DE69419942D1 - Verfahren und vorrichtung zur behandlung einer halbleiterscheibe in einer flüssigkeit - Google Patents

Verfahren und vorrichtung zur behandlung einer halbleiterscheibe in einer flüssigkeit

Info

Publication number
DE69419942D1
DE69419942D1 DE69419942T DE69419942T DE69419942D1 DE 69419942 D1 DE69419942 D1 DE 69419942D1 DE 69419942 T DE69419942 T DE 69419942T DE 69419942 T DE69419942 T DE 69419942T DE 69419942 D1 DE69419942 D1 DE 69419942D1
Authority
DE
Germany
Prior art keywords
treating
liquid
semiconductor disc
disc
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69419942T
Other languages
English (en)
Other versions
DE69419942T2 (de
DE69419942T3 (de
Inventor
Robert Matthews
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LEGACY SYSTEMS
Original Assignee
LEGACY SYSTEMS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=22413729&utm_source=***_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE69419942(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by LEGACY SYSTEMS filed Critical LEGACY SYSTEMS
Publication of DE69419942D1 publication Critical patent/DE69419942D1/de
Publication of DE69419942T2 publication Critical patent/DE69419942T2/de
Application granted granted Critical
Publication of DE69419942T3 publication Critical patent/DE69419942T3/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
DE69419942T 1993-09-22 1994-09-22 Verfahren und vorrichtung zur behandlung einer halbleiterscheibe in einer flüssigkeit Expired - Fee Related DE69419942T3 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12425193A 1993-09-22 1993-09-22
US124251 1993-09-22
PCT/US1994/011080 WO1995008406A1 (en) 1993-09-22 1994-09-22 Process and apparatus for the treatment of semiconductor wafers in a fluid

Publications (3)

Publication Number Publication Date
DE69419942D1 true DE69419942D1 (de) 1999-09-09
DE69419942T2 DE69419942T2 (de) 2000-04-20
DE69419942T3 DE69419942T3 (de) 2005-03-24

Family

ID=22413729

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69419942T Expired - Fee Related DE69419942T3 (de) 1993-09-22 1994-09-22 Verfahren und vorrichtung zur behandlung einer halbleiterscheibe in einer flüssigkeit

Country Status (7)

Country Link
EP (1) EP0739252B2 (de)
JP (1) JPH09503099A (de)
KR (1) KR100354953B1 (de)
CN (1) CN1071153C (de)
AU (1) AU7923894A (de)
DE (1) DE69419942T3 (de)
WO (1) WO1995008406A1 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19531031C2 (de) * 1995-08-23 1997-08-21 Ictop Entwicklungsgesellschaft Verfahren zum Trocknen von Silizium
US5714203A (en) * 1995-08-23 1998-02-03 Ictop Entwicklungs Gmbh Procedure for the drying of silicon
JPH10144650A (ja) 1996-11-11 1998-05-29 Mitsubishi Electric Corp 半導体材料の洗浄装置
US5983907A (en) * 1997-08-05 1999-11-16 Seh America, Inc. Method of drying semiconductor wafers using hot deionized water and infrared drying
DE19960241A1 (de) * 1999-12-14 2001-07-05 Steag Micro Tech Gmbh Vorrichtung und Verfahren zum Behandeln von Substraten
US6369357B1 (en) * 2000-02-07 2002-04-09 Weld Aid Products Inc. Implementation system for continuous welding, method, and products for the implementation of the system and/or method
JP4541422B2 (ja) * 2000-05-15 2010-09-08 東京エレクトロン株式会社 基板処理装置および基板処理方法
DE102008048540A1 (de) * 2008-09-15 2010-04-15 Gebr. Schmid Gmbh & Co. Verfahren zur Behandlung von Substraten, Substrat und Behandlungseinrichtung zur Durchführung des Verfahrens
CN109834092A (zh) * 2017-11-24 2019-06-04 天津环鑫科技发展有限公司 一种自动炉管清洗机构

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4984597B1 (en) * 1984-05-21 1999-10-26 Cfmt Inc Apparatus for rinsing and drying surfaces
US4911761A (en) † 1984-05-21 1990-03-27 Cfm Technologies Research Associates Process and apparatus for drying surfaces
US4902350A (en) * 1987-09-09 1990-02-20 Robert F. Orr Method for rinsing, cleaning and drying silicon wafers
JP2541237B2 (ja) * 1987-09-10 1996-10-09 富士通株式会社 半導体基板の洗浄方法
JP2733771B2 (ja) * 1988-07-29 1998-03-30 日本テキサス・インスツルメンツ株式会社 液体による処理装置
NL8900480A (nl) † 1989-02-27 1990-09-17 Philips Nv Werkwijze en inrichting voor het drogen van substraten na behandeling in een vloeistof.
US5135391A (en) * 1990-04-24 1992-08-04 Micron Technology, Inc. Semiconductor processing gas diffuser plate
US5082518A (en) * 1990-10-29 1992-01-21 Submicron Systems, Inc. Sparger plate for ozone gas diffusion
US5143103A (en) * 1991-01-04 1992-09-01 International Business Machines Corporation Apparatus for cleaning and drying workpieces
US5201958A (en) * 1991-11-12 1993-04-13 Electronic Controls Design, Inc. Closed-loop dual-cycle printed circuit board cleaning apparatus and method

Also Published As

Publication number Publication date
AU7923894A (en) 1995-04-10
WO1995008406A1 (en) 1995-03-30
KR100354953B1 (ko) 2002-12-11
JPH09503099A (ja) 1997-03-25
CN1134123A (zh) 1996-10-23
EP0739252A4 (de) 1996-07-03
DE69419942T2 (de) 2000-04-20
DE69419942T3 (de) 2005-03-24
EP0739252B2 (de) 2004-10-06
EP0739252A1 (de) 1996-10-30
CN1071153C (zh) 2001-09-19
EP0739252B1 (de) 1999-08-04
KR960704645A (ko) 1996-10-09

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Legal Events

Date Code Title Description
8363 Opposition against the patent
8366 Restricted maintained after opposition proceedings
8339 Ceased/non-payment of the annual fee