AU7905100A - Epoxy resin composition and resin encapsulation type semiconductor device - Google Patents
Epoxy resin composition and resin encapsulation type semiconductor deviceInfo
- Publication number
- AU7905100A AU7905100A AU79051/00A AU7905100A AU7905100A AU 7905100 A AU7905100 A AU 7905100A AU 79051/00 A AU79051/00 A AU 79051/00A AU 7905100 A AU7905100 A AU 7905100A AU 7905100 A AU7905100 A AU 7905100A
- Authority
- AU
- Australia
- Prior art keywords
- semiconductor device
- type semiconductor
- encapsulation type
- resin composition
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/687—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing sulfur
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0025—Crosslinking or vulcanising agents; including accelerators
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/13—Phenols; Phenolates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30147999A JP4417494B2 (en) | 1999-09-17 | 1999-09-17 | Epoxy resin composition and resin-encapsulated semiconductor device |
JP301479/99 | 1999-09-17 | ||
PCT/EP2000/009187 WO2001021697A1 (en) | 1999-09-17 | 2000-09-15 | Epoxy resin composition and resin encapsulation type semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
AU7905100A true AU7905100A (en) | 2001-04-24 |
Family
ID=17897412
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU79051/00A Abandoned AU7905100A (en) | 1999-09-17 | 2000-09-15 | Epoxy resin composition and resin encapsulation type semiconductor device |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4417494B2 (en) |
AR (1) | AR025677A1 (en) |
AU (1) | AU7905100A (en) |
WO (1) | WO2001021697A1 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5485487B2 (en) * | 1999-12-13 | 2014-05-07 | ダウ グローバル テクノロジーズ エルエルシー | Flame retardant phosphorus element-containing epoxy resin composition |
DE102005040126A1 (en) * | 2005-08-25 | 2007-03-01 | Altana Electrical Insulation Gmbh | coating composition |
JPWO2013118509A1 (en) * | 2012-02-10 | 2015-05-11 | 三井化学株式会社 | Surface sealant for organic EL element, organic EL device using the same, and manufacturing method thereof |
JP6434748B2 (en) * | 2014-08-29 | 2018-12-05 | 積水化学工業株式会社 | Sealant for organic electroluminescence display element |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2055843A (en) * | 1979-07-20 | 1981-03-11 | Ciba Geigy Ag | Curable epoxide resin mixtures and their use in corrosion resistant coatings |
JPS598767A (en) * | 1982-07-06 | 1984-01-18 | Mitsui Petrochem Ind Ltd | Composition for coating material |
GB8603701D0 (en) * | 1986-02-14 | 1986-03-19 | Dow Chemical Rheinwerk Gmbh | Epoxy resins |
EP0611796A1 (en) * | 1993-02-18 | 1994-08-24 | Ciba-Geigy Ag | Halogen-free, highly filled epoxy resin casting compositions |
JP2875479B2 (en) * | 1994-09-08 | 1999-03-31 | 日本ペルノックス株式会社 | Semiconductor sealing method |
JP2000212395A (en) * | 1999-01-28 | 2000-08-02 | Sumitomo Bakelite Co Ltd | Epoxy resin composition and semiconductor apparatus |
-
1999
- 1999-09-17 JP JP30147999A patent/JP4417494B2/en not_active Expired - Lifetime
-
2000
- 2000-09-15 WO PCT/EP2000/009187 patent/WO2001021697A1/en active Application Filing
- 2000-09-15 AU AU79051/00A patent/AU7905100A/en not_active Abandoned
- 2000-09-15 AR ARP000104843A patent/AR025677A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP2001081156A (en) | 2001-03-27 |
WO2001021697A1 (en) | 2001-03-29 |
JP4417494B2 (en) | 2010-02-17 |
AR025677A1 (en) | 2002-12-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |