DE69908487D1 - Polyimide, Verfahren zu ihrer Herstellung und diese enthaltende photoempfindliche Zusammensetzungen - Google Patents
Polyimide, Verfahren zu ihrer Herstellung und diese enthaltende photoempfindliche ZusammensetzungenInfo
- Publication number
- DE69908487D1 DE69908487D1 DE69908487T DE69908487T DE69908487D1 DE 69908487 D1 DE69908487 D1 DE 69908487D1 DE 69908487 T DE69908487 T DE 69908487T DE 69908487 T DE69908487 T DE 69908487T DE 69908487 D1 DE69908487 D1 DE 69908487D1
- Authority
- DE
- Germany
- Prior art keywords
- polyimides
- processes
- preparation
- compositions containing
- photosensitive compositions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
- C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/42—Block-or graft-polymers containing polysiloxane sequences
- C08G77/452—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences
- C08G77/455—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences containing polyamide, polyesteramide or polyimide sequences
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/106—Binder containing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/128—Radiation-activated cross-linking agent containing
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Materials For Photolithography (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15074298 | 1998-05-14 | ||
JP15074298 | 1998-05-14 | ||
JP23638598A JP3972481B2 (ja) | 1998-05-14 | 1998-08-07 | 感光性組成物 |
JP23638598 | 1998-08-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69908487D1 true DE69908487D1 (de) | 2003-07-10 |
DE69908487T2 DE69908487T2 (de) | 2004-05-13 |
Family
ID=26480238
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69908487T Expired - Lifetime DE69908487T2 (de) | 1998-05-14 | 1999-03-15 | Polyimide, Verfahren zu ihrer Herstellung und diese enthaltende photoempfindliche Zusammensetzungen |
Country Status (4)
Country | Link |
---|---|
US (3) | US6486290B1 (de) |
EP (1) | EP0957125B1 (de) |
JP (1) | JP3972481B2 (de) |
DE (1) | DE69908487T2 (de) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4811162B2 (ja) * | 1998-05-14 | 2011-11-09 | 日本メクトロン株式会社 | ポリイミドおよびその製造法 |
JP3972481B2 (ja) * | 1998-05-14 | 2007-09-05 | 日本メクトロン株式会社 | 感光性組成物 |
EP1199604B1 (de) * | 1999-05-31 | 2014-05-21 | PI R & D Co., Ltd. | Verfahren zur erzeugung eines polyimid-musters unter verwendung eines lichtempfindlichen polyimids und zusammensetzung zum gebrauch dafür |
JP3982296B2 (ja) * | 2002-03-27 | 2007-09-26 | 日本メクトロン株式会社 | 新規ポリイミド共重合体 |
TWI265377B (en) * | 2005-12-19 | 2006-11-01 | Ind Tech Res Inst | Negative photoresist composition |
KR102537349B1 (ko) | 2015-02-02 | 2023-05-26 | 바스프 에스이 | 잠재성 산 및 그의 용도 |
KR102684017B1 (ko) | 2019-03-27 | 2024-07-12 | 가부시키가이샤 가네카 | 알칼리 가용성 폴리이미드 및 그 제조 방법, 네가티브형 감광성 수지 조성물, 경화막, 그리고 패턴 경화막의 제조 방법 |
CN110804181B (zh) * | 2019-11-06 | 2021-04-20 | 中山大学 | 一种透明光敏聚酰亚胺树脂、聚酰亚胺薄膜及其制备方法 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57131227A (en) | 1981-02-09 | 1982-08-14 | Nippon Telegr & Teleph Corp <Ntt> | Photopolymer and its production |
JPS59145216A (ja) | 1983-02-07 | 1984-08-20 | Ube Ind Ltd | 有機溶媒可溶性の感光性ポリアミドイミド |
US4826886A (en) * | 1988-05-26 | 1989-05-02 | Ethyl Corporation | Polyimide foams and their production |
US5194518A (en) * | 1989-09-01 | 1993-03-16 | Nitto Denko Corporation | Thermosetting resin composition comprising perfluoro containing amine terminated oligomer and polymaleimide |
US5477360A (en) * | 1993-04-23 | 1995-12-19 | Kabushiki Kaisha Toshiba | Liquid crystal display device |
US5693379A (en) * | 1994-10-20 | 1997-12-02 | Chisso Corporation | Polyimide |
US5643986A (en) | 1995-03-17 | 1997-07-01 | Ube Industries, Ltd. | Polyimidosiloxane compositions |
US6071667A (en) * | 1995-04-13 | 2000-06-06 | Hitachi Chemical Co., Ltd. | Photosensitive resin composition containing a photosensitive polyamide resin |
US6096480A (en) * | 1995-07-28 | 2000-08-01 | Ube Industries, Ltd. | Photosensitive polyimidosiloxane compositions and insulating films made thereof |
JP3550913B2 (ja) | 1995-10-31 | 2004-08-04 | 宇部興産株式会社 | ポリイミドシロキサンおよびその製法 |
JP3321548B2 (ja) * | 1996-06-17 | 2002-09-03 | 株式会社日立製作所 | 感光性ポリイミド前駆体組成物、およびそれを用いたパターン形成方法 |
US6117510A (en) * | 1996-07-30 | 2000-09-12 | Ube Industries, Ltd. | Adhesive-applied tape |
JP3968835B2 (ja) * | 1996-12-20 | 2007-08-29 | 日本メクトロン株式会社 | シロキサンポリイミドを含有する耐熱性接着剤 |
JP3700311B2 (ja) * | 1997-02-05 | 2005-09-28 | 日本メクトロン株式会社 | シロキサンポリイミドおよびそれを含有する耐熱性接着剤 |
US6025461A (en) * | 1997-09-26 | 2000-02-15 | Nippon Mektron, Limited | Photosensitive polyimide |
JP4016226B2 (ja) * | 1998-01-14 | 2007-12-05 | 味の素株式会社 | 変成ポリイミド樹脂及びこれを含有する熱硬化性樹脂組成物 |
JP3968884B2 (ja) * | 1998-05-01 | 2007-08-29 | 日本メクトロン株式会社 | 感光性組成物 |
JP3972481B2 (ja) * | 1998-05-14 | 2007-09-05 | 日本メクトロン株式会社 | 感光性組成物 |
JP3950560B2 (ja) * | 1998-08-14 | 2007-08-01 | 株式会社巴川製紙所 | 電子部品用接着剤および電子部品用接着テープ |
US6686106B2 (en) * | 2000-06-26 | 2004-02-03 | Ube Industries, Ltd. | Photosensitive resin compositions, insulating films, and processes for formation of the films |
JP2002012667A (ja) * | 2000-06-29 | 2002-01-15 | Shin Etsu Chem Co Ltd | ポリイミドシリコーン樹脂、その溶液組成物、およびポリイミドシリコーン樹脂皮膜 |
-
1998
- 1998-08-07 JP JP23638598A patent/JP3972481B2/ja not_active Expired - Fee Related
-
1999
- 1999-02-26 US US09/259,069 patent/US6486290B1/en not_active Expired - Fee Related
- 1999-03-15 EP EP99104024A patent/EP0957125B1/de not_active Expired - Lifetime
- 1999-03-15 DE DE69908487T patent/DE69908487T2/de not_active Expired - Lifetime
-
2000
- 2000-02-01 US US09/496,098 patent/US6245484B1/en not_active Expired - Lifetime
-
2001
- 2001-10-18 US US09/982,634 patent/US6582885B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP3972481B2 (ja) | 2007-09-05 |
EP0957125B1 (de) | 2003-06-04 |
US6245484B1 (en) | 2001-06-12 |
JP2000034347A (ja) | 2000-02-02 |
US6486290B1 (en) | 2002-11-26 |
US20020045127A1 (en) | 2002-04-18 |
DE69908487T2 (de) | 2004-05-13 |
EP0957125A1 (de) | 1999-11-17 |
US6582885B2 (en) | 2003-06-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |