DE69227146T2 - Gerät und Verfahren zur Beobachtung einer dreidimensionalen Anordnung von Atomen - Google Patents

Gerät und Verfahren zur Beobachtung einer dreidimensionalen Anordnung von Atomen

Info

Publication number
DE69227146T2
DE69227146T2 DE69227146T DE69227146T DE69227146T2 DE 69227146 T2 DE69227146 T2 DE 69227146T2 DE 69227146 T DE69227146 T DE 69227146T DE 69227146 T DE69227146 T DE 69227146T DE 69227146 T2 DE69227146 T2 DE 69227146T2
Authority
DE
Germany
Prior art keywords
observing
atoms
dimensional arrangement
dimensional
arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69227146T
Other languages
English (en)
Other versions
DE69227146D1 (de
Inventor
Hiroshi Kakibayashi
Yasuhiro Mitsui
Hideo Todokoro
Katsuhiro Kuroda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of DE69227146D1 publication Critical patent/DE69227146D1/de
Application granted granted Critical
Publication of DE69227146T2 publication Critical patent/DE69227146T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/305—Contactless testing using electron beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
    • G01N23/04—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material
    • G01N23/046—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material using tomography, e.g. computed tomography [CT]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/40—Imaging
    • G01N2223/419—Imaging computed tomograph
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/22—Treatment of data
    • H01J2237/226—Image reconstruction

Landscapes

  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Pulmonology (AREA)
  • Radiology & Medical Imaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
DE69227146T 1991-05-15 1992-05-13 Gerät und Verfahren zur Beobachtung einer dreidimensionalen Anordnung von Atomen Expired - Fee Related DE69227146T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11012691A JP3287858B2 (ja) 1991-05-15 1991-05-15 電子顕微鏡装置及び電子顕微方法

Publications (2)

Publication Number Publication Date
DE69227146D1 DE69227146D1 (de) 1998-11-05
DE69227146T2 true DE69227146T2 (de) 1999-06-02

Family

ID=14527691

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69227146T Expired - Fee Related DE69227146T2 (de) 1991-05-15 1992-05-13 Gerät und Verfahren zur Beobachtung einer dreidimensionalen Anordnung von Atomen

Country Status (4)

Country Link
US (2) US5278408A (de)
EP (1) EP0513776B1 (de)
JP (1) JP3287858B2 (de)
DE (1) DE69227146T2 (de)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5552602A (en) * 1991-05-15 1996-09-03 Hitachi, Ltd. Electron microscope
US5866905A (en) * 1991-05-15 1999-02-02 Hitachi, Ltd. Electron microscope
US5460034A (en) * 1992-07-21 1995-10-24 The United States Of America As Represented By The Secretary Of The Air Force Method for measuring and analyzing surface roughness on semiconductor laser etched facets
JP3304681B2 (ja) * 1995-04-25 2002-07-22 株式会社日立製作所 電子顕微鏡及び３次元原子配列観察方法
US5541411A (en) * 1995-07-06 1996-07-30 Fei Company Image-to-image registration focused ion beam system
US5659175A (en) * 1995-12-21 1997-08-19 Lucent Technologies Inc. Apparatus and method for tomography of microscopic samples
JP3485707B2 (ja) * 1996-01-09 2004-01-13 沖電気工業株式会社 透過型電子顕微鏡用の平面サンプルの作製方法及びその透過型電子顕微鏡による欠陥測定方法
US5826213A (en) * 1997-02-25 1998-10-20 Kennefick; Christine Method and apparatus for investigating toughening mechanisms and crack advance in lightweight materials
WO1998038669A1 (en) * 1997-02-28 1998-09-03 Arizona Board Of Regents Atomic focusers in electron microscopy
JP3304836B2 (ja) * 1997-08-07 2002-07-22 シャープ株式会社 透過型電子顕微鏡による反応プロセス観察方法
US6049078A (en) * 1997-12-05 2000-04-11 International Business Machines Corporation Transmitting tip for scanning tunneling microscopy system
US6571183B1 (en) * 1998-10-05 2003-05-27 University Of Maryland Imaging using spatial frequency filtering and masking
JP4441831B2 (ja) * 1999-09-16 2010-03-31 株式会社ニコン 顕微鏡装置
US6690007B2 (en) * 2000-08-07 2004-02-10 Shimadzu Corporation Three-dimensional atom microscope, three-dimensional observation method of atomic arrangement, and stereoscopic measuring method of atomic arrangement
GB0222334D0 (en) * 2001-10-04 2002-10-30 X Ray Res Gmbh Automatic adjusting method for a goniometer and associated device
CN1300558C (zh) * 2002-03-14 2007-02-14 株式会社堀场制作所 应力测定方法及应力测定装置
JP2005019218A (ja) 2003-06-26 2005-01-20 Jeol Ltd 電子顕微鏡装置
JP4199629B2 (ja) * 2003-09-18 2008-12-17 株式会社日立ハイテクノロジーズ 内部構造観察方法とその装置
SE0400177D0 (sv) * 2004-01-26 2004-01-26 Nanofactory Instruments Ab Sensor
JP4299208B2 (ja) 2004-08-20 2009-07-22 日本電子株式会社 ３次元像構築方法
WO2006062132A1 (ja) * 2004-12-07 2006-06-15 The University Of Tokyo 立体画像再構成装置、立体画像再構成方法、及び立体画像再構成プログラム
US7700915B2 (en) * 2006-11-28 2010-04-20 Canatu Oy Method, computer program and apparatus for the characterization of molecules
EP2332162A4 (de) 2008-10-12 2013-03-20 Fei Co Hochpräzise balkenplatzierung zur navigation in lokalen bereichen
US8781219B2 (en) 2008-10-12 2014-07-15 Fei Company High accuracy beam placement for local area navigation
JP5670096B2 (ja) * 2009-11-17 2015-02-18 日本電子株式会社 トモグラフィー法を用いた試料の３次元画像取得方法及び装置
US8455822B2 (en) 2010-08-31 2013-06-04 Fei Company Navigation and sample processing using an ion source containing both low-mass and high-mass species
CN105247650A (zh) 2013-05-30 2016-01-13 株式会社日立高新技术 带电粒子束装置、试样观察方法
JP6383650B2 (ja) 2014-11-28 2018-08-29 株式会社日立ハイテクノロジーズ 荷電粒子線装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2220871B1 (de) * 1973-07-27 1978-01-20 Jeol Ltd
JPH0676975B2 (ja) * 1984-09-26 1994-09-28 新技術事業団 表面原子配列構造の観察方法
JPS6296807A (ja) * 1985-10-23 1987-05-06 Mitsubishi Heavy Ind Ltd 非接触試料表面形状測定方法
JPH06105605B2 (ja) * 1987-09-11 1994-12-21 株式会社日立製作所 電子顕微鏡の像観察装置
JPH01211849A (ja) * 1987-10-23 1989-08-25 Kobe Steel Ltd 走査型電子顕微鏡画像からの３次元形状の再構成法および装置
JP2602287B2 (ja) * 1988-07-01 1997-04-23 株式会社日立製作所 Ｘ線マスクの欠陥検査方法及びその装置
US4942299A (en) * 1989-03-01 1990-07-17 Midwest Research Institute Method and apparatus for differential spectroscopic atomic-imaging using scanning tunneling microscopy
US5144148A (en) * 1989-11-07 1992-09-01 International Business Machines Corporation Process for repositioning atoms on a surface using a scanning tunneling microscope
NL9001800A (nl) * 1990-08-10 1992-03-02 Philips Nv Methode voor het direct verkrijgen van amplitude- en fase-informatie van een object met behulp van beelden van een hoge-resolutie elektronenmicroscoop.
US5095207A (en) * 1991-01-07 1992-03-10 University Of Wisconsin - Milwaukee Method of three-dimensional atomic imaging

Also Published As

Publication number Publication date
JPH04337236A (ja) 1992-11-25
US5278408A (en) 1994-01-11
EP0513776A3 (de) 1994-02-16
EP0513776B1 (de) 1998-09-30
DE69227146D1 (de) 1998-11-05
EP0513776A2 (de) 1992-11-19
JP3287858B2 (ja) 2002-06-04
US5475218A (en) 1995-12-12

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee