DE69603531D1 - Epoxyharz, Harzzusammensetzung und Harz-verkapselte Halbleitervorrichtung - Google Patents
Epoxyharz, Harzzusammensetzung und Harz-verkapselte HalbleitervorrichtungInfo
- Publication number
- DE69603531D1 DE69603531D1 DE69603531T DE69603531T DE69603531D1 DE 69603531 D1 DE69603531 D1 DE 69603531D1 DE 69603531 T DE69603531 T DE 69603531T DE 69603531 T DE69603531 T DE 69603531T DE 69603531 D1 DE69603531 D1 DE 69603531D1
- Authority
- DE
- Germany
- Prior art keywords
- resin
- semiconductor device
- encapsulated semiconductor
- epoxy
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D303/00—Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
- C07D303/02—Compounds containing oxirane rings
- C07D303/12—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms
- C07D303/18—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms by etherified hydroxyl radicals
- C07D303/20—Ethers with hydroxy compounds containing no oxirane rings
- C07D303/24—Ethers with hydroxy compounds containing no oxirane rings with polyhydroxy compounds
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C39/00—Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring
- C07C39/205—Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring polycyclic, containing only six-membered aromatic rings as cyclic parts with unsaturation outside the rings
- C07C39/21—Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring polycyclic, containing only six-membered aromatic rings as cyclic parts with unsaturation outside the rings with at least one hydroxy group on a non-condensed ring
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C39/00—Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring
- C07C39/205—Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring polycyclic, containing only six-membered aromatic rings as cyclic parts with unsaturation outside the rings
- C07C39/21—Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring polycyclic, containing only six-membered aromatic rings as cyclic parts with unsaturation outside the rings with at least one hydroxy group on a non-condensed ring
- C07C39/215—Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring polycyclic, containing only six-membered aromatic rings as cyclic parts with unsaturation outside the rings with at least one hydroxy group on a non-condensed ring containing, e.g. diethylstilbestrol
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C08G59/245—Di-epoxy compounds carbocyclic aromatic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10446495A JPH08301974A (ja) | 1995-04-27 | 1995-04-27 | エポキシ樹脂の製造方法 |
JP10676895 | 1995-04-28 | ||
JP10676995 | 1995-04-28 | ||
JP10841895A JP3508289B2 (ja) | 1995-05-02 | 1995-05-02 | エポキシ樹脂組成物および樹脂封止型半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69603531D1 true DE69603531D1 (de) | 1999-09-09 |
DE69603531T2 DE69603531T2 (de) | 1999-12-16 |
Family
ID=27469218
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69603531T Expired - Fee Related DE69603531T2 (de) | 1995-04-27 | 1996-04-25 | Epoxyharz, Harzzusammensetzung und Harz-verkapselte Halbleitervorrichtung |
Country Status (7)
Country | Link |
---|---|
US (2) | US5939473A (de) |
EP (1) | EP0739877B1 (de) |
KR (1) | KR960037716A (de) |
CN (1) | CN1145353A (de) |
CA (1) | CA2175142A1 (de) |
DE (1) | DE69603531T2 (de) |
TW (1) | TW408141B (de) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5686551A (en) * | 1994-01-07 | 1997-11-11 | The Dow Chemical Company | Hydroxy ether polymers as thermoplastic barrier resins |
EP0869140B1 (de) * | 1997-03-31 | 2003-08-13 | Sumitomo Chemical Company, Limited | Epoxidharzzusammensetzung und eine harzverkapselte Halbleiteranordnung |
US6143423A (en) * | 1997-04-07 | 2000-11-07 | Shin-Etsu Chemical Co., Ltd. | Flame retardant epoxy resin compositions |
JPH11317475A (ja) * | 1998-02-27 | 1999-11-16 | Canon Inc | 半導体用封止材樹脂および半導体素子 |
TW459016B (en) * | 1998-03-13 | 2001-10-11 | Sumitomo Chemical Co | Epoxy resin composition and resin-encapsulated semiconductor device |
KR100562454B1 (ko) * | 1998-07-21 | 2006-03-21 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 반도체 봉지용 에폭시 수지 조성물 및 반도체 장치 |
TWI243839B (en) * | 1998-12-24 | 2005-11-21 | Chang Chun Plastics Co Ltd | Epoxy resin and resin-sealed type semiconductor apparatus |
WO2001046290A1 (en) | 1999-12-20 | 2001-06-28 | 3M Innovative Properties Company | Ambient-temperature-stable, one-part curable epoxy adhesive |
US6924596B2 (en) * | 2001-11-01 | 2005-08-02 | Nichia Corporation | Light emitting apparatus provided with fluorescent substance and semiconductor light emitting device, and method of manufacturing the same |
TWI337613B (en) * | 2003-06-19 | 2011-02-21 | Sumitomo Chemical Co | Epoxy compound and cured epoxy resin product |
JP4593123B2 (ja) * | 2004-02-13 | 2010-12-08 | ハリマ化成株式会社 | 導電性接着剤 |
US7417111B2 (en) * | 2004-03-31 | 2008-08-26 | Intel Corporation | Liquid crystalline epoxy resins |
JP2007234828A (ja) | 2006-02-28 | 2007-09-13 | Tdk Corp | 電子部品及びその製造方法 |
ATE508154T1 (de) * | 2008-05-15 | 2011-05-15 | Evonik Degussa Gmbh | Elektronische verpackung |
FR2946049B1 (fr) | 2009-05-27 | 2013-01-18 | Chaire Europ De Chimie Nouvelle Pour Un Dev Durable | Compose phenoliques naturels et leur mode d'activation pour la formulation de resines thermodurcissables |
WO2011040416A1 (ja) * | 2009-09-29 | 2011-04-07 | 日立化成工業株式会社 | 樹脂組成物、樹脂シート、ならびに、樹脂硬化物およびその製造方法 |
US9777106B2 (en) | 2013-03-14 | 2017-10-03 | Case Western Reserve University | Bisphenol polymer precursor replacements |
FR3030514A1 (fr) * | 2014-12-18 | 2016-06-24 | Centre De Coop Int En Rech Agronomique Pour Le Dev (Cirad) | Dimeres polyaromatiques |
CN114350295B (zh) * | 2021-12-30 | 2024-01-26 | 江苏中科科化新材料股份有限公司 | 环氧树脂组合物及其制备方法与应用、环氧树脂及其应用 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL6711158A (de) * | 1966-08-17 | 1968-02-19 | ||
US4189610A (en) * | 1977-10-31 | 1980-02-19 | Monsanto Company | Preparation of 4,4-dioxy-substituted stilbenes |
US4156787A (en) * | 1977-10-31 | 1979-05-29 | Monsanto Company | One-step dehydrohalogenation-rearrangement-hydrogenation of 1,1-bis(4-hydroxyaryl)-2-haloethanes |
DE3622613A1 (de) * | 1986-07-05 | 1988-01-14 | Bayer Ag | Verfahren zur herstellung von polymeren netzwerken mit ueberstrukturen, entsprechende polymere netzwerke und ihre verwendung |
JPS6456721A (en) * | 1987-08-28 | 1989-03-03 | Hitachi Ltd | Epoxy resin composition and semiconductor device coated and sealed therewith |
JPS6485215A (en) * | 1987-09-28 | 1989-03-30 | Hitachi Ltd | Epoxy resin composition |
US5270405A (en) * | 1989-01-17 | 1993-12-14 | The Dow Chemical Company | Mesogenic epoxy compounds |
SG52478A1 (en) * | 1989-01-17 | 1998-09-28 | Dow Chemical Co | Mesogenic epoxy compounds |
US5270404A (en) * | 1989-01-17 | 1993-12-14 | The Dow Chemical Company | Curable compositions of mesogen-containing advanced epoxy resins and curing agents therefor |
US5292831A (en) * | 1989-01-17 | 1994-03-08 | The Dow Chemical Company | Mesogenic epoxy compounds |
US5463091A (en) * | 1989-01-17 | 1995-10-31 | The Dow Chemical Company | Diglycidyl ether of 4,4'-dihydroxy-α-methylstilbene |
US5266660A (en) * | 1989-01-17 | 1993-11-30 | The Dow Chemical Co. | Curable compositions containing mesogenic epoxy compounds and cured products thereof |
DE4040471A1 (de) * | 1990-08-01 | 1992-02-06 | Bayer Ag | Haertbare mischungen zur herstellung von epoxidnetzwerken, verfahren zu deren herstellung und verwendung |
US5360884A (en) * | 1990-08-03 | 1994-11-01 | The Dow Chemical Company | Mesogenic glycidyl amine blends |
US5264502A (en) * | 1990-08-03 | 1993-11-23 | The Dow Chemical Company | Diamino-alpha-alkylstilbene curing agents for epoxy resins |
US5276184A (en) * | 1990-08-03 | 1994-01-04 | The Dow Chemical Company | Sulfonamide compounds containing mesogenic moieties |
US5262509A (en) * | 1990-08-03 | 1993-11-16 | The Dow Chemical Company | Mesogenic glycidyl amines |
US5268434A (en) * | 1990-08-03 | 1993-12-07 | The Dow Chemical Company | Diamino-alpha-alkylstilbenes as epoxy resin curing agents |
JPH04112845A (ja) * | 1990-09-04 | 1992-04-14 | Mitsubishi Kasei Corp | ヒドロキシスチルベン類の製法 |
JPH04202125A (ja) * | 1990-11-30 | 1992-07-22 | Terumo Corp | 肝障害治療薬 |
JPH05139886A (ja) * | 1991-11-21 | 1993-06-08 | Toshiba Corp | 砒素化合物単結晶の製造方法 |
US5314693A (en) * | 1992-02-07 | 1994-05-24 | Kioritz Corporation | Pest control chemicals against pine wood nematodes |
US5414150A (en) * | 1993-12-03 | 1995-05-09 | The Dow Chemical Company | Preparation of 4,4'-dihydroxy-alpha-alkylstilbenes and 4,4'-dihydroxy-alpha, alpha'-dialkylstilbenes |
-
1996
- 1996-04-25 EP EP96106558A patent/EP0739877B1/de not_active Expired - Lifetime
- 1996-04-25 DE DE69603531T patent/DE69603531T2/de not_active Expired - Fee Related
- 1996-04-26 CA CA002175142A patent/CA2175142A1/en not_active Abandoned
- 1996-04-26 KR KR1019960013241A patent/KR960037716A/ko not_active Application Discontinuation
- 1996-04-26 TW TW085105021A patent/TW408141B/zh active
- 1996-04-27 CN CN96108903A patent/CN1145353A/zh active Pending
- 1996-04-29 US US08/639,506 patent/US5939473A/en not_active Expired - Fee Related
-
1997
- 1997-06-20 US US08/879,600 patent/US5939509A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE69603531T2 (de) | 1999-12-16 |
EP0739877A2 (de) | 1996-10-30 |
CA2175142A1 (en) | 1996-10-28 |
TW408141B (en) | 2000-10-11 |
US5939509A (en) | 1999-08-17 |
EP0739877A3 (de) | 1997-03-12 |
CN1145353A (zh) | 1997-03-19 |
US5939473A (en) | 1999-08-17 |
KR960037716A (ko) | 1996-11-19 |
EP0739877B1 (de) | 1999-08-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |