DE69422607D1 - Verfahren zum montieren eines piezoelektrisches element auf einem substrat - Google Patents

Verfahren zum montieren eines piezoelektrisches element auf einem substrat

Info

Publication number
DE69422607D1
DE69422607D1 DE69422607T DE69422607T DE69422607D1 DE 69422607 D1 DE69422607 D1 DE 69422607D1 DE 69422607 T DE69422607 T DE 69422607T DE 69422607 T DE69422607 T DE 69422607T DE 69422607 D1 DE69422607 D1 DE 69422607D1
Authority
DE
Germany
Prior art keywords
substrate
piezoelectric element
mounting
conductive adhesive
dispensed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69422607T
Other languages
English (en)
Other versions
DE69422607T2 (de
Inventor
A Knecht
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CTS Corp
Original Assignee
CTS Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CTS Corp filed Critical CTS Corp
Application granted granted Critical
Publication of DE69422607D1 publication Critical patent/DE69422607D1/de
Publication of DE69422607T2 publication Critical patent/DE69422607T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/0504—Holders; Supports for bulk acoustic wave devices
    • H03H9/0514—Holders; Supports for bulk acoustic wave devices consisting of mounting pads or bumps
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/0504—Holders; Supports for bulk acoustic wave devices
    • H03H9/0528—Holders; Supports for bulk acoustic wave devices consisting of clips
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Die Bonding (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Ceramic Products (AREA)
DE69422607T 1993-11-24 1994-10-21 Verfahren zum montieren eines piezoelektrisches element auf einem substrat Expired - Fee Related DE69422607T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/157,769 US5405476A (en) 1993-11-24 1993-11-24 Method of mounting a piezoelectric element to a substrate using compliant conductive materials
PCT/US1994/012032 WO1995015013A1 (en) 1993-11-24 1994-10-21 Method of mounting a piezoelectric element to a substrate

Publications (2)

Publication Number Publication Date
DE69422607D1 true DE69422607D1 (de) 2000-02-17
DE69422607T2 DE69422607T2 (de) 2001-02-01

Family

ID=22565208

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69422607T Expired - Fee Related DE69422607T2 (de) 1993-11-24 1994-10-21 Verfahren zum montieren eines piezoelektrisches element auf einem substrat

Country Status (9)

Country Link
US (1) US5405476A (de)
EP (1) EP0680663B1 (de)
JP (1) JPH08506453A (de)
CN (1) CN1038456C (de)
AT (1) ATE188806T1 (de)
AU (1) AU1040895A (de)
CA (1) CA2151510A1 (de)
DE (1) DE69422607T2 (de)
WO (1) WO1995015013A1 (de)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5473216A (en) * 1994-06-29 1995-12-05 Motorola, Inc. Piezoelectric device for controlling the frequency-temperature shift of piezoelectric crystals and method of making same
US5500628A (en) * 1995-01-24 1996-03-19 Motorola, Inc. Double-sided oscillator package and method of coupling components thereto
US5781162A (en) * 1996-01-12 1998-07-14 Hughes Electronic Corporation Phased array with integrated bandpass filter superstructure
JPH09246904A (ja) * 1996-03-14 1997-09-19 Citizen Watch Co Ltd 表面実装型水晶振動子
DE19720432A1 (de) * 1996-05-15 1997-12-11 Murata Manufacturing Co Elektronisches Teil und Verfahren zur Herstellung desselben
WO2000033455A1 (fr) * 1998-12-02 2000-06-08 Seiko Epson Corporation Dispositif piezo-electrique et son procédé de fabrication
JP3663953B2 (ja) * 1999-02-24 2005-06-22 松下電器産業株式会社 高周波モジュールとその製造方法
US6608531B2 (en) 2000-10-31 2003-08-19 Cts Corporation Temperature compensated crystal oscillator package
US6580332B2 (en) 2000-11-30 2003-06-17 Cts Corporation Dual-function connection pads for TCXO integrated circuit
US6946919B2 (en) 2002-01-14 2005-09-20 Cts Corporation Controllable crystal oscillator component
US6664864B2 (en) 2001-10-31 2003-12-16 Cts Corporation Cavity design printed circuit board for a temperature compensated crystal oscillator and a temperature compensated crystal oscillator employing the same
US6559728B1 (en) 2001-12-19 2003-05-06 Cts Corporation Miniature ovenized crystal oscillator
KR20030085868A (ko) * 2002-05-02 2003-11-07 삼성전기주식회사 부품 다층 실장 소자의 제조방법 및 이에 의해 제조된 소자
JP2004037181A (ja) * 2002-07-02 2004-02-05 Hitachi Maxell Ltd 振動センサー
US6700448B1 (en) 2002-08-30 2004-03-02 Cts Corporation High performance dual range oscillator module
US20040135473A1 (en) * 2003-01-15 2004-07-15 Byers Charles L. Piezoelectric devices mounted on integrated circuit chip
WO2005020288A2 (en) * 2003-08-19 2005-03-03 Vectron International Multiple cavity/compartment package
JP2005124122A (ja) * 2003-09-25 2005-05-12 Kyocera Corp 圧電振動子収納用パッケージおよび圧電装置
US20090051447A1 (en) * 2007-08-24 2009-02-26 Mccracken Jeffrey A Ovenized oscillator
US7671519B2 (en) * 2007-08-31 2010-03-02 Cts Corporation Bond pad for use with piezoelectric ceramic substrates
JP2013153412A (ja) * 2011-12-27 2013-08-08 Nippon Dempa Kogyo Co Ltd 表面実装型圧電発振器
DE102012200757B4 (de) * 2012-01-05 2022-01-05 Vitesco Technologies GmbH Füllstandsgeber
CN103840789A (zh) * 2012-11-26 2014-06-04 苏州工业园区阳晨封装技术有限公司 单层陶瓷封装外壳及使用该外壳的晶体振荡器
JP6384239B2 (ja) 2014-09-29 2018-09-05 セイコーエプソン株式会社 光学フィルターデバイス、光学モジュール、及び電子機器
JP5711860B1 (ja) * 2014-12-17 2015-05-07 太陽誘電株式会社 圧電式発音体及び電気音響変換装置
IL250305B (en) * 2017-01-26 2021-02-28 Vishay Israel Ltd Electronic component with flexible terminal
CN111294005A (zh) * 2020-03-17 2020-06-16 四川明德亨电子科技有限公司 一种石英晶体谐振器的谐振片固定点胶方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5256882A (en) * 1975-11-05 1977-05-10 Citizen Watch Co Ltd Supporting structure of crystal vibrator
EP0092428B1 (de) * 1982-04-20 1990-04-04 Fujitsu Limited Herstellungsverfahrenfür einen Piezoelektrischen Resonator
US4750246A (en) * 1984-10-29 1988-06-14 Hughes Aircraft Company Method of making compensated crystal oscillator
US4666547A (en) * 1985-03-29 1987-05-19 Snowden Jr Thomas M Electrically conductive resinous bond and method of manufacture
JPS62108607A (ja) * 1985-11-06 1987-05-19 Murata Mfg Co Ltd 圧電部品
JPS62207008A (ja) * 1986-03-07 1987-09-11 Matsushima Kogyo Co Ltd 圧電発振器
US5250870A (en) * 1992-03-25 1993-10-05 Motorola, Inc. Ultra-thin surface mount crystal package

Also Published As

Publication number Publication date
EP0680663A4 (de) 1996-04-03
AU1040895A (en) 1995-06-13
CN1116459A (zh) 1996-02-07
WO1995015013A1 (en) 1995-06-01
EP0680663B1 (de) 2000-01-12
ATE188806T1 (de) 2000-01-15
CA2151510A1 (en) 1995-06-01
JPH08506453A (ja) 1996-07-09
DE69422607T2 (de) 2001-02-01
EP0680663A1 (de) 1995-11-08
US5405476A (en) 1995-04-11
CN1038456C (zh) 1998-05-20

Similar Documents

Publication Publication Date Title
ATE188806T1 (de) Verfahren zum montieren eines piezoelektrisches element auf einem substrat
ATE179833T1 (de) Verfahren zum nachgiebigen zusammenbau eines piezoelektrischen bauelements
DE69118642D1 (de) Montageeinrichtung zum Montieren von einem elektronischen Bauelement über einem Substrat bei der Oberflächemontagetechnologie
US5363277A (en) Structure and method for mounting semiconductor device
EP1189271A3 (de) Leiterplatten und Verfahren zur Montage von Halbleiterbauelementen auf Leiterplatten
HK1012521A1 (en) Method of assembling an adhesively bonded electronic device using a deformable substrate
NO932306D0 (no) Fremgangsmaate for fremstilling av en elektronisk tast eller tastatur samt produkt fremstilt derved
DE3770683D1 (de) Verfahren zur befestigung von elektronischen bauelementen auf einem substrat.
DE69430934D1 (de) Gesinterte Elektrode auf einem Substrat
DE69709699D1 (de) Verfahren zum Verbinden von einem Substrat und einem elektronischen Bauteil
DE68918982D1 (de) Verfahren zur Trennung integrierter Schaltkreise auf einem Substrat.
ATE214476T1 (de) Verfahren zum aufbringen eines mikrosystems oder wandlers auf ein substrat und nach diesem verfahren herstellbare vorrichtung
DE69203089D1 (de) Anordnung für die oberflächenmontage von vorrichtungen mit leitfähigen klebstoff-verbindungen.
DE59711861D1 (de) Verfahren zur Herstellung eines Chip-Moduls
DK0592285T3 (da) Fremgangsmåde og anordning til elektrolytisk metalbelægning på et fleksibelt svagt ledende substrat samt det således opnåede produkt
DE69706357D1 (de) Verfahren zum Montieren von Schaltungsteilen auf ein biegsames Substrat
FI973555A0 (fi) Menetelmä ohmisen kontaktin tuottamiseksi sekä tällaisella ohmisella kontaktilla varustettu puolijohdeväline
TW328172B (en) Ferroelectric device for use in integrated circuits and method of making the same
CA2022929A1 (en) Organic Recording Medium with Electrodes
DE59007150D1 (de) Vorrichtung zum Aufbringen dünner Schichten auf ein Substrat.
DE69514067D1 (de) Verbinder für ein Substrat mit einer elektronischen Schaltung
DE59611448D1 (de) Verfahren zur Befestigung elektronischer Bauelemente auf einem Substrat durch Drucksintern
DE3881360D1 (de) Verfahren zum anbringen eines elektronischen bauelementes auf einem substrat.
DE3875170D1 (de) Verfahren zum kontaktieren von zwei auf einem substrat abgeschiedenen leitenden schichten.
ES2101049T3 (es) Estructura de pelicula metalizada y metodo.

Legal Events

Date Code Title Description
8332 No legal effect for de
8370 Indication related to discontinuation of the patent is to be deleted
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee