DE69636426D1 - Verfahren zur Reinigung von halbleitenden Wafern - Google Patents
Verfahren zur Reinigung von halbleitenden WafernInfo
- Publication number
- DE69636426D1 DE69636426D1 DE69636426T DE69636426T DE69636426D1 DE 69636426 D1 DE69636426 D1 DE 69636426D1 DE 69636426 T DE69636426 T DE 69636426T DE 69636426 T DE69636426 T DE 69636426T DE 69636426 D1 DE69636426 D1 DE 69636426D1
- Authority
- DE
- Germany
- Prior art keywords
- cleaning
- semiconducting wafers
- semiconducting
- wafers
- cleaning semiconducting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/46—Treatment of water, waste water, or sewage by electrochemical methods
- C02F1/461—Treatment of water, waste water, or sewage by electrochemical methods by electrolysis
- C02F1/46104—Devices therefor; Their operating or servicing
- C02F1/4618—Devices therefor; Their operating or servicing for producing "ionised" acidic or basic water
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/34—Treatment of water, waste water, or sewage with mechanical oscillations
- C02F1/36—Treatment of water, waste water, or sewage with mechanical oscillations ultrasonic vibrations
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/46—Treatment of water, waste water, or sewage by electrochemical methods
- C02F1/461—Treatment of water, waste water, or sewage by electrochemical methods by electrolysis
- C02F1/46104—Devices therefor; Their operating or servicing
- C02F1/4618—Devices therefor; Their operating or servicing for producing "ionised" acidic or basic water
- C02F2001/46185—Devices therefor; Their operating or servicing for producing "ionised" acidic or basic water only anodic or acidic water, e.g. for oxidizing or sterilizing
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F2201/00—Apparatus for treatment of water, waste water or sewage
- C02F2201/46—Apparatus for electrochemical processes
- C02F2201/461—Electrolysis apparatus
- C02F2201/46105—Details relating to the electrolytic devices
- C02F2201/4611—Fluid flow
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F2201/00—Apparatus for treatment of water, waste water or sewage
- C02F2201/46—Apparatus for electrochemical processes
- C02F2201/461—Electrolysis apparatus
- C02F2201/46105—Details relating to the electrolytic devices
- C02F2201/46115—Electrolytic cell with membranes or diaphragms
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F2201/00—Apparatus for treatment of water, waste water or sewage
- C02F2201/46—Apparatus for electrochemical processes
- C02F2201/461—Electrolysis apparatus
- C02F2201/46105—Details relating to the electrolytic devices
- C02F2201/46195—Cells containing solid electrolyte
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Electrochemistry (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Hydrology & Water Resources (AREA)
- Environmental & Geological Engineering (AREA)
- Water Supply & Treatment (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Weting (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Separation Using Semi-Permeable Membranes (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13357095 | 1995-05-31 | ||
JP13357095 | 1995-05-31 | ||
JP7295256A JP2832173B2 (ja) | 1995-05-31 | 1995-11-14 | 半導体基板の洗浄装置および洗浄方法 |
JP29525695 | 1995-11-14 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69636426D1 true DE69636426D1 (de) | 2006-09-21 |
DE69636426T2 DE69636426T2 (de) | 2007-05-03 |
Family
ID=26467894
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69636426T Expired - Lifetime DE69636426T2 (de) | 1995-05-31 | 1996-05-28 | Verfahren zur Reinigung von halbleitenden Wafern |
Country Status (7)
Country | Link |
---|---|
US (1) | US5733434A (de) |
EP (1) | EP0750334B1 (de) |
JP (1) | JP2832173B2 (de) |
KR (1) | KR100441803B1 (de) |
DE (1) | DE69636426T2 (de) |
MY (1) | MY120500A (de) |
TW (1) | TW305053B (de) |
Families Citing this family (55)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10303171A (ja) * | 1997-04-28 | 1998-11-13 | Mitsubishi Electric Corp | 半導体ウェーハのウエット処理方法及びウエット処理装置 |
EP0989962A4 (de) * | 1997-06-13 | 2005-03-09 | Mattson Technology Ip Inc | Verfahren zur behandlung von halbleiterscheiben |
JP3116871B2 (ja) * | 1997-09-03 | 2000-12-11 | 日本電気株式会社 | 半導体基板表面分析の前処理方法及びその装置 |
AU1719299A (en) * | 1997-12-10 | 1999-06-28 | Cfmt, Inc. | Wet processing methods for the manufacture of electronic components |
US5932022A (en) * | 1998-04-21 | 1999-08-03 | Harris Corporation | SC-2 based pre-thermal treatment wafer cleaning process |
US7410814B1 (en) * | 1999-01-23 | 2008-08-12 | Loxley Ted A | Process and apparatus for cleaning silicon wafers |
US6261845B1 (en) | 1999-02-25 | 2001-07-17 | Cfmt, Inc. | Methods and systems for determining chemical concentrations and controlling the processing of semiconductor substrates |
DE10002733A1 (de) * | 2000-01-22 | 2001-07-26 | Bwt Privatstiftung Hintersee | Elektrolysezelle und Elektrolyseverfahren |
KR100389917B1 (ko) * | 2000-09-06 | 2003-07-04 | 삼성전자주식회사 | 산화성 물질을 포함하는 아노드 수 및/또는 환원성 물질을포함하는 캐소드 수를 사용하는 반도체 제조를 위한 습식공정 및 이 공정에 사용되는 아노드수 및/또는 캐소드수 |
JP4752117B2 (ja) * | 2001-02-08 | 2011-08-17 | 日本テキサス・インスツルメンツ株式会社 | 半導体ウェハ上の粒子を除去する方法 |
TW552836B (en) * | 2001-07-13 | 2003-09-11 | Jipukomu Kabushiki Kaisha | Method for treating surface of copper articles |
JP4310085B2 (ja) * | 2002-07-31 | 2009-08-05 | 株式会社荏原製作所 | 電解加工方法及び装置 |
TWI224531B (en) | 2001-09-11 | 2004-12-01 | Ebara Corp | Substrate processing apparatus and method |
JP2004002910A (ja) * | 2002-05-30 | 2004-01-08 | Ebara Corp | 電解加工方法及び装置 |
TW592859B (en) * | 2001-09-11 | 2004-06-21 | Ebara Corp | Electrolytic processing apparatus and method |
US9908788B1 (en) | 2001-09-26 | 2018-03-06 | Wrt International Llc | Radium removal from aqueous media using zeolite materials |
US7108784B1 (en) * | 2001-09-26 | 2006-09-19 | Wrt International Llc | Apparatus for removal and destruction of ammonia from an aqueous medium |
US7476311B2 (en) * | 2001-09-26 | 2009-01-13 | Wrt International Llc | Arsenic removal from aqueous media using chemically treated zeolite materials |
US6846380B2 (en) | 2002-06-13 | 2005-01-25 | The Boc Group, Inc. | Substrate processing apparatus and related systems and methods |
US7105087B2 (en) * | 2002-09-17 | 2006-09-12 | Wrt International Llc | Hexa-valent chromium removal from aqueous media using ferrous-form zeolite materials |
US7390414B2 (en) * | 2002-09-25 | 2008-06-24 | Wrt International Llc | Regeneration of chemically treated zeolite |
US7326347B2 (en) * | 2003-10-29 | 2008-02-05 | Wrt International Llc | Dynamic up-flow zeolite system and method |
US6998054B2 (en) * | 2003-12-31 | 2006-02-14 | The Boc Group, Inc. | Selective fluoride and ammonia removal by chromatographic separation of wastewater |
US7527723B2 (en) | 2004-01-16 | 2009-05-05 | Ebara Corporation | Electrolytic processing apparatus and electrolytic processing method |
US20070215552A1 (en) * | 2005-09-16 | 2007-09-20 | Wrt International Llc. | Systems and methods for removal of contaminates from an aqueous media in the absence of modified nitrate levels |
US7520987B1 (en) | 2005-11-15 | 2009-04-21 | Wrt International Llc | System and apparatus for purging absorptive materials used in the removal of contaminates from an aqueous medium |
US8046867B2 (en) | 2006-02-10 | 2011-11-01 | Tennant Company | Mobile surface cleaner having a sparging device |
US8016996B2 (en) * | 2006-02-10 | 2011-09-13 | Tennant Company | Method of producing a sparged cleaning liquid onboard a mobile surface cleaner |
US8156608B2 (en) | 2006-02-10 | 2012-04-17 | Tennant Company | Cleaning apparatus having a functional generator for producing electrochemically activated cleaning liquid |
US8012340B2 (en) * | 2006-02-10 | 2011-09-06 | Tennant Company | Method for generating electrochemically activated cleaning liquid |
US8025787B2 (en) * | 2006-02-10 | 2011-09-27 | Tennant Company | Method and apparatus for generating, applying and neutralizing an electrochemically activated liquid |
US8025786B2 (en) * | 2006-02-10 | 2011-09-27 | Tennant Company | Method of generating sparged, electrochemically activated liquid |
US8007654B2 (en) * | 2006-02-10 | 2011-08-30 | Tennant Company | Electrochemically activated anolyte and catholyte liquid |
US7891046B2 (en) * | 2006-02-10 | 2011-02-22 | Tennant Company | Apparatus for generating sparged, electrochemically activated liquid |
US8663479B2 (en) * | 2006-11-20 | 2014-03-04 | Wrt International Llc | Method for removing cationic contaminants from water using natural zeolite underloaded with transition metal ions to limit leakage of intrinsic arsenic therefrom |
CN101743315A (zh) * | 2007-06-18 | 2010-06-16 | 坦南特公司 | 用于制备醇的***和方法 |
WO2009046279A2 (en) * | 2007-10-04 | 2009-04-09 | Tennant Company | Method and apparatus for neutralizing electrochemically activated liquids |
WO2009149327A2 (en) * | 2008-06-05 | 2009-12-10 | Global Opportunities Investment Group, Llc | Fuel combustion method and system |
EP2291246A2 (de) * | 2008-06-10 | 2011-03-09 | Tennant Company | Elektrolysierte flüssigkeit verwendender dampfreiniger und verfahren dafür |
US20090311137A1 (en) * | 2008-06-11 | 2009-12-17 | Tennant Company | Atomizer using electrolyzed liquid and method therefor |
US8319654B2 (en) * | 2008-06-19 | 2012-11-27 | Tennant Company | Apparatus having electrolysis cell and indicator light illuminating through liquid |
CA2728737C (en) * | 2008-06-19 | 2016-04-19 | Tennant Company | Tubular electrolysis cell comprising concentric electrodes and corresponding method |
US20100089419A1 (en) * | 2008-09-02 | 2010-04-15 | Tennant Company | Electrochemically-activated liquid for cosmetic removal |
JP2009035481A (ja) * | 2008-09-24 | 2009-02-19 | Shin Etsu Handotai Co Ltd | シリコン単結晶ウエーハ |
EP2376127A1 (de) * | 2008-12-17 | 2011-10-19 | Tennant Company | Verfahren und gerät zur applikation einer elektrischen ladung durch eine flüssigkeit mit verbesserten suspensionseigenschaften |
FR2945662B1 (fr) * | 2009-05-18 | 2012-02-17 | Inst Polytechnique Grenoble | Procede de gravure d'un materiau en presence d'un gaz. |
US20110048959A1 (en) * | 2009-08-31 | 2011-03-03 | Tennant Company | Electrochemically-Activated Liquids Containing Fragrant Compounds |
US20110219555A1 (en) * | 2010-03-10 | 2011-09-15 | Tennant Company | Cleaning head and mobile floor cleaner |
DE102010041639A1 (de) * | 2010-09-29 | 2012-03-29 | Wacker Chemie Ag | Verfahren zur Reinigung von Polysilicium-Bruchstücken |
KR101188071B1 (ko) | 2011-02-23 | 2012-10-08 | 주식회사 엘지실트론 | 세정 장치 |
EP2715779A2 (de) * | 2011-05-21 | 2014-04-09 | Meyer Burger Technology AG | Verfahren zur oberflächenbehandlung von metallischen, metalloiden und halbleiter-feststoffen |
US9890464B2 (en) * | 2012-01-12 | 2018-02-13 | Oceanit Laboratories, Inc. | Solid electrolyte/electrode assembly for electrochemical surface finishing applications |
CN104843912B (zh) * | 2015-05-11 | 2020-03-13 | 艾欧史密斯(南京)水处理产品有限公司 | 过滤装置及其清洗方法 |
US11466355B1 (en) | 2016-07-20 | 2022-10-11 | Oceanit Laboratories, Inc. | Submerged underwater electroless, electrochemical deposition of metal on conductive and nonconductive surfaces |
CN108579439A (zh) * | 2018-06-27 | 2018-09-28 | 浙江工业大学膜分离与水处理协同创新中心湖州研究院 | 一种通用型高效抗污堵电场膜过滤器 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0605882B1 (de) * | 1993-01-08 | 1996-12-11 | Nec Corporation | Verfahren und Vorrichtung zur Nassbehandlung von festen Oberflächen |
JP2830733B2 (ja) * | 1994-03-25 | 1998-12-02 | 日本電気株式会社 | 電解水生成方法および電解水生成機構 |
JP2832171B2 (ja) * | 1995-04-28 | 1998-12-02 | 信越半導体株式会社 | 半導体基板の洗浄装置および洗浄方法 |
-
1995
- 1995-11-14 JP JP7295256A patent/JP2832173B2/ja not_active Expired - Fee Related
-
1996
- 1996-05-14 TW TW085105673A patent/TW305053B/zh active
- 1996-05-15 MY MYPI96001835A patent/MY120500A/en unknown
- 1996-05-16 US US08/648,696 patent/US5733434A/en not_active Expired - Fee Related
- 1996-05-28 EP EP96108420A patent/EP0750334B1/de not_active Expired - Lifetime
- 1996-05-28 DE DE69636426T patent/DE69636426T2/de not_active Expired - Lifetime
- 1996-05-30 KR KR1019960018857A patent/KR100441803B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0750334B1 (de) | 2006-08-09 |
EP0750334A3 (de) | 1998-03-11 |
TW305053B (de) | 1997-05-11 |
US5733434A (en) | 1998-03-31 |
JP2832173B2 (ja) | 1998-12-02 |
JPH0950977A (ja) | 1997-02-18 |
KR100441803B1 (ko) | 2004-10-22 |
DE69636426T2 (de) | 2007-05-03 |
EP0750334A2 (de) | 1996-12-27 |
MY120500A (en) | 2005-11-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |