DE69118642D1 - Montageeinrichtung zum Montieren von einem elektronischen Bauelement über einem Substrat bei der Oberflächemontagetechnologie - Google Patents
Montageeinrichtung zum Montieren von einem elektronischen Bauelement über einem Substrat bei der OberflächemontagetechnologieInfo
- Publication number
- DE69118642D1 DE69118642D1 DE69118642T DE69118642T DE69118642D1 DE 69118642 D1 DE69118642 D1 DE 69118642D1 DE 69118642 T DE69118642 T DE 69118642T DE 69118642 T DE69118642 T DE 69118642T DE 69118642 D1 DE69118642 D1 DE 69118642D1
- Authority
- DE
- Germany
- Prior art keywords
- mounting
- substrate
- electronic component
- component over
- technology
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
- H01R12/724—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits containing contact members forming a right angle
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10424—Frame holders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0415—Small preforms other than balls, e.g. discs, cylinders or pillars
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2272551A JPH0732042B2 (ja) | 1990-10-11 | 1990-10-11 | スルーホール接続形電子デバイスとその実装方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69118642D1 true DE69118642D1 (de) | 1996-05-15 |
DE69118642T2 DE69118642T2 (de) | 1996-09-19 |
Family
ID=17515482
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69118642T Expired - Fee Related DE69118642T2 (de) | 1990-10-11 | 1991-10-11 | Montageeinrichtung zum Montieren von einem elektronischen Bauelement über einem Substrat bei der Oberflächemontagetechnologie |
Country Status (4)
Country | Link |
---|---|
US (1) | US5326936A (de) |
EP (1) | EP0480754B1 (de) |
JP (1) | JPH0732042B2 (de) |
DE (1) | DE69118642T2 (de) |
Families Citing this family (43)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06111865A (ja) * | 1992-08-06 | 1994-04-22 | Du Pont Singapore Pte Ltd | 面実装コネクタ装置及びその製造方法 |
TW238431B (de) * | 1992-12-01 | 1995-01-11 | Stanford W Crane Jr | |
US5634821A (en) * | 1992-12-01 | 1997-06-03 | Crane, Jr.; Stanford W. | High-density electrical interconnect system |
JP2716336B2 (ja) * | 1993-03-10 | 1998-02-18 | 日本電気株式会社 | 集積回路装置 |
GB9314038D0 (en) * | 1993-07-07 | 1993-08-18 | Amp Holland | High temperature connection |
US5821457A (en) * | 1994-03-11 | 1998-10-13 | The Panda Project | Semiconductor die carrier having a dielectric epoxy between adjacent leads |
US6339191B1 (en) | 1994-03-11 | 2002-01-15 | Silicon Bandwidth Inc. | Prefabricated semiconductor chip carrier |
AU2093795A (en) * | 1994-03-11 | 1995-09-25 | Panda Project, The | Modular architecture for high bandwidth computers |
US5543586A (en) * | 1994-03-11 | 1996-08-06 | The Panda Project | Apparatus having inner layers supporting surface-mount components |
US5541449A (en) * | 1994-03-11 | 1996-07-30 | The Panda Project | Semiconductor chip carrier affording a high-density external interface |
US5824950A (en) * | 1994-03-11 | 1998-10-20 | The Panda Project | Low profile semiconductor die carrier |
US5576931A (en) * | 1994-05-03 | 1996-11-19 | The Panda Project | Computer with two fans and two air circulation areas |
JP3531971B2 (ja) * | 1994-05-16 | 2004-05-31 | フィガロ技研株式会社 | ガスまたは湿度を検出するセンサとその製造方法 |
US5692297A (en) * | 1994-11-25 | 1997-12-02 | Sumitomo Wiring Systems, Ltd. | Method of mounting terminal to flexible printed circuit board |
US5839189A (en) * | 1995-04-03 | 1998-11-24 | Emerson Electric Co. | Bracket for attaching pin-in-hole components to a surface mount board |
US5670750A (en) * | 1995-04-27 | 1997-09-23 | International Business Machines Corporation | Electric circuit card having a donut shaped land |
US6000126A (en) * | 1996-03-29 | 1999-12-14 | General Dynamics Information Systems, Inc. | Method and apparatus for connecting area grid arrays to printed wire board |
US5743751A (en) * | 1996-05-14 | 1998-04-28 | Davis; Philip E. | Straddle adapter for mounting edge connectors to a printed circuit board |
US5876222A (en) * | 1997-11-07 | 1999-03-02 | Molex Incorporated | Electrical connector for printed circuit boards |
US6369333B1 (en) * | 1998-02-13 | 2002-04-09 | Intel Corporation | Flexible connection system |
US6078102A (en) * | 1998-03-03 | 2000-06-20 | Silicon Bandwidth, Inc. | Semiconductor die package for mounting in horizontal and upright configurations |
US6141869A (en) * | 1998-10-26 | 2000-11-07 | Silicon Bandwidth, Inc. | Apparatus for and method of manufacturing a semiconductor die carrier |
DE10229953A1 (de) * | 2002-07-03 | 2004-01-29 | Hartmann Codier Gmbh & Co.Kg | Bauelement zur Leiterplattenmontage |
JP4416616B2 (ja) * | 2004-09-29 | 2010-02-17 | 株式会社リコー | 電子部品実装体及び電子機器 |
CN1873891A (zh) * | 2005-06-03 | 2006-12-06 | 清华大学 | 真空器件、其制造方法以及吸气装置 |
JP2007194434A (ja) * | 2006-01-19 | 2007-08-02 | Fujitsu Ltd | 実装材整列基板、実装装置、実装方法及び回路基板製造方法 |
JP2007194435A (ja) * | 2006-01-19 | 2007-08-02 | Fujitsu Ltd | 実装材整列基板、実装装置、実装方法及び回路基板製造方法 |
JP2007317688A (ja) * | 2006-05-23 | 2007-12-06 | Sony Corp | 電子部品及び電子部品の実装方法 |
JP2009158892A (ja) * | 2007-12-28 | 2009-07-16 | Nec Corp | 多層配線基板及びその製造方法 |
TWM366773U (en) * | 2009-03-31 | 2009-10-11 | Hon Hai Prec Ind Co Ltd | Electrical connector |
US8907694B2 (en) * | 2009-12-17 | 2014-12-09 | Xcerra Corporation | Wiring board for testing loaded printed circuit board |
US8057240B2 (en) * | 2010-03-23 | 2011-11-15 | Tyco Electronics Corporation | Circuit board for an electrical connector assembly |
JP6139280B2 (ja) | 2013-06-05 | 2017-05-31 | トヨタ自動車株式会社 | 半導体装置 |
KR101660582B1 (ko) * | 2014-06-19 | 2016-09-29 | 황규천 | 엘이디등 및 이를 포함하는 경화기 |
JP2016193078A (ja) * | 2015-03-31 | 2016-11-17 | 株式会社大一商会 | 遊技機 |
DE102015107972A1 (de) | 2015-05-20 | 2016-11-24 | Epcos Ag | Vorrichtung zur Ausrichtung von Kontaktanschlüssen eines elektrischen Bauteils für die Montage auf einer Platine einer elektrischen Schaltung |
JP6265947B2 (ja) * | 2015-07-17 | 2018-01-24 | 株式会社大一商会 | 遊技機 |
JP6192127B2 (ja) * | 2015-07-17 | 2017-09-06 | 株式会社大一商会 | 遊技機 |
JP6265946B2 (ja) * | 2015-07-17 | 2018-01-24 | 株式会社大一商会 | 遊技機 |
JP2017035357A (ja) * | 2015-08-11 | 2017-02-16 | 株式会社大一商会 | 遊技機 |
JP6376663B2 (ja) * | 2015-08-11 | 2018-08-22 | 株式会社大一商会 | 遊技機 |
CN109390764B (zh) * | 2017-08-04 | 2021-09-21 | 富士康(昆山)电脑接插件有限公司 | 一种端子模组、具有端子模组的电连接器及其制造方法 |
JP7166874B2 (ja) * | 2018-10-25 | 2022-11-08 | 古河電気工業株式会社 | 光モジュール実装基板および容器実装基板 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4142286A (en) * | 1978-03-15 | 1979-03-06 | Burroughs Corporation | Apparatus and method for inserting solder preforms on selected circuit board back plane pins |
US4216350A (en) * | 1978-11-01 | 1980-08-05 | Burroughs Corporation | Multiple solder pre-form with non-fusible web |
JP2654476B2 (ja) * | 1987-03-06 | 1997-09-17 | アンプ インコ−ポレ−テツド | 多極コネクタ |
JPH054217Y2 (de) * | 1987-08-03 | 1993-02-02 | ||
EP0360971A3 (de) * | 1988-08-31 | 1991-07-17 | Mitsui Mining & Smelting Co., Ltd. | Substrat für die Montage und sein Herstellungsverfahren und gedruckte Leiterplatte mit Verbinderfunktion und Verbindungsverfahren hierfür |
US5117330A (en) * | 1990-04-09 | 1992-05-26 | Hewlett-Packard Company | Fixture for circuit components |
-
1990
- 1990-10-11 JP JP2272551A patent/JPH0732042B2/ja not_active Expired - Lifetime
-
1991
- 1991-10-10 US US07/774,510 patent/US5326936A/en not_active Expired - Fee Related
- 1991-10-11 DE DE69118642T patent/DE69118642T2/de not_active Expired - Fee Related
- 1991-10-11 EP EP91309389A patent/EP0480754B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE69118642T2 (de) | 1996-09-19 |
JPH0732042B2 (ja) | 1995-04-10 |
EP0480754A2 (de) | 1992-04-15 |
JPH04147579A (ja) | 1992-05-21 |
EP0480754B1 (de) | 1996-04-10 |
US5326936A (en) | 1994-07-05 |
EP0480754A3 (en) | 1992-06-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69118642D1 (de) | Montageeinrichtung zum Montieren von einem elektronischen Bauelement über einem Substrat bei der Oberflächemontagetechnologie | |
DE69709699D1 (de) | Verfahren zum Verbinden von einem Substrat und einem elektronischen Bauteil | |
DE3881543D1 (de) | Loesbare halterung und verfahren zum montieren eines biegsamen filmtraegers fuer einen halbleiterchip auf einem schaltungssubstrat. | |
GB2076703B (en) | Apparatus for mounting a chip-type electronic component on a substrate | |
DE69323995D1 (de) | Verfahren zum Abstimmen von elektronischen Antwortgeräten | |
DE3784213D1 (de) | Elektronischer apparat mit einem keramischen substrat. | |
DE69422607D1 (de) | Verfahren zum montieren eines piezoelektrisches element auf einem substrat | |
DE69226824D1 (de) | Halbleitervorrichtung montiert auf einem Substrat | |
DE59408823D1 (de) | Vorrichtung zum Beschichten von Substraten | |
DE69206868D1 (de) | Einrichtung zum Abziehen eines Abdeckfilms von einem Halbleitersubstrat | |
ATE224634T1 (de) | Leiterplatte und verfahren zum lagegegenauen bestücken und löten von elektronischen bauelementen auf der oberfläche der leiterplatte | |
DE69113679D1 (de) | Verfahren und Bauteil zum Montieren von Bauelementen auf einer Leiterplatte. | |
DE69121747D1 (de) | Einrichtung zum Halten eines Substrats | |
DE69030223D1 (de) | Gestapeltes Mehrschichtsubstrat zum Montieren integrierter Schaltungen | |
DE69401459D1 (de) | Vorrichtung zum Montieren von elektronischen Bauelementen auf Platten | |
DE59108911D1 (de) | Vorrichtung zum Beschichten eines Substrats | |
DE3881360D1 (de) | Verfahren zum anbringen eines elektronischen bauelementes auf einem substrat. | |
ATA255891A (de) | Vorrichtung zum halten von leiterplatten | |
DE59208739D1 (de) | Vorrichtung zum Einbrennen von bedruckten Substraten | |
ITMI910894A0 (it) | Dispositivo per applicare uno strato su un nastro di substrato | |
DE69218723D1 (de) | Metallisierte Filmstruktur und Verfahren | |
FR2663494B1 (fr) | Dispositif electronique a substrat et boitier pour plaquette a circuit imprime. | |
DE69425774D1 (de) | Verfahren zur Umhüllung von elektronischen Hybridbauteilen mittels Kugeln auf einem Substrat | |
GB8331348D0 (en) | Machine for placing electronic components on substrate | |
DE59208176D1 (de) | Vorrichtung zum Beschichten eines Substrates mit einer Substanz |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |