DK229285A - METHOD FOR ASSEMBLING ELECTRONIC CIRCUITS - Google Patents
METHOD FOR ASSEMBLING ELECTRONIC CIRCUITS Download PDFInfo
- Publication number
- DK229285A DK229285A DK229285A DK229285A DK229285A DK 229285 A DK229285 A DK 229285A DK 229285 A DK229285 A DK 229285A DK 229285 A DK229285 A DK 229285A DK 229285 A DK229285 A DK 229285A
- Authority
- DK
- Denmark
- Prior art keywords
- electronic circuits
- assembling electronic
- assembling
- circuits
- electronic
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0469—Surface mounting by applying a glue or viscous material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0537—Transfer of pre-fabricated insulating pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Supply And Installment Of Electrical Components (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB08325803A GB2147148A (en) | 1983-09-27 | 1983-09-27 | Electronic circuit assembly |
PCT/GB1984/000330 WO1985001634A1 (en) | 1983-09-27 | 1984-09-27 | Electronic circuit assembly |
Publications (2)
Publication Number | Publication Date |
---|---|
DK229285A true DK229285A (en) | 1985-05-23 |
DK229285D0 DK229285D0 (en) | 1985-05-23 |
Family
ID=10549343
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK229285A DK229285D0 (en) | 1983-09-27 | 1985-05-23 | METHOD FOR ASSEMBLING ELECTRONIC CIRCUITS |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP0159331A1 (en) |
JP (1) | JPS61500047A (en) |
KR (1) | KR850700100A (en) |
DK (1) | DK229285D0 (en) |
GB (1) | GB2147148A (en) |
WO (1) | WO1985001634A1 (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0218832B1 (en) * | 1985-09-30 | 1990-11-22 | Siemens Aktiengesellschaft | Surface-mounted component and method of affixing a surface-mounted component |
CA1278876C (en) * | 1986-12-25 | 1991-01-08 | Sho Masujima | Adhesive mounted electronic circuit element |
GB8727926D0 (en) * | 1987-11-28 | 1987-12-31 | British Aerospace | Surface mounting leadless components on conductor pattern supporting substrates |
DE3806738C1 (en) * | 1988-03-02 | 1989-09-07 | Espe Stiftung & Co Produktions- Und Vertriebs Kg, 8031 Seefeld, De | |
FR2629953B1 (en) * | 1988-04-06 | 1991-07-05 | Sagem | ELECTRICAL COMPONENT, ESPECIALLY ELECTRIC MOTOR, EQUIPPED WITH DOUBLE PAIRS OF CONTACTS, PARTICULARLY FOR ALLOWING TWO DIFFERENT LOCATIONS ON A PRINTED CIRCUIT PLATE |
EP0378233B1 (en) * | 1989-01-13 | 1994-12-28 | Matsushita Electric Industrial Co., Ltd. | An adhesive composition for use in the mounting of electronic parts and a method for mounting electronic parts on a printed circuit board by the use of the same |
DE58909888C5 (en) * | 1989-05-31 | 2017-03-02 | Osram Gesellschaft mit beschränkter Haftung | A method of manufacturing a surface mount opto-device and surface mount opto-device |
JPH03145186A (en) * | 1989-10-30 | 1991-06-20 | Mitsubishi Electric Corp | Semiconductor module |
JPH0828565B2 (en) * | 1990-09-06 | 1996-03-21 | ティーディーケイ株式会社 | How to mount electronic components on printed circuit boards |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1221914A (en) * | 1969-06-13 | 1971-02-10 | Standard Telephones Cables Ltd | Manufacture of integrated circuits |
GB1467245A (en) * | 1973-07-10 | 1977-03-16 | Lucas Industries Ltd | Method of securing component to a substrate |
JPS53130831A (en) * | 1977-04-20 | 1978-11-15 | Schreiber Klaeranlagen | Apparatus for cleaning dust receiving grate arranged in water way |
JPS54155810A (en) * | 1978-05-29 | 1979-12-08 | Tdk Corp | Bonding method of electronic parts |
JPS5541793A (en) * | 1978-09-20 | 1980-03-24 | Matsushita Electric Ind Co Ltd | Method of mounting microminiature part |
JPS5726379Y2 (en) * | 1978-09-21 | 1982-06-08 | ||
JPS5582487A (en) * | 1978-12-18 | 1980-06-21 | Sony Corp | Electronic circuit device |
JPS55144828A (en) * | 1979-04-24 | 1980-11-12 | Onishi Hitoshi | Malt producing method and movable malt chamber |
JPS55156482U (en) * | 1979-04-26 | 1980-11-11 | ||
JPS5750497A (en) * | 1980-09-11 | 1982-03-24 | Mitsubishi Electric Corp | Method of mounting electric part on printed board |
DE3042043A1 (en) * | 1980-11-07 | 1982-05-27 | Nagel, Hans-Joachim, Dr., 2800 Bremen | DEVICE FOR Fattening poultry |
JPS5880894A (en) * | 1981-11-10 | 1983-05-16 | パイオニア株式会社 | Method of producing printed board |
JPS5885592A (en) * | 1981-11-18 | 1983-05-21 | パイオニア株式会社 | Method of producing printed board |
DE3226222A1 (en) * | 1982-07-14 | 1984-01-26 | Diehl GmbH & Co, 8500 Nürnberg | DEVICE FOR CONNECTING AN ELECTRODE TO A CARRIER |
-
1983
- 1983-09-27 GB GB08325803A patent/GB2147148A/en not_active Withdrawn
-
1984
- 1984-09-27 WO PCT/GB1984/000330 patent/WO1985001634A1/en not_active Application Discontinuation
- 1984-09-27 EP EP84903558A patent/EP0159331A1/en not_active Withdrawn
- 1984-09-27 JP JP59503532A patent/JPS61500047A/en active Pending
-
1985
- 1985-05-17 KR KR1019850700044A patent/KR850700100A/en not_active Application Discontinuation
- 1985-05-23 DK DK229285A patent/DK229285D0/en not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
WO1985001634A1 (en) | 1985-04-11 |
GB2147148A (en) | 1985-05-01 |
EP0159331A1 (en) | 1985-10-30 |
GB8325803D0 (en) | 1983-10-26 |
KR850700100A (en) | 1985-10-21 |
JPS61500047A (en) | 1986-01-09 |
DK229285D0 (en) | 1985-05-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AHS | Application shelved for other reasons than non-payment |