DE69523208T2 - Verfahren zur Reinigung von Halbleiterscheiben mittels verflüssigter Gase - Google Patents

Verfahren zur Reinigung von Halbleiterscheiben mittels verflüssigter Gase

Info

Publication number
DE69523208T2
DE69523208T2 DE69523208T DE69523208T DE69523208T2 DE 69523208 T2 DE69523208 T2 DE 69523208T2 DE 69523208 T DE69523208 T DE 69523208T DE 69523208 T DE69523208 T DE 69523208T DE 69523208 T2 DE69523208 T2 DE 69523208T2
Authority
DE
Germany
Prior art keywords
semiconductor wafers
liquefied gases
cleaning semiconductor
cleaning
liquefied
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69523208T
Other languages
English (en)
Other versions
DE69523208D1 (de
Inventor
Ajit P Paranjpe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Application granted granted Critical
Publication of DE69523208D1 publication Critical patent/DE69523208D1/de
Publication of DE69523208T2 publication Critical patent/DE69523208T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02046—Dry cleaning only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0021—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by liquid gases or supercritical fluids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
DE69523208T 1994-04-08 1995-04-07 Verfahren zur Reinigung von Halbleiterscheiben mittels verflüssigter Gase Expired - Fee Related DE69523208T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US22516494A 1994-04-08 1994-04-08

Publications (2)

Publication Number Publication Date
DE69523208D1 DE69523208D1 (de) 2001-11-22
DE69523208T2 true DE69523208T2 (de) 2002-06-27

Family

ID=22843800

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69523208T Expired - Fee Related DE69523208T2 (de) 1994-04-08 1995-04-07 Verfahren zur Reinigung von Halbleiterscheiben mittels verflüssigter Gase

Country Status (4)

Country Link
US (1) US5494526A (de)
EP (1) EP0681317B1 (de)
JP (1) JPH07302776A (de)
DE (1) DE69523208T2 (de)

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EP0681317A3 (de) 1998-01-21
EP0681317A2 (de) 1995-11-08
US5494526A (en) 1996-02-27
DE69523208D1 (de) 2001-11-22
JPH07302776A (ja) 1995-11-14
EP0681317B1 (de) 2001-10-17

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