DK2771182T3 - Indkapslingsbarrierestak - Google Patents
Indkapslingsbarrierestak Download PDFInfo
- Publication number
- DK2771182T3 DK2771182T3 DK12843853.8T DK12843853T DK2771182T3 DK 2771182 T3 DK2771182 T3 DK 2771182T3 DK 12843853 T DK12843853 T DK 12843853T DK 2771182 T3 DK2771182 T3 DK 2771182T3
- Authority
- DK
- Denmark
- Prior art keywords
- barrier stack
- encapsulation barrier
- encapsulation
- stack
- barrier
- Prior art date
Links
- 238000005538 encapsulation Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/40—Coatings including alternating layers following a pattern, a periodic or defined repetition
- C23C28/42—Coatings including alternating layers following a pattern, a periodic or defined repetition characterized by the composition of the alternating layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/80—Constructional details
- H10K10/88—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
- H10K30/80—Constructional details
- H10K30/88—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
- H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/331—Nanoparticles used in non-emissive layers, e.g. in packaging layer
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
- H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Metallurgy (AREA)
- Nanotechnology (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Composite Materials (AREA)
- Crystallography & Structural Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201161550764P | 2011-10-24 | 2011-10-24 | |
PCT/SG2012/000402 WO2013062486A1 (en) | 2011-10-24 | 2012-10-24 | Encapsulation barrier stack |
Publications (1)
Publication Number | Publication Date |
---|---|
DK2771182T3 true DK2771182T3 (da) | 2019-08-19 |
Family
ID=48168174
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK12843853.8T DK2771182T3 (da) | 2011-10-24 | 2012-10-24 | Indkapslingsbarrierestak |
Country Status (14)
Country | Link |
---|---|
US (2) | US20140252342A1 (da) |
EP (2) | EP2771182B1 (da) |
JP (1) | JP6193245B2 (da) |
KR (1) | KR102082460B1 (da) |
CN (1) | CN104039544A (da) |
AU (1) | AU2012329403B2 (da) |
CA (1) | CA2852879A1 (da) |
DK (1) | DK2771182T3 (da) |
MX (1) | MX2014004592A (da) |
MY (1) | MY166867A (da) |
RU (1) | RU2618824C2 (da) |
SG (1) | SG11201401022SA (da) |
WO (1) | WO2013062486A1 (da) |
ZA (1) | ZA201402225B (da) |
Families Citing this family (71)
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---|---|---|---|---|
CN105189103A (zh) * | 2012-10-18 | 2015-12-23 | 泰拉屏障膜公司 | 封装阻隔叠层 |
JPWO2014141330A1 (ja) * | 2013-03-13 | 2017-02-16 | パナソニック株式会社 | 電子デバイス |
JP6523252B2 (ja) * | 2013-05-02 | 2019-05-29 | テラ‐バリア フィルムズ プライベート リミテッド | デンドリマーでカプセル化されたナノ粒子を含むカプセル化バリアスタック |
KR102279390B1 (ko) * | 2013-07-24 | 2021-07-21 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 접착제 배리어 필름 구조물 |
CN103440824B (zh) * | 2013-08-07 | 2016-08-10 | 北京京东方光电科技有限公司 | 一种有机电致发光显示面板、其制造方法及显示装置 |
KR102116497B1 (ko) * | 2013-09-25 | 2020-05-29 | 삼성디스플레이 주식회사 | 유기발광 디스플레이 장치 및 그 제조방법 |
FR3012345B1 (fr) | 2013-10-29 | 2017-07-28 | Commissariat Energie Atomique | Dispositif d'encapsulation d'un dispositif sensible et procede de realisation dudit dispositif |
KR102100767B1 (ko) * | 2013-11-26 | 2020-04-21 | 엘지디스플레이 주식회사 | 유기발광 표시장치 및 그 제조방법 |
CN104070742A (zh) * | 2014-06-17 | 2014-10-01 | 中国科学院广州能源研究所 | 一种阻隔水汽和防氧渗透的薄膜 |
US10490521B2 (en) * | 2014-06-26 | 2019-11-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Advanced structure for info wafer warpage reduction |
US20160027966A1 (en) * | 2014-07-25 | 2016-01-28 | Nanosys, Inc. | Porous Quantum Dot Carriers |
JP2016063096A (ja) * | 2014-09-18 | 2016-04-25 | 株式会社東芝 | グラフェン配線とその製造方法 |
JP6117758B2 (ja) * | 2014-09-30 | 2017-04-19 | 富士フイルム株式会社 | 積層フィルム、バックライトユニット、液晶表示装置、および、積層フィルムの製造方法 |
US10008396B2 (en) * | 2014-10-06 | 2018-06-26 | Lam Research Corporation | Method for collapse-free drying of high aspect ratio structures |
CN105576056A (zh) * | 2014-11-06 | 2016-05-11 | 汉能新材料科技有限公司 | 一种柔性封装复合膜 |
CN107112200B (zh) * | 2014-11-17 | 2021-03-26 | Sage电致变色显示有限公司 | 多阻挡层封装叠层 |
EP3034548A1 (en) * | 2014-12-18 | 2016-06-22 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO | Barrier film laminate comprising submicron getter particles and electronic device comprising such a laminate |
KR102375891B1 (ko) * | 2014-12-24 | 2022-03-16 | 삼성전자주식회사 | 투명전극 및 이를 포함하는 전자 소자 |
JP6247649B2 (ja) * | 2015-02-02 | 2017-12-13 | 富士フイルム株式会社 | 機能性複合フィルムおよび波長変換フィルム |
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CN104851846A (zh) * | 2015-03-25 | 2015-08-19 | 中山大学 | 一种柔性防水氧封装结构及其制备方法和应用 |
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US10134995B2 (en) | 2016-01-29 | 2018-11-20 | University Of Kentucky Research Foundation | Water processable N-type organic semiconductor |
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US10710116B2 (en) * | 2017-09-21 | 2020-07-14 | General Electric Company | Methods and systems for manufacturing an ultrasound probe |
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US11489082B2 (en) | 2019-07-30 | 2022-11-01 | Epic Battery Inc. | Durable solar panels |
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US11239397B2 (en) * | 2019-12-11 | 2022-02-01 | Mikro Mesa Technology Co., Ltd. | Breathable and waterproof micro light emitting diode display |
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CN111146360A (zh) * | 2019-12-27 | 2020-05-12 | 福建华佳彩有限公司 | 一种薄膜封装结构及其制作方法 |
US11647645B2 (en) | 2021-01-13 | 2023-05-09 | Tpk Advanced Solutions Inc. | Cover plate used in electronic device, electronic device, and method of manufacturing cover plate |
CN112969307B (zh) * | 2021-02-01 | 2024-02-09 | 深圳瑞君新材料技术有限公司 | 一种碳基填充材料的制备方法 |
CN113008945B (zh) * | 2021-02-09 | 2022-08-23 | 中国石油大学(华东) | 一种摩擦纳米发电机驱动的微型气体检测***及其制备方法及应用 |
WO2023279111A1 (en) * | 2021-07-02 | 2023-01-05 | Coreshell Technologies, Inc. | Nanostructured seed layers for lithium metal deposition |
CN114267809B (zh) * | 2021-12-15 | 2023-11-03 | 深圳市华星光电半导体显示技术有限公司 | 显示面板及其制备方法 |
CN114695896B (zh) * | 2022-03-14 | 2023-07-18 | 电子科技大学 | 一种电子器件的自组装高阻隔薄膜封装方法 |
WO2024055091A1 (pt) * | 2022-09-14 | 2024-03-21 | Instituto Hercílio Randon | Preparado de nanopartículas, premix compreendendo o preparado de nanopartículas e monômero, método para modulação de propriedade química e/ou mecânica de um polímero, processo de obtenção de polímero modificado e polímero modificado |
EP4386783A1 (en) | 2022-12-16 | 2024-06-19 | Nexans | Composite water barrier |
CN116814174B (zh) * | 2023-08-24 | 2023-11-28 | 佛山市奥川顺新材料实业有限公司 | 一种复合型pet保护膜及其制备方法 |
CN116825742B (zh) * | 2023-08-28 | 2023-11-03 | 合肥阿基米德电子科技有限公司 | 一种预成型焊片及其制备方法与应用 |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5607789A (en) * | 1995-01-23 | 1997-03-04 | Duracell Inc. | Light transparent multilayer moisture barrier for electrochemical cell tester and cell employing same |
US5916685A (en) | 1996-07-09 | 1999-06-29 | Tetra Laval Holdings & Finance, Sa | Transparent high barrier multilayer structure |
US6465953B1 (en) * | 2000-06-12 | 2002-10-15 | General Electric Company | Plastic substrates with improved barrier properties for devices sensitive to water and/or oxygen, such as organic electroluminescent devices |
CN1536936A (zh) * | 2003-04-11 | 2004-10-13 | 胜园科技股份有限公司 | 纳米复合胶材的有机电激发光元件及其封装方法 |
US7261230B2 (en) | 2003-08-29 | 2007-08-28 | Freescale Semiconductor, Inc. | Wirebonding insulated wire and capillary therefor |
US7781034B2 (en) | 2004-05-04 | 2010-08-24 | Sigma Laboratories Of Arizona, Llc | Composite modular barrier structures and packages |
WO2006006349A1 (ja) * | 2004-07-07 | 2006-01-19 | Kaneka Corporation | ポリマー修飾ナノ粒子の製造方法 |
JP2007069270A (ja) * | 2005-09-02 | 2007-03-22 | Institute Of Physical & Chemical Research | 高分散性無機ナノ粒子 |
DE102005047739B3 (de) * | 2005-09-29 | 2007-02-08 | Siemens Ag | Substrat mit aufgebrachter Beschichtung, und Herstellungsverfahren |
US8039739B1 (en) | 2006-05-05 | 2011-10-18 | Nanosolar, Inc. | Individually encapsulated solar cells and solar cell strings |
FR2903412B1 (fr) * | 2006-07-07 | 2012-10-05 | Cray Valley Sa | Pre-polymere urethane - polyester insature et ses applications |
EP2082619B1 (en) * | 2006-11-06 | 2022-10-12 | Agency for Science, Technology And Research | Nanoparticulate encapsulation barrier stack |
US20080138538A1 (en) * | 2006-12-06 | 2008-06-12 | General Electric Company | Barrier layer, composite article comprising the same, electroactive device, and method |
EP2102630B1 (en) | 2006-12-28 | 2014-12-03 | Agency for Science, Technology And Research | Encapsulated device with integrated gas permeation sensor |
WO2009005975A1 (en) * | 2007-06-29 | 2009-01-08 | 3M Innovative Properties Company | Flexible hardcoat compositions, articles, and methods |
EP2048116A1 (en) * | 2007-10-09 | 2009-04-15 | ChemIP B.V. | Dispersion of nanoparticles in organic solvents |
DE102008031405A1 (de) * | 2008-07-02 | 2010-01-07 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines organischen elektronischen Bauelements und organisches elektronisches Bauelement |
WO2009126115A1 (en) * | 2008-04-09 | 2009-10-15 | Agency For Science, Technology And Research | Multilayer film for encapsulating oxygen and/or moisture sensitive electronic devices |
KR20100026081A (ko) * | 2008-08-29 | 2010-03-10 | 고려대학교 기술지주 (주) | 밀봉제 조성물 및 그 제조 방법 |
ITMI20082206A1 (it) * | 2008-12-12 | 2010-06-13 | Getters Spa | Materiale composito per la protezione di dispositivi sensibili ad h2o costituito da nanozeoliti disperse in una matrice polimerica |
JP2012513887A (ja) * | 2008-12-29 | 2012-06-21 | バイブ ナノ, インコーポレイテッド | ナノスケール触媒 |
JP5717035B2 (ja) * | 2009-06-02 | 2015-05-13 | エージェンシー フォー サイエンス,テクノロジー アンド リサーチ | 多層バリアフィルム |
US20110079756A1 (en) * | 2009-10-02 | 2011-04-07 | Doris Pik-Yiu Chun | Polymer-encapsulated nanoparticle systems |
JP2011194653A (ja) * | 2010-03-18 | 2011-10-06 | Dainippon Printing Co Ltd | 防湿性積層体 |
US8796372B2 (en) * | 2011-04-29 | 2014-08-05 | Rensselaer Polytechnic Institute | Self-healing electrical insulation |
-
2012
- 2012-10-24 EP EP12843853.8A patent/EP2771182B1/en not_active Not-in-force
- 2012-10-24 CN CN201280052305.6A patent/CN104039544A/zh active Pending
- 2012-10-24 SG SG11201401022SA patent/SG11201401022SA/en unknown
- 2012-10-24 DK DK12843853.8T patent/DK2771182T3/da active
- 2012-10-24 CA CA2852879A patent/CA2852879A1/en not_active Abandoned
- 2012-10-24 WO PCT/SG2012/000402 patent/WO2013062486A1/en active Application Filing
- 2012-10-24 MY MYPI2014700805A patent/MY166867A/en unknown
- 2012-10-24 JP JP2014538754A patent/JP6193245B2/ja not_active Expired - Fee Related
- 2012-10-24 RU RU2014111285A patent/RU2618824C2/ru active
- 2012-10-24 US US14/354,118 patent/US20140252342A1/en not_active Abandoned
- 2012-10-24 AU AU2012329403A patent/AU2012329403B2/en not_active Ceased
- 2012-10-24 EP EP19173228.8A patent/EP3593992A1/en not_active Withdrawn
- 2012-10-24 KR KR1020147009719A patent/KR102082460B1/ko active IP Right Grant
- 2012-10-24 MX MX2014004592A patent/MX2014004592A/es active IP Right Grant
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2014
- 2014-03-26 ZA ZA2014/02225A patent/ZA201402225B/en unknown
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2018
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ZA201402225B (en) | 2015-04-29 |
EP2771182A1 (en) | 2014-09-03 |
AU2012329403B2 (en) | 2015-08-20 |
US20140252342A1 (en) | 2014-09-11 |
MX2014004592A (es) | 2014-11-26 |
KR102082460B1 (ko) | 2020-02-27 |
SG11201401022SA (en) | 2014-04-28 |
WO2013062486A1 (en) | 2013-05-02 |
US20190027414A1 (en) | 2019-01-24 |
EP2771182B1 (en) | 2019-05-15 |
MY166867A (en) | 2018-07-24 |
AU2012329403A1 (en) | 2014-04-10 |
JP6193245B2 (ja) | 2017-09-06 |
KR20140093213A (ko) | 2014-07-25 |
CA2852879A1 (en) | 2013-05-02 |
EP3593992A1 (en) | 2020-01-15 |
RU2014111285A (ru) | 2015-12-27 |
RU2618824C2 (ru) | 2017-05-11 |
EP2771182A4 (en) | 2015-06-10 |
CN104039544A (zh) | 2014-09-10 |
JP2015502869A (ja) | 2015-01-29 |
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