DE69504377T2 - Mittel mit geringer elektromagnetischer Transparenz und Reflexion zur Unterdrückung von elektromagnetischen Interferenzen und damit versehene elektronische Vorrichtung - Google Patents
Mittel mit geringer elektromagnetischer Transparenz und Reflexion zur Unterdrückung von elektromagnetischen Interferenzen und damit versehene elektronische VorrichtungInfo
- Publication number
- DE69504377T2 DE69504377T2 DE69504377T DE69504377T DE69504377T2 DE 69504377 T2 DE69504377 T2 DE 69504377T2 DE 69504377 T DE69504377 T DE 69504377T DE 69504377 T DE69504377 T DE 69504377T DE 69504377 T2 DE69504377 T2 DE 69504377T2
- Authority
- DE
- Germany
- Prior art keywords
- reflection
- medium
- electronic device
- device provided
- provided therewith
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0233—Filters, inductors or a magnetic substance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/08—Magnetic details
- H05K2201/083—Magnetic materials
- H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12014—All metal or with adjacent metals having metal particles
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP00486494A JP3401650B2 (ja) | 1994-01-20 | 1994-01-20 | 電磁波干渉抑制体 |
JP14496594A JPH0818271A (ja) | 1994-06-27 | 1994-06-27 | 電子装置およびそのノイズ抑制方法 |
JP19239994A JP3528255B2 (ja) | 1994-08-16 | 1994-08-16 | 混成集積回路素子及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69504377D1 DE69504377D1 (de) | 1998-10-08 |
DE69504377T2 true DE69504377T2 (de) | 1999-02-25 |
Family
ID=27276491
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69504377T Expired - Lifetime DE69504377T2 (de) | 1994-01-20 | 1995-01-20 | Mittel mit geringer elektromagnetischer Transparenz und Reflexion zur Unterdrückung von elektromagnetischen Interferenzen und damit versehene elektronische Vorrichtung |
Country Status (6)
Country | Link |
---|---|
US (2) | US5864088A (de) |
EP (1) | EP0667643B1 (de) |
CN (2) | CN1075339C (de) |
DE (1) | DE69504377T2 (de) |
FI (1) | FI117224B (de) |
MY (1) | MY120407A (de) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102011087263A1 (de) * | 2011-11-28 | 2013-05-29 | Lenze Drives Gmbh | Abschirmvorrichtung für elektrische Einheiten |
DE102006028358B4 (de) | 2005-06-20 | 2018-12-27 | Fuji Electric Co., Ltd. | Leistungshalbleitermodul |
Families Citing this family (123)
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US6720493B1 (en) | 1994-04-01 | 2004-04-13 | Space Electronics, Inc. | Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages |
US5811050A (en) * | 1994-06-06 | 1998-09-22 | Gabower; John F. | Electromagnetic interference shield for electronic devices |
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JPH0993034A (ja) * | 1995-09-22 | 1997-04-04 | Tokin Corp | 複合磁性体及びその製造方法ならびに電磁干渉抑制体 |
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DE19947130C1 (de) * | 1999-09-30 | 2000-11-02 | Siemens Ag | Elektrisches Gerät mit in einem Gehäuse angeordneten und nach außen elektromagnetisch abgeschirmten Komponenten |
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JP4398056B2 (ja) * | 2000-04-04 | 2010-01-13 | Necトーキン株式会社 | 樹脂モールド体 |
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-
1995
- 1995-01-16 FI FI950182A patent/FI117224B/fi not_active IP Right Cessation
- 1995-01-17 MY MYPI95000100A patent/MY120407A/en unknown
- 1995-01-18 CN CN95100245A patent/CN1075339C/zh not_active Expired - Lifetime
- 1995-01-19 US US08/374,825 patent/US5864088A/en not_active Expired - Lifetime
- 1995-01-20 DE DE69504377T patent/DE69504377T2/de not_active Expired - Lifetime
- 1995-01-20 EP EP95100779A patent/EP0667643B1/de not_active Expired - Lifetime
-
1998
- 1998-09-24 US US09/159,965 patent/US6448491B1/en not_active Expired - Lifetime
-
2001
- 2001-04-27 CN CNB011169109A patent/CN1199545C/zh not_active Expired - Fee Related
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DE102006028358B4 (de) | 2005-06-20 | 2018-12-27 | Fuji Electric Co., Ltd. | Leistungshalbleitermodul |
DE102011087263A1 (de) * | 2011-11-28 | 2013-05-29 | Lenze Drives Gmbh | Abschirmvorrichtung für elektrische Einheiten |
Also Published As
Publication number | Publication date |
---|---|
DE69504377D1 (de) | 1998-10-08 |
FI117224B (fi) | 2006-07-31 |
MY120407A (en) | 2005-10-31 |
FI950182A (fi) | 1995-07-21 |
CN1075339C (zh) | 2001-11-21 |
US5864088A (en) | 1999-01-26 |
CN1355670A (zh) | 2002-06-26 |
CN1115562A (zh) | 1996-01-24 |
FI950182A0 (fi) | 1995-01-16 |
EP0667643B1 (de) | 1998-09-02 |
CN1199545C (zh) | 2005-04-27 |
US6448491B1 (en) | 2002-09-10 |
EP0667643A1 (de) | 1995-08-16 |
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