DE69229314T2 - Halbleiteranordnung und Verfahren zur Herstellung - Google Patents

Halbleiteranordnung und Verfahren zur Herstellung

Info

Publication number
DE69229314T2
DE69229314T2 DE69229314T DE69229314T DE69229314T2 DE 69229314 T2 DE69229314 T2 DE 69229314T2 DE 69229314 T DE69229314 T DE 69229314T DE 69229314 T DE69229314 T DE 69229314T DE 69229314 T2 DE69229314 T2 DE 69229314T2
Authority
DE
Germany
Prior art keywords
manufacturing
semiconductor device
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69229314T
Other languages
English (en)
Other versions
DE69229314D1 (de
Inventor
Atsushi Yoshinouchi
Keiji Tarui
Yoshihumi Yaoi
Tatsuo Morita
Shuhei Tsuchimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP3344269A external-priority patent/JP2698724B2/ja
Priority claimed from JP8368892A external-priority patent/JP2834928B2/ja
Application filed by Sharp Corp filed Critical Sharp Corp
Publication of DE69229314D1 publication Critical patent/DE69229314D1/de
Application granted granted Critical
Publication of DE69229314T2 publication Critical patent/DE69229314T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1259Multistep manufacturing methods
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409Unipolar field-effect transistors
    • H01L29/66477Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66742Thin film unipolar transistors
    • H01L29/6675Amorphous silicon or polysilicon transistors
    • H01L29/66757Lateral single gate single channel transistors with non-inverted structure, i.e. the channel layer is formed before the gate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/78603Thin film transistors, i.e. transistors with a channel being at least partly a thin film characterised by the insulating substrate or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Thin Film Transistor (AREA)
DE69229314T 1991-09-10 1992-09-10 Halbleiteranordnung und Verfahren zur Herstellung Expired - Lifetime DE69229314T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP23056191 1991-09-10
JP3344269A JP2698724B2 (ja) 1991-12-26 1991-12-26 薄膜トランジスタ及びその製造方法
JP8368892A JP2834928B2 (ja) 1991-09-10 1992-04-06 半導体素子

Publications (2)

Publication Number Publication Date
DE69229314D1 DE69229314D1 (de) 1999-07-08
DE69229314T2 true DE69229314T2 (de) 1999-11-11

Family

ID=27304301

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69229314T Expired - Lifetime DE69229314T2 (de) 1991-09-10 1992-09-10 Halbleiteranordnung und Verfahren zur Herstellung

Country Status (2)

Country Link
EP (1) EP0532314B1 (de)
DE (1) DE69229314T2 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100291971B1 (ko) 1993-10-26 2001-10-24 야마자끼 순페이 기판처리장치및방법과박막반도체디바이스제조방법
US6867432B1 (en) 1994-06-09 2005-03-15 Semiconductor Energy Lab Semiconductor device having SiOxNy gate insulating film
US6291837B1 (en) 1997-03-18 2001-09-18 Semiconductor Energy Laboratory Co., Ltd. Substrate of semiconductor device and fabrication method thereof as well as semiconductor device and fabrication method thereof
US6601308B2 (en) * 2002-01-02 2003-08-05 Bahram Khoshnood Ambient light collecting bow sight
US7968884B2 (en) 2006-12-05 2011-06-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US7851277B2 (en) 2006-12-05 2010-12-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of manufacturing same
US8067772B2 (en) 2006-12-05 2011-11-29 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US8581260B2 (en) 2007-02-22 2013-11-12 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device including a memory
TWI535028B (zh) 2009-12-21 2016-05-21 半導體能源研究所股份有限公司 薄膜電晶體
KR101836067B1 (ko) 2009-12-21 2018-03-08 가부시키가이샤 한도오따이 에네루기 켄큐쇼 박막 트랜지스터와 그 제작 방법
US8476744B2 (en) 2009-12-28 2013-07-02 Semiconductor Energy Laboratory Co., Ltd. Thin film transistor with channel including microcrystalline and amorphous semiconductor regions
US8704230B2 (en) 2010-08-26 2014-04-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US9230826B2 (en) 2010-08-26 2016-01-05 Semiconductor Energy Laboratory Co., Ltd. Etching method using mixed gas and method for manufacturing semiconductor device
JP5960000B2 (ja) * 2012-09-05 2016-08-02 ルネサスエレクトロニクス株式会社 半導体装置及び半導体装置の製造方法
KR102340066B1 (ko) 2016-04-07 2021-12-15 가부시키가이샤 한도오따이 에네루기 켄큐쇼 박리 방법 및 플렉시블 디바이스의 제작 방법

Also Published As

Publication number Publication date
DE69229314D1 (de) 1999-07-08
EP0532314B1 (de) 1999-06-02
EP0532314A1 (de) 1993-03-17

Similar Documents

Publication Publication Date Title
DE69228787D1 (de) Verfahren und Anlage zur Herstellung von Halbleitervorrichtungen
DE69403593D1 (de) Gerät und Verfahren zur Herstellung einer Halbleitervorrichtung
DE69209678D1 (de) Halbleiteranordnung für Hochspannungsverwendung und Verfahren zur Herstellung
DE69323827T2 (de) Diamant-Halbleiter und Verfahren zur Herstellung
DE69431023D1 (de) Halbleiteraufbau und Verfahren zur Herstellung
DE69631315T2 (de) Halbleiterspeicheranordnung und Verfahren zur Herstellung
DE69229314D1 (de) Halbleiteranordnung und Verfahren zur Herstellung
DE69508885T2 (de) Halbleiterdiode und Verfahren zur Herstellung
DE69014454D1 (de) Hochspannungs-Halbleiteranordnung und Verfahren zur Herstellung.
DE69033900D1 (de) Halbleiteranordnung und Verfahren zu seiner Herstellung
DE69128963T2 (de) Halbleitervorrichtung und Verfahren zu seiner Herstellung
DE69227290T2 (de) Halbleiteranordnung und Verfahren zur Herstellung
DE69416619D1 (de) Halbleiterspeicheranordnung und Verfahren zur Herstellung
DE69128406D1 (de) Lateraler MOSFET und Verfahren zur Herstellung
DE69528683T2 (de) Halbleiterbauteil und Verfahren zur Herstellung desselben
DE69221379T2 (de) Halbleiter-Speicherbauteil und Verfahren zur Herstellung desselben
DE69417933D1 (de) Verfahren und Vorrichtung zur Herstellung von Halbleitervorrichtungen
DE69321049D1 (de) Halbleiteranordnung mit Seitenwand-Gate und Verfahren zur Herstellung
DE69524529D1 (de) Halbleiterspeicheranordnung und Verfahren zur Herstellung
DE69511992T2 (de) Halbleiteranordnung und Verfahren zur Herstellung
DE69128829T2 (de) Feldeffekttransistor und Verfahren zur Herstellung
DE69219688D1 (de) Halbleitervorrichtung und Verfahren zur Herstellung derselben
DE69114187T2 (de) Vorrichtung und Verfahren zur Herstellung von Halbleitereinrichtungen.
DE69310031T2 (de) Quartzgerät und Verfahren zur Herstellung
DE69303643D1 (de) Halbleiterlaservorrichtung und Verfahren zur Herstellung

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
R071 Expiry of right

Ref document number: 532314

Country of ref document: EP