DE69908487D1 - Polyimide, Verfahren zu ihrer Herstellung und diese enthaltende photoempfindliche Zusammensetzungen - Google Patents

Polyimide, Verfahren zu ihrer Herstellung und diese enthaltende photoempfindliche Zusammensetzungen

Info

Publication number
DE69908487D1
DE69908487D1 DE69908487T DE69908487T DE69908487D1 DE 69908487 D1 DE69908487 D1 DE 69908487D1 DE 69908487 T DE69908487 T DE 69908487T DE 69908487 T DE69908487 T DE 69908487T DE 69908487 D1 DE69908487 D1 DE 69908487D1
Authority
DE
Germany
Prior art keywords
polyimides
processes
preparation
compositions containing
photosensitive compositions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69908487T
Other languages
English (en)
Other versions
DE69908487T2 (de
Inventor
Lin-Chiu Chiang
Jenq-Tain Lin
Nobuyuki Sensui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Mektron KK
Original Assignee
Nippon Mektron KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mektron KK filed Critical Nippon Mektron KK
Publication of DE69908487D1 publication Critical patent/DE69908487D1/de
Application granted granted Critical
Publication of DE69908487T2 publication Critical patent/DE69908487T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42—Block-or graft-polymers containing polysiloxane sequences
    • C08G77/452—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences
    • C08G77/455—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences containing polyamide, polyesteramide or polyimide sequences
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/106—Binder containing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/128—Radiation-activated cross-linking agent containing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Materials For Photolithography (AREA)
DE69908487T 1998-05-14 1999-03-15 Polyimide, Verfahren zu ihrer Herstellung und diese enthaltende photoempfindliche Zusammensetzungen Expired - Lifetime DE69908487T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP15074298 1998-05-14
JP15074298 1998-05-14
JP23638598A JP3972481B2 (ja) 1998-05-14 1998-08-07 感光性組成物
JP23638598 1998-08-07

Publications (2)

Publication Number Publication Date
DE69908487D1 true DE69908487D1 (de) 2003-07-10
DE69908487T2 DE69908487T2 (de) 2004-05-13

Family

ID=26480238

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69908487T Expired - Lifetime DE69908487T2 (de) 1998-05-14 1999-03-15 Polyimide, Verfahren zu ihrer Herstellung und diese enthaltende photoempfindliche Zusammensetzungen

Country Status (4)

Country Link
US (3) US6486290B1 (de)
EP (1) EP0957125B1 (de)
JP (1) JP3972481B2 (de)
DE (1) DE69908487T2 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4811162B2 (ja) * 1998-05-14 2011-11-09 日本メクトロン株式会社 ポリイミドおよびその製造法
JP3972481B2 (ja) * 1998-05-14 2007-09-05 日本メクトロン株式会社 感光性組成物
EP1199604B1 (de) * 1999-05-31 2014-05-21 PI R & D Co., Ltd. Verfahren zur erzeugung eines polyimid-musters unter verwendung eines lichtempfindlichen polyimids und zusammensetzung zum gebrauch dafür
JP3982296B2 (ja) * 2002-03-27 2007-09-26 日本メクトロン株式会社 新規ポリイミド共重合体
TWI265377B (en) * 2005-12-19 2006-11-01 Ind Tech Res Inst Negative photoresist composition
KR102537349B1 (ko) 2015-02-02 2023-05-26 바스프 에스이 잠재성 산 및 그의 용도
KR102684017B1 (ko) 2019-03-27 2024-07-12 가부시키가이샤 가네카 알칼리 가용성 폴리이미드 및 그 제조 방법, 네가티브형 감광성 수지 조성물, 경화막, 그리고 패턴 경화막의 제조 방법
CN110804181B (zh) * 2019-11-06 2021-04-20 中山大学 一种透明光敏聚酰亚胺树脂、聚酰亚胺薄膜及其制备方法

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57131227A (en) 1981-02-09 1982-08-14 Nippon Telegr & Teleph Corp <Ntt> Photopolymer and its production
JPS59145216A (ja) 1983-02-07 1984-08-20 Ube Ind Ltd 有機溶媒可溶性の感光性ポリアミドイミド
US4826886A (en) * 1988-05-26 1989-05-02 Ethyl Corporation Polyimide foams and their production
US5194518A (en) * 1989-09-01 1993-03-16 Nitto Denko Corporation Thermosetting resin composition comprising perfluoro containing amine terminated oligomer and polymaleimide
US5477360A (en) * 1993-04-23 1995-12-19 Kabushiki Kaisha Toshiba Liquid crystal display device
US5693379A (en) * 1994-10-20 1997-12-02 Chisso Corporation Polyimide
US5643986A (en) 1995-03-17 1997-07-01 Ube Industries, Ltd. Polyimidosiloxane compositions
US6071667A (en) * 1995-04-13 2000-06-06 Hitachi Chemical Co., Ltd. Photosensitive resin composition containing a photosensitive polyamide resin
US6096480A (en) * 1995-07-28 2000-08-01 Ube Industries, Ltd. Photosensitive polyimidosiloxane compositions and insulating films made thereof
JP3550913B2 (ja) 1995-10-31 2004-08-04 宇部興産株式会社 ポリイミドシロキサンおよびその製法
JP3321548B2 (ja) * 1996-06-17 2002-09-03 株式会社日立製作所 感光性ポリイミド前駆体組成物、およびそれを用いたパターン形成方法
US6117510A (en) * 1996-07-30 2000-09-12 Ube Industries, Ltd. Adhesive-applied tape
JP3968835B2 (ja) * 1996-12-20 2007-08-29 日本メクトロン株式会社 シロキサンポリイミドを含有する耐熱性接着剤
JP3700311B2 (ja) * 1997-02-05 2005-09-28 日本メクトロン株式会社 シロキサンポリイミドおよびそれを含有する耐熱性接着剤
US6025461A (en) * 1997-09-26 2000-02-15 Nippon Mektron, Limited Photosensitive polyimide
JP4016226B2 (ja) * 1998-01-14 2007-12-05 味の素株式会社 変成ポリイミド樹脂及びこれを含有する熱硬化性樹脂組成物
JP3968884B2 (ja) * 1998-05-01 2007-08-29 日本メクトロン株式会社 感光性組成物
JP3972481B2 (ja) * 1998-05-14 2007-09-05 日本メクトロン株式会社 感光性組成物
JP3950560B2 (ja) * 1998-08-14 2007-08-01 株式会社巴川製紙所 電子部品用接着剤および電子部品用接着テープ
US6686106B2 (en) * 2000-06-26 2004-02-03 Ube Industries, Ltd. Photosensitive resin compositions, insulating films, and processes for formation of the films
JP2002012667A (ja) * 2000-06-29 2002-01-15 Shin Etsu Chem Co Ltd ポリイミドシリコーン樹脂、その溶液組成物、およびポリイミドシリコーン樹脂皮膜

Also Published As

Publication number Publication date
JP3972481B2 (ja) 2007-09-05
EP0957125B1 (de) 2003-06-04
US6245484B1 (en) 2001-06-12
JP2000034347A (ja) 2000-02-02
US6486290B1 (en) 2002-11-26
US20020045127A1 (en) 2002-04-18
DE69908487T2 (de) 2004-05-13
EP0957125A1 (de) 1999-11-17
US6582885B2 (en) 2003-06-24

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