DE69629686D1 - Fotohärtbare epoxyzusammensetzung - Google Patents

Fotohärtbare epoxyzusammensetzung

Info

Publication number
DE69629686D1
DE69629686D1 DE69629686T DE69629686T DE69629686D1 DE 69629686 D1 DE69629686 D1 DE 69629686D1 DE 69629686 T DE69629686 T DE 69629686T DE 69629686 T DE69629686 T DE 69629686T DE 69629686 D1 DE69629686 D1 DE 69629686D1
Authority
DE
Germany
Prior art keywords
epoxy composition
photocurable epoxy
photocurable
composition
epoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69629686T
Other languages
English (en)
Other versions
DE69629686T2 (de
Inventor
Alan Lawton
John Nebe
Anthony Thommes
V Caspar
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DSM IP Assets BV
Original Assignee
DSM NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=23892033&utm_source=***_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE69629686(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by DSM NV filed Critical DSM NV
Application granted granted Critical
Publication of DE69629686D1 publication Critical patent/DE69629686D1/de
Publication of DE69629686T2 publication Critical patent/DE69629686T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C41/00Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
    • B29C41/003Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor characterised by the choice of material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10Processes of additive manufacturing
    • B29C64/106Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
    • B29C64/124Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified
    • B29C64/129Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask
    • B29C64/135Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask the energy source being concentrated, e.g. scanning lasers or focused light sources
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0037Production of three-dimensional images
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0037Other properties
    • B29K2995/0072Roughness, e.g. anti-slip
    • B29K2995/0073Roughness, e.g. anti-slip smooth
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/146Laser beam

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Optics & Photonics (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Epoxy Resins (AREA)
DE69629686T 1995-06-07 1996-06-04 Fotohärtbare epoxyzusammensetzung Expired - Lifetime DE69629686T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US47648295A 1995-06-07 1995-06-07
US476482 1995-06-07
PCT/US1996/008488 WO1996041239A1 (en) 1995-06-07 1996-06-04 Photohardenable epoxy composition

Publications (2)

Publication Number Publication Date
DE69629686D1 true DE69629686D1 (de) 2003-10-02
DE69629686T2 DE69629686T2 (de) 2004-06-17

Family

ID=23892033

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69629686T Expired - Lifetime DE69629686T2 (de) 1995-06-07 1996-06-04 Fotohärtbare epoxyzusammensetzung

Country Status (5)

Country Link
US (2) US5707780A (de)
EP (1) EP0830641B1 (de)
JP (1) JPH11507090A (de)
DE (1) DE69629686T2 (de)
WO (1) WO1996041239A1 (de)

Families Citing this family (62)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2146070C (en) * 1995-03-15 2002-01-29 Kees Jonckers Improved reactor for the synthesis of urea
AU2653497A (en) 1996-05-09 1997-11-26 Dsm N.V. Photosensitive resin composition for rapid prototyping and process for the manufacture of 3-dimensional objects
ES2144836T3 (es) * 1996-07-29 2000-06-16 Ciba Sc Holding Ag Composicion liquida reticulable por radiacion, en especial para estereolitografia.
US7332537B2 (en) * 1996-09-04 2008-02-19 Z Corporation Three dimensional printing material system and method
JP3786480B2 (ja) * 1996-10-14 2006-06-14 Jsr株式会社 光硬化性樹脂組成物
US6379866B2 (en) 2000-03-31 2002-04-30 Dsm Desotech Inc Solid imaging compositions for preparing polypropylene-like articles
US6287748B1 (en) 1998-07-10 2001-09-11 Dsm N.V. Solid imaging compositions for preparing polyethylene-like articles
US6762002B2 (en) 1998-07-10 2004-07-13 Dsm Desotech, Inc. Solid imaging compositions for preparing polypropylene-like articles
US20060154175A9 (en) * 1998-07-10 2006-07-13 Lawton John A Solid imaging compositions for preparing polypropylene-like articles
US6203871B1 (en) * 1998-10-14 2001-03-20 Lexmark International, Inc. Encapsulant for leads in an aqueous environment
CA2388046A1 (en) * 1999-11-05 2001-05-17 Z Corporation Material systems and methods of three-dimensional printing
KR100696412B1 (ko) 1999-12-22 2007-03-20 타이요 잉크 메뉴펙츄어링 컴퍼니, 리미티드 활성 에너지선 경화성 수지조성물
JP4713704B2 (ja) * 2000-02-29 2011-06-29 太陽ホールディングス株式会社 活性エネルギー線硬化性樹脂組成物
JP4497610B2 (ja) * 1999-12-22 2010-07-07 太陽インキ製造株式会社 光硬化性樹脂組成物
US20030207959A1 (en) * 2000-03-13 2003-11-06 Eduardo Napadensky Compositions and methods for use in three dimensional model printing
US6569373B2 (en) * 2000-03-13 2003-05-27 Object Geometries Ltd. Compositions and methods for use in three dimensional model printing
US7300619B2 (en) * 2000-03-13 2007-11-27 Objet Geometries Ltd. Compositions and methods for use in three dimensional model printing
US8481241B2 (en) 2000-03-13 2013-07-09 Stratasys Ltd. Compositions and methods for use in three dimensional model printing
US7555542B1 (en) 2000-05-22 2009-06-30 Internap Network Services Corporation Method and system for directing requests for content to a content server based on network performance
US6981055B1 (en) 2000-08-22 2005-12-27 Internap Network Services Corporation Method and system for optimizing routing through multiple available internet route providers
US6811937B2 (en) 2001-06-21 2004-11-02 Dsm Desotech, Inc. Radiation-curable resin composition and rapid prototyping process using the same
US20030198824A1 (en) * 2002-04-19 2003-10-23 Fong John W. Photocurable compositions containing reactive polysiloxane particles
US20040054025A1 (en) * 2002-06-20 2004-03-18 Lawton John A. Compositions comprising a benzophenone photoinitiator
US7087109B2 (en) * 2002-09-25 2006-08-08 Z Corporation Three dimensional printing material system and method
WO2004029567A1 (en) * 2002-09-26 2004-04-08 Rensselaer Polytechnic Institute Analytical instruments for monitoring photopolymerization
US20040077745A1 (en) * 2002-10-18 2004-04-22 Jigeng Xu Curable compositions and rapid prototyping process using the same
US20040087687A1 (en) * 2002-10-30 2004-05-06 Vantico A&T Us Inc. Photocurable compositions with phosphite viscosity stabilizers
ES2376237T3 (es) * 2003-05-21 2012-03-12 Z Corporation Sistema de material en polvo termopl�?stico para modelos de apariencia a partir de sistemas de impresión en 3d.
US7232850B2 (en) * 2003-10-03 2007-06-19 Huntsman Advanced Materials Americas Inc. Photocurable compositions for articles having stable tensile properties
US20070149667A1 (en) * 2003-10-16 2007-06-28 Dsm Ip Assets B.V. Curable compositions and rapid prototyping process using the same
US20050101684A1 (en) * 2003-11-06 2005-05-12 Xiaorong You Curable compositions and rapid prototyping process using the same
US20050165127A1 (en) * 2003-12-31 2005-07-28 Dsm Desotech, Inc. Solid imaging compositions for preparing polyethylene-like articles
KR101031693B1 (ko) * 2004-06-18 2011-04-29 엘지디스플레이 주식회사 패턴형성용 레지스트 및 이를 이용한 패턴형성방법
US20060172230A1 (en) * 2005-02-02 2006-08-03 Dsm Ip Assets B.V. Method and composition for reducing waste in photo-imaging applications
US20070241482A1 (en) * 2006-04-06 2007-10-18 Z Corporation Production of three-dimensional objects by use of electromagnetic radiation
EP2089215B1 (de) * 2006-12-08 2015-02-18 3D Systems Incorporated Dreidimensionales druckmaterialsystem
JP5129267B2 (ja) * 2007-01-10 2013-01-30 スリーディー システムズ インコーポレーテッド 改良された色、物品性能及び使用の容易さ、を持つ3次元印刷材料システム
US7968626B2 (en) 2007-02-22 2011-06-28 Z Corporation Three dimensional printing material system and method using plasticizer-assisted sintering
JP2014055241A (ja) * 2012-09-12 2014-03-27 Sanyo Chem Ind Ltd 感光性組成物
KR20170018067A (ko) 2014-06-23 2017-02-15 카본, 인크. 다중 경화 메커니즘을 갖는 물질로부터 폴리우레탄 3차원 물체를 제조하는 방법
CN107438513B (zh) 2015-02-05 2020-12-29 卡本有限公司 通过间歇曝光的增材制造方法
US10391711B2 (en) 2015-03-05 2019-08-27 Carbon, Inc. Fabrication of three dimensional objects with multiple operating modes
US10471655B2 (en) 2015-09-04 2019-11-12 Carbon, Inc. Cyanate ester dual resins for additive manufacturing
CN108291011B (zh) 2015-09-09 2021-03-02 卡本有限公司 用于增材制造的环氧双重固化树脂
WO2017048710A1 (en) * 2015-09-14 2017-03-23 Carbon, Inc. Light-curable article of manufacture with portions of differing solubility
US10647873B2 (en) 2015-10-30 2020-05-12 Carbon, Inc. Dual cure article of manufacture with portions of differing solubility
WO2017079502A1 (en) 2015-11-05 2017-05-11 Carbon, Inc. Silicone dual cure resins for additive manufacturing
US10501572B2 (en) 2015-12-22 2019-12-10 Carbon, Inc. Cyclic ester dual cure resins for additive manufacturing
JP7189015B2 (ja) 2015-12-22 2022-12-13 カーボン,インコーポレイテッド 二重硬化樹脂を用いた積層造形のための二重前駆体樹脂システム
US10343331B2 (en) 2015-12-22 2019-07-09 Carbon, Inc. Wash liquids for use in additive manufacturing with dual cure resins
US10787583B2 (en) 2015-12-22 2020-09-29 Carbon, Inc. Method of forming a three-dimensional object comprised of a silicone polymer or co-polymer
EP3394673A1 (de) 2015-12-22 2018-10-31 Carbon, Inc. Herstellung von verbundprodukten aus mehreren zwischenprodukten durch generative fertigung mit zweifachhärtungsharzen
WO2017112571A1 (en) 2015-12-22 2017-06-29 Carbon, Inc. Dual cure additive manufacturing of rigid intermediates that generate semi-rigid, flexible, or elastic final products
US10647054B2 (en) 2015-12-22 2020-05-12 Carbon, Inc. Accelerants for additive manufacturing with dual cure resins
US10500786B2 (en) 2016-06-22 2019-12-10 Carbon, Inc. Dual cure resins containing microwave absorbing materials and methods of using the same
WO2018094131A1 (en) 2016-11-21 2018-05-24 Carbon, Inc. Method of making three-dimensional object by delivering reactive component for subsequent cure
US11535686B2 (en) 2017-03-09 2022-12-27 Carbon, Inc. Tough, high temperature polymers produced by stereolithography
US10316213B1 (en) 2017-05-01 2019-06-11 Formlabs, Inc. Dual-cure resins and related methods
JP6894015B2 (ja) 2017-06-21 2021-06-23 カーボン,インコーポレイテッド 積層造形の方法
CN112074395A (zh) * 2018-03-02 2020-12-11 福姆实验室公司 潜伏性固化树脂及相关方法
US11504903B2 (en) 2018-08-28 2022-11-22 Carbon, Inc. 1K alcohol dual cure resins for additive manufacturing
US20220064367A1 (en) 2018-12-10 2022-03-03 Delo Industrie Klebstoffe Gmbh & Co. Kgaa Cationically curable composition and method for the joining, casting and coating of substrates using the composition

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3450613A (en) * 1964-03-09 1969-06-17 Bausch & Lomb Epoxy adhesive containing acrylic acid-epoxy reaction products and photosensitizers
US3640718A (en) 1968-04-10 1972-02-08 Minnesota Mining & Mfg Spectral sentization of photosensitive compositions
US3700643A (en) * 1970-09-02 1972-10-24 Union Carbide Corp Radiation-curable acrylate-capped polycaprolactone compositions
US3742086A (en) * 1971-05-28 1973-06-26 J Epel Thermosetting composition
US4026705A (en) * 1975-05-02 1977-05-31 General Electric Company Photocurable compositions and methods
US4069054A (en) * 1975-09-02 1978-01-17 Minnesota Mining And Manufacturing Company Photopolymerizable composition containing a sensitized aromatic sulfonium compound and a cationacally polymerizable monomer
US4113895A (en) * 1976-11-19 1978-09-12 American Can Company Method for producing multilayered coated substrate
US4138255A (en) * 1977-06-27 1979-02-06 General Electric Company Photo-curing method for epoxy resin using group VIa onium salt
US4169732A (en) * 1978-01-09 1979-10-02 International Business Machines Corporation Photosensitive coating composition and use thereof
US4173476A (en) * 1978-02-08 1979-11-06 Minnesota Mining And Manufacturing Company Complex salt photoinitiator
US4156035A (en) * 1978-05-09 1979-05-22 W. R. Grace & Co. Photocurable epoxy-acrylate compositions
US4291114A (en) * 1978-10-18 1981-09-22 Minnesota Mining And Manufacturing Co. Imageable, composite-dry transfer sheet and process of using same
US4250053A (en) * 1979-05-21 1981-02-10 Minnesota Mining And Manufacturing Company Sensitized aromatic iodonium or aromatic sulfonium salt photoinitiator systems
US4245029A (en) * 1979-08-20 1981-01-13 General Electric Company Photocurable compositions using triarylsulfonium salts
US4442197A (en) * 1982-01-11 1984-04-10 General Electric Company Photocurable compositions
US4504374A (en) * 1983-03-09 1985-03-12 Desoto, Inc. Ultraviolet cured coating method to provide stone chip resistance
DE3565013D1 (en) * 1984-02-10 1988-10-20 Ciba Geigy Ag Process for the preparation of a protection layer or a relief pattern
US4603182A (en) * 1984-10-05 1986-07-29 General Electric Company Low viscosity epoxy resin compositions
US4668601A (en) * 1985-01-18 1987-05-26 Minnesota Mining And Manufacturing Company Protective coating for phototools
US4694029A (en) * 1985-04-09 1987-09-15 Cook Paint And Varnish Company Hybrid photocure system
GB8515475D0 (en) * 1985-06-19 1985-07-24 Ciba Geigy Ag Forming images
US4657779A (en) 1986-03-19 1987-04-14 Desoto, Inc. Shrinkage-resistant ultraviolet-curing coatings
ATE161860T1 (de) * 1988-02-19 1998-01-15 Asahi Denka Kogyo Kk Kunststoffzusammensetzung für optisches modellieren
US5182056A (en) * 1988-04-18 1993-01-26 3D Systems, Inc. Stereolithography method and apparatus employing various penetration depths
JPH04500929A (ja) * 1988-08-08 1992-02-20 デソート インコーポレイテッド 光硬化性コンパウンドおよびインベストメント鋳造法
US5223584A (en) * 1989-07-11 1993-06-29 Gencorp Inc. In situ thermoset molecular composites
US5059512A (en) * 1989-10-10 1991-10-22 International Business Machines Corporation Ultraviolet light sensitive photoinitiator compositions, use thereof and radiation sensitive compositions
DE59007720D1 (de) * 1989-10-27 1994-12-22 Ciba Geigy Ag Verfahren zur Abstimmung der Strahlungsempfindlichkeit von photopolymerisierbaren Zusammensetzungen.
US5055439A (en) * 1989-12-27 1991-10-08 International Business Machines Corporation Photoacid generating composition and sensitizer therefor
US5236812A (en) 1989-12-29 1993-08-17 E. I. Du Pont De Nemours And Company Solid imaging method and apparatus
JP2667934B2 (ja) 1991-05-01 1997-10-27 アライド−シグナル・インコーポレーテッド ビニルエーテル−エポキシドポリマー類を用いた立体リソグラフィー
JPH0586149A (ja) * 1991-09-30 1993-04-06 I C I Japan Kk 光立体成形用樹脂組成物並びに立体成形体の形成方法
TW269017B (de) * 1992-12-21 1996-01-21 Ciba Geigy Ag
US5384339A (en) * 1993-03-09 1995-01-24 Starkey; Donn R. Epoxy based balancing compound and method for balancing a rotor utilizing an ultraviolet-curable epoxy resin composition
US6117536A (en) * 1998-09-10 2000-09-12 Ga-Tek Inc. Adhesion promoting layer for use with epoxy prepregs

Also Published As

Publication number Publication date
WO1996041239A1 (en) 1996-12-19
JPH11507090A (ja) 1999-06-22
DE69629686T2 (de) 2004-06-17
EP0830641A1 (de) 1998-03-25
USRE39106E1 (en) 2006-05-23
EP0830641B1 (de) 2003-08-27
US5707780A (en) 1998-01-13

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