircase function.
  • the above resonance condition (1) applies to each of these steps.
  • the trapezoidal cross section of the transducer thus achieves the smearing of a defined transverse resonance, which would occur with parallel walls, onto the frequency band given by f resu and f reso : and w u : length of the lower trapezoidal edge and w o : Length of the upper trapezoidal edge means.
  • the respective longitudinal section may also be trapezoidal.
  • the individual vibrating elements 4 are located on a common damping body 20, the surface of which represents the base area in which the second electrode surfaces 10 of the vibrating elements 4 are arranged. This can be known from a particle-filled plastic, the z. B. based on epoxy or polyurethane exist.
  • the individual vibrating elements 4 with essentially smooth boundary surfaces 12, 14 are separated from one another by V-shaped gaps or incisions 22. It is noteworthy that the V-shaped incisions 22 each extend into the damping body 20 in the present embodiment.
  • Each oscillating element 4 is provided with a coupling layer 24 on the radiation side. It should therefore be emphasized that in the present embodiment, a common coupling layer covering all oscillator elements 4 is not used.
  • the individual coupling layers 24 are also separated from one another by the V-shaped gap 22. This ensures good acoustic decoupling.
  • the incision 22 common to all layers 24, 8, 6, 10 and 20 is produced in one operation in each case in the manufacture of the ultrasound array 2.
  • the ultrasonic radiation area on each coupling layer 24 is designated by 26 in each case.
  • the first electrode surface 8 facing the radiation surface of the oscillating elements 4 is smaller than the effective second electrode surface 10 facing the damping layer 20.
  • the wedge angle was 2.5 °
  • the thickness t of the individual vibrating element 4 t 0.4 mm
  • the length 1 12 mm
  • the width w u 0.2 mm.
  • the thickness t to be used depends on the piezo material and the width w u on the medium in which the ultrasound propagates after coupling.
  • the width w u should be less than or equal to ⁇ / 2, where ⁇ is the wavelength.
  • the thickness t and the width w u should differ by a factor of 2 or larger. In the present case, a factor of almost exactly 2 was chosen for the dimensioning.
  • Fig. 2 In the reduced side view of Fig. 2 is shown schematically that the radiation-side first electrode 8 is bent sideways on both edges and electrically from the edges via a ground line 28 to a common point 30, z. B. to a grounded terminal 32, is performed.
  • the rear second electrode 10 has a center tap which is connected to a further connection 36 via a line 34.
  • Vibrating elements 4 with non-parallel boundary surfaces 12, 14 and / or 16, 18 can only be produced with great difficulty with the usual machining methods (mechanical sawing or cut-off grinding). Therefore, this problem is solved in the present case by using a device with laser sawing technology ("laser saw”).
  • laser saw a device with laser sawing technology
  • different types of lasers can be used for this, such as. B. Argon ion and Nd-YAG lasers.
  • the prepared layer package 40 consististing of layers 24, 8, 6, 10, 20 with piezoceramic 6
  • the ceramic 6 is basically transparent to the light of the abovementioned lasers, the absorption of the laser radiation takes place only on the basis of nonlinear effects. This means that the cut surfaces do not become very smooth and 22 beads are formed on the edges.
  • an excimer laser 42 is therefore used to avoid overheating and to achieve smooth surfaces, the light in the ultraviolet range of which is directly absorbed by the piezoceramic 6 in the layer package 40.
  • the radiation 44 emerging from the laser 42 is focused with a focusing device 46, which generates a point focus 48, that is, preferably with a converging lens, and is irradiated onto the location of the ceramic 6 in the package 40 that is to be removed.
  • the desired V-shape of the incisions 22 and thus the trapezoidal shape of the vibrating elements 4 can be selected by the focusing device 46.
  • the incisions 22 are now produced by a relative movement of the piezoelectric ceramic 6 and the laser light with the point focus 48 during the irradiation.
  • the layer package 40 is mounted on a holder 50 which is moved in the direction of arrow 52.
  • the device according to FIG. 5 is constructed similarly to the device according to FIG. 4.
  • the focusing device 46 here consists of a cylindrical lens, which converges the laser light 44 to a line focus 54, which has the length of the incision 22.
  • the relative movement which is indicated by the arrow 52 in FIG. 4, can be avoided.
  • the spacing of the incisions (22, ie the width w of the vibrating elements 4) is set in FIGS. 4 and 5 by appropriate mechanical (stepwise) advancement of the package 40 transversely to the main beam direction s of the laser beam.
  • this package 40 with the holder 50 is gradually increased moved in the direction of arrow 56.
  • FIG. 6 A further device for producing V-shaped incisions is shown in FIG. 6.
  • the radiation 44 emerging from the laser 42 is broadened via the beam expansion device 58, so that the expanded laser beam 59 irradiates the entire array area.
  • the laser beam 59 then passes through a mask 60 which is provided with slots 62.
  • the arrangement of the slots 62 represents an image of the incisions 22 lying next to one another in the ceramic 6.
  • This mask 60 is imaged on the surface of the layer package 40 with the focusing device 46, which now represents an imaging system, so that the expanded laser beam 59 likewise Many line foci are generated at the same time as incisions 22 are to be made in the ceramic 6.
  • the device according to FIG. 6 thus allows all incisions 22 in the ultrasound array 2, which are spaced apart in parallel, to be produced in one operation.
  • the depth of cut of the incisions 22 is set by the number of laser pulses. This is possible with very high repeatability.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
EP89103112A 1989-02-22 1989-02-22 Transducteur ultrasonore à éléments de vibration trapézoidaux, et procédé et dispositif pour leur fabrication Expired - Lifetime EP0383972B1 (fr)

Priority Applications (6)

Application Number Priority Date Filing Date Title
DE89103112T DE58906448D1 (de) 1989-02-22 1989-02-22 Ultraschall-Array mit trapezförmigen Schwingerelementen sowie Verfahren und Vorrichtung zu seiner Herstellung.
EP89103112A EP0383972B1 (fr) 1989-02-22 1989-02-22 Transducteur ultrasonore à éléments de vibration trapézoidaux, et procédé et dispositif pour leur fabrication
AT89103112T ATE98530T1 (de) 1989-02-22 1989-02-22 Ultraschall-array mit trapezfoermigen schwingerelementen sowie verfahren und vorrichtung zu seiner herstellung.
JP2039535A JP2960093B2 (ja) 1989-02-22 1990-02-19 超音波アレー及びその加工方法と装置
US07/484,352 US5045746A (en) 1989-02-22 1990-02-22 Ultrasound array having trapezoidal oscillator elements and a method and apparatus for the manufacture thereof
US08/116,800 USRE35011E (en) 1989-02-22 1993-09-03 Ultrasound array having trapezoidal oscillator elements and a method and apparatus for the manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP89103112A EP0383972B1 (fr) 1989-02-22 1989-02-22 Transducteur ultrasonore à éléments de vibration trapézoidaux, et procédé et dispositif pour leur fabrication

Publications (2)

Publication Number Publication Date
EP0383972A1 true EP0383972A1 (fr) 1990-08-29
EP0383972B1 EP0383972B1 (fr) 1993-12-15

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EP89103112A Expired - Lifetime EP0383972B1 (fr) 1989-02-22 1989-02-22 Transducteur ultrasonore à éléments de vibration trapézoidaux, et procédé et dispositif pour leur fabrication

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Country Link
US (2) US5045746A (fr)
EP (1) EP0383972B1 (fr)
JP (1) JP2960093B2 (fr)
AT (1) ATE98530T1 (fr)
DE (1) DE58906448D1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0620048A2 (fr) * 1993-04-12 1994-10-19 Acuson Corporation Transducteurs à ultrason ayant des lobes secondaires réduits et procédé de fabrication correspondant
EP1067609A1 (fr) * 1999-01-22 2001-01-10 Kansai Research Institute Dispositif a film mince piezoelectrique, procede de production associe et tete d'enregistrement a jet d'encre
WO2007024671A2 (fr) * 2005-08-23 2007-03-01 Gore Enterprise Holdings, Inc. Ensemble transducteur ultrasonore ameliore et procede de production associe
CN115921259A (zh) * 2023-01-03 2023-04-07 京东方科技集团股份有限公司 一种超声换能单元及其制备方法、超声换能器件

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US5371717A (en) * 1993-06-15 1994-12-06 Hewlett-Packard Company Microgrooves for apodization and focussing of wideband clinical ultrasonic transducers
US5423319A (en) * 1994-06-15 1995-06-13 Hewlett-Packard Company Integrated impedance matching layer to acoustic boundary problems for clinical ultrasonic transducers
US5493541A (en) * 1994-12-30 1996-02-20 General Electric Company Ultrasonic transducer array having laser-drilled vias for electrical connection of electrodes
US5644085A (en) * 1995-04-03 1997-07-01 General Electric Company High density integrated ultrasonic phased array transducer and a method for making
WO1997001868A1 (fr) * 1995-06-27 1997-01-16 Philips Electronics N.V. Procede de fabrication de composants electroniques multicouches
US5698928A (en) * 1995-08-17 1997-12-16 Motorola, Inc. Thin film piezoelectric arrays with enhanced coupling and fabrication methods
US5855049A (en) * 1996-10-28 1999-01-05 Microsound Systems, Inc. Method of producing an ultrasound transducer
JP2927286B1 (ja) * 1998-02-05 1999-07-28 日本電気株式会社 圧電アクチュエータ及びその製造方法
DE19833213C2 (de) * 1998-07-23 2002-11-07 Siemens Ag Ultraschall-Sendeanordnung
US6894425B1 (en) * 1999-03-31 2005-05-17 Koninklijke Philips Electronics N.V. Two-dimensional ultrasound phased array transducer
US6390985B1 (en) * 1999-07-21 2002-05-21 Scimed Life Systems, Inc. Impedance matching transducers
US7105985B2 (en) * 2001-04-23 2006-09-12 Product Systems Incorporated Megasonic transducer with focused energy resonator
JP3485904B2 (ja) * 2001-04-24 2004-01-13 松下電器産業株式会社 音響変換器
JP3883823B2 (ja) * 2001-06-19 2007-02-21 日本電波工業株式会社 マトリクス型の超音波探触子及びその製造方法
US7309948B2 (en) * 2001-12-05 2007-12-18 Fujifilm Corporation Ultrasonic transducer and method of manufacturing the same
US20070222339A1 (en) * 2004-04-20 2007-09-27 Mark Lukacs Arrayed ultrasonic transducer
JP4805254B2 (ja) * 2004-04-20 2011-11-02 ビジュアルソニックス インコーポレイテッド 配列された超音波トランスデューサ
US20060100522A1 (en) * 2004-11-08 2006-05-11 Scimed Life Systems, Inc. Piezocomposite transducers
JP4619845B2 (ja) * 2005-03-25 2011-01-26 株式会社東芝 超音波プローブ及び超音波診断装置
CA2628100C (fr) 2005-11-02 2016-08-23 Visualsonics Inc. Systeme ultrasons haute frequence en reseau
US7622848B2 (en) * 2006-01-06 2009-11-24 General Electric Company Transducer assembly with z-axis interconnect
US7569977B2 (en) * 2006-08-02 2009-08-04 Cts Corporation Laser capacitance trimmed piezoelectric element and method of making the same
US9184369B2 (en) 2008-09-18 2015-11-10 Fujifilm Sonosite, Inc. Methods for manufacturing ultrasound transducers and other components
CN102308375B (zh) 2008-09-18 2015-01-28 视声公司 用于制造超声换能器和其他部件的方法
US9173047B2 (en) 2008-09-18 2015-10-27 Fujifilm Sonosite, Inc. Methods for manufacturing ultrasound transducers and other components
JP5511202B2 (ja) * 2009-03-09 2014-06-04 キヤノン株式会社 圧電体素子、それを用いた液体吐出ヘッド及び記録装置
US8345511B1 (en) * 2010-03-15 2013-01-01 The United States Of America As Represented By The Secretary Of The Navy Blazed array for broadband transmission/reception
JP6052233B2 (ja) * 2014-05-26 2016-12-27 Tdk株式会社 積層型圧電素子
US11417309B2 (en) * 2018-11-29 2022-08-16 Ascent Venture, Llc. Ultrasonic transducer with via formed in piezoelectric element and method of fabricating an ultrasonic transducer including milling a piezoelectric substrate

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0620048A2 (fr) * 1993-04-12 1994-10-19 Acuson Corporation Transducteurs à ultrason ayant des lobes secondaires réduits et procédé de fabrication correspondant
EP0620048A3 (en) * 1993-04-12 1995-11-29 Acuson Ultrasound transducers with reduced sidelobes and method for manufacture thereof.
EP1067609A1 (fr) * 1999-01-22 2001-01-10 Kansai Research Institute Dispositif a film mince piezoelectrique, procede de production associe et tete d'enregistrement a jet d'encre
EP1067609A4 (fr) * 1999-01-22 2007-06-13 Canon Kk Dispositif a film mince piezoelectrique, procede de production associe et tete d'enregistrement a jet d'encre
WO2007024671A2 (fr) * 2005-08-23 2007-03-01 Gore Enterprise Holdings, Inc. Ensemble transducteur ultrasonore ameliore et procede de production associe
WO2007024671A3 (fr) * 2005-08-23 2007-06-21 Gore Enterprise Holdings Inc Ensemble transducteur ultrasonore ameliore et procede de production associe
CN115921259A (zh) * 2023-01-03 2023-04-07 京东方科技集团股份有限公司 一种超声换能单元及其制备方法、超声换能器件

Also Published As

Publication number Publication date
US5045746A (en) 1991-09-03
DE58906448D1 (de) 1994-01-27
EP0383972B1 (fr) 1993-12-15
JP2960093B2 (ja) 1999-10-06
ATE98530T1 (de) 1994-01-15
USRE35011E (en) 1995-08-08
JPH02246700A (ja) 1990-10-02

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