EP0307591A2 - Procédé et appareil pour aligner des billes de soudure - Google Patents

Procédé et appareil pour aligner des billes de soudure Download PDF

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Publication number
EP0307591A2
EP0307591A2 EP88112127A EP88112127A EP0307591A2 EP 0307591 A2 EP0307591 A2 EP 0307591A2 EP 88112127 A EP88112127 A EP 88112127A EP 88112127 A EP88112127 A EP 88112127A EP 0307591 A2 EP0307591 A2 EP 0307591A2
Authority
EP
European Patent Office
Prior art keywords
solder balls
aligning
plate
holes
aligning plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP88112127A
Other languages
German (de)
English (en)
Other versions
EP0307591A3 (en
EP0307591B1 (fr
Inventor
Hideyuki Fukasawa
Mamoru Kobayashi
Masahiro Wanami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of EP0307591A2 publication Critical patent/EP0307591A2/fr
Publication of EP0307591A3 publication Critical patent/EP0307591A3/en
Application granted granted Critical
Publication of EP0307591B1 publication Critical patent/EP0307591B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/11001—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
    • H01L2224/11003—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate for holding or transferring the bump preform
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
    • H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
    • H01L2224/11334—Manufacturing methods by local deposition of the material of the bump connector in solid form using preformed bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/742—Apparatus for manufacturing bump connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0257—Brushing, e.g. cleaning the conductive pattern by brushing or wiping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S269/00—Work holders
    • Y10S269/903—Work holder for electrical circuit assemblages or wiring systems

Definitions

  • the present invention relates to a method for aligning solder balls, and in particular to a method for aligning solder balls suitable for aligning and sticking solder balls onto electrodes of a semi­conductor chip or connection pads of a circuit substrate beforehand.
  • a semiconductor chip is mounted on a circuit substrate, and solder balls are heated and melted to couple the electrodes of the semiconductor chip with connection pads of the circuit substrate electrically and mechanically. In implementing this method, it becomes necessary to align and stick onto electrodes of the semiconductor chip or connection pads of the circuit substrate.
  • solder balls Such alignment of solder balls has heretofore been performed as follows. First of all, a mask having a number of holes corresponding to aligned positions of the solder balls is placed on the electrode face of the semiconductor chip or the component mounting face of the circuit substrate, and solder balls are supplied onto the mask. Under this state, the mask is vibrated to put solder balls into holes of the mask, or solder balls are put into holes manually one by one by using a tool such as a vacuum pincette or a brush. Thereafter extra solder balls existing on the mask are removed by using a brush, for example.
  • solder balls might adhere to each other and solder balls might adhere to a tool such as a brush because of static electricity. Therefore, solder balls might not get easily into holes of the mask and solder balls aligned once might jump out from holes when extra solder balls on the mask are removed, resulting in a problem of extremely low work efficiency.
  • An object of the present invention is to provide an efficient method for aligning solder balls with the above described problem.
  • the above described object is achieved by supplying solder balls on an aligning plate having aligned through-holes formed therein and sucking air from the bottom of the aligning plate to make the solder balls fit into and adhere to the through-holes.
  • solder balls supplied onto the aligning plate are attracted into through-holes of the aligning plate by air, it is possible to align solder balls on the aligning plate sufficiently without being affected by static electricity. Since solder balls aligned once are attracted into through-holes of the aligning plate, solder balls already aligned do not jump out from the through-holes when extra solder balls are removed by a brush or the like. Therefore, efficient aligning work becomes possible.
  • Figs. 1 and 2 are rough sectional views used for explaining an embodiment of the present invention.
  • numeral 1 denotes an alignment plate, which is formed by sticking two plates, i.e., a lower plate 2 and an upper plate 3 together.
  • the material of the plates 2 and 3 comprises glass or ceramics, for example.
  • glass photo­sensitive glass having excellent working performance, heat-resistance and adaptability in the rate of expansion with semiconductor chip, for example, is often used.
  • through-holes 4 having smaller diameters than outer diameters of solder balls to be aligned are opened at positions corresponding to alignment positions.
  • through-holes 5 having slightly larger diameters than outside diameters of solder balls are opened at positions corresponding to the through-holes 4.
  • Numeral 6 denotes an aligning plate fixing block for fixing the aligning plate 1.
  • An air sucking nozzle 8 is coupled to the aligning plate fixing block 6 so as to face an opening 7 of the aligning plate fixing block.
  • the air sucking nozzle 8 is connected to a vacuum pump or the like, which is not illustrated, via a tube or the like.
  • the aligning plate 1 is fixed to the aligning plate fixing block 6 and solder balls 9 are supplied onto the aligning plate 1.
  • Air suction using the sucking nozzle 8 is then started. Since air on the surface of the aligning plate 1 is sucked via the through-holes 4 and 5, solder balls 9 located near through-holes 5 are attracted into the through-holes together with air and eventually attracted and held under the state that they are fitted into the through-holes 5. That is to say, the through-holes 5 serve as guide holes for attracting solder balls 9, while the lower through­holes 4 actually position and attract the solder balls.
  • solder balls 9 are aligned at all through-hole positions, the surface of the aligning plate 1 is swept by a brush 10 as shown in Fig. 2, for example, to remove extra solder balls existing on the aligning plate 1. Since solder balls already aligned are held in the through-holes 4 by the air suction during this work, solder balls already aligned do not jump out from the through-holes 4. The fact that only upper portions of the aligned solder balls protrude slightly from the surface of the aligning plate 1 and most portions of the aligned solder balls are within the through-holes 5 is also effective in preventing the escape of the solder balls already aligned.
  • the air suction is stopped, and the aligning plate 1 for aligning the solder balls is removed from the aligning plate fixing block 6. The work for aligning the solder balls is thus completed.
  • the aligning plates 2 and 3 are removed from the aligning plate fixing block 6, and a circuit substrate 11 is placed on the aligning plates 2 and 3 to perform soldering work, as shown in Fig. 3.
  • solder balls are supplied onto the aligning plate under the state that the air suction is stopped in the above described embodiment.
  • solder balls may be supplied while the air suction is being performed.
  • the structure of the aligning plate may be changed suitably.
  • two plates of the aligning plate 1, i.e., the lower plate 2 and the upper plate 3 may be formed as one body.
  • the method of the present invention is similarly applicable to alignment of small balls other than solder balls.
  • the present invention brings about an effect that solder balls can be aligned easily and efficiently.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
EP88112127A 1987-09-14 1988-07-27 Procédé et appareil pour aligner des billes de soudure Expired - Lifetime EP0307591B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP230406/87 1987-09-14
JP62230406A JPH0795554B2 (ja) 1987-09-14 1987-09-14 はんだ球整列装置

Publications (3)

Publication Number Publication Date
EP0307591A2 true EP0307591A2 (fr) 1989-03-22
EP0307591A3 EP0307591A3 (en) 1990-10-03
EP0307591B1 EP0307591B1 (fr) 1994-03-23

Family

ID=16907384

Family Applications (1)

Application Number Title Priority Date Filing Date
EP88112127A Expired - Lifetime EP0307591B1 (fr) 1987-09-14 1988-07-27 Procédé et appareil pour aligner des billes de soudure

Country Status (5)

Country Link
US (1) US4871110A (fr)
EP (1) EP0307591B1 (fr)
JP (1) JPH0795554B2 (fr)
KR (1) KR910004514B1 (fr)
DE (1) DE3888607T2 (fr)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5118027A (en) * 1991-04-24 1992-06-02 International Business Machines Corporation Method of aligning and mounting solder balls to a substrate
EP0527387A1 (fr) * 1989-09-11 1993-02-17 Nippon Steel Corporation Procédés et dispositif pour fixer un plot de contact aux conducteurs d'une bande TAB
US5219117A (en) * 1991-11-01 1993-06-15 Motorola, Inc. Method of transferring solder balls onto a semiconductor device
US5454159A (en) * 1994-02-18 1995-10-03 Unisys Corporation Method of manufacturing I/O terminals on I/O pads
EP0796200A2 (fr) * 1994-09-14 1997-09-24 Vanguard Automation, Inc. Procede et appareil de remplissage d'une grille a globules de soudure
US5758409A (en) * 1995-10-31 1998-06-02 Matsushita Electric Industrial Co., Ltd Conductive ball-placing apparatus
EP0854520A2 (fr) * 1997-01-20 1998-07-22 Oki Electric Industry Co., Ltd. Méthode de fixation d'un dispositif semiconducteur optique sur un substrat
EP0901165A1 (fr) * 1997-09-05 1999-03-10 Matra Marconi Space France Boítier à microcircuit intégré et procédé de montage de microcircuit intégré
EP0902610A1 (fr) * 1997-09-10 1999-03-17 STMicroelectronics S.r.l. Arrangement ordonné de billes de soudage sur les plages de contact correspondantes de la plaque de base d'un dispositif à réseau de billes (BGA)
WO1999040620A1 (fr) * 1998-02-04 1999-08-12 E.I. Du Pont De Nemours And Company Procede et appareil ameliores permettant de faire adherer et de centrer des particules sur des aires adhesives d'une surface presentant un ensemble d'aires adhesives et non adhesives
EP0964442A1 (fr) * 1997-01-30 1999-12-15 Nippon Steel Corporation Substrat d'agencement de billes pour former des bosses, tete d'agencement de billes, dispositif d'agencement de billes et procede d'agencement de billes
WO2001035458A1 (fr) * 1999-11-05 2001-05-17 Universal Instruments Corporation Procede et appareil servant a assembler un boitier a grille matricielle a billes ou a echelle d'une puce
FR2860177A1 (fr) * 2003-09-26 2005-04-01 Novatec Procede et dispositif de prehension de billes a partir d'un conditionnement en vrac
EP1211720A3 (fr) * 2000-11-10 2006-07-05 Hitachi, Ltd. Procédé et dispositif pour la formation de bosses de soudage

Families Citing this family (88)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2629435B2 (ja) * 1990-10-17 1997-07-09 日本電気株式会社 アレイ状光素子用サブ基板の作製方法
US5145104A (en) * 1991-03-21 1992-09-08 International Business Machines Corporation Substrate soldering in a reducing atmosphere
US5205896A (en) * 1992-02-03 1993-04-27 Hughes Aircraft Company Component and solder preform placement device and method of placement
GB2269335A (en) * 1992-08-04 1994-02-09 Ibm Solder particle deposition
US5788143A (en) * 1992-04-08 1998-08-04 International Business Machines Corporation Solder particle deposition
US5284287A (en) * 1992-08-31 1994-02-08 Motorola, Inc. Method for attaching conductive balls to a substrate
JPH07122594A (ja) * 1993-10-28 1995-05-12 Hitachi Ltd 導電性バンプの形成方法
JP3290788B2 (ja) * 1993-12-14 2002-06-10 富士通株式会社 プリント基板の半田膜形成装置
US5431332A (en) * 1994-02-07 1995-07-11 Motorola, Inc. Method and apparatus for solder sphere placement using an air knife
US5657528A (en) * 1994-08-25 1997-08-19 Matsushita Electric Industrial Co., Ltd. Method of transferring conductive balls
JP3271461B2 (ja) * 1995-02-07 2002-04-02 松下電器産業株式会社 半田ボールの搭載装置および搭載方法
US5620129A (en) * 1995-02-17 1997-04-15 Rogren; Philip E. Device and method for forming and attaching an array of conductive balls
TW267265B (en) * 1995-06-12 1996-01-01 Connector Systems Tech Nv Low cross talk and impedance controlled electrical connector
US6939173B1 (en) 1995-06-12 2005-09-06 Fci Americas Technology, Inc. Low cross talk and impedance controlled electrical connector with solder masses
JP3158966B2 (ja) * 1995-06-19 2001-04-23 松下電器産業株式会社 バンプ付電子部品の製造装置および製造方法
US5685477A (en) * 1995-06-28 1997-11-11 Intel Corporation Method for attaching and handling conductive spheres to a substrate
US5899376A (en) * 1995-07-11 1999-05-04 Nippon Steel Corporation Transfer of flux onto electrodes and production of bumps on electrodes
US5687901A (en) * 1995-11-14 1997-11-18 Nippon Steel Corporation Process and apparatus for forming ball bumps
US6099935A (en) * 1995-12-15 2000-08-08 International Business Machines Corporation Apparatus for providing solder interconnections to semiconductor and electronic packaging devices
US5782399A (en) * 1995-12-22 1998-07-21 Tti Testron, Inc. Method and apparatus for attaching spherical and/or non-spherical contacts to a substrate
US5816482A (en) * 1996-04-26 1998-10-06 The Whitaker Corporation Method and apparatus for attaching balls to a substrate
US6024584A (en) * 1996-10-10 2000-02-15 Berg Technology, Inc. High density connector
US6093035A (en) * 1996-06-28 2000-07-25 Berg Technology, Inc. Contact for use in an electrical connector
US5762258A (en) * 1996-07-23 1998-06-09 International Business Machines Corporation Method of making an electronic package having spacer elements
US6063701A (en) * 1996-09-14 2000-05-16 Ricoh Company, Ltd. Conductive particle transferring method
US6241535B1 (en) 1996-10-10 2001-06-05 Berg Technology, Inc. Low profile connector
SG71046A1 (en) 1996-10-10 2000-03-21 Connector Systems Tech Nv High density connector and method of manufacture
US6042389A (en) * 1996-10-10 2000-03-28 Berg Technology, Inc. Low profile connector
US6139336A (en) 1996-11-14 2000-10-31 Berg Technology, Inc. High density connector having a ball type of contact surface
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WO1999040620A1 (fr) * 1998-02-04 1999-08-12 E.I. Du Pont De Nemours And Company Procede et appareil ameliores permettant de faire adherer et de centrer des particules sur des aires adhesives d'une surface presentant un ensemble d'aires adhesives et non adhesives
WO2001035458A1 (fr) * 1999-11-05 2001-05-17 Universal Instruments Corporation Procede et appareil servant a assembler un boitier a grille matricielle a billes ou a echelle d'une puce
US6484927B1 (en) 1999-11-05 2002-11-26 Delaware Capital Formation Corporation Method and apparatus for balling and assembling ball grid array and chip scale array packages
EP1211720A3 (fr) * 2000-11-10 2006-07-05 Hitachi, Ltd. Procédé et dispositif pour la formation de bosses de soudage
FR2860177A1 (fr) * 2003-09-26 2005-04-01 Novatec Procede et dispositif de prehension de billes a partir d'un conditionnement en vrac
WO2005031847A1 (fr) * 2003-09-26 2005-04-07 Novatec Sa Procede et dispositif de prehension de billes a partir d'un conditionnement en vrac

Also Published As

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EP0307591A3 (en) 1990-10-03
KR910004514B1 (ko) 1991-07-05
DE3888607T2 (de) 1994-06-30
JPH0795554B2 (ja) 1995-10-11
JPS6473625A (en) 1989-03-17
DE3888607D1 (de) 1994-04-28
KR890006132A (ko) 1989-05-18
EP0307591B1 (fr) 1994-03-23
US4871110A (en) 1989-10-03

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