DE69404588D1 - Elektronisches Bauelement und Verfahren zu seiner Herstellung - Google Patents
Elektronisches Bauelement und Verfahren zu seiner HerstellungInfo
- Publication number
- DE69404588D1 DE69404588D1 DE69404588T DE69404588T DE69404588D1 DE 69404588 D1 DE69404588 D1 DE 69404588D1 DE 69404588 T DE69404588 T DE 69404588T DE 69404588 T DE69404588 T DE 69404588T DE 69404588 D1 DE69404588 D1 DE 69404588D1
- Authority
- DE
- Germany
- Prior art keywords
- production
- electronic component
- electronic
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/058—Holders; Supports for surface acoustic wave devices
- H03H9/059—Holders; Supports for surface acoustic wave devices consisting of mounting pads or bumps
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
- H03H9/1071—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16237—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bonding area disposed in a recess of the surface of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01087—Francium [Fr]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5227044A JPH0786867A (ja) | 1993-09-13 | 1993-09-13 | 電子部品とその製造方法 |
JP22704593A JP2998510B2 (ja) | 1993-09-13 | 1993-09-13 | 電子部品とその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69404588D1 true DE69404588D1 (de) | 1997-09-04 |
DE69404588T2 DE69404588T2 (de) | 1997-11-27 |
Family
ID=26527479
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69404588T Expired - Lifetime DE69404588T2 (de) | 1993-09-13 | 1994-09-13 | Elektronisches Bauelement und Verfahren zu seiner Herstellung |
Country Status (5)
Country | Link |
---|---|
US (1) | US5872331A (de) |
EP (1) | EP0643482B1 (de) |
KR (1) | KR0171921B1 (de) |
CN (1) | CN1063894C (de) |
DE (1) | DE69404588T2 (de) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07221589A (ja) * | 1994-01-31 | 1995-08-18 | Matsushita Electric Ind Co Ltd | 電子部品とその製造方法 |
SE511926C2 (sv) * | 1997-04-16 | 1999-12-20 | Ericsson Telefon Ab L M | Skärmningshölje jämte förfarande för framställning och användning av ett skärmningshölje samt mobiltelefon med skärmningshölje |
DE19806550B4 (de) | 1998-02-17 | 2004-07-22 | Epcos Ag | Elektronisches Bauelement, insbesondere mit akustischen Oberflächenwellen arbeitendes Bauelement - OFW-Bauelement |
DE19806818C1 (de) | 1998-02-18 | 1999-11-04 | Siemens Matsushita Components | Verfahren zur Herstellung eines elektronischen Bauelements, insbesondere eines mit akustischen Oberflächenwllen arbeitenden OFW-Bauelements |
JP3109477B2 (ja) * | 1998-05-26 | 2000-11-13 | 日本電気株式会社 | マルチチップモジュール |
US6121672A (en) * | 1998-11-03 | 2000-09-19 | Utmc Microelectronic Systems Inc. | Raised pedestal radiation shield for sensitive electronics |
KR100418550B1 (ko) * | 1998-12-29 | 2004-02-11 | 가부시끼가이샤 도시바 | 탄성표면파 장치 |
AU2001263463A1 (en) * | 2000-06-06 | 2001-12-17 | Sawtek, Inc. | System and method for array processing of surface acoustic wave devices |
US6649832B1 (en) * | 2001-08-31 | 2003-11-18 | Cypress Semiconductor Corporation | Apparatus and method for coupling with components in a surface mount package |
US6930364B2 (en) * | 2001-09-13 | 2005-08-16 | Silicon Light Machines Corporation | Microelectronic mechanical system and methods |
US6846423B1 (en) | 2002-08-28 | 2005-01-25 | Silicon Light Machines Corporation | Wafer-level seal for non-silicon-based devices |
US6877209B1 (en) | 2002-08-28 | 2005-04-12 | Silicon Light Machines, Inc. | Method for sealing an active area of a surface acoustic wave device on a wafer |
KR100725010B1 (ko) * | 2003-05-26 | 2007-06-04 | 가부시키가이샤 무라타 세이사쿠쇼 | 압전 전자 부품, 및 그 제조방법, 통신기 |
JP2004357094A (ja) * | 2003-05-30 | 2004-12-16 | Fujitsu Media Device Kk | 電子部品及びパッケージ |
WO2005099088A1 (en) * | 2004-03-26 | 2005-10-20 | Cypress Semiconductor Corp. | Integrated circuit having one or more conductive devices formed over a saw and/or mems device |
TWI238483B (en) * | 2004-09-01 | 2005-08-21 | Phoenix Prec Technology Corp | Semiconductor electrical connecting structure and method for fabricating the same |
JP5025425B2 (ja) * | 2007-10-31 | 2012-09-12 | 三洋電機株式会社 | 携帯機器 |
US20090115642A1 (en) * | 2007-10-31 | 2009-05-07 | Tetsuji Omura | Device actuated by key operations |
US8247888B2 (en) * | 2009-04-28 | 2012-08-21 | Dai Nippon Printing Co., Ltd. | Semiconductor device and method for manufacturing metallic shielding plate |
CN111742622B (zh) * | 2018-03-02 | 2023-09-29 | 株式会社村田制作所 | 多层陶瓷基板以及多层陶瓷基板的制造方法 |
KR20240078966A (ko) | 2022-11-28 | 2024-06-04 | 대한전선 주식회사 | 교류파괴 시험용 전력 케이블 시료 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3706840A (en) * | 1971-05-10 | 1972-12-19 | Intersil Inc | Semiconductor device packaging |
JPS5478692A (en) * | 1977-12-05 | 1979-06-22 | Matsushima Kogyo Co Ltd | Crystal vibrator |
JPS60170316A (ja) * | 1984-02-14 | 1985-09-03 | Nitto Electric Ind Co Ltd | 気密封止型水晶発振子 |
US4639631A (en) * | 1985-07-01 | 1987-01-27 | Motorola, Inc. | Electrostatically sealed piezoelectric device |
JPH0815152B2 (ja) * | 1986-01-27 | 1996-02-14 | 三菱電機株式会社 | 半導体装置及びその製造方法 |
JPS63241941A (ja) * | 1987-03-30 | 1988-10-07 | Toshiba Corp | 貼設電子装置 |
US5103290A (en) * | 1989-06-16 | 1992-04-07 | General Electric Company | Hermetic package having a lead extending through an aperture in the package lid and packaged semiconductor chip |
US5166773A (en) * | 1989-07-03 | 1992-11-24 | General Electric Company | Hermetic package and packaged semiconductor chip having closely spaced leads extending through the package lid |
JPH0340510A (ja) * | 1989-07-06 | 1991-02-21 | Murata Mfg Co Ltd | 弾性表面波装置 |
DE69115799T2 (de) * | 1990-08-28 | 1996-07-11 | Ibm | Herstellung von Halbleiterpackungen |
EP0823780B8 (de) * | 1991-09-12 | 2002-09-04 | Matsushita Electric Industrial Co., Ltd. | Elektroakustische hybride integrierte Schaltung und Methode zu deren Herstellung |
WO1993017456A1 (en) * | 1992-01-27 | 1993-09-02 | Harris Corporation | Semiconductor devices and methods of mass production thereof |
US5545845A (en) * | 1994-11-21 | 1996-08-13 | Dsc Communications Corporation | Transportable weathertight EMI shielded cabinet structure |
-
1994
- 1994-09-09 KR KR1019940022714A patent/KR0171921B1/ko not_active IP Right Cessation
- 1994-09-12 CN CN94115917A patent/CN1063894C/zh not_active Expired - Fee Related
- 1994-09-12 US US08/304,782 patent/US5872331A/en not_active Expired - Lifetime
- 1994-09-13 EP EP94114374A patent/EP0643482B1/de not_active Expired - Lifetime
- 1994-09-13 DE DE69404588T patent/DE69404588T2/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
KR0171921B1 (ko) | 1999-03-30 |
CN1104817A (zh) | 1995-07-05 |
CN1063894C (zh) | 2001-03-28 |
DE69404588T2 (de) | 1997-11-27 |
EP0643482B1 (de) | 1997-07-30 |
EP0643482A1 (de) | 1995-03-15 |
US5872331A (en) | 1999-02-16 |
KR950010727A (ko) | 1995-04-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: PANASONIC CORP., KADOMA, OSAKA, JP |
|
8320 | Willingness to grant licences declared (paragraph 23) |