DE69937180D1 - Lichtemittierende Halbleitervorrichtung in Chipbauweise - Google Patents

Lichtemittierende Halbleitervorrichtung in Chipbauweise

Info

Publication number
DE69937180D1
DE69937180D1 DE69937180T DE69937180T DE69937180D1 DE 69937180 D1 DE69937180 D1 DE 69937180D1 DE 69937180 T DE69937180 T DE 69937180T DE 69937180 T DE69937180 T DE 69937180T DE 69937180 D1 DE69937180 D1 DE 69937180D1
Authority
DE
Germany
Prior art keywords
chip
emitting device
type semiconductor
semiconductor light
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69937180T
Other languages
English (en)
Other versions
DE69937180T2 (de
Inventor
Hiroki Ishinaga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of DE69937180D1 publication Critical patent/DE69937180D1/de
Application granted granted Critical
Publication of DE69937180T2 publication Critical patent/DE69937180T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
DE69937180T 1998-10-23 1999-10-22 Lichtemittierende Halbleitervorrichtung in Chipbauweise Expired - Fee Related DE69937180T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP30178098 1998-10-23
JP30178098A JP3871820B2 (ja) 1998-10-23 1998-10-23 半導体発光素子

Publications (2)

Publication Number Publication Date
DE69937180D1 true DE69937180D1 (de) 2007-11-08
DE69937180T2 DE69937180T2 (de) 2009-07-09

Family

ID=17901093

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69937180T Expired - Fee Related DE69937180T2 (de) 1998-10-23 1999-10-22 Lichtemittierende Halbleitervorrichtung in Chipbauweise

Country Status (4)

Country Link
US (1) US6180962B1 (de)
EP (1) EP0996172B1 (de)
JP (1) JP3871820B2 (de)
DE (1) DE69937180T2 (de)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3887124B2 (ja) * 1999-04-30 2007-02-28 ローム株式会社 チップ型半導体発光素子
JP2001034983A (ja) * 1999-07-14 2001-02-09 Sankyo Seiki Mfg Co Ltd 光ピックアップ装置用受発光素子
JP3895086B2 (ja) * 1999-12-08 2007-03-22 ローム株式会社 チップ型半導体発光装置
JP5110744B2 (ja) * 2000-12-21 2012-12-26 フィリップス ルミレッズ ライティング カンパニー リミテッド ライアビリティ カンパニー 発光装置及びその製造方法
US20020114591A1 (en) * 2001-02-22 2002-08-22 International Business Machines Corporation Optical subassembly for fiber arrays with a 90 degree conductor turn
JP4979107B2 (ja) * 2001-03-15 2012-07-18 ローム株式会社 Ｌｅｄ装置
US6583447B2 (en) * 2001-08-27 2003-06-24 Harvatek Corp. Multiple LED chip package
US6501103B1 (en) * 2001-10-23 2002-12-31 Lite-On Electronics, Inc. Light emitting diode assembly with low thermal resistance
US7775685B2 (en) * 2003-05-27 2010-08-17 Cree, Inc. Power surface mount light emitting die package
US7244965B2 (en) 2002-09-04 2007-07-17 Cree Inc, Power surface mount light emitting die package
JP3910171B2 (ja) * 2003-02-18 2007-04-25 シャープ株式会社 半導体発光装置、その製造方法および電子撮像装置
JP4514413B2 (ja) * 2003-04-14 2010-07-28 豊田合成株式会社 Ｌｅｄランプ及びその製造方法
TW576614U (en) * 2003-06-30 2004-02-11 Yi-Chen Tang Low-voltage driven high-brightness LED
US7276782B2 (en) * 2003-10-31 2007-10-02 Harvatek Corporation Package structure for semiconductor
US20050179041A1 (en) * 2004-02-18 2005-08-18 Lumileds Lighting U.S., Llc Illumination system with LEDs
US7980743B2 (en) 2005-06-14 2011-07-19 Cree, Inc. LED backlighting for displays
EP1959505B1 (de) * 2007-02-14 2015-09-09 Tridonic Jennersdorf GmbH LED-Modul mit Linse und Herstellungsverfahren dafür
JP4205135B2 (ja) 2007-03-13 2009-01-07 シャープ株式会社 半導体発光装置、半導体発光装置用多連リードフレーム
TWI367552B (en) * 2007-08-22 2012-07-01 Everlight Electronics Co Ltd Soldering process for electrical component and apparatus thereof
CN102549785B (zh) * 2009-10-01 2014-12-17 日亚化学工业株式会社 发光装置
DE102010027313A1 (de) * 2010-07-16 2012-01-19 Osram Opto Semiconductors Gmbh Trägervorrichtung für einen Halbleiterchip, elektronisches Bauelement mit einer Trägervorrichtung und optoelektronisches Bauelement mit einer Trägervorrichtung
JP2011003928A (ja) * 2010-09-17 2011-01-06 Rohm Co Ltd 発光装置
JP6262816B2 (ja) * 2011-02-16 2018-01-17 ローム株式会社 Ｌｅｄモジュール
USD753612S1 (en) * 2012-09-07 2016-04-12 Cree, Inc. Light emitter device
JP6322828B2 (ja) * 2014-02-07 2018-05-16 ローム株式会社 発光モジュールおよび発光装置
DE102014110473A1 (de) 2014-07-24 2016-01-28 Osram Opto Semiconductors Gmbh Träger für ein elektrisches Bauelement
JP6728676B2 (ja) * 2015-12-26 2020-07-22 日亜化学工業株式会社 発光装置

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Publication number Priority date Publication date Assignee Title
JPS5779681A (en) 1980-11-04 1982-05-18 Alps Electric Co Ltd Light emitting chip parts
JPS6097654A (ja) * 1983-11-01 1985-05-31 Toshiba Corp 封止型半導体装置
JPS61240687A (ja) 1985-04-18 1986-10-25 Matsushita Electric Ind Co Ltd 発光素子
JP2675135B2 (ja) * 1989-04-22 1997-11-12 ティーディーケイ株式会社 混成集積回路部品の構造
JPH04337657A (ja) * 1991-05-14 1992-11-25 Hitachi Cable Ltd 半導体装置用リードフレーム
JPH05335437A (ja) * 1992-06-04 1993-12-17 Nec Corp 半導体装置
JPH0613523A (ja) * 1992-06-29 1994-01-21 Toshiba Corp 半導体電子部品
US5612512A (en) * 1992-11-11 1997-03-18 Murata Manufacturing Co., Ltd. High frequency electronic component having base substrate formed of bismaleimide-triazine resin and resistant film formed on base substrate
JPH0773121B2 (ja) * 1992-12-28 1995-08-02 日本電気株式会社 半導体装置用パッケージ及びその製造方法
JP2501174B2 (ja) * 1993-07-09 1996-05-29 富士通株式会社 表面実装用端子の製造方法
JPH07142665A (ja) * 1993-11-17 1995-06-02 Matsushita Electric Ind Co Ltd リード付電子部品
JP3226147B2 (ja) 1995-03-09 2001-11-05 株式会社富士通ゼネラル 表面実装部品の接合構造
JP3065509B2 (ja) * 1995-06-02 2000-07-17 スタンレー電気株式会社 表面実装型発光ダイオード
JP3158018B2 (ja) * 1995-07-17 2001-04-23 シャープ株式会社 横発光型ｌｅｄおよびその製造方法
JP3550875B2 (ja) * 1996-05-14 2004-08-04 ソニー株式会社 リードフレームとこれを用いた半導体装置
JP3288263B2 (ja) * 1996-07-15 2002-06-04 松下電器産業株式会社 樹脂封止型半導体装置用リードフレーム
JPH1074879A (ja) * 1996-08-30 1998-03-17 Mitsui High Tec Inc 半導体装置用リードフレーム
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JP2976917B2 (ja) 1997-03-31 1999-11-10 日本電気株式会社 半導体装置
JP3269025B2 (ja) * 1998-04-16 2002-03-25 三洋電機株式会社 半導体装置とその製造方法

Also Published As

Publication number Publication date
JP3871820B2 (ja) 2007-01-24
JP2000133845A (ja) 2000-05-12
EP0996172A1 (de) 2000-04-26
EP0996172B1 (de) 2007-09-26
US6180962B1 (en) 2001-01-30
DE69937180T2 (de) 2009-07-09

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Legal Events

Date Code Title Description
8332 No legal effect for de
8328 Change in the person/name/address of the agent

Representative=s name: BOCKHORNI & KOLLEGEN, 80687 MUENCHEN

8370 Indication of lapse of patent is to be deleted
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee