ES528336A0 - Metodo para encapsular circuitos electronicos - Google Patents
Metodo para encapsular circuitos electronicosInfo
- Publication number
- ES528336A0 ES528336A0 ES528336A ES528336A ES528336A0 ES 528336 A0 ES528336 A0 ES 528336A0 ES 528336 A ES528336 A ES 528336A ES 528336 A ES528336 A ES 528336A ES 528336 A0 ES528336 A0 ES 528336A0
- Authority
- ES
- Spain
- Prior art keywords
- electronic circuits
- encapsulating electronic
- encapsulating
- circuits
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/296—Organo-silicon compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/453,004 US4508758A (en) | 1982-12-27 | 1982-12-27 | Encapsulated electronic circuit |
Publications (2)
Publication Number | Publication Date |
---|---|
ES8407625A1 ES8407625A1 (es) | 1984-10-01 |
ES528336A0 true ES528336A0 (es) | 1984-10-01 |
Family
ID=23798849
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES528336A Granted ES528336A0 (es) | 1982-12-27 | 1983-12-22 | Metodo para encapsular circuitos electronicos |
Country Status (4)
Country | Link |
---|---|
US (1) | US4508758A (es) |
EP (1) | EP0114474A1 (es) |
JP (1) | JPS59161054A (es) |
ES (1) | ES528336A0 (es) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4830922A (en) * | 1986-02-28 | 1989-05-16 | Sparrowhawk Bryan L | Removable controlled thickness conformal coating |
US4843036A (en) * | 1987-06-29 | 1989-06-27 | Eastman Kodak Company | Method for encapsulating electronic devices |
US4843280A (en) * | 1988-01-15 | 1989-06-27 | Siemens Corporate Research & Support, Inc. | A modular surface mount component for an electrical device or led's |
US4890383A (en) * | 1988-01-15 | 1990-01-02 | Simens Corporate Research & Support, Inc. | Method for producing displays and modular components |
US4913930A (en) * | 1988-06-28 | 1990-04-03 | Wacker Silicones Corporation | Method for coating semiconductor components on a dielectric film |
EP0364163A3 (en) * | 1988-10-14 | 1991-11-21 | AT&T Corp. | Electro-optic device including opaque protective regions |
US5019409A (en) * | 1989-01-27 | 1991-05-28 | Microelectronics And Computer Technology Corporation | Method for coating the top of an electrical device |
US4908935A (en) * | 1989-03-22 | 1990-03-20 | American Telephone And Telegraph Company, At&T Bell Laboratories | Method for fabricating electronic devices |
US5215801A (en) * | 1990-08-22 | 1993-06-01 | At&T Bell Laboratories | Silicone resin electronic device encapsulant |
US5240746A (en) * | 1991-02-25 | 1993-08-31 | Delco Electronics Corporation | System for performing related operations on workpieces |
US5271953A (en) * | 1991-02-25 | 1993-12-21 | Delco Electronics Corporation | System for performing work on workpieces |
US5368899A (en) * | 1992-02-28 | 1994-11-29 | Delco Electronics Corp. | Automatic vertical dip coater with simultaneous ultraviolet cure |
DE4329251C2 (de) * | 1993-08-31 | 1996-08-14 | Philips Patentverwaltung | Anordnung zum Schutz von gegen Überspannungen empfindlichen Bauelementen auf gedruckten Schaltungsplatten |
US5545440A (en) * | 1994-12-05 | 1996-08-13 | At&T Global Information Solutions Company (Aka Ncr Corporation) | Method and apparatus for polymer coating of substrates |
US6465743B1 (en) * | 1994-12-05 | 2002-10-15 | Motorola, Inc. | Multi-strand substrate for ball-grid array assemblies and method |
US5776798A (en) * | 1996-09-04 | 1998-07-07 | Motorola, Inc. | Semiconductor package and method thereof |
US6150193A (en) * | 1996-10-31 | 2000-11-21 | Amkor Technology, Inc. | RF shielded device |
US6962829B2 (en) * | 1996-10-31 | 2005-11-08 | Amkor Technology, Inc. | Method of making near chip size integrated circuit package |
US5981314A (en) | 1996-10-31 | 1999-11-09 | Amkor Technology, Inc. | Near chip size integrated circuit package |
KR19980042662A (ko) * | 1996-11-22 | 1998-08-17 | 윌리엄비.켐플러 | 집적 회로 칩 패키징 방법 |
KR20080111480A (ko) * | 2006-03-16 | 2008-12-23 | 제이에스알 가부시끼가이샤 | 산화물 미립자 함유 폴리실록산 조성물 및 그의 제조 방법 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3151099A (en) * | 1960-05-30 | 1964-09-29 | Rhone Poulenc Sa | Water curable organopolysiloxanes containing silicic esters and zirconic or titanic esters |
GB1304362A (es) * | 1969-04-25 | 1973-01-24 | ||
US3729445A (en) * | 1969-08-01 | 1973-04-24 | Dow Corning | Fluorosilicone polymers |
BE759621A (fr) * | 1969-12-01 | 1971-06-01 | Dow Corning | Copolymeres sequences d'organosiloxanes non corrosifs, vulcanisables a la temperature ambiante |
US3647917A (en) * | 1970-04-06 | 1972-03-07 | Dow Corning | Room temperature vulcanizable silicone rubber with unprimed adhesion |
US3642692A (en) * | 1970-04-09 | 1972-02-15 | Dow Corning | Room temperature vulcanizable silicone rubber with improved cleanability |
US3714709A (en) * | 1970-07-06 | 1973-02-06 | Rca Corp | Method of manufacturing thick-film hybrid integrated circuits |
US3706695A (en) * | 1970-10-12 | 1972-12-19 | Dow Corning | Method of preparing a silicone emulsion and regenerating same and electrically conductive product |
US3706840A (en) * | 1971-05-10 | 1972-12-19 | Intersil Inc | Semiconductor device packaging |
US3702835A (en) * | 1971-06-18 | 1972-11-14 | Dow Corning | Room temperature vulcanizable silicone elastomer containing molybdenum blue |
US3719635A (en) * | 1971-06-18 | 1973-03-06 | Dow Corning | Metal hydrocarbonoxides in room temperature vulcanizable silicone elastomers |
US3840492A (en) * | 1972-02-10 | 1974-10-08 | Gen Electric | Flame retardant organopolysiloxane composition |
US3847848A (en) * | 1972-12-04 | 1974-11-12 | Gen Electric | Two-part room temperature vulcanizable silicone rubber compositions |
US3968055A (en) * | 1974-10-25 | 1976-07-06 | Combustion Engineering, Inc. | Method of preparing conductive room temperature vulcanizing material |
US3996189A (en) * | 1975-04-29 | 1976-12-07 | American Optical Corporation | Optically clear filled silicone elastomers |
JPS6043869B2 (ja) * | 1977-12-28 | 1985-09-30 | 東芝シリコ−ン株式会社 | 常温硬化性ポリオルガノシロキサン組成物 |
US4257932A (en) * | 1978-06-27 | 1981-03-24 | General Electric Company | Curable compositions and process |
US4230754A (en) * | 1978-11-07 | 1980-10-28 | Sprague Electric Company | Bonding electronic component to molded package |
JPS55148446A (en) * | 1979-05-10 | 1980-11-19 | Nec Corp | Component for electric circuit |
JPS5636145A (en) * | 1979-08-31 | 1981-04-09 | Hitachi Ltd | Thin semiconductor integrated circuit device and its manufacture |
JPS56122145A (en) * | 1980-02-29 | 1981-09-25 | Shin Etsu Chem Co Ltd | Resin composition for sealing semiconductor device |
US4318939A (en) * | 1980-08-21 | 1982-03-09 | Western Electric Co., Incorporated | Stabilized catalyzed organopolysiloxanes |
US4395526A (en) * | 1981-06-26 | 1983-07-26 | General Electric Company | One package, stable, moisture curable, polyalkoxy-terminated organopolysiloxane compositions and method for making |
-
1982
- 1982-12-27 US US06/453,004 patent/US4508758A/en not_active Expired - Lifetime
-
1983
- 1983-12-12 EP EP83307537A patent/EP0114474A1/en not_active Withdrawn
- 1983-12-22 ES ES528336A patent/ES528336A0/es active Granted
- 1983-12-23 JP JP58242282A patent/JPS59161054A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
US4508758A (en) | 1985-04-02 |
ES8407625A1 (es) | 1984-10-01 |
JPS59161054A (ja) | 1984-09-11 |
EP0114474A1 (en) | 1984-08-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FD1A | Patent lapsed |
Effective date: 19990405 |