DE69422607D1 - Verfahren zum montieren eines piezoelektrisches element auf einem substrat - Google Patents
Verfahren zum montieren eines piezoelektrisches element auf einem substratInfo
- Publication number
- DE69422607D1 DE69422607D1 DE69422607T DE69422607T DE69422607D1 DE 69422607 D1 DE69422607 D1 DE 69422607D1 DE 69422607 T DE69422607 T DE 69422607T DE 69422607 T DE69422607 T DE 69422607T DE 69422607 D1 DE69422607 D1 DE 69422607D1
- Authority
- DE
- Germany
- Prior art keywords
- substrate
- piezoelectric element
- mounting
- conductive adhesive
- dispensed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 title abstract 6
- 239000000853 adhesive Substances 0.000 abstract 2
- 230000001070 adhesive effect Effects 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0504—Holders; Supports for bulk acoustic wave devices
- H03H9/0514—Holders; Supports for bulk acoustic wave devices consisting of mounting pads or bumps
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0504—Holders; Supports for bulk acoustic wave devices
- H03H9/0528—Holders; Supports for bulk acoustic wave devices consisting of clips
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Die Bonding (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
- Ceramic Products (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/157,769 US5405476A (en) | 1993-11-24 | 1993-11-24 | Method of mounting a piezoelectric element to a substrate using compliant conductive materials |
PCT/US1994/012032 WO1995015013A1 (en) | 1993-11-24 | 1994-10-21 | Method of mounting a piezoelectric element to a substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69422607D1 true DE69422607D1 (de) | 2000-02-17 |
DE69422607T2 DE69422607T2 (de) | 2001-02-01 |
Family
ID=22565208
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69422607T Expired - Fee Related DE69422607T2 (de) | 1993-11-24 | 1994-10-21 | Verfahren zum montieren eines piezoelektrisches element auf einem substrat |
Country Status (9)
Country | Link |
---|---|
US (1) | US5405476A (de) |
EP (1) | EP0680663B1 (de) |
JP (1) | JPH08506453A (de) |
CN (1) | CN1038456C (de) |
AT (1) | ATE188806T1 (de) |
AU (1) | AU1040895A (de) |
CA (1) | CA2151510A1 (de) |
DE (1) | DE69422607T2 (de) |
WO (1) | WO1995015013A1 (de) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5473216A (en) * | 1994-06-29 | 1995-12-05 | Motorola, Inc. | Piezoelectric device for controlling the frequency-temperature shift of piezoelectric crystals and method of making same |
US5500628A (en) * | 1995-01-24 | 1996-03-19 | Motorola, Inc. | Double-sided oscillator package and method of coupling components thereto |
US5781162A (en) * | 1996-01-12 | 1998-07-14 | Hughes Electronic Corporation | Phased array with integrated bandpass filter superstructure |
JPH09246904A (ja) * | 1996-03-14 | 1997-09-19 | Citizen Watch Co Ltd | 表面実装型水晶振動子 |
DE19720432A1 (de) * | 1996-05-15 | 1997-12-11 | Murata Manufacturing Co | Elektronisches Teil und Verfahren zur Herstellung desselben |
WO2000033455A1 (fr) * | 1998-12-02 | 2000-06-08 | Seiko Epson Corporation | Dispositif piezo-electrique et son procédé de fabrication |
JP3663953B2 (ja) * | 1999-02-24 | 2005-06-22 | 松下電器産業株式会社 | 高周波モジュールとその製造方法 |
US6608531B2 (en) | 2000-10-31 | 2003-08-19 | Cts Corporation | Temperature compensated crystal oscillator package |
US6580332B2 (en) | 2000-11-30 | 2003-06-17 | Cts Corporation | Dual-function connection pads for TCXO integrated circuit |
US6946919B2 (en) | 2002-01-14 | 2005-09-20 | Cts Corporation | Controllable crystal oscillator component |
US6664864B2 (en) | 2001-10-31 | 2003-12-16 | Cts Corporation | Cavity design printed circuit board for a temperature compensated crystal oscillator and a temperature compensated crystal oscillator employing the same |
US6559728B1 (en) | 2001-12-19 | 2003-05-06 | Cts Corporation | Miniature ovenized crystal oscillator |
KR20030085868A (ko) * | 2002-05-02 | 2003-11-07 | 삼성전기주식회사 | 부품 다층 실장 소자의 제조방법 및 이에 의해 제조된 소자 |
JP2004037181A (ja) * | 2002-07-02 | 2004-02-05 | Hitachi Maxell Ltd | 振動センサー |
US6700448B1 (en) | 2002-08-30 | 2004-03-02 | Cts Corporation | High performance dual range oscillator module |
US20040135473A1 (en) * | 2003-01-15 | 2004-07-15 | Byers Charles L. | Piezoelectric devices mounted on integrated circuit chip |
WO2005020288A2 (en) * | 2003-08-19 | 2005-03-03 | Vectron International | Multiple cavity/compartment package |
JP2005124122A (ja) * | 2003-09-25 | 2005-05-12 | Kyocera Corp | 圧電振動子収納用パッケージおよび圧電装置 |
US20090051447A1 (en) * | 2007-08-24 | 2009-02-26 | Mccracken Jeffrey A | Ovenized oscillator |
US7671519B2 (en) * | 2007-08-31 | 2010-03-02 | Cts Corporation | Bond pad for use with piezoelectric ceramic substrates |
JP2013153412A (ja) * | 2011-12-27 | 2013-08-08 | Nippon Dempa Kogyo Co Ltd | 表面実装型圧電発振器 |
DE102012200757B4 (de) * | 2012-01-05 | 2022-01-05 | Vitesco Technologies GmbH | Füllstandsgeber |
CN103840789A (zh) * | 2012-11-26 | 2014-06-04 | 苏州工业园区阳晨封装技术有限公司 | 单层陶瓷封装外壳及使用该外壳的晶体振荡器 |
JP6384239B2 (ja) | 2014-09-29 | 2018-09-05 | セイコーエプソン株式会社 | 光学フィルターデバイス、光学モジュール、及び電子機器 |
JP5711860B1 (ja) * | 2014-12-17 | 2015-05-07 | 太陽誘電株式会社 | 圧電式発音体及び電気音響変換装置 |
IL250305B (en) * | 2017-01-26 | 2021-02-28 | Vishay Israel Ltd | Electronic component with flexible terminal |
CN111294005A (zh) * | 2020-03-17 | 2020-06-16 | 四川明德亨电子科技有限公司 | 一种石英晶体谐振器的谐振片固定点胶方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5256882A (en) * | 1975-11-05 | 1977-05-10 | Citizen Watch Co Ltd | Supporting structure of crystal vibrator |
EP0092428B1 (de) * | 1982-04-20 | 1990-04-04 | Fujitsu Limited | Herstellungsverfahrenfür einen Piezoelektrischen Resonator |
US4750246A (en) * | 1984-10-29 | 1988-06-14 | Hughes Aircraft Company | Method of making compensated crystal oscillator |
US4666547A (en) * | 1985-03-29 | 1987-05-19 | Snowden Jr Thomas M | Electrically conductive resinous bond and method of manufacture |
JPS62108607A (ja) * | 1985-11-06 | 1987-05-19 | Murata Mfg Co Ltd | 圧電部品 |
JPS62207008A (ja) * | 1986-03-07 | 1987-09-11 | Matsushima Kogyo Co Ltd | 圧電発振器 |
US5250870A (en) * | 1992-03-25 | 1993-10-05 | Motorola, Inc. | Ultra-thin surface mount crystal package |
-
1993
- 1993-11-24 US US08/157,769 patent/US5405476A/en not_active Expired - Fee Related
-
1994
- 1994-10-21 WO PCT/US1994/012032 patent/WO1995015013A1/en active IP Right Grant
- 1994-10-21 EP EP95901014A patent/EP0680663B1/de not_active Expired - Lifetime
- 1994-10-21 CN CN94190927A patent/CN1038456C/zh not_active Expired - Fee Related
- 1994-10-21 AT AT95901014T patent/ATE188806T1/de not_active IP Right Cessation
- 1994-10-21 AU AU10408/95A patent/AU1040895A/en not_active Abandoned
- 1994-10-21 JP JP7515063A patent/JPH08506453A/ja active Pending
- 1994-10-21 DE DE69422607T patent/DE69422607T2/de not_active Expired - Fee Related
- 1994-10-21 CA CA002151510A patent/CA2151510A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
EP0680663A4 (de) | 1996-04-03 |
AU1040895A (en) | 1995-06-13 |
CN1116459A (zh) | 1996-02-07 |
WO1995015013A1 (en) | 1995-06-01 |
EP0680663B1 (de) | 2000-01-12 |
ATE188806T1 (de) | 2000-01-15 |
CA2151510A1 (en) | 1995-06-01 |
JPH08506453A (ja) | 1996-07-09 |
DE69422607T2 (de) | 2001-02-01 |
EP0680663A1 (de) | 1995-11-08 |
US5405476A (en) | 1995-04-11 |
CN1038456C (zh) | 1998-05-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8332 | No legal effect for de | ||
8370 | Indication related to discontinuation of the patent is to be deleted | ||
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |