DK208087D0 - Fremgangsmaade og kredsloebskort til udfoerelse af test under burn-in af integrerede halvlederkredsloeb - Google Patents

Fremgangsmaade og kredsloebskort til udfoerelse af test under burn-in af integrerede halvlederkredsloeb

Info

Publication number
DK208087D0
DK208087D0 DK208087A DK208087A DK208087D0 DK 208087 D0 DK208087 D0 DK 208087D0 DK 208087 A DK208087 A DK 208087A DK 208087 A DK208087 A DK 208087A DK 208087 D0 DK208087 D0 DK 208087D0
Authority
DK
Denmark
Prior art keywords
procedure
circuit card
integrated semiconductor
semiconductor circuits
test during
Prior art date
Application number
DK208087A
Other languages
English (en)
Other versions
DK208087A (da
Inventor
Viggo Kamstrup Janum
Original Assignee
Scantest Systems A S
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Scantest Systems A S filed Critical Scantest Systems A S
Priority to DK208087A priority Critical patent/DK208087A/da
Publication of DK208087D0 publication Critical patent/DK208087D0/da
Priority to JP62144225A priority patent/JPS63274885A/ja
Priority to US07/184,505 priority patent/US4945302A/en
Publication of DK208087A publication Critical patent/DK208087A/da

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2868—Complete testing stations; systems; procedures; software aspects
    • G01R31/287—Procedures; Software aspects

Landscapes

  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
DK208087A 1987-04-24 1987-04-24 Fremgangsmaade og kredsloebskort til udfoerelse af test under burn-in af integrerede halvlederkredsloeb DK208087A (da)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DK208087A DK208087A (da) 1987-04-24 1987-04-24 Fremgangsmaade og kredsloebskort til udfoerelse af test under burn-in af integrerede halvlederkredsloeb
JP62144225A JPS63274885A (ja) 1987-04-24 1987-06-11 半導体集積回路をバ−ン・イン中に試験する方法及び回路基板
US07/184,505 US4945302A (en) 1987-04-24 1988-04-21 Process and a circuit board for performing tests during burn-in of integrated semi-conductor circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DK208087A DK208087A (da) 1987-04-24 1987-04-24 Fremgangsmaade og kredsloebskort til udfoerelse af test under burn-in af integrerede halvlederkredsloeb

Publications (2)

Publication Number Publication Date
DK208087D0 true DK208087D0 (da) 1987-04-24
DK208087A DK208087A (da) 1988-10-25

Family

ID=8109944

Family Applications (1)

Application Number Title Priority Date Filing Date
DK208087A DK208087A (da) 1987-04-24 1987-04-24 Fremgangsmaade og kredsloebskort til udfoerelse af test under burn-in af integrerede halvlederkredsloeb

Country Status (3)

Country Link
US (1) US4945302A (da)
JP (1) JPS63274885A (da)
DK (1) DK208087A (da)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5829128A (en) * 1993-11-16 1998-11-03 Formfactor, Inc. Method of mounting resilient contact structures to semiconductor devices
GB2258356B (en) * 1991-07-31 1995-02-22 Metron Designs Ltd Method and apparatus for conditioning an electronic component having a characteristic subject to variation with temperature
US5391984A (en) * 1991-11-01 1995-02-21 Sgs-Thomson Microelectronics, Inc. Method and apparatus for testing integrated circuit devices
US5278495A (en) * 1991-11-08 1994-01-11 Ncr Corporation Memory and apparatus for a thermally accelerated reliability testing
JPH07130817A (ja) * 1993-10-30 1995-05-19 Sony Corp 金属配線の信頼性評価方法及び金属配線の信頼性評価装置
US5677853A (en) * 1994-11-16 1997-10-14 Delco Electronics Corp. Product testing by statistical profile of test variables
US5798653A (en) * 1995-04-20 1998-08-25 Sun Microsystems, Inc. Burn-in system for reliable integrated circuit manufacturing
FR2750767B1 (fr) * 1996-07-08 1998-10-09 Dassault Electronique Dispositif de test de cartes electroniques dans des conditions speciales de temperature ou de traitement
US6327676B1 (en) * 1998-03-31 2001-12-04 Emc Corporation Test equipment
US6501290B2 (en) 1999-09-29 2002-12-31 Intel Corporation Direct to chuck coolant delivery for integrated circuit testing
US6433568B1 (en) * 2000-06-08 2002-08-13 Motorola, Inc. Massive parallel semiconductor manufacturing test process
US7023227B1 (en) * 2002-02-12 2006-04-04 National Semiconductor Corporation Apparatus for socketing and testing integrated circuits and methods of operating the same
US8201038B2 (en) * 2009-09-29 2012-06-12 International Business Machines Corporation Integrating design for reliability technology into integrated circuits
CN114076859A (zh) * 2020-08-18 2022-02-22 中国科学院国家空间科学中心 一种针对宇航用核心元器件的全温老炼测试***及其方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3609547A (en) * 1970-03-27 1971-09-28 Eugene A Slusser Integrated circuit test system
US3842346A (en) * 1972-12-20 1974-10-15 C Bobbitt Continuity testing of solid state circuitry during temperature cycling
US4374317A (en) * 1979-07-05 1983-02-15 Reliability, Inc. Burn-in chamber
US4379259A (en) * 1980-03-12 1983-04-05 National Semiconductor Corporation Process of performing burn-in and parallel functional testing of integrated circuit memories in an environmental chamber
JPS5951109B2 (ja) * 1980-08-29 1984-12-12 富士通株式会社 エ−ジング装置における高温部と低温部の接続方法
US4542341A (en) * 1982-01-04 1985-09-17 Artronics Corporation Electronic burn-in system
US4749947A (en) * 1986-03-10 1988-06-07 Cross-Check Systems, Inc. Grid-based, "cross-check" test structure for testing integrated circuits

Also Published As

Publication number Publication date
JPS63274885A (ja) 1988-11-11
US4945302A (en) 1990-07-31
DK208087A (da) 1988-10-25

Similar Documents

Publication Publication Date Title
DK208087D0 (da) Fremgangsmaade og kredsloebskort til udfoerelse af test under burn-in af integrerede halvlederkredsloeb
DK291184D0 (da) Fremgangsmaade og indretning til test af kredsloebsplader
DE69031551D1 (de) Integrierte Halbleiterschaltung und Testmethode dafür
EP0202905A3 (en) Semiconductor integrated circuit (ic) including circuit elements for evaluating the ic and means for testing the circuit elements
IT1224333B (it) Apparecchiatura di prova per schede di circuiti stampati e relativa sonda
DE69019402D1 (de) Prüfverfahren und -gerät für integrierte Schaltungen.
KR900006789A (ko) 전자장치를 시험하는 시험장치 및 방법과 시험장치를 갖춘 반도체장치
EP0128774A3 (en) High throughput circuit tester and test technique avoiding overdriving damage
GB2317456B (en) Wafer burn-in test circuit of semiconductor memory device
KR900008646A (ko) 반도체 집적회로의 레이아우트패턴(layout pattern)의 작성방법 및 작성장치
KR880700275A (ko) 전자 장치 테스트 방법 및 테스트용 집적 회로 테스터
DE68914738D1 (de) Gerät zur automatischen schaltungsinternen Prüfung von Teilnehmerschaltungen und Verfahren.
DE69319273T2 (de) Testverfahren für integrierte Halbleiter-Schaltung
DE68910322D1 (de) Verfahren zur Inspektion von Durchkontakt-Stiften in integrierten Schaltungspackungen mittels Photoemission.
KR880701967A (ko) 제거가능한 중첩층을 사용하여 전자회로 및 집적회로 칩을 시험하는 방법 및 구성
FR2604260B1 (fr) Testeur de circuits electroniques
FR2634025B1 (fr) Adaptateur de brochage pour le test de circuits imprimes de haute densite
KR900006791A (ko) Ic의 테스트 핀을 이용한 테스트 모드설정회로
KR910005447A (ko) 웨이퍼 스캐일(scale) 집적회로 장치
DK459789D0 (da) Metode og apparat til lokalisering af kortslutninger imellem kredsloeb
KR950015660U (ko) 웨이퍼 테스트용 프로브 카드의 탐침 고정장치
DE69120922D1 (de) Verfahren zum Prüfen von Temperaturmesschaltungen und Prüfer die dieses Verfahren anwendet
JPS53145576A (en) Measuring method of electrical characteristics of semiconductor wafers and probe card used in said method
FR2565354B3 (fr) Procede et dispositif de test de circuits integres sur tranches
EP0436337A3 (en) Technique for simplified testing of semiconductor circuits

Legal Events

Date Code Title Description
AHS Application shelved for other reasons than non-payment