DE69933480D1 - Mehrschichtige leiterplatte - Google Patents

Mehrschichtige leiterplatte

Info

Publication number
DE69933480D1
DE69933480D1 DE69933480T DE69933480T DE69933480D1 DE 69933480 D1 DE69933480 D1 DE 69933480D1 DE 69933480 T DE69933480 T DE 69933480T DE 69933480 T DE69933480 T DE 69933480T DE 69933480 D1 DE69933480 D1 DE 69933480D1
Authority
DE
Germany
Prior art keywords
conductor plate
multilayer conductor
multilayer
plate
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69933480T
Other languages
English (en)
Other versions
DE69933480T2 (de
Inventor
Motoo Asai
Takashi Kariya
Kenichi Shimada
Hiroshi Segawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Publication of DE69933480D1 publication Critical patent/DE69933480D1/de
Application granted granted Critical
Publication of DE69933480T2 publication Critical patent/DE69933480T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0215—Metallic fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
DE69933480T 1999-04-13 1999-05-21 Mehrschichtige leiterplatte Expired - Lifetime DE69933480T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP10554999A JP4442832B2 (ja) 1999-04-13 1999-04-13 多層プリント配線板
JP10554999 1999-04-13
PCT/JP1999/002689 WO2000062588A1 (fr) 1999-04-13 1999-05-21 Carte imprimee multicouche

Publications (2)

Publication Number Publication Date
DE69933480D1 true DE69933480D1 (de) 2006-11-16
DE69933480T2 DE69933480T2 (de) 2007-06-21

Family

ID=14410663

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69933480T Expired - Lifetime DE69933480T2 (de) 1999-04-13 1999-05-21 Mehrschichtige leiterplatte
DE69938982T Expired - Lifetime DE69938982D1 (de) 1999-04-13 1999-05-21 Mehrlagen Gedruckteschaltungsplatte

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE69938982T Expired - Lifetime DE69938982D1 (de) 1999-04-13 1999-05-21 Mehrlagen Gedruckteschaltungsplatte

Country Status (7)

Country Link
EP (2) EP1744608B1 (de)
JP (1) JP4442832B2 (de)
KR (1) KR100629400B1 (de)
CN (1) CN1225953C (de)
DE (2) DE69933480T2 (de)
MY (1) MY130361A (de)
WO (1) WO2000062588A1 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE60027141T2 (de) 1999-10-26 2006-12-28 Ibiden Co., Ltd., Ogaki Gedruckte mehrschichtleiterplatte und herstellungsverfahren für gedruckte mehrschichtleiterplatte
JP4535598B2 (ja) * 2000-10-30 2010-09-01 イビデン株式会社 多層プリント配線板および多層プリント配線板の製造方法
JP4605888B2 (ja) * 2000-10-30 2011-01-05 イビデン株式会社 多層プリント配線板および多層プリント配線板の製造方法
EP1491927B1 (de) 2002-04-01 2013-02-27 Ibiden Co., Ltd. Ic-chip-anbringsubstrat, und ic-chip-anbringsubstratherstellungsverfahren.
US7070207B2 (en) 2003-04-22 2006-07-04 Ibiden Co., Ltd. Substrate for mounting IC chip, multilayerd printed circuit board, and device for optical communication
CN1899003B (zh) * 2004-03-03 2010-12-29 揖斐电株式会社 蚀刻液、蚀刻方法以及印刷电路板
JP5124984B2 (ja) * 2005-05-20 2013-01-23 日立化成工業株式会社 印刷配線板
JP5512562B2 (ja) 2010-03-29 2014-06-04 日本特殊陶業株式会社 多層配線基板
JP6261354B2 (ja) 2014-01-27 2018-01-17 インターナショナル・ビジネス・マシーンズ・コーポレーションＩｎｔｅｒｎａｔｉｏｎａｌ Ｂｕｓｉｎｅｓｓ Ｍａｃｈｉｎｅｓ Ｃｏｒｐｏｒａｔｉｏｎ チップ実装構造体およびその製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6366993A (ja) * 1986-09-08 1988-03-25 日本電気株式会社 多層配線基板
JPH0427194A (ja) * 1990-05-22 1992-01-30 Hitachi Chem Co Ltd 高密度多層配線板およびその製造法
US5473120A (en) * 1992-04-27 1995-12-05 Tokuyama Corporation Multilayer board and fabrication method thereof
US5487218A (en) * 1994-11-21 1996-01-30 International Business Machines Corporation Method for making printed circuit boards with selectivity filled plated through holes
EP1318708B1 (de) * 1995-10-23 2004-10-20 Ibiden Co., Ltd. Harzfüllstoff und mehrschichtige Leiterplatte
KR100273089B1 (ko) * 1995-11-10 2001-01-15 엔도 마사루 다층프린트 배선판 및 다층프린트 배선판의 제조방법
JPH1022611A (ja) * 1996-07-05 1998-01-23 Hitachi Ltd 配線平坦化方法と該方法を使用する多層配線基板の製造方法及びその多層配線基板

Also Published As

Publication number Publication date
JP2000299562A (ja) 2000-10-24
EP1744608A2 (de) 2007-01-17
WO2000062588A1 (fr) 2000-10-19
EP1194025A1 (de) 2002-04-03
EP1744608A3 (de) 2007-04-18
EP1194025B1 (de) 2006-10-04
KR100629400B1 (ko) 2006-09-27
DE69938982D1 (de) 2008-08-07
EP1194025A4 (de) 2004-08-25
EP1744608B1 (de) 2008-06-25
MY130361A (en) 2007-06-29
DE69933480T2 (de) 2007-06-21
CN1225953C (zh) 2005-11-02
KR20010110735A (ko) 2001-12-13
CN1348678A (zh) 2002-05-08
JP4442832B2 (ja) 2010-03-31

Similar Documents

Publication Publication Date Title
DE69837110D1 (de) Mehrschichtige leiterplatte
DE60228030D1 (de) Mehrschichtige leiterplatte
DE60025418D1 (de) Magnetische Mehrschichtenstruktur
DE50007581D1 (de) Leiterfolie
DE69942279D1 (de) Vielschichtig aufgebaute leiterplatte
DE69906785D1 (de) Mehrschichtige leitung
DE69926157D1 (de) Plattenverbindungsvorrichtungen
DE60044974D1 (de) Mehrschichtige leiterplatte und leiterplatten-herstellungsmethode
DE60039745D1 (de) Vielschichtkondensator
NO20002572D0 (no) Flerlags-struktur
DK1173134T3 (da) Termoplastisk flerlagsstruktur
DE60014226T8 (de) Laminiervorrichtung
DE60026336D1 (de) Elektronisches vorschaltgerät
DE60012837D1 (de) Laminiervorrichtung
DE69933480D1 (de) Mehrschichtige leiterplatte
ATE309824T1 (de) Enzyminhibitoren
DE60028934D1 (de) Schaltungsanordnung
FI19992374A (fi) Levyantenni
DE1237671T1 (de) Nutfräser
DE29909388U1 (de) Mehrschichtige Schnellbau-Trockenbauplatte
FI981697A0 (fi) Monikerroksinen litteä johdin
DE60017671D1 (de) Schaltungsanordnung
DE60004458D1 (de) Schaltungsanordnung
ATA20142000A (de) Hydraulikkreislauf
DE29905424U1 (de) Flexible Platteneinrichtung

Legal Events

Date Code Title Description
8381 Inventor (new situation)

Inventor name: SEGAWA, HIROSHI, IBI-GUN, GIFU 501-0601, JP

Inventor name: SHIMADA, KENICHI, IBI-GUN, GIFU 501-0601, JP

Inventor name: KARIYA, TAKASHI, IBI-GUN, GIFU 501-0601, JP

Inventor name: ASAI, MOTOO, IBI-GUN. GIFU 501-0601, JP

8364 No opposition during term of opposition