DE69739498D1 - Festkörperbildaufnameapparat und Verwendung in einer Kamera - Google Patents

Festkörperbildaufnameapparat und Verwendung in einer Kamera

Info

Publication number
DE69739498D1
DE69739498D1 DE69739498T DE69739498T DE69739498D1 DE 69739498 D1 DE69739498 D1 DE 69739498D1 DE 69739498 T DE69739498 T DE 69739498T DE 69739498 T DE69739498 T DE 69739498T DE 69739498 D1 DE69739498 D1 DE 69739498D1
Authority
DE
Germany
Prior art keywords
camera
solid state
imaging apparatus
state imaging
solid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69739498T
Other languages
English (en)
Inventor
Yuichi Takagi
Masayoshi Kanazawa
Kazuhiko Ueda
Makoto Tsuchimochi
Shigeo Ikeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP8155234A external-priority patent/JPH104510A/ja
Priority claimed from JP8214438A external-priority patent/JPH1065132A/ja
Priority claimed from JP21886096A external-priority patent/JP3417225B2/ja
Application filed by Sony Corp filed Critical Sony Corp
Application granted granted Critical
Publication of DE69739498D1 publication Critical patent/DE69739498D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/1462—Coatings
    • H01L27/14623—Optical shielding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H01L27/14627—Microlenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19106—Disposition of discrete passive components in a mirrored arrangement on two different side of a common die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Electromagnetism (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Studio Devices (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
DE69739498T 1996-05-17 1997-05-14 Festkörperbildaufnameapparat und Verwendung in einer Kamera Expired - Lifetime DE69739498D1 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP12293196 1996-05-17
JP8155234A JPH104510A (ja) 1996-06-17 1996-06-17 カメラ
JP8214438A JPH1065132A (ja) 1996-08-14 1996-08-14 半導体撮像装置
JP21886096A JP3417225B2 (ja) 1996-05-17 1996-08-20 固体撮像装置とそれを用いたカメラ

Publications (1)

Publication Number Publication Date
DE69739498D1 true DE69739498D1 (de) 2009-09-03

Family

ID=27470895

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69739498T Expired - Lifetime DE69739498D1 (de) 1996-05-17 1997-05-14 Festkörperbildaufnameapparat und Verwendung in einer Kamera
DE69739708T Expired - Lifetime DE69739708D1 (de) 1996-05-17 1997-05-14 Festkörperbildaufnahmegerät

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE69739708T Expired - Lifetime DE69739708D1 (de) 1996-05-17 1997-05-14 Festkörperbildaufnahmegerät

Country Status (3)

Country Link
US (4) US6795120B2 (de)
EP (4) EP0807976B1 (de)
DE (2) DE69739498D1 (de)

Families Citing this family (132)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3645702B2 (ja) * 1997-12-25 2005-05-11 オリンパス株式会社 電子カメラ
US20080128844A1 (en) * 2002-11-18 2008-06-05 Tessera North America Integrated micro-optical systems and cameras including the same
US7129978B1 (en) 1998-07-13 2006-10-31 Zoran Corporation Method and architecture for an improved CMOS color image sensor
US6703617B1 (en) 1999-04-26 2004-03-09 Simage Oy Device for imaging radiation
GB9909574D0 (en) * 1999-04-26 1999-06-23 Simage Oy X-ray imaging system
US7092031B1 (en) * 1999-07-30 2006-08-15 Zoran Corporation Digital camera imaging module
US7176446B1 (en) 1999-09-15 2007-02-13 Zoran Corporation Method and apparatus for distributing light onto electronic image sensors
FR2800912B1 (fr) * 1999-11-04 2003-07-25 St Microelectronics Sa Boitier semi-conducteur optique et procede de fabrication d'un tel boitier
FR2800909B1 (fr) * 1999-11-04 2003-08-22 St Microelectronics Sa Boitier semi-conducteur optique et procede de fabrication d'un tel boitier
FR2800911B1 (fr) * 1999-11-04 2003-08-22 St Microelectronics Sa Boitier semi-conducteur optique et procede de fabrication d'un tel boitier
US20010007475A1 (en) * 2000-01-06 2001-07-12 Asahi Kogaku Kogyo Kabushiki Kaisha Image pickup device and its mounting structure for an optical low-pass filter
US6351027B1 (en) * 2000-02-29 2002-02-26 Agilent Technologies, Inc. Chip-mounted enclosure
JP4004705B2 (ja) * 2000-02-29 2007-11-07 松下電器産業株式会社 撮像装置と撮像装置組立方法
JP3607160B2 (ja) 2000-04-07 2005-01-05 三菱電機株式会社 撮像装置
TW528889B (en) * 2000-11-14 2003-04-21 Toshiba Corp Image pickup apparatus, manufacturing method thereof, and portable electric apparatus
JP2002252338A (ja) * 2000-12-18 2002-09-06 Canon Inc 撮像装置及び撮像システム
JP3540281B2 (ja) * 2001-02-02 2004-07-07 シャープ株式会社 撮像装置
JP3821652B2 (ja) * 2001-02-26 2006-09-13 三菱電機株式会社 撮像装置
GB2374725A (en) * 2001-04-20 2002-10-23 Kingpak Tech Inc Stacked structure having image sensing chip and integrated circuit arrange on opposite surfaces of a substrate
FR2824953B1 (fr) * 2001-05-18 2004-07-16 St Microelectronics Sa Boitier semi-conducteur optique a lentille incorporee et blindage
JP2003060948A (ja) * 2001-06-05 2003-02-28 Seiko Precision Inc 固体撮像装置
WO2003015400A1 (fr) * 2001-08-07 2003-02-20 Hitachi Maxell, Ltd Module de camera
US6545716B2 (en) * 2001-09-13 2003-04-08 Tracey Gardiner Camera body for protecting components
US7545437B2 (en) * 2001-11-29 2009-06-09 Olympus Optical Co., Ltd. Digital camera for an optical apparatus including a cooling mechanism for a solid-state imaging device
JP4009473B2 (ja) * 2002-03-08 2007-11-14 オリンパス株式会社 カプセル型内視鏡
DE10220671B4 (de) * 2002-05-10 2004-08-26 Hella Kg Hueck & Co. Optisches System für eine Kamera
JP2004104078A (ja) * 2002-06-28 2004-04-02 Sanyo Electric Co Ltd カメラモジュールおよびその製造方法
KR20040019650A (ko) * 2002-08-28 2004-03-06 삼성전기주식회사 내장형 카메라 모듈
TW558064U (en) * 2002-09-23 2003-10-11 Ist Internat Semiconductor Tec Thin type camera module
JP3688677B2 (ja) * 2002-11-19 2005-08-31 株式会社東芝 カメラの組み込み方法及びカメラ付き携帯形電子機器
US7742088B2 (en) * 2002-11-19 2010-06-22 Fujifilm Corporation Image sensor and digital camera
JP2004200965A (ja) * 2002-12-18 2004-07-15 Sanyo Electric Co Ltd カメラモジュール及びその製造方法
DE10259795A1 (de) * 2002-12-19 2004-07-08 Siemens Ag Bilderzeugungsvorrichtung zum Einbau im Dachbereich oder im Aussenspiegel eines Kraftfahrzeuges
EP1471730A1 (de) * 2003-03-31 2004-10-27 Dialog Semiconductor GmbH Miniaturkameramodul
US20040212726A1 (en) * 2003-04-22 2004-10-28 Mu-Jung Wang Electronic image-capture module
JP4231328B2 (ja) * 2003-04-24 2009-02-25 浜松ホトニクス株式会社 固体撮像装置
FR2854498B1 (fr) 2003-04-29 2005-09-16 St Microelectronics Sa Boitier semi-conducteur a capteur optique s'installant a l'interieur d'un objet.
US7701489B1 (en) * 2003-05-27 2010-04-20 Apple Inc. Method and apparatus for color correction
KR100526191B1 (ko) * 2003-06-18 2005-11-03 삼성전자주식회사 고체 촬상용 반도체 장치
JP4253534B2 (ja) * 2003-06-23 2009-04-15 オリンパス株式会社 撮像装置
KR100541650B1 (ko) * 2003-08-12 2006-01-10 삼성전자주식회사 고체 촬상용 반도체 장치 및 그 제조방법
US7369699B1 (en) 2003-08-29 2008-05-06 Apple Inc. Methods and apparatuses for restoring color and enhancing electronic images
US6934065B2 (en) * 2003-09-18 2005-08-23 Micron Technology, Inc. Microelectronic devices and methods for packaging microelectronic devices
JP4170950B2 (ja) * 2003-10-10 2008-10-22 松下電器産業株式会社 光学デバイスおよびその製造方法
WO2005041561A1 (en) * 2003-10-27 2005-05-06 Koninklijke Philips Electronics N.V. Camera module and manufacturing method for such a camera module
US7583862B2 (en) * 2003-11-26 2009-09-01 Aptina Imaging Corporation Packaged microelectronic imagers and methods of packaging microelectronic imagers
TWI296154B (en) * 2004-01-27 2008-04-21 Casio Computer Co Ltd Optical sensor module
US7098580B2 (en) * 2004-01-29 2006-08-29 Kyocera Corporation Piezoelectric oscillator
US7253397B2 (en) * 2004-02-23 2007-08-07 Micron Technology, Inc. Packaged microelectronic imagers and methods of packaging microelectronic imagers
US8092734B2 (en) * 2004-05-13 2012-01-10 Aptina Imaging Corporation Covers for microelectronic imagers and methods for wafer-level packaging of microelectronics imagers
US7253957B2 (en) * 2004-05-13 2007-08-07 Micron Technology, Inc. Integrated optics units and methods of manufacturing integrated optics units for use with microelectronic imagers
US20050275750A1 (en) * 2004-06-09 2005-12-15 Salman Akram Wafer-level packaged microelectronic imagers and processes for wafer-level packaging
US7498647B2 (en) 2004-06-10 2009-03-03 Micron Technology, Inc. Packaged microelectronic imagers and methods of packaging microelectronic imagers
US7199439B2 (en) * 2004-06-14 2007-04-03 Micron Technology, Inc. Microelectronic imagers and methods of packaging microelectronic imagers
US7262405B2 (en) * 2004-06-14 2007-08-28 Micron Technology, Inc. Prefabricated housings for microelectronic imagers
US7294897B2 (en) * 2004-06-29 2007-11-13 Micron Technology, Inc. Packaged microelectronic imagers and methods of packaging microelectronic imagers
US7232754B2 (en) 2004-06-29 2007-06-19 Micron Technology, Inc. Microelectronic devices and methods for forming interconnects in microelectronic devices
KR100592368B1 (ko) * 2004-07-06 2006-06-22 삼성전자주식회사 반도체 소자의 초박형 모듈 제조 방법
US7416913B2 (en) * 2004-07-16 2008-08-26 Micron Technology, Inc. Methods of manufacturing microelectronic imaging units with discrete standoffs
US7189954B2 (en) * 2004-07-19 2007-03-13 Micron Technology, Inc. Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers
US7402453B2 (en) * 2004-07-28 2008-07-22 Micron Technology, Inc. Microelectronic imaging units and methods of manufacturing microelectronic imaging units
US7364934B2 (en) 2004-08-10 2008-04-29 Micron Technology, Inc. Microelectronic imaging units and methods of manufacturing microelectronic imaging units
US7521719B2 (en) * 2004-08-13 2009-04-21 Paul Steven Schranz Light emitting and image sensing device and apparatus
US7397066B2 (en) * 2004-08-19 2008-07-08 Micron Technology, Inc. Microelectronic imagers with curved image sensors and methods for manufacturing microelectronic imagers
US7223626B2 (en) * 2004-08-19 2007-05-29 Micron Technology, Inc. Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers
US7115961B2 (en) * 2004-08-24 2006-10-03 Micron Technology, Inc. Packaged microelectronic imaging devices and methods of packaging microelectronic imaging devices
US7429494B2 (en) 2004-08-24 2008-09-30 Micron Technology, Inc. Microelectronic imagers with optical devices having integral reference features and methods for manufacturing such microelectronic imagers
US7276393B2 (en) * 2004-08-26 2007-10-02 Micron Technology, Inc. Microelectronic imaging units and methods of manufacturing microelectronic imaging units
US20070148807A1 (en) * 2005-08-22 2007-06-28 Salman Akram Microelectronic imagers with integrated optical devices and methods for manufacturing such microelectronic imagers
US7511262B2 (en) * 2004-08-30 2009-03-31 Micron Technology, Inc. Optical device and assembly for use with imaging dies, and wafer-label imager assembly
US7646075B2 (en) * 2004-08-31 2010-01-12 Micron Technology, Inc. Microelectronic imagers having front side contacts
US7300857B2 (en) 2004-09-02 2007-11-27 Micron Technology, Inc. Through-wafer interconnects for photoimager and memory wafers
US8462384B2 (en) * 2004-09-29 2013-06-11 Apple Inc. Methods and apparatuses for aesthetically enhanced image conversion
EP1648181A1 (de) * 2004-10-12 2006-04-19 Dialog Semiconductor GmbH Einzelbildabspeichervorrichtung
US7701728B2 (en) * 2004-10-28 2010-04-20 Kyocera Corporation Electronic component module and radio comunications equipment
US7271482B2 (en) * 2004-12-30 2007-09-18 Micron Technology, Inc. Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods
US7214919B2 (en) * 2005-02-08 2007-05-08 Micron Technology, Inc. Microelectronic imaging units and methods of manufacturing microelectronic imaging units
US7303931B2 (en) * 2005-02-10 2007-12-04 Micron Technology, Inc. Microfeature workpieces having microlenses and methods of forming microlenses on microfeature workpieces
US20060177999A1 (en) * 2005-02-10 2006-08-10 Micron Technology, Inc. Microelectronic workpieces and methods for forming interconnects in microelectronic workpieces
US7190039B2 (en) * 2005-02-18 2007-03-13 Micron Technology, Inc. Microelectronic imagers with shaped image sensors and methods for manufacturing microelectronic imagers
US7508063B2 (en) * 2005-04-05 2009-03-24 Texas Instruments Incorporated Low cost hermetically sealed package
US7795134B2 (en) 2005-06-28 2010-09-14 Micron Technology, Inc. Conductive interconnect structures and formation methods using supercritical fluids
US7262134B2 (en) 2005-09-01 2007-08-28 Micron Technology, Inc. Microfeature workpieces and methods for forming interconnects in microfeature workpieces
US7288757B2 (en) * 2005-09-01 2007-10-30 Micron Technology, Inc. Microelectronic imaging devices and associated methods for attaching transmissive elements
JP4752447B2 (ja) * 2005-10-21 2011-08-17 ソニー株式会社 固体撮像装置およびカメラ
US20070152134A1 (en) * 2006-01-05 2007-07-05 Techno International Co., Ltd. Pinhole type imaging device
US20070291126A1 (en) * 2006-06-20 2007-12-20 Matsushita Electric Industrial Co., Ltd. Camera with interchangeable lenses having electrical circuitry
KR100810284B1 (ko) * 2006-09-28 2008-03-06 삼성전자주식회사 카메라 모듈과 그 제조 방법
CN101271885B (zh) * 2007-03-21 2010-06-09 鸿富锦精密工业（深圳）有限公司 影像感测器封装及其应用的影像摄取装置
CN101359081B (zh) * 2007-08-03 2010-09-29 鸿富锦精密工业（深圳）有限公司 相机模组
CN102313959B (zh) * 2007-11-21 2014-11-12 Lg伊诺特有限公司 摄像模块
DE102008047088B4 (de) * 2008-09-12 2019-05-29 Jabil Circuit Inc. Kamera-Modul für ein Mobiltelefon
CN101770059B (zh) * 2008-12-27 2012-06-20 鸿富锦精密工业（深圳）有限公司 相机模组
US20100194465A1 (en) * 2009-02-02 2010-08-05 Ali Salih Temperature compensated current source and method therefor
JP2010278667A (ja) * 2009-05-27 2010-12-09 Fujifilm Corp 固体撮像ユニット、撮影装置、および固体撮像素子固定方法
JP5487842B2 (ja) * 2009-06-23 2014-05-14 ソニー株式会社 固体撮像装置
JP5299188B2 (ja) * 2009-09-16 2013-09-25 富士通株式会社 撮像装置、それを備えた電子装置、及び撮像装置の製造方法
GB0920946D0 (en) 2009-11-30 2010-01-13 St Microelectronics Res & Dev Electromagnetic shielding for camera modules
JP5484148B2 (ja) * 2010-03-26 2014-05-07 キヤノン株式会社 光電変換素子ユニットおよび撮像装置
WO2011120480A1 (de) * 2010-04-01 2011-10-06 Conti Temic Microelectronic Gmbh Vorrichtung mit optischem modul und trägerplatte
DE102010021819B4 (de) * 2010-05-28 2018-10-18 Deutsches Zentrum für Luft- und Raumfahrt e.V. Detektor-Modul und höchstauflösender Satellit
JP2012009547A (ja) * 2010-06-23 2012-01-12 Sony Corp 固体撮像装置、電子機器
JP2012049911A (ja) * 2010-08-27 2012-03-08 Canon Inc 光電変換装置および撮像システム
US8934052B2 (en) * 2010-11-02 2015-01-13 Stmicroelectronics Pte Ltd Camera module including an image sensor and a laterally adjacent surface mount device coupled at a lower surface of a dielectric material layer
JP5794002B2 (ja) 2011-07-07 2015-10-14 ソニー株式会社 固体撮像装置、電子機器
JP5525109B2 (ja) * 2011-08-23 2014-06-18 富士フイルム株式会社 撮像装置
DE102011084393A1 (de) * 2011-10-13 2013-04-18 Robert Bosch Gmbh Mikromechanische Funktionsvorrichtung, insbesondere Lautsprechervorrichtung, und entsprechendes Herstellungsverfahren
DE102011086722A1 (de) * 2011-11-21 2013-05-23 Robert Bosch Gmbh Mikromechanische Funktionsvorrichtung, insbesondere Lautsprechervorrichtung, und entsprechendes Herstellungsverfahren
US9082808B2 (en) * 2012-06-05 2015-07-14 Oracle International Corporation Batch process for three-dimensional integration
CN103944354B (zh) * 2013-01-17 2017-03-22 台达电子工业股份有限公司 整合功率模块封装结构
TWI478479B (zh) 2013-01-17 2015-03-21 Delta Electronics Inc 整合功率模組封裝結構
KR20140100323A (ko) * 2013-02-06 2014-08-14 삼성전자주식회사 3차원 일체형 광전 집적회로
WO2014175460A1 (ja) * 2013-04-26 2014-10-30 京セラ株式会社 電子素子実装用基板および電子装置
KR102244153B1 (ko) * 2013-09-13 2021-04-23 엘지이노텍 주식회사 카메라 모듈
KR102384600B1 (ko) * 2013-09-13 2022-04-08 엘지이노텍 주식회사 카메라 모듈
CN103950886B (zh) * 2014-04-30 2015-12-09 中国科学院地质与地球物理研究所 一种mems传感器封装结构及其封装方法
WO2015199134A1 (ja) 2014-06-25 2015-12-30 京セラ株式会社 撮像素子実装用基板および撮像装置
JP6051399B2 (ja) 2014-07-17 2016-12-27 関根　弘一 固体撮像装置及びその製造方法
USD760230S1 (en) * 2014-09-16 2016-06-28 Daishinku Corporation Piezoelectric vibration device
KR102338395B1 (ko) 2015-04-24 2021-12-13 엘지이노텍 주식회사 자동차용 카메라 모듈
WO2017022450A1 (ja) * 2015-07-31 2017-02-09 ソニー株式会社 ピンホールカメラ、電子機器、および製造方法
KR102472566B1 (ko) 2015-12-01 2022-12-01 삼성전자주식회사 반도체 패키지
WO2017130887A1 (ja) * 2016-01-28 2017-08-03 オリンパス株式会社 撮像ユニット、撮像モジュールおよび内視鏡
US10082651B2 (en) 2016-04-11 2018-09-25 Omnivision Technologies, Inc. Slim imager, associated system-in-package, and associated method
EP3562138A4 (de) * 2016-12-23 2020-12-23 Ningbo Sunny Opotech Co., Ltd. Arraykameramodul und verwendung davon
CN108243297A (zh) * 2016-12-23 2018-07-03 宁波舜宇光电信息有限公司 摄像模组及其电路板组件和制造方法以及带有摄像模组的电子设备
US11049898B2 (en) 2017-04-01 2021-06-29 Ningbo Sunny Opotech Co., Ltd. Systems and methods for manufacturing semiconductor modules
CN117133784A (zh) * 2017-07-25 2023-11-28 索尼半导体解决方案公司 固态摄像装置
CN111361071B (zh) * 2018-12-26 2022-05-10 中芯集成电路（宁波）有限公司 摄像组件的封装方法
US20220109091A1 (en) * 2020-10-06 2022-04-07 Texas Instruments Incorporated Integrated circuit device package
TWI804052B (zh) * 2021-06-04 2023-06-01 同欣電子工業股份有限公司 無焊接式感測鏡頭
DE102021205841A1 (de) * 2021-06-10 2022-12-15 MICRO-EPSILON-MESSTECHNIK GmbH & Co. K.G. Gehäuse für eine elektronische Einheit und Sensorsystem mit einem Gehäuse

Family Cites Families (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4445274A (en) * 1977-12-23 1984-05-01 Ngk Insulators, Ltd. Method of manufacturing a ceramic structural body
JPS5624969A (en) * 1979-08-09 1981-03-10 Canon Inc Semiconductor integrated circuit element
JPS5734094A (en) 1980-08-08 1982-02-24 Nippon Kayaku Kk Static charge hard ammonium nitrate oil explosive
JPS58216474A (ja) * 1982-06-10 1983-12-16 Toshiba Corp 光半導体装置
US4760440A (en) * 1983-10-31 1988-07-26 General Electric Company Package for solid state image sensors
JPS60103681A (ja) * 1983-11-10 1985-06-07 Nec Corp 樹脂封止型光電変換モジユ−ル
JPS62102548A (ja) * 1985-10-30 1987-05-13 Toshiba Corp 樹脂封止型半導体装置の製造方法
DD242308A1 (de) * 1985-11-08 1987-01-21 Werk Fernsehelektronik Veb Multichiphybridbaustein
JPS6343353A (ja) 1986-08-08 1988-02-24 Olympus Optical Co Ltd 固体撮像装置
US4918521A (en) * 1987-01-20 1990-04-17 Olympus Optical Co., Ltd. Solid state imaging apparatus
JPS63236371A (ja) * 1987-03-24 1988-10-03 Nec Corp 光受信装置
JPS63308375A (ja) * 1987-06-10 1988-12-15 Hitachi Ltd 固体撮像装置
JPH01154569A (ja) * 1987-12-11 1989-06-16 Nec Corp 固体撮像装置
CA1301384C (en) * 1988-02-29 1992-05-19 Takeshi Ban Video telephone with changeable aperture
JPH0631387Y2 (ja) 1988-04-13 1994-08-22 呉羽化学工業株式会社 焦電型赤外線センサ
US5253010A (en) * 1988-05-13 1993-10-12 Minolta Camera Kabushiki Kaisha Printed circuit board
US5122861A (en) * 1988-11-25 1992-06-16 Fuji Photo Film Co., Ltd. Solid state image pickup device having particular package structure
JPH0732208B2 (ja) * 1989-10-31 1995-04-10 三菱電機株式会社 半導体装置
JP2591838B2 (ja) * 1990-02-13 1997-03-19 東ソー株式会社 ポリフェニレンスルフィド樹脂組成物
JPH0453155A (ja) * 1990-06-15 1992-02-20 Mitsubishi Electric Corp 半導体容器
KR920702545A (ko) * 1990-06-26 1992-09-04 아이자와 스스무 반도체 장치 및 그 제조 방법
JPH04235475A (ja) * 1991-01-10 1992-08-24 Olympus Optical Co Ltd 固体撮像装置
DE69219453T2 (de) 1991-09-24 1997-12-18 Nohmi Bosai Ltd Pyroelektrisches element
EP0714127B1 (de) * 1991-11-28 2003-01-29 Kabushiki Kaisha Toshiba Halbleitergehäuse
WO1993022787A1 (en) 1992-04-28 1993-11-11 Lsi Logic Corporation Arrangement for mounting a lens to a solid state image sensor
US5422435A (en) * 1992-05-22 1995-06-06 National Semiconductor Corporation Stacked multi-chip modules and method of manufacturing
JP3114106B2 (ja) 1992-06-23 2000-12-04 ソニー株式会社 パッケージ
JP2843464B2 (ja) * 1992-09-01 1999-01-06 シャープ株式会社 固体撮像装置
JP3295141B2 (ja) * 1992-09-29 2002-06-24 セイコープレシジョン株式会社 測距装置およびこの測距装置を有するカメラ
JP3237258B2 (ja) * 1993-01-22 2001-12-10 株式会社デンソー セラミック多層配線基板
GB9301405D0 (en) 1993-01-25 1993-03-17 Philips Electronics Uk Ltd An image sensor
DE4302442A1 (de) * 1993-01-29 1994-08-04 Fahrzeugklimaregelung Gmbh Sensor zur Erfassung der Bestrahlungsstärke und des Einfallwinkels der Sonnenstrahlung
US5337217A (en) * 1993-02-25 1994-08-09 Eastman Kodak Company Integrated circuit package for an image sensor
JP3198796B2 (ja) * 1993-06-25 2001-08-13 富士電機株式会社 モールドモジュール
US5486720A (en) * 1994-05-26 1996-01-23 Analog Devices, Inc. EMF shielding of an integrated circuit package
US5423119A (en) * 1994-07-08 1995-06-13 Hualon Microelectronics Corporation Method for manufacturing a hybrid circuit charge-coupled device image sensor
US5940126A (en) * 1994-10-25 1999-08-17 Kabushiki Kaisha Toshiba Multiple image video camera apparatus
JP2746171B2 (ja) * 1995-02-21 1998-04-28 日本電気株式会社 固体撮像装置及びその製造方法
JPH09181287A (ja) * 1995-10-24 1997-07-11 Sony Corp 受光装置とその製造方法
US5763943A (en) * 1996-01-29 1998-06-09 International Business Machines Corporation Electronic modules with integral sensor arrays
US6028351A (en) * 1996-10-09 2000-02-22 Texas Instruments Incorporated Gasket sealed integrated circuit package
US6753922B1 (en) * 1998-10-13 2004-06-22 Intel Corporation Image sensor mounted by mass reflow

Also Published As

Publication number Publication date
US20040263671A1 (en) 2004-12-30
EP1715525A2 (de) 2006-10-25
EP0807976B1 (de) 2009-07-22
DE69739708D1 (de) 2010-01-28
EP1715524B1 (de) 2013-08-07
EP1715526B1 (de) 2013-05-08
EP1715524A2 (de) 2006-10-25
US8098309B2 (en) 2012-01-17
EP1715524A3 (de) 2008-01-23
US8564702B2 (en) 2013-10-22
US20140042578A1 (en) 2014-02-13
EP1715526A2 (de) 2006-10-25
US20020044215A1 (en) 2002-04-18
US20120069230A1 (en) 2012-03-22
EP0807976A3 (de) 1999-03-24
EP1715526A3 (de) 2008-01-23
EP1715525B1 (de) 2009-12-16
EP0807976A2 (de) 1997-11-19
EP1715525A3 (de) 2008-01-23
US6795120B2 (en) 2004-09-21

Similar Documents

Publication Publication Date Title
DE69739498D1 (de) Festkörperbildaufnameapparat und Verwendung in einer Kamera
DE69729149D1 (de) Prozesskassette und Bilderzeugungsgerät mit herausnehmbarer Prozesskassette
DE69725505D1 (de) Bildkombinationsgerät und -verfahren
DE69731316D1 (de) Bildmarkierung und -authentifizierung in einer kamera
DE69517459D1 (de) Bilderzeugungsgerät und -verfahren
DE69717220T2 (de) Arbeitseinheit und elektrophotographisches Bilderzeugungsgerät
DE69723528D1 (de) Arbeitseinheit und elektrophotographisches Bilderzeugungsgerät
DE69723382D1 (de) Arbeitseinheit und elektrophotographisches Bilderzeugungsgerät
DE69721423D1 (de) Arbeitseinheit und elektrophotographisches Bilderzeugungsgerät
DE69723189D1 (de) Arbeitseinheit und elektrophotographisches Bilderzeugungsgerät
DE69720629D1 (de) Arbeitseinheit und elektrophotographisches Bilderzeugungsgerät
DE69719895T2 (de) Arbeitseinheit und elektrophotographisches Bilderzeugungsgerät
DE69738594D1 (de) Strahlungsbildwandler und dazugehörige Verfahren
DE69432097D1 (de) Abbildungsgerät und -verfahren
DE4497968T1 (de) Abbildungsverfahren und Abbildungseinrichtung
DE69715584D1 (de) Bilderzeugungsgerät und -Verfahren
DE69426658T2 (de) Abbildungsgerät und -verfahren
DE69720901D1 (de) Arbeitseinheit und elektrophotographisches Bilderzeugungsgerät
DE69516434D1 (de) Leistungssteuervorrichtung und dieselbe benutzendes Bilderzeugungsgerät
HK1009012A1 (en) Illuminating device and photographing apparatus
DE69835578D1 (de) Photoelektrische Umwandlungsvorrichtung, Bildaufnahmevorrichtung und Verwendung in einer autofocus Kamera
DE69512853T2 (de) Bilderzeugungsverfahren und -Vorrichtungen
DE69517543D1 (de) Bilderzeugungsverfahren und Gerät
DE69529017D1 (de) Spannungserhöhungsschaltung und ihre Verwendung in einer Festkörper-Bildaufnahmevorrichtung
DE69737642D1 (de) Festkörperbildsensor, Steuerungsverfahren und Verwendung desselben in einer Kamera

Legal Events

Date Code Title Description
8364 No opposition during term of opposition